Synthesis and properties of poly(amide imide)s based on 2,2′‐ or 4,4′‐bis(4‐aminophenoxy)biphenyl and various bis(trimellitimide)s

Three series of isomeric poly(amide imide)s (series III, IV, and V) were synthesized by the direct polycondensation of 2,2′‐bis(4‐aminophenoxy)biphenyl (2,2′‐BAPB), 4,4′‐bis(4‐aminophenoxy)biphenyl (4,4′‐BAPB), or their equimolar mixture (2,2′‐BAPB/4,4′‐BAPB = 1/1) with 12 diimide diacids and with triphenyl phosphite and pyridine as condensing agents. A comparison of the physical properties of these three series was also made. The inherent viscosities of series III, IV, and V were 0.25–0.84, 0.25–1.52, and 0.43–1.30 dL g^?1, respectively. Most of the series III polymers showed better solubility because of the non‐para structure, with the solubility order found to be III > V > IV. According to X‐ray diffraction patterns, the amorphous poly(amide imide)s had excellent solubility, whereas the crystalline polymers were less soluble. All the soluble polymers afforded transparent, flexible, and tough films, which had tensile strengths of 57–104 MPa, elongations at break of 3–20%, and initial moduli of 2.05–2.86 GPa. The glass‐transition temperatures (measured by differential scanning calorimetry) were highest for series IV, which contained the rigid 4,4′‐biphenyl units (254–299°C); copolymer series V ranked second (237–277°C), and series III, with crank 2,2′‐biphenyl structures, had the lowest values (227–268°C). The 10% weight‐loss temperatures (measured by thermogravimetric analysis) were close to one another, ranging from 527 to 574°C in nitrogen and from 472 to 543°C in air. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 2763–2774, 2002     

Synthesis and characterization of low‐dielectric photosensitive polyimide/silica hybrid materials

Photosensitive polyimide/silica hybrid materials were synthesized by reaction between 4,4′‐hexafluoroisopropylidene diphthalic anhydride (6FDA) and 4,4′‐oxydianiline. The intrachain chemical bonding and the interchain hydrogen bonding between the polyimide and silica moieties were increased by the incorporation of 2‐(dimethylamino) ethyl acrylate and 3‐aminopropyl trimetho xysilane, respectively. The photoinitiator was bis(2,4,6‐trimethyl benzoyl) phenylphosphine oxide (Irgacure‐819). The various coupling agents were utilized included tetrakis (allyloxy) silane (TAL). Most silica hybrid films showed better volume shrinkage and temperature resistance. The cooperation of octavinyl POSS, as the coupling agent, can lower dielectric constant (k) down to 2.48 but with the poorer volume shrinkage and temperature resistance than the other silica hybrid films. The addition of tetramethyl orthosilicate and 3‐methacryloxy propyltrimethoxysilane with silica content of 5.6 wt % can reduce k down to 2.26 but with worse volume shrinkage than the incorporation with TAL. The TAL hybrid film with degree of polymerization of 25 showed the best properties that optimized photolithography, dielectric constant (k = 3.81), volume shrinkage, and temperature resistance (Td5% = 378°C) with only 0.22 wt % silica content. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Preparation and properties of melt‐processable polyimides based on fluorinated aromatic diamines and aromatic dianhydrides

Two series of melt‐processable polyimides were prepared from 4,4′‐bis(3‐amino‐5‐trifluoromethylphenoxy)biphenyl (m‐6FBAB) and 4,4′‐bis(4‐amino‐5‐trifluoromethylphenoxy) biphenyl (p‐6FBAB) with various aromatic dianhydrides. The effects of the chemical structures of the polyimides on their properties, especially the melt processability and organic solubility, were investigated. The experimental results demonstrate that some of the fluorinated aromatic polyimides showed good melt processability at elevated temperatures (250–360°C) with relatively low melt viscosities and could be melt‐molded to produce strong and tough polyimide sheets. Meanwhile, the polyimides showed excellent organic solubility in both polar aprotic solvents and common solvents to give stable polyimide solutions with high polymer concentrations and relatively low viscosities. Thus, we prepared high‐quality polyimide films by casting the polyimide solutions on glass plates followed by baking at relatively low temperatures. The polyimides derived from m‐6FBAB showed better melt processability and solubility than the p‐6FBAB based polymers. The melt‐processable polyimides showed a good combination of thermal stability and mechanical properties, with decomposition temperatures of 547–597°C, glass‐transition temperatures in the range 205–264°C, tensile strengths of 81.3–104.9 MPa, and elongations at break as high as 19.6%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis and properties of hydrogen‐bonded poly(amide‐imide) hybrid films

Poly(amide‐imide), PI, hybrid films are prepared by using sol–gel techniques. First, the poly(amide amic acid) with controlled block chain length of 5000 and 10,000 g/mol and uncontrolled chain length are synthesized by condensation reaction with 4,4′‐diaminodiphenyl ether (ODA), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), trimellitic anhydride chloride (TMAC) and terminated with p‐aminopropyltrimethoxysilane (APrTMOS). And then the imidization reactions of poly (amide amic acid) are proceeded to obtain the poly (amide‐imide) hybrid film. Hybrid films with 5000 g/mol block chain length possess higher storage modulus, lower glass transition temperature and damping intensity comparing to films with 10,000 g/mol block chain length. The addition of TMAC to the poly(amide‐imide) hybrids is due to the increase of toughness and intermolecular hydrogen bonding, which is the average strength of intermolecular bonding and studied by the hydrogen‐bonded fraction (f_bonded), frequency difference (Δν) and shiftment. Meanwhile, PI hybrid films containing more APrTMOS and TMAC content possess higher thermal and mechanical properties. On the other hand, hybrid films with 10,000 g/mol block chain length and more TMAC content have higher gas permeabilities than other films. The degradation temperatures of 5 wt % loss of all hybrid films are all higher than 540°C and increased as the increase of TMAC content. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and properties of organosoluble polyimide/clay hybrids

A soluble polyimide prepared from 7,7′‐bis(4‐aminophenoxy)‐4,4,4′,4′‐tetramethyl‐2,2′‐spirobichroman and 4,4′‐hexafluoroisopropylidenediphthalic anhydride was mixed with organo‐modified montmorillonite or synthetic mica in N,N‐dimethylacetamide. The content of the clay minerals was 1, 2, and 4 wt %, respectively. Transparent, flexible, and tough films could be cast from the hybrid solutions. The hybrid films were characterized with wide‐angle X‐ray scattering (WAXS), transmission electron microscopy, thermomechanical analysis, thermogravimetric analysis, and differential scanning calorimetry. The WAXS results revealed that the montmorillonite was dispersed more homogeneously than the synthetic mica in the polyimide matrix. In both polyimide/clay hybrids the addition of clay caused thermal expansion coefficients to decrease, and the thermal stability was slightly enhanced. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2067–2072, 2001     

Processable and colorless fluorinated poly(ether imide)s based on an isopropylidene‐containing bis(ether anhydride) and various aromatic bis(ether amine)s bearing trifluoromethyl groups

A series of novel organosoluble and light‐colored fluorinated poly(ether imide)s (PEIs) ( IV ) having inherent viscosities of 0.43–0.59 dL/g were prepared from 4,4′‐[1,4‐phenylenbis(isopropylidene‐1,4‐phenyleneoxy)]diphthalic anhydride ( I ) and various trifluoromethyl‐substituted aromatic bis(ether amine)s by a standard two‐step process with thermal and chemical imidization of poly(amic acid) precursors. These PEIs showed excellent solubility in many organic solvents and could be solution‐cast into transparent and tough films. These films were essentially colorless, with an UV–visible absorption edge of 361–375 nm and a very low b* value (a yellowness index) of 15.3–17.0. They also showed good thermal stability with glass‐transition temperature of 191–248°C, 10% weight loss temperature in excess of 494°C, and char yields at 800°C in nitrogen more than 39%. The thermally cured PEI films showed good mechanical properties with tensile strengths of 83–96 MPa, elongations at break of 8–11%, and initial moduli of 1.7–2.0 GPa. They possessed lower dielectric constants of 3.25–3.72 (1 MHz). In comparison with the V series nonfluorinated PEIs, the IV series showed better solubility, lower color intensity, and lower dielectric constants. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 620–628, 2007     

Synthesis and characterization of polyimide–silica nanocomposites using novel fluorine‐modified silica nanoparticles

Polyimide–silica nanocomposites were synthesized with 4,4′‐oxydianiline, 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), and fluorine‐modified silica nanoparticles. Fluorinated precursors such as 4″,4?‐(hexafluoroisopropylidene)bis(4‐phenoxyaniline) (6FBPA) and 4,4′‐(hexafluoroisopropylindene)diphenol (BISAF) were employed to modify the surface of the silica nanoparticles. The microstructures and thermal, mechanical, and dielectric properties of the polyimide–silica nanocomposites were investigated. An improvement in the thermal stability and storage modulus of the polyimide nanocomposites due to the addition of the modified silica nanoparticles was observed. The microstructures of the polyimide–silica nanocomposites containing 6FBPA‐modified silica exhibited more uniformity than those of the nanocomposites containing BISAF‐modified silica. The dielectric constants of the polyimide were considerably reduced by the incorporation of pristine silica or 6FBPA‐modified silica but not BISAF‐modified silica. The addition of a modifier with higher fluorine contents did not ensure a lower dielectric constant. The uniformity of the silica distribution, manipulated by the reactivity of the modifier, played an important role in the reduction of the dielectric constant. Using 6FBPA‐modified silica nanoparticles demonstrated an effective way of synthesizing low‐dielectric‐constant polyimide–silica nanocomposites. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 882–890, 2007     

Effect of organosilica isomers on the interfacial interaction in polyimide/aromatic organosilica hybrids

We report the effect of organosilica precursor isomers on the interfacial interaction between polyimide and organosilica in polyimide/organosilica hybrid composite films. Poly(4,4′‐oxydianiline biphenyltetracarboxamic acid) (BPDA‐ODA PAA) was used as the polyimide precursor, while the organosilica was made using o‐substituted, m‐substituted, and p‐substituted phenyl organosilica precursor isomers. For the preparation of precursor hybrid films, BPDA‐ODA PAA and organosilica precursors were mixed and then the organosilica precursors were converted to corresponding organosilica via sol–gel process. Finally, these precursor films were converted to corresponding polyimide/organosilica hybrid films by the thermal imidization of BPDA‐ODA PAA, which results in poly(4,4′‐oxydianiline biphenyltetracarboximide) (BPDA‐ODA PI). The polyimide/organosilica hybrid films were characterized using three distinctive nuclear magnetic resonance spectroscopies (¹H NMR, ¹³C‐CPMAS‐NMR, and ²⁹Si‐MAS‐NMR), wide‐angle X‐ray diffraction (WAXD), small‐angle X‐ray scattering (SAXS), and peel strength measurement. We found that the m‐substituted phenyl organosilica shows poorer interfacial interaction with BPDA‐ODA PI than do the o‐ or p‐substituted phenyl organosilicas. It was observed, however, that the peel strength of the hybrid films against an aluminum substrate increased with increasing contents of organosilicas, regardless of the nature of the organosilica isomers. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2507–2513, 2007     

Moisture-Resistant and Mechanically Strong Polyimide-Polymethylsilsesquioxane Hybrid Aerogels with Tunable Microstructure

Moisture-resistant and mechanically strong polyimide (PI)-polymethylsilsesquioxane hybrid aerogels with doubly cross-linked structures are synthesized through sol–gel technology and supercritical CO₂ fluid drying. By using bis(trimethoxysilylpropyl) amine as a cross-linker, the end-capped polyamide acid derived from biphenyl-3,3′,4,4′-tetracarboxylic dianhydride and 4,4′-oxydianiline is cross-linked with a silica network using methyltrimethoxysilane as the silica source precursor. The resultant hybrid aerogels show low density (0.12–0.15 g cm⁻³), low thermal conductivity (0.032–0.049 W m⁻¹ K⁻¹), high hydrophobicity (125–140°) and good thermal stability (above 435 °C) with tunable microstructure. With the increase of silica sol volume, the microstructure of hybrid aerogels transforms from fibrous network to hierarchical microstructure. Aerogels with high content of silica sol exhibit good moisture resistance, high Young's modulus (Max. 19.6 MPa), and high specific modulus (Max. 131 kN m kg⁻¹), which are attributed to their unique hierarchical microstructure with a sheet skeleton. These hybrid aerogels are promising in the fields of thermal insulation, aerospace applications and so on.     

Light‐colored fluorinated polyimides based on 2,5‐bis(4‐amino‐2‐trifluoromethylphenoxy)biphenyl and various aromatic dianhydrides

A novel trifluoromethyl‐containing aromatic diamine monomer, 2,5‐bis (4‐amino‐2‐trifluoromethylphenoxy)biphenyl (2), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and phenylhydroquinone in the presence of potassium carbonate to yield the intermediate dinitro compound (1), followed by catalytic reduction with hydrazine and Pd/C. A series of fluorinated polyimides (code 5a–f) were synthesized from diamine (2) with six commercially available aromatic dianhydrides using a standard two‐stage process with thermal or chemical imidization of poly(amic acid). Most of fluorinated polyimides showed good solubility at a concentration of 5–10 wt % and even in pyridine and dioxane. For improving solubility of 5c, copolyimides (5c/a–f) were also prepared from 2 and a pair of dianhydrides (3c/a–f), which were mixed in the molar ratio 1:1. All the polyimide films had a tensile strength in the range from 73 to 112 MPa, an elongation at break within a range of 9–23%, and an initial modulus in the range of 1.6–2.2 GPa. These polyimides exhibited glass transition temperatures of 220–267°C and showed no significant decomposition below 500°C under either nitrogen or air atmosphere. In comparison with the analogous nonfluorinated polyimides based on 2,5‐bis (4‐aminophenoxy) biphenyl (2′), the fluorinated polyimides showed better solubility as well as reduced color intensity, lower dielectric constant, and moisture absorption. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4101–4110, 2006     

Synthesis and properties of fluoro‐polyetherimides

A series of amorphous fluoro‐polyetherimides based on 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluropropane dianhydride (6FDA) and di‐ether‐containing diamines 4,4′‐bis(3‐aminophenoxy)diphenyl sulfone (m‐SED), 4,4′‐bis(4‐aminophenoxy)diphenyl sulfone (p‐SED), 4,4′‐bis(4‐aminophenoxy)diphenyl propane (BPADE) were synthesized. These melt processable polyetherimide polymers from p‐SED and BPADE showed excellent electrical properties. The dielectric constants, 2.74 and 2.65 at 10 MHz respectively, are lower than commercially available polyetherimide ULTEM® 1000, and polyimide Kapton® H films. In addition, we found that trifluoromethyl groups‐containing polyimides not only show extraordinary electrical properties, but they also exhibit excellent long‐term thermo‐oxidative stability and reduced water absorption relative to non‐fluorinated polyimides. The weight retention of these fluoro‐polyetherimides at 315°C for 300 h in air varies from 93% to 98%. Whereas, their moisture absorption at 100 RH at 50°C was in the range of 0.3% to 1.05%, which is much lower than those of Ultem 1000 and Kapton H. In the case of fluoro‐polyetherimides from p‐SED and m‐SED (para and meta isomers) diamines with ‘ether’ and sulfonyl (‐SO₂‐) spacer groups, the d‐spacing and T_g values decreased from 4.72Å to 4.56Å and 293°C to 244°C respectively. Similarly, the transparency of these polymer films (in the range of 80% to 90%) at 500 nm solar wavelength was higher than Ultem 1000 and Kapton H.     

Novel low‐dielectric‐constant copolyimide thin films composed with SiO2 hollow spheres

A series of copolyimide/SiO₂ hollow sphere thin films were prepared successfully based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and 9,9‐bis(4‐(4‐aminophenoxy)phenyl)fluorene (molar ratio = 3 : 1) as diamine, and 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride) as dianhydride, with different wt % SiO₂ hollow sphere powder with particle size 500 nm. Some films possessed excellent dielectric properties, with ultralow dielectric constants of 1.8 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared spectra, scanning electron microscope, thermogravimetric analysis, and dynamic mechanical thermal analysis. The polyimide (PI) films exhibited glass‐transition temperatures in the range of 209– 273°C and possessed initial thermal decomposition temperature reaching up to 413–477°C in air and 418–472°C in nitrogen. Meanwhile, the composite films were also exhibited good mechanical properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis of highly transparent and heat‐resistant polyimides containing bulky pendant moieties

A new diamine with bulky pendant biphenyl and ortho‐position dimethyl structures, 4,4′‐((1,1′‐biphenyl)‐4‐ylmethylene)bis(2,6‐dimethylaniline), was synthesized via a one‐pot reaction of 4‐biphenyl carboxaldehyde and 2,6‐dimethylaniline. The diamine was employed to polymerize with several dianhydrides via one‐step condensation under high‐temperature conditions. The light yellow or colorless polyimide (PI) films obtained were found to have cut‐off wavelengths in the range 286–358 nm and transmittance over 80% in the visible region (400–780 nm). Meanwhile, these PIs possessed excellent solubility in common organic solvents, even in low‐boiling‐point solvents such as chloroform (CHCl₃), dichloromethane (CH₂Cl₂) and tetrahydrofuran. The glass transition temperatures (T_g) of the PIs were determined to exceed 343 °C, even to 456 °C. All PI films were flexible with a tensile strength of 78–119 MPa, a Young's modulus of 2.0–2.5 GPa and elongation at break of 4.0%–8.2%. Therefore, these colorless PIs can be used as candidate materials for flexible display substrates. © 2019 Society of Chemical Industry     

Synthesis and thermal,mechanical and gas permeation properties of aromatic polyimides containing different linkage groups

Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry     

Resistive switching characteristics of polyimides derived from 2,2′‐aryl substituents tetracarboxylic dianhydrides

2,2′‐Position aryl‐substituted tetracarboxylic dianhydrides including 2,2′‐bis(biphenyl)‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride and 2,2′‐bis[4‐(naphthalen‐1‐yl)phenyl)]‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride were synthesized. A new series of aromatic polyimides (PIs) were synthesized via a two‐step procedure from 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride and the newly synthesized tetracarboxylic dianhydrides monomers reacting with 2,2′‐bis[4′‐(3″,4″,5″‐trifluorophenyl)phenyl]‐4,4′‐biphenyl diamine. The resulting polymers exhibited excellent organosolubility and thermal properties associated with T_g at 264 °C and high initial thermal decomposition temperatures (T_5%) exceeding 500 °C in argon. Moreover, the fabricated sandwich structured memory devices of Al/PI‐a/ITO was determined to present a flash‐type memory behaviour, while Al/PI‐b/ITO and Al/PI‐c/ITO exhibited write‐once read‐many‐times memory capability with different threshold voltages. In addition, Al/polymer/ITO devices showed high stability under a constant stress or continuous read pulse voltage of ? 1.0 V. Copyright © 2011 Society of Chemical Industry     

Synthesis and characterization of organosoluble and transparent polyimides derived from trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride

A novel dianhydride, trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride (1,2‐CHDPA), was prepared through aromatic nucleophilic substitution reaction of 4‐nitrophthalonitrile with trans‐cyclohexane‐1,2‐diol followed by hydrolysis and dehydration. A series of polyimides (PIs) were synthesized from one‐step polycondensation of 1,2‐CHDPA with several aromatic diamines, such as 2,2′‐bis(trifluoromethyl)biphenyl‐4,4′‐diamine (TFDB), bis(4‐amino‐2‐trifluoromethylphenyl)ether (TFODA), 4,4′‐diaminodiphenyl ether (ODA), 1,4‐bis(4‐aminophenoxy)benzene (TPEQ), 4,4′‐(1,3‐phenylenedioxy)dianiline (TPER), 2,2′‐bis[4‐(3‐aminodiphenoxy)phenyl]sulfone (m‐BAPS), and 2,2′‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]sulfone (6F‐BAPS). The glass transition temperatures (T_gs) of the polymers were higher than 198°C, and the 5% weight loss temperatures (T_d5%s) were in the range of 424–445°C in nitrogen and 415–430°C in air, respectively. All the PIs were endowed with high solubility in common organic solvents and could be cast into tough and flexible films, which exhibited good mechanical properties with tensile strengths of 76–105 MPa, elongations at break of 4.7–7.6%, and tensile moduli of 1.9–2.6 GPa. In particular, the PI films showed excellent optical transparency in the visible region with the cut‐off wavelengths of 369–375 nm owing to the introduction of trans‐1,2‐cyclohexane moiety into the main chain. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42317.     

Hydroquinone Based Sulfonated Copolytriazoles with Enhanced Proton Conductivity

A series of new fluorinated sulfonated copolytriazoles (PTHQSH‐XX) with ion exchange capacity (IEC_w) values ranging from 1.66 to 2.82 meq g⁻¹ are prepared via cuprous ion catalyzed azide‐alkyne click polymerization reaction between 1,4‐bis(prop‐2‐ynyloxy)benzene, 4,4′‐diazido‐2,2′‐stilbene disulfonic acid disodium salt (SA), and 4,4‐bis[3′‐trifluoromethyl‐4′(4‐azidobenzoxy) benzyl] biphenyl (QAZ). The degree of sulfonation of the copolytriazoles is adjusted between 60% and 90% by varying the molar ratio of sulfonated monomer (SA) to the nonsulfonated monomer (QAZ). The structure of the copolytriazoles is characterized by Fourier transform infrared and NMR spectroscopy. The solution‐cast membranes of these copolymers exhibit high thermal, mechanical, oxidative and hydrolytic stability, and high proton conductivity (19–142 mS cm⁻¹ at 80 °C and 22–157 mS cm⁻¹ at 90 °C). Transmission electron microscopy confirms the formation of good phase separated morphology with ionic clusters in the range of 15–145 nm.     

Preparation and properties of polyimide/silica hybrid composites based on polymer‐modified colloidal silica

A new type of polyimide/silica (PI/SiO₂) hybrid composite films was prepared by blending polymer‐modified colloidal silica with the semiflexible polyimide. Polyimide was solution‐imidized at higher temperature than the glass transition temperature (T_g) using 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐diaminodiphenyl ether (ODA). The morphological observation on the prepared hybrid films by scanning electron microscopy (SEM) pointed to the existence of miscible organic–inorganic phase, which resulted in improved mechanical properties compared with pure PI. The incorporation of the silica structures in the PI matrix also increased both T_g and thermal stability of the resulting films. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2053–2061, 2006     

New polymer syntheses: XV. Synthesis and characterization of new polyketoamine polymers containing ether or thioether linkages in the main chain

An interesting new class of linear polyketoamine polymers containing ether or thioether linkages in the main chain has been synthesized by solution polycondensation of 4,4′‐bis(chloroacetyl)diphenyl ether ( I ), 4,4′‐bis(chloroacetyl)diphenyl sulfide ( II ) and 4,4′‐bis(chloroacetyl)diphenyl sulfone ( III ) with various aliphatic and aromatic diamines. The model compounds IV, V and VI were synthesized from the monomers I, II and III with aniline in dry benzene and their structures were confirmed by elemental and spectral analyses. The resulting polymers were characterized by elemental and spectral analyses, as well as by solubility and viscometry measurements. The thermal properties were evaluated by TGA and DSC and correlated to their structural units. X‐ray analysis showed that the polymers had some degree of crystallinity in the region 2θ = 5° to 60°. The UV‐visible spectra of some selected polymers were measured in dimethylsulfoxide (DMSO) solution and showed absorption bands in the range 260–475 nm, due to n–π* and π–π* transition. In addition, the morphological properties of selected examples were tested by SEM, and the electrical properties of these polymers were measured. Copyright © 2005 Society of Chemical Industry     

Comparative study of silicon‐containing polyimides from different oxydianilines

Silicon‐containing polyimides were synthesized by solution polycondensation of bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride with 3,4‐oxydianiline and 4,4′‐oxydianiline, respectively. All the poly(amic acid) films could be obtained by solution‐casting from N,N‐dimethylacetamide solutions and thermally converted into transparent and tough polyimide films. The physical properties of thin films of those polyimides were compared by DSC, TGA, UV–visible spectroscopy, and dynamic mechanical analysis. The polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 3,4‐oxydianiline exhibited superior energy‐damping characteristic, mechanical properties, and optical transparency, whereas that from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 4,4′‐oxydianiline possessed higher glass‐transition temperature and thermal stability. Because of the unsymmetric structure of the polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 3,4‐oxydianiline, its increasing rate of linear coefficient of thermal expansion with temperature was quicker than that of the polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 4,4′‐oxydianiline. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 2363–2367, 2004