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1.
Three novel polyimides (PIs) having pendent 4‐(quinolin‐8‐yloxy) aniline group were prepared by polycondensation of a new diamine with commercially available tetracarboxylic dianhydrides, such as pyromellitic dianhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and bicyclo[2.2.2]‐oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride. These PIs were characterized by FTIR, 1H NMR, and elemental analysis; they had high yields with inherent viscosities in the range of 0.4–0.5 dl g−1, and exhibited excellent solubility in many organic solvents such as N,N‐dimethyl acetamide, N,N′‐dimethyl formamide, N‐methyl pyrrolidone (NMP), dimethyl sulfoxide, and pyridine. These PIs exhibited glass transition temperatures (Tg) between 250 and 325° C. Their initial decomposition temperatures (Ti) ranged between 270 and 450°C, and 10% weight loss temperature (T10) up to 500°C with 68% char yield at 600°C under nitrogen atmosphere. Transparent and hard polymer films were obtained via casting from their NMP solutions. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011  相似文献   

2.
To investigate the CF3 group affecting the coloration and solubility of polyimides (PI), a novel fluorinated diamine 1,1‐bis[4‐(4‐amino‐2‐ trifluoromethylphenoxy)phenyl]‐1‐phenylethane (2) was prepared from 1,1‐ bis(4‐hydrophenyl)‐1‐phenylethan and 2‐chloro‐5‐nitrobenzotrifluoride. A series of light‐colored and soluble PI 5 were synthesized from 2 and various aromatic dianhydrides 3a–f using a standard two‐stage process with thermal 5a– f(H) and chemical 5a–f(C) imidization of poly(amic acid). The 5 series had inherent viscosities ranging from 0.55 to 0.98 dL/g. Most of 5a–f(H) were soluble in amide‐type solvents, such as N‐methyl‐2‐pyrrolidone (NMP), N,N‐ dimethylacetamide (DMAc), and N,N‐dimethylformamide (DMF), and even soluble in less polar solvents, such as m‐Cresol, Py, Dioxane, THF, and CH2Cl2, and the 5(C) series was soluble in all solvents. The GPC data of the 5a–f(C) indicated that the Mn and Mw values were in the range of 5.5–8.7 × 104 and 8.5–10.6 × 104, respectively, and the polydispersity index (PDI) Mw /Mn values were 1.2–1.5. The PI 5 series had excellent mechanical properties. The glass transition temperatures of the 5 series were in the range of 232–276°C, and the 10% weight loss temperatures were at 505–548 °C in nitrogen and 508–532 °C in air, respectively. They left more than 56% char yield at 800°C in nitrogen. These films had cutoff wavelengths between 356.5–411.5 nm, the b* values ranged from 5.0–71.1, the dielectric constants, were 3.11–3.43 (1MHz) and the moisture absorptions were in the range of 011–0.40%. Comparing 5 containing the analogous PI 6 series based on 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐ phenylethane (BAPPE), the 5 series with the CF3 group showed lower color intensity, dielectric constants, and better solubility. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2399–2412, 2005  相似文献   

3.
A new diacid containing optically active functional groups, N,N′‐(4,4′‐diphthaloyl)‐bis‐L ‐leucine diacid ( 3 ), was synthesized and used in a preparation of a series of poly(amide‐imide)s (PAIs) by direct polycondensation with various aromatic diamines in N‐methyl‐2‐pyrrolidinone (NMP). All polymers derived from diacid ( 3 ) were highly organosoluble in the solvents like N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, N,N‐dimethylformamide, dimethyl sulfoxide, tetrahydrofuran, γ‐butyrolactone, cyclohexanone, and chloroform at room temperature or upon heating. Inherent viscosities of the PAIs were found to range between 0.34 and 0.61·dL g?1. All the PAIs afforded flexible and tough films. The glass‐transition temperatures of these PAIs were recorded between 212 and 237°C by differential scanning calorimetry, and the 10% weight loss temperatures were ranging from 372 to 393°C and 336–372°C under nitrogen and air, respectively. The polyimide films had a tensile strength in the range of 63–88 MPa and a tensile modulus in the range of 1.2–1.7 GPa. Optically active PAIs exhibited specific rotations in the range of ?10.58° to ?38.70°. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007  相似文献   

4.
A series of copolyimide/SiO2 hollow sphere thin films were prepared successfully based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and 9,9‐bis(4‐(4‐aminophenoxy)phenyl)fluorene (molar ratio = 3 : 1) as diamine, and 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride) as dianhydride, with different wt % SiO2 hollow sphere powder with particle size 500 nm. Some films possessed excellent dielectric properties, with ultralow dielectric constants of 1.8 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared spectra, scanning electron microscope, thermogravimetric analysis, and dynamic mechanical thermal analysis. The polyimide (PI) films exhibited glass‐transition temperatures in the range of 209– 273°C and possessed initial thermal decomposition temperature reaching up to 413–477°C in air and 418–472°C in nitrogen. Meanwhile, the composite films were also exhibited good mechanical properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011  相似文献   

5.
A new kind of pyridine‐containing aromatic diamine monomer, 4‐phenyl‐2,6‐bis[4‐(4‐aminophenoxy)phenyl]‐pyridine (PAPP), was successfully synthesized by a modified chichibabin reaction of benzaldehyde and a substituted acetophenone, 4‐(4‐nitrophenoxy)‐acetophenone (NPAP), followed by a reduction of the resulting dinitro compound 4‐phenyl‐2,6‐bis[4‐(4‐nitrophenoxy)phenyl]‐pyridine (PNPP) with Pd/C and hydrazine monohydrate. The aromatic diamine was employed to synthesize a series of new pyridine‐containing polyimides by polycondensation with various aromatic dianhydrides in N‐methy‐2‐pyrrolidone (NMP) via the conventional two‐step method, i.e., ring‐opening polycondensation forming the poly (amic acid)s and further thermal or chemical imidization forming polyimides. The inherent viscosities of the resulting polyimides were in the range of 0.79–1.13 dL/g, and most of them were soluble in common organic solvents such as N,N‐dimethylacetamide (DMAc), NMP, and tetrahydrofuran (THF), etc. Meanwhile, strong and flexible polyimide films were obtained, which had good thermal stability, with the glass transition temperatures (Tg) of 268–338°C and the temperature at 5% weight loss of 521–548°C in air atmosphere, as well as outstanding mechanical properties with tensile strengths of 89.2–112.1 MPa and elongations at break of 9.5–15.4%. The polyimides also were found to possess low dielectric constants ranging from 2.53 to 3.11. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 212–219, 2007  相似文献   

6.
A novel bismaleimide, 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl, containing noncoplanar 2,2′‐dimethylbiphenylene and flexible ether units in the polymer backbone was synthesized from 2,2′‐dimethyl‐4,4′‐bis(4‐aminophenoxy)biphenyl with maleic anhydride. The bismaleimide was reacted with 11 diamines using m‐cresol as a solvent and glacial acetic acid as a catalyst to produce novel polyaspartimides. Polymers were identified by elemental analysis and infrared spectroscopy, and characterized by solubility test, X‐ray diffraction, and thermal analysis (differential scanning calorimetry and thermogravimetric analysis). The inherent viscosities of the polymers varied from 0.22 to 0.48 dL g−1 in concentration of 1.0 g dL−1 of N,N‐dimethylformamide. All polymers are soluble in N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide, dimethylsulfoxide, pyridine, m‐cresol, and tetrahydrofuran. The polymers, except PASI‐4, had moderate glass transition temperature in the range of 188°–226°C and good thermo‐oxidative stability, losing 10% mass in the range of 375°–426°C in air and 357°–415°C in nitrogen. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 279–286, 1999  相似文献   

7.
A series of new, organosoluble, and light‐colored poly(amide imide imide)s were synthesized from tetraimide dicarboxylic acid ( I ) and various aromatic diamines by direct polycondensation with triphenyl phosphite and pyridine as condensing agents. I was prepared by the azeotropic condensation of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, m‐aminobenzoic acid, and 4,4′‐oxydianiline at a 2/2/1 molar ratio in N‐methyl‐2‐pyrrolidone (NMP)/toluene. The thin films cast from N,N‐dimethylacetamide (DMAc) had cutoff wavelengths shorter than 400 nm (365–394 nm) and color coordinate b* values between 13.10 and 36.07; these polymers were lighter in color than the analogous poly(amide imide)s and isomeric polymers. All of the polymers were readily soluble in a variety of organic solvents, including NMP, DMAc, N,N‐dimethylformamide, dimethyl sulfoxide, and even less polar dioxane and tetrahydrofuran. The cast films exhibited tensile strengths of 90–104 MPa, elongations at break of 7–22%, and initial moduli of 1.9–2.4 GPa. The glass‐transition temperatures of the polymers were recorded at 274–319°C. They had 10% weight losses at temperatures beyond 520°C and left more than a 50% residue even at 800°C in nitrogen. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 669–679, 2003  相似文献   

8.
A series of aromatic copolyethers containing 1,3,4‐oxadiazole rings and fluorene groups was prepared by nucleophilic substitution polymerization technique of 9,9‐bis(4‐hydroxyphenyl)fluorene, 1 , or of different amounts of 1 and an aromatic bisphenol, such as 4,4′‐isopropylidenediphenol or phenolphthalein, with 2,5‐bis(p‐fluorophenyl)‐1,3,4‐oxadiazole. The polymers were easily soluble in polar solvents like N‐methylpyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide, and chloroform and can be cast from solutions into thin flexible films. They showed high thermal stability, with decomposition temperature being above 425°C. The polymers exhibited a glass‐transition temperature in the range of 195–295°C, with a reasonable interval between glass‐transition and decomposition temperature. Electrical insulating properties of some polymer films were evaluated on the basis of dielectric constant and dielectric loss and their variation with frequency and temperature. The values of the dielectric constant at 10 kHz and 20°C were in the range of 3.16–3.25. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

9.
A new kind of aromatic unsymmetrical diamine monomer containing thiazole ring, 2‐amino‐5‐(4‐aminophenyl)‐thiazole (AAPT), was synthesized. A series of novel polyimides were prepared by polycondensation of AAPT with various aromatic dianhydrides by one‐step polyimidation process. The synthesized polyimides had inherent viscosity values of 0.36–0.69 dL/g and were easily dissolved in highly dipolar solvents. Meanwhile, strong and flexible polyimide films were obtained, which have good thermal and thermo‐oxidative stability with the glass transition temperatures (Tg) of 276.7–346.1°C, the temperature at 5% weight loss of 451–492°C in nitrogen and 422–440°C in air, as well as have outstanding mechanical properties with the tensile strengths of 94–122 MPa, elongations at breakage of 5–18%. These films also had dielectric constants of 3.12–3.38 at 10 MHz. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

10.
A new diamine 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐hexahydro‐4,7‐methanoindan ( 3 ) was prepared through the nucleophilic displacement of 5,5′‐bis(4‐hydroxylphenyl)‐hexahydro‐4,7‐methanoindan ( 1 ) with p‐halonitrobenzene in the presence of K2CO3 in N,N‐dimethylformamide (DMF), followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of new polyamides were synthesized by the direct polycondensation of diamine 3 with various aromatic dicarboxylic acids. The polymers were obtained in quantitative yields with inherent viscosities of 0.76–1.02 dl g−1. All the polymers were soluble in aprotic dipolar solvents such as N,N‐dimethylacetamide (DMAc) and N‐methyl‐2‐pyrrolidone (NMP), and could be solution cast into transparent, flexible and tough films. The glass transition temperatures of the polyamides were in the range 245–282 °C; their 10% weight loss temperatures were above 468 °C in nitrogen and above 465 °C in air. © 2000 Society of Chemical Industry  相似文献   

11.
A series of new cardo poly(ether imide)s bearing flexible ether and bulky xanthene pendant groups was prepared from 9,9‐bis[4‐(4‐aminophenoxy)phenyl]xanthene with six commercially available aromatic tetracarboxylic dianhydrides in N,N‐dimethylacetamide (DMAc) via the poly(amic acid) precursors and subsequent thermal or chemical imidization. The intermediate poly(amic acid)s had inherent viscosities between 0.83 and 1.28 dL/g, could be cast from DMAc solutions and thermally converted into transparent, flexible, and tough poly(ether imide) films which were further characterized by X‐ray and mechanical analysis. All of the poly(ether imide)s were amorphous and their films exhibited tensile strengths of 89–108 MPa, elongations at break of 7–9%, and initial moduli of 2.12–2.65 GPa. Three poly(ether imide)s derived from 4,4′‐oxydiphthalic anhydride, 4,4′‐sulfonyldiphthalic anhydride, and 2,2‐bis(3,4‐dicarboxyphenyl))hexafluoropropane anhydride, respectively, exhibited excellent solubility in various solvents such as DMAc, N,N‐dimethylformamide, N‐methyl‐2‐pyrrolidinone, pyridine, and even in tetrahydrofuran at room temperature. The resulting poly(ether imide)s with glass transition temperatures between 286 and 335°C had initial decomposition temperatures above 500°C, 10% weight loss temperatures ranging from 551 to 575°C in nitrogen and 547 to 570°C in air, and char yields of 53–64% at 800°C in nitrogen. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012  相似文献   

12.
A series of novel aromatic polyimides were synthesized from N,N‐di(4‐aminophenyl)‐N′,N′‐diphenyl‐4,4′‐oxydianiline and aromatic tetracarboxylic dianhydrides through a conventional two‐step procedure. Most of the polyimides exhibited reasonable solubility in organic solvents and could afford robust films via solution casting. The polyimides exhibited high thermal stability, with glass transition temperatures in the range 227–273 °C and 10% weight‐loss temperatures in excess of 550 °C. All the polyimide films showed ambipolar redox and multi‐electrochromic behaviors. They exhibited two reversible oxidation redox couples at 0.94–0.98 and 1.09–1.12 V versus Ag/AgCl in acetonitrile solution. A coupling reaction between the radical cations of the pendent triphenylamine units occurred during the oxidative process forming a tetraphenylbenzidine structure which resulted in an additional redox state and color change. © 2014 Society of Chemical Industry  相似文献   

13.
A novel, asymmetric diamine, 3‐(4‐aminophenylthio)‐N‐aminophthalimide, was prepared from 3‐chloro‐N‐aminophthalimide and 4‐aminobenzenethiol. The structure of the diamine was determined via IR and 1H‐NMR spectroscopy and elemental analysis. A series of polyimides were synthesized from 3‐(4‐aminophenylthio)‐N‐aminophthalimide and aromatic dianhydrides by a conventional two‐step method in N,N‐dimethylacetamide and by a one‐step method in phenols. These polyimides showed good solubility in 1‐methyl‐2‐pyrrolidinone, m‐cresol, and p‐chlorophenol, except polyimide from pyromellitic dianhydride, which was only soluble in p‐chlorophenol. The 5% weight loss temperatures of these polyimides ranged from 460 to 498°C in air. Dynamic mechanical thermal analysis indicated that the glass‐transition temperatures of the polyimides were in the range 278–395°C. The tensile strengths at break, moduli, and elongations of these polyimides were 146–178 MPa, 1.95–2.58 GPa, and 9.1–13.3%, respectively. Compared with corresponding polyimides from 4,4′‐diamiodiphenyl ether, these polymers showed enhanced solubility and higher glass‐transition temperatures. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

14.
A polyfluorinated aromatic diamine, 3,3′, 5,5′‐tetrafluoro‐4,4′‐diaminodiphenylmethane (TFDAM), was synthesized and characterized. A series of polyimides, PI‐1–PI‐4, were prepared by reacting the diamine with four aromatic dianhydrides via a one‐step high‐temperature polycondensation procedure. The obtained polyimide resin had moderate inherent viscosity (0.56–0.68 dL/g) and excellent solubility in common organic solvents. The polyimide films exhibited good thermal stability, with an initial thermal decomposition temperature of 555°C–621°C, a 10% weight loss temperature of 560°C–636°C, and a glass‐transition temperature of 280°C–326°C. Flexible and tough polyimide films showed good tensile properties, with tensile strength of 121–138 MPa, elongation at break of 9%–12%, and tensile modulus of 2.2–2.9 GPa. The polyimide films were good dielectric materials, and surface and volume resistance were on the order of a magnitude of 1014 and 1015 Ω cm, respectively. The dielectric constant of the films was below 3.0 at 1 MHz. The polyfluorinated films showed good transparency in the visible‐light region, with a cutoff wavelength as low as 302 nm and transmittance higher than 70% at 450 nm. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1442–1449, 2007  相似文献   

15.
A series of polyamides were synthesized by the direct polycondensation of 2,2‐bis[4‐(4‐amino‐2‐fluorophenoxy)phenyl]hexafluoropropane with various commercially available dicarboxylic acids such as terephthalic acid, isophthalic acid, 5‐t‐butyl isophthalic acid, and 2,6‐naphthalene dicarboxylic acid. The synthesized polyamides were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, dimethyl sulfoxide, tetrahydrofuran, and chloroform, and they exhibited inherent viscosities of 0.42–0.59 dL/g. The polyamides exhibited weight‐average molecular weights of up to 26,000, which depended on the exact repeating unit structure. These polyamides showed good thermal stability up to 440°C for a 10% weight loss in synthetic air. The polyamides synthesized from 5‐t‐butyl isophthalic acid and isophthalic acid exhibited glass‐transition temperatures of 217 and 185°C, respectively (by differential scanning calorimetry) in nitrogen. The polyamides synthesized from terephthalic acid and 2,6‐naphthalene dicarboxylic acid showed melting temperatures of 319 and 385°C, respectively. The polyamides films were pale yellow, with tensile strengths of up to 82 MPa, moduli of elasticity of up to 2.3 GPa, and elongations at break of up to 9%, which depended on the exact repeating unit structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 691–696, 2003  相似文献   

16.
3,6‐bi(4‐fluorobenzoyl)‐N‐methylcarbazole and 3,6‐bi(4‐fluorobenzoyl)‐N‐ethylcarbazole were synthesized and used to prepare poly(arylene ether ketone)s (PAEKs) with high glass transition temperatures (Tg) and good solubility. High molecular weight amorphous PAEKs were prepared from these two difluoroketones with hydroquinone, phenolphthalein, 9,9‐bis(4‐hydroxyphenyl)fluorene and 4‐(4‐hydroxylphenyl)‐2,3‐phthalazin‐1‐one, respectively. All these polymers presented high thermal stability with glass transition temperatures being in the range 239–303 °C and a 5% thermal weight loss temperature above 460 °C. Compared with the Tg of phenolphthalein‐based PAEK (PEK‐C), fluorene‐based PAEK (BFEK) and phthalazinone‐based PAEK (DPEK) not containing a carbazole unit, these polymers presented a 30–50 °C increase in Tg. Meanwhile, PAEKs prepared from N‐ethylcarbazole difluoroketone showed good solubility in ordinary organic solvents, and all polymers exhibited excellent resistance to hydrochloric acid (36.5 wt%) and sodium hydroxide (50 wt%) solutions. In particular, phthalazinone‐based PAEK bearing N‐ethylcarbazole afforded simultaneously a Tg of 301 °C with good solubility. Tensile tests of films showed that these polymers have desirable mechanical properties. The carbazole‐based difluoroketones play an important role in preparing soluble PAEKs with high Tg by coordinating the relationship between chain rigidity resulting from the carbazole unit and chain distance from the side alkyl. © 2014 Society of Chemical Industry  相似文献   

17.
A series of aromatic polyamides containing 5‐(4‐acetoxy‐benzamido) pendent groups have been synthesized and their properties have been characterized and compared with those of related polyamides. The polyamides have weight‐ and number‐average molecular weights in the range of 36,680–65,700 and 12,685–35,490, respectively, and polydispersities in the range of 1.82–3.66. These polymers show good thermal stability comparable to traditional aromatic polyisophthalamides, with initial decomposition temperature between 270–320°C and glass transition temperature in the range of 230–270°C. Compared with related polyisophthalamides without any pendent groups, the present polymers show better solubility in certain solvents such as N‐methylpyrrolidinone and dimethylacetamide and can be cast from solutions into thin transparent flexible films having dielectric constants in the range of 3.42–4.27. The polymer films display remarkable hydrophilicity, which makes them potential candidates for use as advanced materials in humidity sensors. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 650–657, 2001  相似文献   

18.
A novel polyimide (PI) with mesogenic units was synthesized by the reaction between the pendent hydroxyl group of PI and the epoxy group of a liquid crystalline (LC) compound in the presence of N,N‐dimethylaniline at 120–130 °C. As a result, a novel in‐situ self‐reinforced PI film materials was obtained. The macromolecular reaction between the hydroxyl group and epoxy group was investigated by a model reaction. The properties of PI were studied by WAXD, DSC and polarized optical microscopy, and the results indicate that the polyimides with mesogenic units exhibit a smectic phase, the mesogenic units level influencing the side‐chain crystallinity, and also the thermal and mechanical properties of the polymers; the enhanced PI films possess good solubility, higher thermal stability, higher tensile strength and modulus. © 2001 Society of Chemical Industry  相似文献   

19.
A new trifluoromethylated bis(ether amine) monomer, 9,9‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]xanthene (BATFPX), was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 9,9‐bis(4‐hydroxyphenyl)xanthene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel fluorinated polyimides were synthesized from BATFPX with various commercially available aromatic tetracarboxylic dianhydrides by one‐step polycondensation in m‐cresol. The resulting polyimides were readily soluble in many organic solvents such as N,N‐dimethylacetamide and tetrahydrofuran, and afforded transparent, flexible and strong films with low moisture absorption (0.28–0.51%), low dielectric constant (2.85–3.26 at 1 MHz) and good optical transparency with UV‐visible absorption cut‐off wavelengths at 352–410 nm. All the polyimides were amorphous and exhibited high thermal stability, with glass transition temperatures of 282–330 °C, 5% weight loss temperatures above 520 °C in nitrogen or air and char yields higher than 55% at 800 °C in nitrogen. Also, these polyimides had good mechanical properties with tensile strengths of 93–118 MPa, elongations at break of 9–16% and initial moduli of 2.07–2.58 GPa. Copyright © 2011 Society of Chemical Industry  相似文献   

20.
A new diimide–diacid chloride (3) containing a noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit was synthesized by treating 2,2′‐dimethyl‐4,4′‐diamino‐biphenylene with trimellitic anhydride followed by refluxing with thionyl chloride. Various new poly(ester‐imide)s were prepared from 3 with different bisphenols by solution polycondensation in nitrobenzene using pyridine as hydrogen chloride quencher at 170°C. Inherent viscosities of the poly(ester‐imide)s were found to range between 0.31 and 0.35 dL g?1. All of the poly(ester‐imide)s, except the one containing pendent adamantyl group 5e, exhibited excellent solubility in the following solvents: N,N‐dimethylformamide, tetrahydrofuran, tetrachloroethane, dimethyl sulfoxide, N,N‐dimethylacetamide, N‐methyl‐2‐pyrrolidinone, m‐cresol, o‐chlorophenol, and chloroform. The polymers showed glass‐transition temperatures between 166 and 226°C. The 10% weight loss temperatures of the poly(ester‐imide)s, measured by TGA, were found to be in the range between 415 and 456°C in nitrogen. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2486–2493, 2004  相似文献   

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