An intelligent-agent framework for concurrent product design andplanning

This paper proposes a multi-agent framework to develop product design and planning using the concurrent engineering approach. The ideas in the framework draw on design-team behavior in many domains. The goal is to provide information that will help teams of designers, engineers and managers from various functional areas improve initial designs so that they satisfy a wider variety of concerns. Our model provides support to bring together constraints from the different team members in the development cycle. By integrating downstream constraints into the design phase, we reduce the need for redesign (due to design mistakes) later in the product development cycle. Our framework integrates a blackboard architecture with an intelligent agent (IA) network. Our methodology uses conflict-resolution (CR) techniques and design-improvement suggestions to refine the initial product design, and process plan generation and simulation to verify the manufacturability of the design. The contributions of the paper are threefold. First, our framework provides a more realistic way of modeling design teams by providing a way to model an individual team member's perspective as a segment of a continuum of task knowledge. Second, we identify the essential components of concurrent engineering needs, and develop a framework for integrating these components so as to ensure adequate coordination among the processes involved. Third, our methodology uniquely meshes together design constraints with factory resource considerations, so that the final product design is ensured to be feasible and manufacturable     

Quick-turnaround-time improvement for product development andtransfer to mass production

We describe equipment and facility operational methods in a production fab which are designed to achieve quick-turnaround-time (QTAT) manufacturing and ease product transfer from development to mass production. An advanced CIM system with precise lot management is introduced to keep the optimum balance of manufacturing TAT and throughput. Substantial end-user computing reduces the engineering holding time for handling development lots. In situ monitoring technologies are applied for the utilization enhancement of plasma-assisted equipment. A 9% manufacturing TAT reduction and a 14% throughput increase are estimated using a manufacturing simulator. The number of wafers in QTAT lots is reduced for processing time reduction. As a result, manufacturing TAT of QTAT lots with reduction from 24 wafers to three is reduced to 56% compared with that of normal lots in the production fab. This new production fab realizes QTAT development and agile product transfer from development to mass production with full process compatibility     

The MMST computer-integrated manufacturing system framework

Computer-integrated manufacturing (CIM) is the harmonious connection, integration, and interoperation of automation equipment within a manufacturing facility. In a semiconductor wafer fab, this includes integration of the processing equipment with all of the supporting systems for product and process specification, production planning and scheduling, and material handling and tracking. Traditionally, CIM systems have been characterized as monolithic mainframe-based systems and/or inflexible islands of automation with limited interoperability. Today's manufacturing demands fully integrated dynamic systems which directly support the concepts of lean, flexible and agile manufacturing to high quality standards. These requirements drove the design of a new CIM system which was developed for the Microelectronics Manufacturing Science and Technology (MMST) program. This paper provides an overview of the MMST CIM system framework which is based on open distributed system and object technologies. The CIM system was demonstrated in a 1000 wafer pilot production run in 1993 which achieved world record cycle time, and is now being commercialized as part of the WORKS product family from Texas Instruments     

The QML system for monolithic microcircuits

The qualified manufacturers list (QML) for monolithic microcircuits is described. The approach is commonly known as generic qualification. The QML approach provides for an integrated manufacturing process from device design through final test. It is predicted, on the basis of this philosophy, that quality and reliability can be designed into a product. The implementation of a total-quality-management (TQM) program within the manufacturing unit is key to the success of the QML system. The generic qualification process, the requirements for QML-based products, and the status of the program are designed     

A method for quality precoordination in a quality assuranceinformation system

A new concept is introduced of an information center for planning and controlling the quality of products and processes in a factory. This center is called the Quality Assurance Information System (QAIS), and its role is to tie together through quality related functions, design, manufacturing, distribution, sales and other factory management systems to optimize overall factory performance. The quality functions of QAIS as carried out through coordination and precoordination activities are considered. A formal approach for dealing with precoordination activities is presented and a methodology is proposed for the quantitative evaluation and selection of complex systems satisfying desired product or process quality requirements from a number of the factory's subsystems. Practical steps on how to implement precoordination are presented and the methodology is illustrated through a case example     

Quality-oriented-maintenance for multiple interactive tooling components in discrete manufacturing processes

In discrete manufacturing processes such as stamping, assembly, or machining processes, product quality, often defined in terms of the dimensional integrity of work pieces, is jointly affected by multiple process variables. During the production phase, the states of tooling components, which are measured by adjustable process variables, are subject to possible random continuous drifts in their means & variances. These drifts of component states may significantly deteriorate product quality during production. Therefore, maintenance of the tooling components with consideration of both their continuous state drifts as well as catastrophic failures is crucial in assuring desired product quality & productivity. In contrast to traditional maintenance models where product quality has not been well addressed, especially for discrete manufacturing processes, a general quality-oriented-maintenance methodology is proposed in this paper to minimize the overall production costs. In this research, the total production cost includes product quality loss due to process drifts, productivity loss due to catastrophic failures, and maintenance costs. The quality-oriented-maintenance model is built based on a response model linking process variables with multidimensional product quality. It can be obtained either from engineering analysis for specific processes, or from statistical design of experiments. Three typical multi-component maintenance models are investigated under the general quality-oriented-maintenance framework. A case study for a sheet-metal stamping process is presented to demonstrate the effectiveness of the proposed methodology.     

面向PCB行业的装备控制及检测共性技术

为提升PCB行业装备的自动化和智能化水平,降低生产成本,提高产品质量和效益,文章研究了PCB自动检测和生产设备的两个不可或缺的共性技术:运动控制和视觉检测技术。论文介绍了基于组件化模型集成设计的控制系统设计开发方法,通过对控制系统共性的提取和功能及非功能属性的抽象,借助工具集成实现对控制系统的仿真和验证,采用可重用实时组件设计方法,实现了面向PCB检测领域的高效集成的运动开发平台,通过该平台可实现对不同控制应用所需控制系统的快速开发。针对PCB行业自动视觉测量及表面质量检测的共性问题,在三维复合测量、图元智能识别、高速高精几何形貌测量、多区段复合式可编程智能照明技术、高速自动聚焦、面向应用的软件快速定制等关键共性技术领域实现了突破,并成功应用于多种面向PCB行业的系列化中高档设备,包括手动/电动/CNC精密影像测量仪、PCB微钻刃面全自动光学检测设备、FPC自动光学检测设备、PCB微钻全自动刃磨机、全自动套环机、CNC24开槽机等。     

Development of the order fulfillment process in the foundry fab byapplying distributed multi-agents on a generic message-passing platform

In order to provide a better service for customers, the modeling and simulation of the order fulfillment process (OFP) is important for the semiconductor foundry fab since supervisors can use them to find the bottleneck in the process. The scope of this paper is to: model the OFP of a foundry fab in the distributed environment using multi-agents; provide the functionalities for each application in the OFP; and provide a generic message-passing platform (GMPP) for the distributed environment. The OFP can be viewed as the enterprise-scale integration of applications. It is decomposed into four subprocesses: order management process, planning process, manufacturing execution system, and event monitoring. Each application in the subprocess is regarded as an agent and performs its task based on its knowledge constrained by its objectives. Agents are located in the distributed environment in order to possess the properties of a distributed system. The message types in the GMPP are classified into application-to-application, application-to-person and person-to-application. The enabling communication protocols are addressed. The entire OFP is built on the GMPP. Some useful information for decision support systems is shown in the simulation results     

数字化转型中不同企业的中台战略及架构设计

国家经济转型和技术的高速发展,对企业提出数字化转型需求,如何通过IT架构升级来加速转型成为各个企业研究的新课题。阐述了中台的定义、作用和常见的类型,并对比分析了不同业务链长度的典型企业的中台战略和架构,提出了生产和运营解耦的中台规划理念。结合运营商现状,针对运营商建设中台的方法和类型提出了建议。     

面向工程协同设计与实现的群体决策支持系统研究

将群体决策支持系统技术引入工程协同设计与实现，提出了面向工程协同设计与实现的群体决策支持系统层次结构，实现了模型库系统、知识库系统、数据库系统、交互系统、系统集成方法和系统运行的协调控制。以某实际产品协同设计与实现为背景，实现了产品设计、仿真的工作流建模、并行协同机制以及应用软件模型化方法。为新产品设计与研制提供一个集成开发平台。     

Platform designer: An approach for modeling multiprocessor platforms based on SystemC

This paper[3.5pc] presents the Platform Designer (PD) framework, a set of SystemC based tools that provide support for modeling, simulation and analysis of multiprocessor SoC platforms (MPSoC), at different abstraction levels. PD provides mechanisms for interconnection specification, process synchronization and communication, thus allowing the modeling of a complete platform, in a unified environment. To do that it uses an extension of the ArchC ADL and acsys, a tool that enables the automatic generation of a SystemC simulator of the platform. The main advantages of this approach are twofold. First, designers have more flexibility since they can integrate and configure different processors to the platform, using a single environment. Second, it enables a faster design space exploration, given that it automatically generates SystemC simulators of whole platforms at distinct abstraction levels. A number of platform variations can be tried out with minor design changes, thus reducing design time. Experimental results show the suitability of the platform simulator for design space exploration. Real applications (with medium complexity) run in the platform in few minutes. Combined with the facility to generate platforms with minor changes, this feature allows an improvement of the design space exploration.     

A production planning methodology for semiconductor manufacturingbased on iterative simulation and linear programming calculations

We introduce a methodology for automated production planning of semiconductor manufacturing based on iterative linear programming (LP) optimization and discrete-event simulation calculations. The LP formulation incorporates epoch dependent parameters for flow times from lot release up to each operation on each manufacturing route. LP-derived release schedules are used as input to the simulation model, from which statistics on flow times are collected and used to reformulate the LP model for a revised planning calculation. Iteration continues until satisfactory agreement between simulation and LP models is obtained. We demonstrate in experiments on an industry data set that a relatively small number of iterations is required to develop a production plan correctly characterizing future flow times as a function of factory load and product mix. The methodology makes possible automated production planning of semiconductor manufacturing on an engineering work station     

Cost based surface mount PCB design evaluation

In today's manufacturing field there is continuous demand for product flexibility and shorter product throughput time. Production planning and cost estimating activities need to be speeded up. Consequently, the traditional gap between the designer who designs new products and the estimator who evaluates the financial consequences of the design is fading. Cost optimization is being integrated in the design process, and the designer needs to take more responsibility for the cost of the product at the design stage itself. There is a lack of tools to assist the designer in analyzing a Printed Circuit Board's (PCBs) design from a manufacturing perspective, especially from an economic aspect. This is true in Surface Mount Technology (SMT) production where the integration of the design and manufacturing functions is often hampered by the lack of sufficient, in-depth manufacturing knowledge and associated cost information. This research developed a cost estimation tool for the designer in the surface mount PCB assembly domain by integrating Computer Aided Design (CAD), Computer Aided Process Planning (CAPP), and cost estimation techniques using a knowledge based framework. Cost estimation can be done at two design stages. First, a rough cost estimate can be obtained from knowing the component mix, the type of boad material, and the size of board. Then, after the detailed design, a more accurate assembly cost can be obtained by generating a macro-process plan from the given CAD data. The cost module considers tangible factors including the material costs, the equipment costs, process costs, and the labor costs. The model used also considers the intangible cost in a preliminary evaluation of design costs. The cost advisor and the Design For Manufacture (DFM) environment have been developed using C++ and object oriented programming constructs under the MS Windows operating system.     

基于改进遗传算法的虚拟制造单元继承性重构调度技术

Aiming to the demand for efficiency and flexibility under multi variety and variable batch production and the problem that existing manufacturing units were difficult to support high quality consistency and efficiency of key parts under fragmented orders, a C_max and minimizing the difference of virtual manufacturing cell composition before and after reconfiguration, an improved genetic algorithm based on inherited reconfiguration decoding strategy was proposed, and a similarity calculation method between orders under known cell configuration and the original manufacturing cell was designed. It ensures the maximization of the manufacturing cell and carries out reconstruction by inheriting the configuration of the original manufacturing cell. Finally, the validity and feasibility of the proposed model and algorithm are verified by the actual production data of a photoelectric observation product.     

空基平台一体化阵列天线技术综述

随着全空域内通讯探测需求的不断拓展,各式空基传感器载体平台纷纷涌现,对阵列天线在载体平台的集成技术提出了前所未有的挑战。为最大限度利用载体平台资源,提升平台整体效能,天线与平台的设计逐渐深度耦合,最终形成了“载荷平台一体化阵列天线”的技术概念。文章全面梳理了载荷平台一体化天线的技术需求、演进路线,并从新体制阵列设计与验证、天线设计与集成、材料工艺体系,以及系统鲁棒性优化等方面详细论述了关键技术与发展方向。希望对载荷平台一体化天线技术的发展与工程化应用起到推动作用。     

基于XML的机床产品协同设计信息交互模型的研究

针对分布式异地、异构协同环境下机床产品设计数据结构化与非结构化的特征，提出利用半结构化语言XML描述机床类产品设计信息模型的方法，给出了XML样式化接口与映射接口的实现机制，为协同设计中产品设计资源的跨平台交互处理以及远程机床的在线加工后处理提供了有效的数据模型和解决途径。     

一种基于RS485总线的SoC产品测试平台的设计

介绍了一种以ARM高性能微处理器为核心,基于RS485总线的SoC产品自动化批量测试平台的设计方案.在对测试平台整体设计思路进行概述之后,介绍了其硬件组成及软件设计方法.经测试和实际运行表明,该测试平台能满足多种SoC产品的测试要求,能广泛应用于多种SoC产品的自动化批量测试中,提高生产效率,降低生产成本.     

一种流程企业生产计划的多目标优化方法

传统的流程企业生产计划研究缺少大系统建模方法和相应的优化算法，而且多为单目标、确定性模型，使生产计划缺乏应有的灵活性。提出了一种新的流程企业生产计划的优化方法，将投入产出分析与模糊相关机会目标规划结合，建立流程企业生产计划的模糊优化模型．并使用基于模糊模拟、神经元网络和遗传算法的混合智能算法进行求解。     

Integrating environmental objectives in the operational planning ofprinted circuit board assembly

This paper presents a methodology for operational control of printed circuit board (PCB) assembly systems with respect to environmental objectives for managing per-unit and per-setup waste flows. The approach builds upon the concept of unit process modeling, process chaining and evaluation of multicriteria effects first applied to product design. Three approaches are used to guide planning and control decisions for the management of hazard profiles at the facility level: product assignment, worker assignment, and a hybrid approach. The optimization models seek to balance overall waste mass and facility-level hazard given throughput constraints and demand requirements. A case example is given for scheduling six board types over four production lines in a two-shift operation     

A methodology for product mix planning in semiconductor foundrymanufacturing

Since a semiconductor foundry plant manufactures a wide range of memory and logic products using the make-to-order business model, the product mix is an important production decision. This paper first describes the characteristics of the product mix planning problem in foundry manufacturing that are attributable to the long flow time and queuing network behaviors. The issues of time bucket selection, mix optimization and bottleneck-based planning are next addressed. A decision software system based on integer linear programming techniques and a heuristic procedure has been implemented for mix planning. Data provided by a wafer plant has been used to study problems related to product mix planning. It was determined that the suitable time bucket of planning is either one week or one month and the lead-time offset factor should be included in the logic of workload calculation. This paper also presents various facets of product mix decisions and how they should be integrated with operations management