Fourier transform infrared spectroscopic characterization of aromatic bismaleimide resin cure states

Interesting polyimide materials, possessing good mechanical and thermal properties, are obtained by homopolymerization or reaction of 4,′4-bis(maleimidodiphenylmethane) with a diamine. Fourier transform infrared spectroscopy has been used to characterize the crosslinking of such materials using maleimide and amine absorption bands. Amine group reaction on double bonds is readily achieved and appears to be insensitive to the temperature of curing. On the other hand, the decrease of maleimide double bonds is strongly dependent on the reaction temperature. The residual amount of double bonds present in the cured material is a function of the temperature: a linear relationship holds between residual double bond concentration vs. curing temperature. The general behavior during crosslinking of this kind of polyimide was related to glass transition temperature changes.     

Relationships in a bismaleimide resin system. Part I: Cure mechanisms

A series of bismaleimide resin systems has been examined in order to identify the molecular features responsible for the mechanical response of these materials. A range of network structures was produced both by formulation of resins with different ratios of N,N′-bismaleimido-4,4′-diphenylmethane (BMI) and methylene dianiline (MDA), and by the use of different thermal processing cycles. Spectrographic and chromatographic techniques were used to study the reactions that occurred during the cure. Two principal reactions were confirmed: a Michael addition reaction which provides linear chain growth, and an addition reaction which produces crosslinking through the double bonds of the maleimide group. In general, curing at a lower temperature or increasing the MDA content served to favor chain extension over crosslinking, which might be expected to increase molecular mobility in the resin.     

Biobased thermosetting resins composed of L‐lysine methyl ester and bismaleimide

Lysine methyl ester (LME), which was generated in situ by the reaction of lysine methyl ester dihydrochloride and triethylamine in dimethyl sulfoxide (DMSO), was prepolymerized with 4,4′‐bismaleimidodiphenylmethane (BMI) at 80°C for 2 h in DMSO. Then, the formed prepolymer was precipitated in water. The obtained LME/BMI prepolymers with molar ratios of 2:2, 2:3, and 2:4 were compression‐molded at a final temperature of 230°C for 2 h to produce cured lysine methyl ester/4,4′‐bismaleimidodiphenylmethane resins (cLBs; cLB22, cLB23, and cLB24, respectively). Fourier transform infrared (FTIR) analyses revealed that the Michael addition reaction of amino groups to the C?C bonds of the maleimide group occurred in addition to the homopolymerization of the maleimide group. The glass‐transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI feed content, and cLB24 showed the highest T_g (343°C) and T₅ (389°C). The flexural strengths (131–150 MPa) and moduli (3.0–3.6 GPa) of the cLBs were comparable to those of the conventionally cured resins of BMI and 4,4′‐diaminodiphenylmethane. Field emission scanning electron microscopy analysis revealed that there was no phase separation for all of the cured resins. Although cLB23 and cLB24 were not biodegradable, cLB22 had a biodegradability of 8.5% after 30 days in an aerobic aqueous medium containing activated sludge. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40379.     

Model Adherend Surface Effects on Epoxy Cure Reactions

Adherend surface effects on the amine cure of epoxy resins were investivated using finely divided aluminum oxide as high surface area models for aluminum. Calorimetric analysis of simplified crosslinking systems revealed significantly faster reactions which led to lower glass transition temperature materials for activated aluminum oxide filled samples. A monofunctional amine and epoxy were then utilized to obtain soluble reaction products amenable to molecular characterization. These studies similarly showed an increase in the rate of epoxy consumption in the presence of activated aluminum oxide which was attributed to both an increase in the rate of amine addition to epoxy as well as to epoxy homopolymerization. The latter was not observed in the unfilled mixtures. Such changes in reaction mechanism at the adherend surface have implications for the strength and durability of actual adhesive bonds.     

Model Adherend Surface Effects on Epoxy Cure Reactions

Adherend surface effects on the amine cure of epoxy resins were investivated using finely divided aluminum oxide as high surface area models for aluminum. Calorimetric analysis of simplified crosslinking systems revealed significantly faster reactions which led to lower glass transition temperature materials for activated aluminum oxide filled samples. A monofunctional amine and epoxy were then utilized to obtain soluble reaction products amenable to molecular characterization. These studies similarly showed an increase in the rate of epoxy consumption in the presence of activated aluminum oxide which was attributed to both an increase in the rate of amine addition to epoxy as well as to epoxy homopolymerization. The latter was not observed in the unfilled mixtures. Such changes in reaction mechanism at the adherend surface have implications for the strength and durability of actual adhesive bonds.     

New biobased epoxy hardeners: Thiol-ene addition on oligobutadiene

We report the synthesis and characterization of oligobutadienes functionalized with primary amine groups and theirs use as hardeners for epoxy resins. The functionalization of polybutadiene (with 59% of 1,2 double bonds) was carried out by the addition of 2-amino-3-mercaptopropanoic acid (cysteamine) in different ratios through thiol-ene coupling. The thiol-ene addition was performed in tetrahydrofurane solvent with 2,2′-azobis(2-methylpropionitrile) as radical initiator at 70 °C. The ratio polymer/cysteamine was varied in order to obtain several number of amine functions per polymer chain and to compare the reactivity of thiol onto 1,2 and 1,4 double bonds of polybutadiene. The different characterizations of synthesized polymeric amines allowed us to identify the quantities of amine groups grafted onto 1,2 and 1,4 double bonds, the cyclization side reactions of 1,2 double bonds and the unreacted 1,2 and 1,4 double bonds. These polymeric amines were mixed with epoxy resins (BADGE) and led to materials with glass transition temperatures between 20 °C and 60 °C depending on the polymeric amines functionalities. The thermal properties of synthesized resins are similar to the ones measured on epoxy resins obtained with commercial hardeners (cycloaliphatic amine and 1,10-diaminodecane).     

Bio-based hydroxymethylated eugenol modified bismaleimide resin and its high-temperature composites

Hydroxymethylated eugenol (MEG) and poly (hydroxymethylated eugenol) (PMEG) were synthesized by the condensation reaction of eugenol (EG) with formaldehyde. The different contents of MEG and PMEG were used to modify 4,4′-bismaleimidediphenylmethane (BMI). The cured MEG-BMI resins exhibit good thermal stability evidenced by its 5% weight loss temperatures above 407°C and its residue above 39.4% at 800°C under nitrogen. For carbon/MEG-BMI composites, their glass transition temperatures were around 400°C; their flexural strength and moduli were maintained at a range of 488.87–575.47 MPa and 48.84–60.26 GPa, respectively. With the increasing content of BMI in the resin formulation, the flexural properties decreased; comprehensively the composite with the eugenol/maleimide unit ratio (1:0.3 mol) had the best mechanical and thermal properties, meanwhile its renewable carbon content was as high as 57.80%. As a new candidate of high temperature thermosetting resin, MEG would find promising applications for advanced composites' matrice.     

Novel thermosetting resins based on 4-(N-maleimidophenyl)glycidylether I. Preparation and characterization of monomer and cured resins

A hybrid monomer of 4-(N-maleimidophenyl)glycidylether (MPGE), which possesses both oxirane ring and maleimide curable groups, was first synthesized from N-(4-hydroxyphenyl)maleimide and epichlorohydrin by using benzyltrimethylammonium chloride as a catalyst. MPGE was then cured with amine compounds (DDM and DICY) and diethylphosphite (DEP) to result in crosslinking networks. The curing kinetics and mechanisms were studied. High glass transition temperature, good thermal stability, and attractive flame retardance were observed for the prepared resins. These thermal and flame retardant properties of the cured resins were further enhanced by using DEP as the curing agent, which incorporated phosphorus into the cured resins.     

Mechanical and thermal properties of epoxy resins with reversible crosslinks

The tensile properties: Young's modulus, ultimate tensile strength, ultimate elongation, the glass transition temperature, and the dynamic mechanical properties (dynamic shear modulus (G'), loss tangent (Tan δ)), of three epoxy resins (Epon 828, Epon 836, Epon HPT 1071) cured with the disulfide-containing crosslinking agent—4.4-dithiodianilme (DTDA) have been characterized. The results show that DTDA is a satisfactory crosslinking agent for the epoxide resins that have been studied as compared to the well-known curing agent methylene dianiline (MDA). There are no significant differences between the properties of Epon 828 cured with DTDA at stoichiometric ratio (2:1) and Epon 828 cured with DTDA at small amine excess ratio (1.75:1). The glass transition temperature of the cured tetrafunctional epoxy resin Epon HPT 1971 (235°C) is significantly higher than that of difunctional epoxy resins such as Epon 828 (T_g–175°C), but the product is too brittle to be used without plasticizer.     

Preparation and properties of bismaleimide resins of aromatic sulfone ether diamine

Aromatic sulfone ether diamine, bis[4-(4-aminophenoxy)phenyl]-sulfone (SED), was prepared by the nucleophilic aromatic substitution of 4,4′-dichlorodiphenylsulphone by p-aminophenolate. The reaction was conducted in the presence of excess potassium carbonate as a weak base, toluene as the dehydrating agent and N-methylpyrrolidone as the dipolar aprotic solvent. SED showed good solubility in common organic solvents, such as dioxan, tetrahydrofuran, butanone and acetone. SED was reacted with maleic anhydride to obtain aromatic sulfone ether bismaleimide, bis[4-(4-maleimidophenoxy)phenyl]-sulfone (SEM). The compounds were characterized by FTIR and ¹H NMR analysis. Furthermore, copolymer resins of SED with 4,4′-bismaleimidodiphenyl methane (BMI) and SEM were prepared. After curing, crosslinked resins with better thermal stability resulted. The temperature at maximum rate of weight loss (T_max) and the heat-resistant temperature index (T_i) in air were found to be 426°C, 208°C and 579°C, 221°C for BMI/SED and SEM/SED resins, respectively. Compared with the corresponding 4,4′-diaminodiphenyl methane (DDM) system, BMI/SED and SEM/SED showed a slight decrease in T_max and T_i SED-modified BMI/amine resin based glass cloth laminates for printed circuit boards showed higher mechanical properties than those of the corresponding unmodified system. With SED instead of the original amine component in 3–5% weight fraction, the tensile strength, flexural strength and impact strength of the laminates increased markedly. Meanwhile, the stripping strength and weld resistance were also improved by the addition of SED.     

Phenolic resins with phenyl maleimide functions: Thermal characteristics and laminate composite properties

Phenolic resins bearing varying concentrations of phenyl maleimide functions were synthesized by copolymerizing phenol with N‐(4‐hydroxyphenyl)maleimide (HPM) and formaldehyde in the presence of an acid catalyst. The resins underwent a two‐stage curing, through condensation of methylol groups and addition polymerization of maleimide groups. The cure characterization of the resin by dynamic mechanical analysis confirmed the two‐stage cure and the dominance of maleimide polymerization over methylol condensation in the network buildup process. The kinetics of both cure reactions, studied by the Rogers method, substantiated the earlier proposed cure mechanism for each stage. Although the initial decomposition temperature of the cured resin was not significantly improved, enhancing the crosslink density through HPM improved thermal stability of the material in a higher temperature regime. The anaerobic char yield also increased proportional to the maleimide content. Isothermal pyrolysis and analysis of the char confirmed that pyrolysis occurs by loss of hydrocarbon and nitrogenous products. The resins serve as effective matrices in silica‐ and glass fabric–reinforced composites whose mechanical properties are optimum for moderately crosslinked resins, in which failure occurs through a combination of fiber debonding and resin fracture. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1664–1674, 2001     

Synthesis and characterization of epoxy film cured with phosphorous‐containing phenolic resin

Through the electrophilic addition reaction of ? P(O)? H and C?C, a series of novel phosphorus‐containing phenolic resins bearing maleimide (P‐PMFs) were synthesized and used as curing agent for preparing high performance and flame retardancy epoxy resins. The structure of the resin was confirmed with FTIR and elemental analysis. Thermal properties and thermal degradation behaviors of the thermosetted resin was investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The epoxy resins exhibited high glass transition temperature (143–156°C), goof thermal stability (>330°C) and retardation on thermal degradation rates. High char yields (700°C, 52.9%) and high limited oxygen indices (30.6–34.8) were observed, indicating the resins' good flame retardance for the P‐PMFs/CNE cured resins. The developed resin may be used potentially as environmentally preferable products in electronic fields. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 3813–3817, 2007     

Bio-based thermosetting resins composed of aliphatic polyol-derived polymaleimides and allyleugenol

Bio-based bismaleimide (2MPD), trismaleimide (3MGC) and tetramaleimide (4MDG) were synthesized by reactions of 4-isocyanatophenylmaleimide with 1,3-propanediol, glycerol and α,α′-diglycerol, respectively. Although 2MPD did not melt until the temperature where thermal decomposition starts, 3MGC and 4MDG exhibited broad melting temperatures with onset points at 165 °C and 124 °C, respectively. 3MGC and 4MDG were homogeneously prepolymerized at 170 °C with 2,4-diallyl-6-methoxyphenol (rAEG) which was prepared by the Claisen rearrangement of allyl-etherified eugenol (AEG). The prepolymers were compression-molded at 250 °C to produce cured rAEG/3MGC (A3Mxy) and rAEG/4MDG (A4Mxy) with the allyl/maleimide ratio of x/y = 1/1, 1/2 or 1/3. The FT-IR analysis revealed that the ene reaction of allyl and maleimide groups and subsequent addition copolymerization occurred for the cured resins. The thermal and mechanical properties of the cured resins were compared with those of the cured rAEG/4,4′-bismaleimidodiphenylmethane (BMI) (ABMxy) with the same allyl/maleimide ratio. A3M13 and A4M13 showed no inflection point of thermal expansion due to glass transition until 300 °C, which is a little lower than the thermo-degradation temperature. Flexural strengths and flexural strains at break for A3Ms and A4Ms increased with the polymaleimide contents, and those of A3M13 and A4M13 were much higher than those of ABM13.     

间乙炔基苯基马来酰亚胺改性炔丙基酚醛树脂

以不同质量比的间乙炔基苯基马来酰亚胺单体(3-APMI)和炔丙基酚醛树脂(PN)进行共聚制备了一系列间乙炔基苯基马来酰亚胺改性的炔丙基酚醛树脂(APMI-PN),希望通过引入马来酰亚胺链段赋予PN树脂更高的固化反应活性和耐热性。通过DSC、TGA、DMA、FT-IR、凝胶时间、流变分析、力学性能等测试手段对所合成的树脂及其浇注体的性能进行了研究。与PN树脂相比,APMI-PN树脂体系的固化反应活性大大提高,170℃下的凝胶时间可由140 min缩短为31.6 min或更短。固化物耐热性明显提高,玻璃化转变温度为385~474℃,起始热分解温度约为418~445℃。m(PN)∶m(APMI)=1∶1时,改性树脂(APMI-PN-1-1)复合材料的室温及400℃下弯曲强度比3-APMI体系分别提高了66%,15%,400℃层间剪切强度提高了23%,这是一种综合性能优良的耐高温复合材料基体树脂。     

Synthesis and thermal polymerization of a novel stilbene-maleimide AB-monomer

Summary A novel AB-monomer, 3-maleimidostilbene (ST-MAI), was synthesized. DSC investigation indicated that the ST-MAI monomer melted at 127°C and thermally polymerized in the temperature range of 180 ∼ 300°C. IR investigation on the thermal polymerization processes proved that the thermal polymerization included not only copolymerizaiton between stilbene and maleimide, but also homopolymerization of maleimide. The largest reaction conversion of maleimide and stilbene unit in a ST-MAI monomer was about 82% and 50% respectively. The glass transition temperature of cured ST-MAI resin was 234°C, determined by DSC. The decomposition temperatures for 10% weight loss was above 430°C in both air and nitrogen atmospheres. Received: 14 July 1999/Revised version: 30 September 1999/Accepted: 5 October 1999     

4-炔丙氧基苯基马来酰亚胺共混改性聚芳基乙炔

将4-炔丙氧基苯基马来酰亚胺(简称4-PPM)与聚芳基乙炔(简称PAA)进行共混改性,在保持PAA树脂耐热性的基础上改善其固化工艺性能。用红外、流变及DSC等测试方法研究了共混树脂的固化工艺性能,用TGA及DMA的测试方法研究了共混树脂固化物的耐热性能。结果表明共混树脂具有良好的加工性能,并且固化物也具有良好的耐热性能。玻璃化转变温度高于370℃,在N2中的分解温度高于400℃,失重5%的温度高于413℃,900℃的残留率高于56%。对比各个配比的共混树脂,4-PPM质量分数为50%的树脂表现出较好的固化工艺性能和耐热性能,可作为耐高温复合材料的基体。     

Fluorinated bismaleimide resin with good processability,high toughness,and outstanding dielectric properties

In this study, novel fluorinated bismaleimide (BMI) resins were prepared by the copolymerization of 2,2′‐bis[4‐(4‐maleimidephenoxy)phenyl]hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA) to enhance their dielectric properties. The dielectric properties of the resins were investigated in the frequency range 7–18 GHz through a cavity method. Through the incorporation of a hexafluoroisopropyl group with the polymer chain, the dielectric constant (ε) was effectively decreased because of the small dipole and the low polarizability of the carbon‐fluorine (C? F) bonds. The 6FBMP/6FDABPA resin possessed excellent dielectric properties, with ε being 2.88 and the dielectric loss being 0.009 at 10 GHz and 25°C. In comparison with the 4,4′‐bismaleimidodiphenylmethane (BDM)/2,2′‐diallyl bisphenol A (DABPA) resin, the glass‐transition temperature (T_g) of 6FBMP/6FDABPA decreased. The flexible ether group in the long chain of 6FBMP was considered to disrupt chain packing and cause a decreased crosslinking density and a lower T_g. 6FBMP/6FDABPA showed a similar thermal decomposition temperature and good thermal properties like the BDM/DABPA resin, whereas the impact strength of the 6FBMP/6FDABPA resin was almost 1.6 times higher than that of the BDM/DABPA resin. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42791.     

Polydimethylsiloxane containing isocyanate group-modified epoxy resin: Curing,characterization, and properties

A synthesized polydimethylsiloxane containing an isocyanate group was used to improve the flexibility and to reduce the internal stress of epoxy resin cured with MDA (4,4′-methylene dianiline). The effect of polysiloxane content on the curing kinetics of a novolac-type epoxy modified with an isocyanate group was investigated. It was found that the modified epoxy resin showed significant improvement in impact strength. The polysiloxane containing isocyanate groups effectively depressed the internal stress of cured epoxy resins by reducing the flexural modulus and the coefficient of thermal expansion, while the glass transition temperature was increased. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 2739–2747, 1999     

Thermal and dielectric properties of bismaleimide‐triazine resins containing octa(maleimidophenyl)silsesquioxane

Octa(maleimidophenyl)silsesquioxane (OMPS) was synthesized, characterized, and employed to modify the BT resin which composed of 4,4′‐bismaleimidodiphenylmethane (BMI) and 2,2′‐bis(4‐cyanatophenyl)propane (BCE). The curing reaction between OMPS and BT resin was first investigated. It was found that OMPS accelerate the curing reaction of BCE, and the onset temperature of the cyclotrimerization was reduced up to 95.5°C (by DSC). As demonstrated by DSC and FTIR, there was no evidence that indicated the coreaction between maleimide and cyanate ester. 2,2′‐diallyl bisphenol A (DBA) and diglycidyl ether of bisphenol A (E‐51) (Wuxi Resin Factory, Jiangsu Province, China) were also used to enhance the toughness of BT resin, and the formulated BTA (containing DBA) and BTE (containing E‐51) resins were obtained. The thermal properties of BT, BTA, and BTE resins incorporated with OMPS were then investigated. The results of DMA and TG showed that the BT, BTA, and BTE resins containing 1 wt % of OMPS exhibit enhanced thermal properties in comparison with their pristine resins respectively, while more contents of OMPS may impair the thermal properties of the polymer matrix, though the effect of OMPS was slight. Finally, the dielectric constant of these hybrid materials were detected, and their dielectric constant were distinctly reduced by the incorporation of OMPS, while overmuch contents of OMPS were disadvantageous for dielectric constant because of the aggregation of OMPS. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

Synthesis and characterization of siliconized epoxy-1,3-bis(maleimido)benzene intercrosslinked matrix materials

Intercrosslinked network of siliconized epoxy-1,3-bis(maleimido)benzene matrix systems have been developed. The siliconization of epoxy resin was carried out by using various percentages of (5-15%) hydroxyl-terminated polydimethylsiloxane (HTPDMS) with γ-aminopropyltriethoxysilane (γ-APS) as crosslinking agent and dibutyltindilaurate as catalyst. The siliconized epoxy systems were further modified with various percentages of (5-15%) 1,3-bis(maleimido)benzene (BMI) and cured by using diaminodiphenylmethane (DDM). The neat resin castings prepared were characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into epoxy resin improves the toughness of epoxy resin with reduction in the values of stress-strain properties whereas, incorporation of bismaleimide into epoxy resin improves stress-strain properties with lowering of toughness. However, the introduction of both siloxane and bismaleimide into epoxy resin influences the mechanical properties according to their percentage content. Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and measurement of heat distortion temperature were also carried out to assess the thermal behavior of the matrix samples. DSC thermogram of the BMI modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g), thermal degradation temperature and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content and this may be due to the homopolymerization of BMI rather than Michael addition reaction. The morphology of the BMI modified epoxy and siliconized epoxy systems were also studied by scanning electron microscopy.