Effect of microencapsulated curing agents on the curing behavior for diglycidyl ether of bisphenol A epoxy resin systems

Microcapsules containing a curing agent, 2‐phenyl imidazole (2PZ), for a diglycidyl ether of bisphenol A (DGEBA) epoxy resin were prepared by a solid‐in‐oil‐in‐water emulsion solvent evaporation technique with poly(methyl methacrylate) (PMMA) as a polymeric wall. The mean particle size of the microcapsules and the concentration of 2PZ were about 10 μm and nearly 10 wt %, respectively. The onset cure temperature and peak temperature of the DGEBA/2PZ–PMMA microcapsule system appeared to increase by nearly 30 and 10°C, respectively, versus those of the DGEBA/2PZ system because of the increased reaction energy of curing. The former could take more than 3 months at room temperature, whereas the latter was cured after only a week. The values of the reaction order (a curing kinetic parameter) for DGEBA/2PZ and DGEBA/2PZ–PMMA microcapsules were quite close, and this showed that the curing reactions of the two samples proceeded conformably. The curing mechanism was investigated, and a two‐step initiation mechanism was considered: the first was assigned to adduct formation, whereas the second was due to alkoxide‐initiated polymerization. The glass‐transition temperature of DGEBA/2PZ was 165.2°C, nearly 20°C higher than the glass‐transition temperatures of DGEBA/2PZ–PMMA microcapsules and DGEBA/2PZ/PMMA microspheres, as determined by differential scanning calorimetry measurements. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Effect of curing order on the curing kinetics and morphology of bisGMA/DGEBA interpenetrating polymer networks

The curing kinetics and morphology of an interpenetrating polymer network (IPN) formed from an epoxy resin (DGEBA) cured by an imidazole (1‐MeI) and a dimethacrylate resin (bisGMA), cured by low‐ and high‐temperature peroxide initiators (TBPEH and DHPB, respectively) have been studied by temperature‐ramping DSC, isothermal near‐infrared (NIR), DMTA and small‐angle neutron scattering (SANS). bisGMA and DGEBA are polar and chemically similar thermosetting resins which should enhance the miscibility of their IPNs. The phase structure was controlled by varying the curing procedure: the order of gelation of the components is dependent on the choice of low‐ and high‐temperature initiators for bisGMA and this affects the morphology formation. In the cure of the bisGMA/TBPEH:DGEBA/1‐MeI system, the dimethacrylate cures first. For isothermal cure studies at 80 °C, the final conversion of the epoxy is reduced by high crosslinking of the methacrylate groups in the IPN causing vitrification before full cure. The dimethacrylate conversion is enhanced due to plasticisation with unreacted DGEBA, and its cure rate is increased due to accelerated decomposition of TBPEH initiator by 1‐MeI. SANS revealed that phase separation occurs in these IPNs with domains on the scale of 6–7 nm. In the cure of the bisGMA/DHBP:DGEBA/1‐MeI system, the epoxy cures at a similar rate to that of the methacrylate groups. For isothermal cure studies at 80 °C, similar final conversions of the epoxy have been observed except for the 75:25 IPN. The cure rate of the methacrylate groups in the IPN is increased also due to accelerated decomposition of DHBP initiator by 1‐MeI, and the extent of accelerated decomposition for DHBP is stronger than that in the TBPEH‐based systems. SANS studies revealed that this system is more homogeneous due to the rapid formation of the dimethacrylate gel in the presence of the preformed epoxy network which interlocks the networks at low degrees of methacrylate conversion. Copyright © 2006 Society of Chemical Industry     

Acetone—Formaldehyde—Phenol based IPNs for Glass Fibre Reinforced Composite Applications

Abstract

Three component IPNs Glass fibre reinforced composites (GRC) have been prepared from acetone-formaldehyde-phenol (AF-P) resin, Diglycedyl ether of bisphenol-A (DGEBA) (a commercial epoxy resin) and methyl methacrylate (MMA) (a vinyl monomer). The curing catalyst hexamethylene tetramine (HMTA) for AF-P, radical initiators 2,2′-azobisisobutyronitrile (AIBN) for MMA and curing catalyst 4,4′-diamino diphenyl methane (DDM) for epoxy resin were employed. All the IPN GRCs were characterized in terms of their resistance to chemical reagents, thermal behaviour (DSC, TGA) and mechanical properties.     

Synthesis and characterization of high performance,transparent interpenetrating polymer networks with polyurethane and poly(methyl methacrylate)

Transparent, interpenetrating polymer network (IPN) materials were synthesized using polyurethane (PU) and poly(methyl methacrylate) (PMMA). PMMA contributed to the transparency and rigidity necessary for use in impact‐resistant applications, whereas PU contributed to toughness. Several factors affecting the physical properties, such as the ratio of PU to PMMA, curing profile, inclusion of different isocyanates for the PU phase, and use of an inhibitor in the PMMA phase, were investigated. Full‐IPNs were synthesized so that the two polymer networks would remain entangled with one another, and domain sizes of each system were reduced, mitigating phase separation. Both simultaneous IPNs, polymerization of monomers occurring at the same time, and sequential IPNs, polymerization of monomers occurring at different temperatures, were synthesized for studying the reaction kinetics and final morphologies. The phase morphology and the final thermal and mechanical properties of the IPNs prepared were evaluated. Findings suggest that samples containing ～80 wt% PMMA, 1,6‐diisocyanatohexane 99+% (DCH), and an inhibitor with the MMA monomer created favorable results in the thermo‐mechanical and optical properties. POLYM. ENG. SCI. 2013. © 2012 Society of Plastics Engineers     

Blends of epoxy resins and polyphenylene oxide as processing aids and toughening agents 2: Curing kinetics,rheology, structure and properties

The curing behaviour, chemorheology, morphology and dynamic mechanical properties of epoxy ? polyphenylene oxide (PPO) blends were investigated over a wide range of compositions. Two bisphenol A based di‐epoxides ? pure and oligomeric DGEBA ? were used and their cure with primary, tertiary and quaternary amines was studied. 4,4′‐methylenebis(3‐chloro‐2,6‐diethylaniline) (MCDEA) showed high levels of cure and gave the highest exotherm peak temperature, and so was chosen for blending studies. Similarly pure DGEBA was selected for blending due to its slower reaction rate because of the absence of accelerating hydroxyl groups. For the PPO:DGEBA340/MCDEA system, the reaction rate was reduced with increasing PPO content due to a dilution effect but the heat of reaction were not significantly affected. The rheological behaviour during cure indicated that phase separation occurred prior to gelation, followed by vitrification. The times for phase separation, gelation and vitrification increased with higher PPO levels due to a reduction in the rate of polymerization. Dynamic mechanical thermal analysis of PPO:DGEBA340/MCDEA clearly showed two glass transitions due to the presence of phase separated regions where the lower T_g corresponded to an epoxy‐rich phase and the higher T_g represented the PPO‐rich phase. SEM observations of the cured PPO:DGEBA340/MCDEA blends revealed PPO particles in an epoxy matrix for blends with 10 wt% PPO, co‐continuous morphology for the blend with 30 wt% PPO and epoxy‐rich particles dispersed in a PPO‐rich matrix for 40wt% and more PPO. © 2014 Society of Chemical Industry     

Poly(ethylene‐co‐vinyl acetate)‐graft‐poly(methyl methacrylate) (EVA‐graft‐PMMA) as a modifier of epoxy resins

Conventional approaches to toughen thermosets are: (1) the polymerization‐induced phase separation of a rubber or a thermoplastic, or (2) the use of a dispersion of preformed particles in the initial formulation. In the present study it is shown that it is possible to combine both techniques by using graft copolymers with one of the blocks being initially immiscible and the other that phase separates during polymerization. This is illustrated by the use of poly(ethylene‐co‐vinyl acetate)‐graft‐poly(methyl methacrylate) (EVA‐graft‐PMMA) as modifier of an epoxy resin. EVA is initially immiscible and PMMA phase separates during polymerization. Blends of an epoxy monomer based on diglycidylether of bisphenol A (DGEBA, 100 parts by weight), piperidine (5 parts by weight), and PMMA (5 parts by weight), showed the typical polymerization‐induced phase separation of PMMA‐rich domains before gelation of the epoxy network. Replacing PMMA by EVA‐graft‐PMMA (5 parts by weight), yielded stable dispersions of EVA blocks, favoured by the initial solubility of PMMA blocks. Phase separation of PMMA blocks in the course of polymerization led to a dispersion of in situ generated biphasic particles (plausibly composed of EVA cores surrounded by PMMA shells), with average diameters varying from 0.3 to 0.6 µm with the cure temperature. This procedure may be used to generate stable dispersions of biphasic particles for toughening purposes. © 2002 Society of Chemical Industry     

Poly(methyl methacrylate)–epoxy vitrimer composites

In this study, we synthesized poly(methyl methacrylate) (PMMA) epoxy vitrimer composites by doping methyl methacrylate (MMA) and benzoyl peroxide into a curing system of epoxy resin and citric acid. The vitrimer composites were characterized with dynamic mechanical thermal analysis, scanning electron microscopy, and stress‐relaxation and lap‐shear testing. The test results show that with increasing amount of MMA, the existence of PMMA in the epoxy vitrimer matrix in the form of intermiscible, slightly soluble, and phase separation became more evident. When the doping amount of PMMA reached 10–25 wt %, the bonding strength of the PMMA–epoxy vitrimer composites was about two times that of the epoxy vitrimer (from 2.3 to 4.3 MPa). This showed that the self‐healing strength of the vitrimer composites was better than that of the pure vitrimer. When the PMMA in the epoxy matrix was in a slightly soluble form, the linear PMMA improved the mechanical properties of the epoxy vitrimer by physical winding. At the same time, the doping of PMMA promoted the transesterification rate of the epoxy vitrimer and enhanced the bonding strength of the composites without lowering the epoxy vitrimer glass‐transition temperature. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46307.     

Layered silicate nanocomposites based on various high‐functionality epoxy resins: The influence of an organoclay on resin cure

The influence of an organically modified clay on the curing behavior of three epoxy systems widely used in the aerospace industry and of different structures and functionalities was studied. Diglycidyl ether of bisphenol A (DGEBA), triglycidyl p‐amino phenol (TGAP) and tetraglycidyl diamino diphenylmethane (TGDDM) were mixed with an octadecyl ammonium ion modified organoclay and cured with diethyltoluene diamine (DETDA). The techniques of dynamic mechanical thermal analysis (DMTA), chemorheology and differential scanning calorimetry (DSC) were applied to investigate gelation and vitrification behavior, as well as catalytic effects of the clay on resin cure. While the formation of layered silicate nanocomposite based on the bifunctional DGEBA resin has been previously investigated to some extent, this paper represents the first detailed study of the cure behavior of different high performance, epoxy nanocomposite systems.     

A novel approach to interpenetrating networks of epoxy resin and polydimethylsiloxane

A novel methodology for preparing interpenetrating polymer networks (IPNs) between an epoxy resin, diglycidylether of bisphenol A (DGEBA) and polydimethylsiloxane (PDMS) was proposed. The vinyl‐terminated PDMS (vinyl‐PDMS) was partially crosslinked with hydrogen‐containing PDMS (H‐PDMS) and was mixed with DGEBA, modified silica (m‐silica), and a methyl tetrahydrophtalic anhydride (MTHPA) curing agent. Subsequently, the curing reactions of the DGEBA/m‐silica and PDMS were allowed to occur separately and simultaneously leading to an IPN. The m‐silica played a double‐fold role: Cocuring with DGEBA and H‐bonding with the oxygen atoms on the PDMS segments, and thus acted as a compatibilizer between DGEBA and PDMS and promoted the generation of the IPN structure. The resulted partially miscible structure was characterized through the dispersion of silica particles and the glass transition behavior of the samples. The mechanical properties of the IPNs were also investigated. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Comparison of the curing kinetics of a DGEBA/acid anhydride epoxy resin system using differential scanning calorimetry and a microwave‐heated calorimeter

The cure of an epoxy resin system, based upon a diglycidyl ether of bisphenol‐A (DGEBA) with HY917 (an acid anhydride hardener) and DY073 (an amine–phenol complex that acted as an accelerator), was investigated using a conventional differential scanning calorimeter and a microwave‐heated power‐compensated calorimeter. Dynamic cure of the epoxy resin using four different heating rates and isothermal cure using four different temperatures were carried out and the degree of cure and reaction rates were compared. The cure kinetics were analyzed using several kinetics models. The results showed different activation energies for conventional and microwave curing and suggested different reaction mechanisms were responsible for curing using the two heating methods. Resins cured using conventional heating showed higher glass transition temperatures than did those cured using microwave heating. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 2054–2063, 2007     

含氟环氧丙烯酸酯树脂固化动力学研究

采用甲基丙烯酸甲酯(MMA)、甲基丙烯酸缩水甘油酯(GMA)、丙烯酸六氟丁酯(F6BA),通过溶液聚合法制备了含氟环氧丙烯酸酯树脂P(MMA/GMA/F6BA)。采用DSC研究了以己二酸为固化剂的固化反应,确定固化反应动力学方程和固化反应级数;采用FTIR跟踪固化反应过程,确定固化反应时间。     

Curing and mechanical properties of dicyanate/poly(ether sulfone) semi‐interpenetrating polymer networks

Semi‐interpenetrating polymer networks (semi‐IPNs) composed of a dicyanate resin and a poly(ether sulfone) (PES) were prepared, and their curing behavior and mechanical properties were investigated. The curing behavior of the dicyanate/PES semi‐IPN systems catalyzed by an organic metal salt was analyzed. Differential scanning calorimetry was used to study the curing behavior of the semi‐IPN systems. The curing rate of the semi‐IPN systems decreased as the PES content increased. An autocatalytic reaction mechanism was used to analyze the curing reaction of the semi‐IPN systems. The glass‐transition temperature of the semi‐IPNs decreased with increasing PES content. The thermal decomposition behavior of the semi‐IPNs was investigated. The morphology of the semi‐IPNs was investigated with scanning electron microscopy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 1079–1084, 2003     

Chemorheology of thermosetting resins. III. Effect of low-profile additive on the chemorheology and curing kinetics of unsaturated polyester resin

An experimental study was conducted to investigate the effect of low-profile thermoplastic additives on the rheological behavior during cure and the curing kinetics of unsaturated polyester resin. For the study, a general-purpose polyester resin was used and two different types of thermoplastic additive, poly(vinyl acetate) (PVAc) and poly(methyl methacrylate) (PMMA), were used as low-profile additives. It has been found that, during cure, the resin/PMMA system exhibits shearthinning behavior even before the cure time reaches the critical value tη∞ whereas the resin/PVAc system does not. Also, both PVAc and PMMA help reduce the shrinkage of the resin during cure. However, our study shows that shrinkage control becomes effective only when the shear rate is greater than a certain critical value. The curing behavior determined with the aid of differential scanning calorimetry (DSC) shows that the rate of cure and the final degree of cure are decreased when the amount of low-profile additive is increased.     

Reaction kinetics,thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with p‐phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T_g and thermal degradation temperature. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Poly(methyl methacrylate)‐modified epoxy/amine system for reactive rotational moulding: crosslinking kinetics and rheological properties

BACKGROUND: The rotational moulding of thermosetting resins is hampered by their low viscosity and the abrupt increase in their viscosity as they polymerize. This study investigates the use of poly(methylmethacrylate) (PMMA) as a rheological processing aid in reactive blends of an aromatic diepoxy resin (diglycidyl ether of bisphenol‐A, DGEBA) and an aromatic diamine (diethyltoluenediamine, DETDA) by studying the miscibility, curing, rheology, dynamic properties and morphology of the uncured solutions and of the resulting highly crosslinked polymer blends. RESULTS: The PMMA was miscible in the uncured resins as expected from consideration of their solubility parameters, and the effect of PMMA concentration on the glass transition temperature, measured via differential scanning calorimetry (DSC), was fitted to several models. Addition of PMMA significantly increased the viscosity of the uncured blend which obeyed the log‐additivity rule. The curing behaviour was monitored using DSC, infrared spectroscopy and dynamic rheology and it was found that addition of PMMA caused a small reduction in rate due to a dilution effect. The dynamic and steady shear rheologies were used to determine the gel point and gel relaxation index. Dynamic mechanical thermal analysis provided evidence for phase separation of the components into PMMA‐rich domains and an epoxy‐rich matrix and this was confirmed with electron microscopy studies. CONCLUSION: These results indicate that addition of small amounts of PMMA to DGEBA/DETDA enlarges the processing window with regards to the rotational moulding of thermosets. In addition, the blending of small amounts (ca 10 wt%) of PMMA with the DGEBA/DETDA resin appears to cause only a modest sacrifice in thermal resistance. Copyright © 2009 Society of Chemical Industry     

Kinetic of epoxy resin formation by high‐performance liquid chromatography

This article is focused on the following of the cure of an epoxy resin by high‐performance liquid chromatography (HPLC) and the comparison of the data obtained with those obtained by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) techniques usually employed for characterize curing processes. A reversed‐phase HPLC method with UV detection is developed to study the kinetic of the curing reaction of diglycidyl ether of bisphenol A (DGEBA) with 1,3‐cyclohexanebismethylamine (1,3‐BAC) at 60, 70, and 80°C, before and after gelation. The limits of quantification obtained permit the application of the proposed method until the last steps of the formation kinetic. HPLC and DSC analysis show a good correlation. The gel conversions obtained by HPLC and DMA agree well. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 497–504, 2003     

Cure behavior of epoxy resin containing castor oil and cashew nut shell liquid and its derivative

The cure behavior of epoxy resin with a conventional amide‐type hardener (HD) was investigated in the presence of castor oil (CO), cashew nut shell liquid (CNSL), and cashew nut shell liquid–formaldehyde resin (CFR) with dynamic differential scanning calorimetry (DSC). The activation energy of the curing reaction was also calculated on the basis of nonisothermal DSC thermograms at various heating rates. A one‐stage curing was noted in the case of epoxy resin filled with CO, whereas the epoxy resin with CNSL and CFR showed a two‐stage curing process. A competitive cure reaction was noted for the epoxy resin/CNSL(or CFR)/HD blends. In the absence of HD, CFR showed lower values of curing enthalpy than that of CNSL. The activation energy of epoxy resin curing increased with increasing CNSL and CFR loading. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Characterization of the cure‐state of DGEBA‐DDS epoxy using ultrasonic,dynamic mechanical,and thermal probes

Three experimental techniques were used to characterize the cure state of an epoxy resin system of DGEBA epoxide and DDS diamine curing agent. Samples were prepared from non‐stoichiometric monomer mixtures designed so as to simulate various stages of cure of a stoichiometrically prepared epoxy. Such an approach allows for variable temperature characterization of specimens without concern for ongoing chemical reactions that would cloud interpretation of results. Additional experiments were performed on stoichiometric samples that were isothermally cured. Differential scanning calorimetry (DSC) was used to measure the heat of reaction and glass transition temperature. Dynamic mechanical analysis (DMA) was used to measure complex modulus, while ultrasonic cure monitoring (UCM) was used to measure longitudinal velocity throughout cure. DSC analysis was found to be insensitive to changes occurring at the latter stage of polymer network development, especially after vitrification. DMA characterization, however, was found to be quite sensitive to the rubbery modulus (and as such, the cure state), but is limited to cure states above gelation. Only the UCM technique was robust enough to accommodate all cure states while providing highly sensitive measurements of mechanical property development.     

Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003