Growth of silicon nanoclusters on different substrates by plasma enhanced chemical vapor deposition

We report an atomic force microscopy study of the early stages of growth of silicon nanoclusters formed on different substrates by plasma-enhanced chemical vapor deposition, using dichlorosilane (SiH2CI2) and hydrogen (H2) as reactive gases. (100) n-type single crystalline silicon, fused silica, amorphous silicon nitride and corning glass, were used as substrates for the growth of the nanoclusters, which were formed at low substrate temperature (200 degrees C). The diameter, height and number density of the clusters were controlled by the deposition time and pressure. It was found that not only the plasma conditions but also the surface characteristics of the substrate influence the cluster density, shape, and size. For the ordered silicon surface and the amorphous fused silica, the nanoclusters result oval in shape and exhibit preferential growth along the surface. When deposited over amorphous silicon nitride and corning glass, the density of nanoclusters increases and there is a tendency toward columnar growth since the diameter of the nanoclusters tends to decrease. We conclude that although the specific features of the nanoclusters originate from the chlorine chemistry introduced by the SiHxCly deposition precursor and the chemical stability of chlorine-terminated surfaces under hydrogen plasma, the surface quality and roughness also plays an important role on the nucleation and mobility of the species. The combination of both effects gives rise to the different nanostructured growths observed.     

Growth behavior of iridium on Si substrates prepared by plasma enhanced atomic layer deposition

Growth behavior of iridium (Ir) thin film on Si substrates prepared by plasma enhanced atomic layer deposition (PEALD) was systematically studied. Ir(EtCp)(COD) and oxygen was employed as a precursor and reactant, respectively. To obtain optimal conditions for depositing nanometer scale Ir thin film, deposition temperature, cycle dependence and precursor feeding time dependence were studied. Uniform 12 nm thick Ir layer with sharp interface was grown at the temperature range of 330-360 degrees C at the fixed deposition cycles of 300. The grown Ir film showed linear properties as a function of deposition cycles which is a typical self-limiting characteristic of ALD. The XRD patterns revealed that IrOx was not formed due to relatively low partial pressure of oxygen. The optimal conditions obtained for 12 nm thick Ir thin film were 330 degrees C of deposition temperature, 300 deposition cycles, and 10 sec of precursor feeding time.     

磁场辅助等离子体增强化学气相沉积

本文根据螺线管线圈内部磁场的分布规律，以及磁场对等离子体内部电子的作用原理，设计了磁场辅助的等离子体增强化学气相沉积（PECVD）系统，并且研究了在PECVD系统中获得均匀磁场的方法。而后，以SiH4和N2为反应气体，在低气压下沉积了SiN薄膜。测量了SiN薄膜的沉积速率，折射率，表面形貌等参数。验证了磁场分布的均匀性，分析了磁场在等离子体增强化学气相沉积系统中的作用。     

微波等离子体化学气相沉积法在硅片上同时生长碳化硅和金刚石

研究了衬底温度、核化密度、衬底表而预处理等工艺参数对微波等离子体化学气相沉积法在硅片上同时生长碳化硅和金刚石的影响.采用扫描电镜、X-射线衍射、喇曼光谱和红外光谱对样品进行了表征.结果表明:从高核化密度生长的金刚石膜中探测不到碳化硅;不论对硅衬底进行抛光预处理还是未抛光预处理,从低核化密度牛长的金刚石厚膜中总能探测到碳化硅.碳化硅生长在硅衬底上未被金刚石覆盖的地方,或者是在金刚石晶核之间的空洞处.碳化硅形成和金刚石生长是同时发生的两个竞争过程.此研究结果为制备金刚石和碳化砟复合材料提供了一种新的方法.     

Remote plasma processing of sapphire substrates for deposition of TiN and TiO2

The paper uses remote plasma assisted deposition, oxidation and nitridation processes for depositing thin films of metallic TiN on crystalline sapphire (0001) substrates. These films on sapphire substrates are being studied as window materials for high power radio frequency (RF) power tubes. A sequence of four process steps has been performed in a reactor chamber that isolates the deposition and surface-processing chamber from the plasma generation region. The chamber is part of an ultra-high-vacuum (UHV) compatible multi-chamber cluster in which the sequence of four process steps can be interrupted after each step, and surface chemistry changes can be identified by in-line Auger electron spectroscopy (AES). The four process steps, performed after an ex-situ chemical clean and blow-dry in nitrogen gas, are (i) a remote plasma-assisted oxidation (RPAO) in which surface contaminants including adventitious carbon are removed; (ii) a remote plasma-assisted nitridation (RPAN) process which forms a superficial layer of generic AION used to increase surface adhesion of the TiN films; (iii) a remote plasma-enhanced chemical-vapor deposition (RPECVD) process for deposition of 2 to 5 nm thick TiN films, and finally (iv) a second RPAN step that increases the ratio of Ti-N bonding in the TiN films with respect to adventitious O-atom incorporation from the Ti precursor, Ti tetra-butoxide.     

Growth of Ge islands on Si substrates

We present a study of Ge islands formation on Si(100) substrates using grazing-incidence small-angle X-ray scattering (GISAXS) and atomic force microscopy (AFM). Samples were prepared by magnetron sputtering of a 5 nm thick Ge layer in a very high vacuum on Si(100) substrate held at different temperatures. The vertical cut (perpendicular to the surface) of the experimental 2D GISAXS pattern has been fitted using a Guinier approximation. The optimum temperature for the islands formation was 650 °C. At this temperature, islands grow in conical shape with very similar dimensions; however, inter-island distances varied significantly.     

Mechanical properties of carbon-modified silicon oxide barrier films deposited by plasma enhanced chemical vapor deposition on polymer substrates

Cohesive and adhesive properties of silicon oxide barrier coatings deposited from an oxygen/hexamethyldisiloxane gas mixture by plasma enhanced chemical vapor deposition, with controlled incorporation of carbon on 12 μm thick polyethylene terephtalate films were investigated. The reactor was equipped with a 2.45 GHz slot antenna plasma source and a 13.56 MHz-biased substrate holder. The two plasma sources were operated separately or in a dual mode. It was found that no or negligible internal stresses were introduced in the silicon oxide coatings as long as the increase of energy experienced by the film was compensated by the densification of the oxide. For a range of process parameters and carbon content on the changes of the crack onset strain, adhesion, and cohesion were found to be similar. Generally a high crack onset strain or good adhesion and cohesion were measured for films with an increased carbon content, although this was obtained at the expense of the gas barrier performance. Promising approaches towards high-barrier thin films with good mechanical integrity are proposed, based on coatings with a gradient in the carbon content and in the mechanical properties, on nano-composite laminates, and on organo-silane treatments.     

High quality Ge epitaxial layers on Si by ultrahigh vacuum chemical vapor deposition

Flat, relaxed Ge epitaxial layers with low threading dislocation density (TDD) of 1.94 × 10⁶ cm^− 2 were grown on Si(001) by ultrahigh vacuum chemical vapor deposition. High temperature Ge growth at 500 °C on 45 nm low temperature (LT) Ge buffer layer grown at 300 °C ensured the growth of a flat surface with RMS roughness of 1 nm; however, the growth at 650 °C resulted in rough intermixed SiGe layer irrespective of the use of low temperature Ge buffer layer due to the roughening of LT Ge buffer layer during the temperature ramp and subsequent severe surface diffusion at high temperatures. Two-dimensional Ge layer grown at LT was very crucial in achieving low TDD Ge epitaxial film suitable for device applications.     

Growth of Ge nanoparticles on SiO2/Si interfaces during annealing of plasma enhanced chemical vapor deposited thin films

Multilayer germanosilicate (Ge:SiO₂) films have been grown by plasma enhanced chemical vapor deposition. Each Ge:SiO₂ layer is separated by a pure SiO₂ layer. The samples were heat treated at 900 °C for 15 and 45 min. Transmission electron microscopy investigations show precipitation of particles in the layers of highest Ge concentration. Furthermore there is evidence of diffusion between the layers. This paper focuses mainly on observed growth of Ge particles close to the interface, caused by Ge diffusion from the Ge:SiO₂ layer closest to the interface through a pure SiO₂ layer and to the interface. The particles grow as spheres in a direction away from the interface. Particles observed after 15 min anneal time are 4 nm in size and are amorphous, while after 45 min anneal time they are 7 nm in size and have a crystalline diamond type Ge structure.     

等离子体增强化学气相沉积设备的研制

本文介绍非晶硅薄膜太阳能电池生产线的核心设备——等离子体增强化学气相沉积(PECVD, Plasma Enhanced Chemical Vapor Deposition)系统,并阐述了其重要地位.非晶硅太阳能电池制造的关键技术是非晶硅薄膜的制备,目前最常见的制备方法是PECVD技术.PECVD技术凭借其低温沉积、可大面积成膜、成膜均匀等特点,在非晶硅薄膜制备方面迅速发展.PECVD系统用于制备非晶硅太阳能电池的关键结构P、I、N硅薄膜层.本文阐述了该设备的结构特点、技术指标、工作原理及工艺过程,对沉积室的结构和配置进行了详细设计计算,非晶硅太阳能电池稳定后的转化效率可达6％.     

Polycrystalline Si1-x Ge x thin film deposition by rapid thermal chemical vapor deposition

Polycrystalline silicon germanium (poly-Si_1−xGe_x) thin films on a-Si film have been deposited by rapid thermal chemical vapor deposition (RTCVD) with SiH₄–GeH₄–H₂. Effect of GeH₄/SiH₄ and deposition temperature on stoichiometry (x), Si-Ge binding character, composition, hydrogen configuration, crystallinity, preferred orientation, grain size, and surface roughness of poly-Si_1−xGe_x films has been investigated. Poly-Si_1−xGe_x deposited on the substrate with amorphous silicon buffer layer on oxide shows better crystallinity and contains the less amount of oxygen than the one deposited directly on the oxide surface. At low temperature region, the Ge–H bond with the small amount of Si–H₂ bond is dominant but all hydrogen bonds are desorbed at high temperature. All films have polycrystalline phase and the grain size and (111) orientation increased with increasing deposition temperature in which Ge content also increases at the fixed gas flow rate of GeH₄ to total source gas. Poly-Si_1−xGe_x/Si thin film transistors (TFT) are fabricated and hydrogen during post-hydrogenation process preferentially is attached to Ge dangling bond and the TFT characteristics could be improved.     

Optimised plasma enhanced chemical vapour deposition (PECVD) process for double layer diamond-like carbon (DLC) deposition on germanium substrates

Double layer DLC-films were deposited on germanium substrates by the PECVD-method, using ethyne as reactant gas during RF plasma excitation in a parallel plate reactor. The electric field distribution in the plasma chamber was simulated by FEM. The basic concept was the utilization of coatings with graded interfaces and without other materials.The bias voltage, working pressure and substrate temperature were changed stepwise to create an appropriate combination of an adhesive layer with improved elastic properties and a wear protective layer with increased hardness on the top.The layer thickness was determined by Scanning Electron Microscopy. Thickness data were used in combination with Infrared Spectroscopy to calculate the Refractive Index of the layer.Double layered DLC-films with Vickers hardness up to 3500 HV and a refractive index of around 2 were generated, which can be used as wear resistant optical layer on germanium substrates.     

Effect of impinging ion energy on the substrates during deposition of SiOx films by radiofrequency plasma enhanced chemical vapor deposition process

Radiofrequency (13.56 MHz) plasma enhanced chemical vapor deposition process is used for deposition of SiO_x films on bell metal substrates using Ar/hexamethyldisiloxane/O₂ glow discharge. The DC self-bias voltage developed on the substrates is observed to be varied from − 35 V to − 115 V depending on the RF power applied to the plasma. Plasma potential measurements during film deposition process are carried out by self-compensated emissive probe. The deposited films are characterized by Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), nanoindentation, nano-scratch test and thermogravimetric analysis. The characterization results show strong dependency of the SiO_x films properties on the energy of the ions impinging on the substrates during deposition. Analysis of Raman spectra indicates an increase in vitreous silica content and reduction in defective Si-O-Si chemical structure in the deposited SiO_x films with increasing ion energy impinging on the substrates. The increase in inorganic (Si and O) content in the SiO_x films is further confirmed from XPS analysis. The growth of SiO_x films with more inorganic content and defect free chemical structure apparently contribute to the increase in their hardness and scratch resistance behavior. The films show higher thermal stability as the energy of the ions arriving at substrates increases with DC self-bias voltage. The possibility of using SiO_x films for surface protection of bell metal is also explored.     

Ge-rich islands grown on patterned Si substrates by low-energy plasma-enhanced chemical vapour deposition

Si(1-x)Ge(x) islands grown on Si patterned substrates have received considerable attention during the last decade for potential applications in microelectronics and optoelectronics. In this work we propose a new methodology to grow Ge-rich islands using a chemical vapour deposition technique. Electron-beam lithography is used to pre-pattern Si substrates, creating material traps. Epitaxial deposition of thin Ge films by low-energy plasma-enhanced chemical vapour deposition then leads to the formation of Ge-rich Si(1-x)Ge(x) islands (x > 0.8) with a homogeneous size distribution, precisely positioned with respect to the substrate pattern. The island morphology was characterized by atomic force microscopy, and the Ge content and strain in the islands was studied by μRaman spectroscopy. This characterization indicates a uniform distribution of islands with high Ge content and low strain: this suggests that the relatively high growth rate (0.1 nm s(-1)) and low temperature (650?°C) used is able to limit Si intermixing, while maintaining a long enough adatom diffusion length to prevent nucleation of islands outside pits. This offers the novel possibility of using these Ge-rich islands to induce strain in a Si cap.     

Study of NbGeSi films deposited by chemical vapour deposition

NbGeSi films were prepared by chemical vapour deposition. Results of X-ray diffraction, electron microscopy and chemical composition examinations are reported. The A15 phase was obtained over a wide composition range and a new Nb₃Si₂ structure was produced. The stability and the homogeneity of these materials are discussed.     

Photoluminescence and structure of ZnO films deposited on Si substrates by metal-organic chemical vapor deposition

The structure and photoluminescence (PL) at room temperature of ZnO films deposited on Si(111) substrates by metal-organic chemical vapor deposition (MO-CVD) using diethylzinc (DEZ) and CO₂ was investigated. It was found that these properties strongly depend on growth temperature and pressure. ZnO films can be deposited only at low pressure and in the temperature region of 500–650°C. The samples grown at certain conditions can generate stronger luminescence of ZnO. When the growth temperature increased to 650°C, the ZnO₂ phase was observed in X-ray diffraction (XRD) patterns of the samples. This characteristic became evident after the samples annealed. Appearance of a ZnO₂ phase results in production of a new emission band centered at 575 nm in the PL spectrum at room temperature, and the green emitting band also disappears.     

Real-time studies of Ge growth on nanostructured Si substrates

Nanostructured substrates are an interesting path towards the production of quantum dots devoted to microelectronic applications. In this work we report results on the effects of different nanopatterning methods to obtain lateral ordering of Ge islands grown on Si. By using Scanning Tunneling Microscopy we have studied in real-time the wetting layer growth and islands formation on nanopatterned Si substrates at 500 °C. We compare results obtained on Si substrates nanopatterned by using two different techniques: STM lithography and natural patterning induced by surface instabilities such as step bunching. Different issues on both cases have been addressed: substrate preparation, Ge dots placement and growth mode. We have observed that, on Si(001), the Ge islands nucleate near the holes and on Si(111) step bunching can guide the growth of aligned rows of islands.     

辅助PECVD的磁场模拟计算与分析

本文介绍了磁场辅助PECVD工作原理,磁场对沉积薄膜的影响。通过对PECVD中磁场对带电粒子的约束作用、等离子体能量转换频率分析,建立辅助磁场模型并进行数值计算。在现有辅助磁场基础上改进设计适用于PECVD设备的螺线管磁场系统,得到不同物理条件下磁场分布规律。进而确定螺线管结构参数得到均匀分布的磁场,为辅助PECVD磁场的应用提供了一种方法。