Thermomechanical and shape memory properties of thermosetting shape memory polymer under compressive loadings

Shape memory polymers (SMPs) are an emerging class of active polymers that may be used for a range of reconfigurable structures. In this study, the thermomechanical and shape memory behavior of a thermosetting SMP was investigated using large‐scale compressive tests and small‐scale indentation tests. Results show that the SMP exhibits different deformation modes and mechanical properties in compression than in tension. In glassy state, the SMP displays significant plastic deformation and has a much higher modulus and yield strength in comparison to those obtained in tension. In rubbery state, the SMP behaves like a hyperelastic material and again has a much higher modulus than that obtained in tension. The SMPs were further conditioned separately in simulated service environments relevant to Air Force missions, namely, (1) exposure to UV radiation, (2) immersion in jet‐oil, and (3) immersion in water. The thermomechanical and shape recovery properties of the original and conditioned SMPs were examined under compression. Results show that all the conditioned SMPs exhibit a decrease in T_g as compared to the original SMP. Environmental conditionings generally result in higher moduli and yield strength of the SMPs in the glassy state but lower modulus in the rubbery state. In particular, the UV exposure and water immersion, also weaken the shape recovery abilities of the SMPs. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Stress memory of a thermoset shape memory polymer

The performance of stress recovery and shape recovery are equally important for high performance shape memory polymers (SMPs) in emerging applications. However, unlike shape recovery, stress recovery does not always follow a monotonic behavior, i.e., “stress plateau,” “stress overshoot,” and “stress undershoot” can be observed. In order to reveal the complicated stress memorization and recovery behavior, this study employs a phenomenological model which considers the recovery stress as the sum of residual programming stress, memorized stress, thermal stress, and relaxed stress for amorphous crosslinked SMPs. This model is demonstrated by a stress recovery experiment in which a polystyrene based SMP was programmed at two prestrain levels above the glass transition temperature, i.e., 20% (neo‐Hookean hyperelastic region) and 50% (strain‐hardening region), and two fixation temperatures, i.e., 20°C (below T_g) and 45°C (within the T_g region), respectively. In addition, a clear distinction between the memorized stress and recovery stress is presented. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42112.     

Facile control of high temperature shape memory polymers

Glass transition temperature (T_g) is crucial in determining application areas of high temperature shape memory polymers (SMPs), but some T_gs are difficult or uneconomic to be obtained. Here we introduce a facile way to prepare high temperature SMPs with controllable T_gs from 183 to 230 °C by copolymerization of polyimides, and relationships between T_gs and diamine components of the shape memory copolyimides agree with Fox Equation. These copolyimides can fix temporary shape and return to original shape nicely, and the possible mechanisms of their high shape fixity and shape recovery are analyzed on the basis of thermomechanical properties and molecular structures. The copolymerization of shape memory polyimides has offered an effective way to obtain high temperature SMPs with desired properties. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44902.     

Glass Dielectrics in Extreme High‐Temperature Environment

Thin and flexible glass ribbons can be rolled into a film capacitor structures for power electronic circuits. Glass has excellent electrical properties and is a leading candidate to replace polymer films for high‐temperature applications. The dielectric properties of a low‐alkali aluminoborosilicate glass were characterized up to temperatures of 400°C. Low‐field permittivity values of 6 with dielectric loss below 0.01 were found for temperatures below 300°C. The dielectric breakdown strength exceeded 5 MV/cm for temperature of 400°C and high‐field polarization measurements showed that glass has over 95% energy efficiency at temperatures of 200°C, which is a target temperature for high‐temperature power electronic circuits driven by wide bandgap semiconductor devices.     

Protein/glycerol blends and injection‐molded bioplastic matrices: Soybean versus egg albumen

Two well‐known proteins have been selected in order to produce bioplastics through injection molding: a soy protein isolate (SPI) and an egg white albumen concentrate (EW). Each of them has been thoroughly mixed with glycerol (40 wt %) and the blend then obtained have been characterized by means of rheological and thermomechanical techniques, which allowed the optimization of the processing moulding conditions (cylinder temperature, 60°C–65°C; mould temperature, 120°C; post‐injection pressure, 500–600 bars). Once bioplastics were obtained, their thermomechanical and tensile properties, as well as their water uptake capacity and transparency were evaluated. Bioplastics containing EW showed higher values in the elastic and loss moduli, E′ and E″, from ?30°C to 130°C, than the corresponding SPI bioplastic. However, they both showed qualitatively the same evolution with temperature, where E′ and E″ decreased up to a plateau at high temperatures. When examining their tensile and water uptake properties is found that SPI bioplastics are more ductile and present enhanced water uptake behavior over EW bioplastics, which on the other hand possess higher Young's modulus. SPI seems to provide tougher bioplastics, being an excellent option for potential superabsorbent applications, whereas EW would suit for those applications requiring higher mechanical properties. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42980.     

Characterization and strain‐energy‐function‐based modeling of the thermomechanical response of shape‐memory polymers

Shape‐memory polymers (SMPs) are an emerging class of active polymers that can be used on a wide range of reconfigurable structures and actuation devices. In this study, an epoxy‐based SMP was synthesized, and its thermomechanical behaviors were comprehensively characterized. The stress–strain behavior of the SMP was determined to be nonlinear, finite deformation in all regions. Strain‐energy‐based models were used to capture the complicated stress–strain behavior and shape‐recovery response of the SMP. Among various strain energy functions, the stretch‐based Ogden model provided the best fit to the experimental observations. Compared to the sophisticated models developed for SMPs, the strain‐energy‐based model was found to be reliable and much easier to use for practical SMP designs. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41861.     

Recent advance on constitutive models of thermal‐sensitive shape memory polymers

Shape memory polymers (SMPs) are a novel class of shape memory materials which can store a deformed (temporary) shape and recover an original (permanent) shape under a shape memory thermomechanical loading–unloading cycle. The deformation mechanisms of SMPs are very complicated, but the SMPs also have a lot of advantages and the widespread application value and prospect. So developing proper constitutive models that describe thermomechanical properties of SMPs and the shape memory effect is very challenging and of great theoretical and application value. Based on the deformation mechanisms and considerable experimental investigations of SMPs, researchers have developed many constitutive models. This article investigates the deformation mechanism and introduces the recent research advance of the constitutive models of thermal‐sensitive SMPs. Special emphases are given on the micromechanical constitutive relations in which the deformation is considered being based on the microstructure of the SMPs. Finally, the lack of research and prospects for further research are discussed. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

High transition temperature shape memory polymers (SMPs) by telechelic oligomer approach

This work describes the synthesis and comparative shape memory properties of cross-linked networks derived from epoxy and cyanate ester monomers containing polyether oligomers as reactive shape memory segments. The hydroxy telechelic oligomers viz. polyethyleneglycol (PEG), polypropyleneglycol (PPG), and polytetramethyleneglycol (PTG) are reacted with epoxy–cyanate ester matrix resulting in shape memory polymers with high transition temperatures. The soft oligomer segments act as flexible linker unit which interconnect oxazolidone, isocyanurate and triazine ring structures in the cross-linked polymer. The resultant cyclomatrix SMPs exhibit high transition temperatures 132, 178 and 161 °C respectively for PEG, PPG and PTG integrated SMPs. The E_g/E_r ratios are increased in the order PEG < PTG < PPG. The PTG and PPG based SMPs show shape retention of 99% and shape recovery of >98% with recovery time <100 s. All the SMPs display good thermal stabilities (both inert and oxidative) above 275 °C.     

Annealing and crystallization kinetics of poly(lactic acid) pieces obtained by additive manufacturing

In this study, we investigated the influence of isothermal treatment of poly(lactic acid) (PLA) 3D printed samples at different crystallization temperatures. In this case, we analyzed the effect of each crystallization temperature on spherulites formation in printed PLA, affecting the final mechanical properties of pieces. For such, the thermomechanical properties, morphological structure, and crystallization kinetics were analyzed before and after thermal treatment. The 3D printed samples were heat treated at 80°C, 90°C, 100°C, 110°C, and 119°C. With annealing, we observed an improvement in the mechanical PLA properties; however, the exothermic crystallization peak was different for the samples. Pieces before annealing were found to have a low crystallinity index (Ic) of 2%–7%, and the pieces after annealing presented a considerable Ic (27%–34%). Annealing temperatures of 100°C, 110°C, and 119°C produced the fastest crystallization kinetics, while annealing temperatures of 80°C and 90°C resulted in the lowest crystallization kinetics for complete crystallization. After annealing, improvement in the flexural strength (34%–47%) and Young's modulus (26%–51%) for all annealed pieces occurred. The appropriate condition was observed at 100°C, which was the onset temperature of crystallization, owing to the combination of the shorter time of crystallization with the increased mechanical properties.     

Shape‐memory behavior of high‐strength amorphous thermoplastic poly(para‐phenylene)

The purpose of this study was to investigate the shape‐memory behavior of poly(para‐phenylene) (PPP) under varying programming temperatures, relaxation times, and recovery conditions. PPP is an inherently stiff and strong aromatic thermoplastic, not previously investigated for use as a shape‐memory material. Initial characterization of PPP focused on the storage and relaxation moduli for PPP at various frequencies and temperatures, which were used to develop continuous master curves for PPP using time–temperature superposition (TTS). Shape‐memory testing involved programming PPP samples to 50% tensile strain at temperatures ranging from 155°C to 205°C, with varying relaxation holds times before cooling and storage. Shape‐recovery behavior ranged from nearly complete deformation recovery to poor recovery, depending heavily on the thermal and temporal conditions during programming. Straining for extended relaxation times and elevated temperatures significantly decreased the recoverable deformation in PPP during shape‐memory recovery. However, PPP was shown to have nearly identical full recovery profiles when programmed with decreased and equivalent relaxation times, illustrating the application of TTS in programming of the shape‐memory effect in PPP. The decreased shape recovery at extended relaxation times was attributed to time‐dependent visco‐plastic effects in the polymer becoming significant at longer time‐scales associated with the melt/flow regime of the master curve. Under constrained‐recovery, recoverable deformation in PPP was observed to have an exponentially decreasing relationship to the bias stress. This study demonstrated the effective use of PPP as a shape‐memory polymer (SMP) both in mechanical behavior as well as in application. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42903.     

Highly filled graphite polybenzoxazine composites for an application as bipolar plates in fuel cells

Highly filled graphite polybenzoxazine composites as bipolar plate material for polymer electrolyte membrane fuel cell (PEMFC) are developed. At the maximum graphite content of 80 wt % (68 vol %), storage modulus was increased from 5.9 GPa of the neat polybenzoxazine matrix to 23 GPa in the composite. Glass transition temperatures (T_g) of the composites were ranging from 176°C to 195°C and the values substantially increased with increasing the graphite contents. Thermal conductivity as high as 10.2 W/mK and electrical conductivity of 245 S cm^?1 were obtained in the graphite filled polybenzoxazine at its maximum graphite loading. The obtained properties of the graphite filled polybenzoxazine composites exhibit most values exceed the United States department of energy requirements for PEMFC applications. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 3909–3918, 2013     

Dependency of the shape memory properties of a polyurethane upon thermomechanical cyclic conditions

The relationship between the shape memory properties and thermomechanical cyclic conditions was investigated with a type of shape memory polyurethane (SMPU). The thermal and dynamic mechanical properties of the polyurethane were examined by using differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). It was found that the SMPU exhibited good shape memory effects (SMEs) at deformation temperatures ranging from T_g to T_g + 25 °C. The strain recovery ratios increased with the increase of deformation speed and with the decrease in maximum strain. The recovery ratios also increased with increasing fixing speed. Therefore, in practical applications, in order to obtain better SMEs, the SMPU should be cooled to its frozen state as soon as possible after being deformed at a high temperature. The ‘fixity’ dramatically increased with the decrease in fixing temperature. To obtain optimal SMEs, the polymer has to be reheated up to the temperature at which the polymer deformed. In addition, the recovery ratios of the SMPU could increase slightly with the increase of recovery time. Copyright © 2004 Society of Chemical Industry     

Dielectric behavior and properties of a cyanate ester containing dicyclopentadiene. I

2,6‐Dimethyl phenol dicyclopentadiene dicyanate ester (DCPDCY) was synthesized through the reaction of 2,6‐dimethyl phenol dicyclopentadiene novolac and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared, mass spectrometry, NMR spectrometry, and elemental analysis. DCPDCY was then cured by itself or cured with bisphenol A dicyanate ester (BADCY) to form triazine structures. The thermal properties of the cured DCPDCY resins were studied with differential scanning calorimetry, dynamic mechanical analysis (DMA), dielectric analysis, and thermogravimetric analysis; these data were compared with those of BADCY. The cured DCPDCY resins exhibited a lower dielectric constant (2.58 at 1 MHz), a lower dissipation factor (20.2 mU at 1 MHz), less thermal stability (the 5% degradation temperature and char yield were 430°C and 32.1%, respectively), a lower glass‐transition temperature (266°C by thermomechanical analysis and 271°C by DMA), a lower coefficient of thermal expansion (22.5 ppm before the glass‐transition temperature and 124.9 ppm after the glass‐transition temperature), and less moisture absorption (0.88% at 48 h) than BADCY, but they showed higher moduli (6.28 GPa at 150°C and 5.35 GPa at 150°C) than the bisphenol A system. The properties of the cured cocyanate esters (DCPDCY and BADCY) lay between those of cured BADCY and DCPDCY, except for the moduli. The moduli of some cocyanate esters were even higher than those of cured BADCY and DCPDCY. A positive deviation from the Fox equation was observed for cocyanate esters. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2079–2089, 2005     

Synthesis and characterization of novel polyimides derived from 4,4’-bis(5-amino-2-pyridinoxy)benzophenone: effect of pyridine and ketone units in the main

A diamine monomer, 4,4’-bis(5-amino-2-pyridinoxy)benzophenone, was designed and synthesized, and used to react with commercially different kinds of aromatic dianhydrides to prepare a series of polyimides containing pyridine and ketone units via the classical two-step procedure. Glass transition temperatures (T_g) of the resultant polyimides PI-(1–5) derived from 4,4’-bis(5-amino-2-pyridinoxy) benzophenone with various dianhydrides ranged from 201 to 310 °C measured by differential scanning calorimetry. The temperatures for 5%wt loss of the resultant polyimides in nitrogen atmosphere obtained from the thermogravimetric analysis curves fell in the range of 472–501 °C. The temperatures for 10%wt loss of the resultant polyimides in nitrogen atmosphere fell in the range of 491–537 °C. Meanwhile, the char yields at 800 °C were in the range of 55.3–60.8%. Moreover, the moisture absorption of polyimide films was measured in the range of 0.37–2.09%. The thin films showed outstanding mechanical properties with tensile strengths of 103–145 MPa, an elongation at break of 12.9–15.2%, and a tensile modulus of 1.20–1.88 Gpa, respectively. The coefficients of thermal expansion of the resultant polyimides were obtained among 26–62 ppm °C^?1. To sum up, this series of polyimides had a good combination of properties applied for high-performance materials and showed promising potential applications in the fields of optoelectronic devices.     

Silicone membranes to inhibit water uptake into thermoset polyurethane shape‐memory polymer conductive composites

Electroactive shape memory polymer (SMP) composites capable of shape actuation via resistive heating are of interest for various biomedical applications. However, water uptake into SMPs will produce a depression of the glass transition temperature (T_g) resulting in shape recovery in vivo. While water actuated shape recovery may be useful, it is foreseen to be undesirable during early periods of surgical placement into the body. Silicone membranes have been previously reported to prevent release of conductive filler from an electroactive polymer composite in vivo. In this study, a silicone membrane was used to inhibit water uptake into a thermoset SMP composite containing conductive filler. Thermoset polyurethane SMPs were loaded with either 5 wt % carbon black or 5 wt % carbon nanotubes, and subsequently coated with either an Al₂O₃‐ or silica‐filled silicone membrane. It was observed that the silicone membranes, particularly the silica‐filled membrane, reduced the rate of water absorption (37°C) and subsequent T_g depression versus uncoated composites. In turn, this led to a reduction in the rate of recovery of the permanent shape when exposed to water at 37°C. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41226.     

Light and Shape-Memory Polymers: Characterization,Preparation, Stimulation,and Application

Shape-memory polymers (SMPs) are smart materials that change shape when exposed to stimuli and have various applications in different fields due to their unique properties. Light, as a kind of electromagnetic radiation, plays an important role in understanding the structure-property relations of SMPs, preparing original shapes, using them as non-contact stimuli sources, and tuning the optical properties of SMPs. This review provides a comprehensive review of the involvement of light in structure-preparation-stimuli-application of SMPs. The review is divided into four sections. First, applications of optical/spectroscopic approaches that provide information for understanding structure-property relations in SMPs, especially during programming and recovery. Second, describes how to build SMPs with light, including different photochemical reactions and 3D photocuring technologies. Third, discusses how light is used to trigger the shape change of SMPs through both photochemical and photothermal mechanisms. Last, focuses on how to take advantage of the shape-memory effect to tune the optical characteristics of polymers, including various structures of SMP color-changing materials and their synthetic strategies. Future research could focus on developing efficient photothermal fillers, new 3D printing techniques for SMPs, exploring their use in biomedical and wearable devices, and optimizing SMPs for industrial applications.     

Changes in structure of PA6 during processing

Using thermomechanical analysis, the molecular weight distribution and relaxation transitions were investigated in commercial PA6 and in this polymer after passage through an extruder with a static mixer. A diblock or triblock amorphous structure and a crystalline portion in the studied PA6 were found. These amorphous structures differ in the glass transition temperatures by 80–180°C. There was a principal difference in the topological and molecular structures of PA6 depending on the processing conditions—number of cycles and shear rates. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2361–2368, 2001     

Determination of gelation temperature of poly(vinyl chloride) by thermomechanical and thermogravimetric parameters

Preheating between the temperatures of 200 and 280°C is done to a film‐structured poly(vinyl chloride) (PVC) sample, which has a gelation temperature ∼ 250°C. After this preheat, the PVC's thermomechanical and thermal differences, at temperatures before and after thermal gelation, are observed. Consequently, when some thermomechanical and thermal parameters, obtained at temperatures before and after gelation, are compared, it can be said that this is an easier method to determine the gelation temperature of a polymer. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 1635–1640, 2005     

Shape memory polymers based on uniform aliphatic urethane networks

Aliphatic urethane polymers have been synthesized and characterized, using monomers with high molecular symmetry, to form amorphous networks with very uniform supermolecular structures, which can be used as photo‐thermally actuable shape memory polymers (SMPs). The monomers used include hexamethylene diisocyanate (HDI), trimethylhexamethylenediamine (TMHDI), N,N,N′,N′‐tetrakis(hydroxypropyl)ethylenediamine (HPED), triethanolamine (TEA), and 1,3‐butanediol (BD). The new polymers were characterized by solvent extraction, NMR, XPS, UV/VIS, DSC, DMTA, and tensile testing. The resulting polymers were found to be single phase amorphous networks with very high gel fraction, excellent optical clarity, and extremely sharp single glass transitions in the range of 34–153°C. Thermomechanical testing of these materials confirms their excellent shape memory behavior, high recovery force, and low mechanical hysteresis (especially on multiple cycles), effectively behaving as ideal elastomers above T_g. We believe these materials represent a new and potentially important class of SMPs, and should be especially useful in applications such as biomedical microdevices. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Thermal,mechanical, and shape‐memory properties of nanorubber‐toughened,epoxy‐based shape‐memory nanocomposites

Epoxy‐based shape‐memory polymers (ESMPs) are a type of the most promising engineering smart polymers. However, their inherent brittleness limits their applications. Existing modification approaches are either based on complicated chemical reactions or done at the cost of the thermal properties of the ESMPs. In this study, a simple approach was used to fabricate ESMPs with the aim of improving their overall properties by introducing crosslinked carboxylic nitrile–butadiene nanorubber (CNBNR) into the ESMP network. The results show that the toughness of the CNBNR–ESMP nanocomposites greatly improved at both room temperature and the glass‐transition temperature (T_g) over that of the pure ESMP. Meanwhile, the increase in the toughness did not negatively affect other macroscopic properties. The CNBNR–ESMP nanocomposites presented improved thermal properties with a T_g in a stable range around 100 °C, enhanced thermal stabilities, and superior shape‐memory performance in terms of the shape‐fixing ratio, shape‐recovery ratio, shape‐recovery time, and repeatability of shape‐memory cycles. The combined property improvements and the simplicity of the manufacturing process demonstrated that the CNBNR–ESMP nanocomposites are desirable candidates for large‐scale applications in the engineering field as smart structural materials. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45780.