Temperature-dependent electroluminescence in InGaN/GaN multiple-quantum-well light-emitting diodes

We present a comparative study on temperature dependence of electroluminescence (EL) of InGaN/GaN multiple-quantum-well (MQW) light-emitting diodes (LEDs) with identical structure but different indium contents in the active region. For the ultraviolet (UV) and blue LEDs, the EL intensity decreases dramatically with decreasing temperature after reaching a maximum at 150 K. The peak energy exhibits a large redshift in the range of 20–50 meV with a decrease of temperature from 200 K to 70 K, accompanying the appearance of longitudinal-optical (LO) phonon replicas broadening the low energy side of the EL spectra. This redshift is explained by carrier relaxation into lower energy states, leading to dominant radiative recombination at localized states. In contrast, the peak energy of the green LED exhibits a minimal temperature-induced shift, and the emission intensity increases monotonically with decreasing temperature down to 5 K. We attribute the different temperature dependences of the EL to different degrees of the localization effects in the MQW regions of the LEDs.     

Transient and stable electroluminescence properties of alternating-current biased organic light-emitting diodes

In this work,transient electroluminescence (EL) (brightness-voltage waveform curve) was utilized to investigate the working mechanism of alternating-current biased organic light-emitting diodes (AC-OLE...     

InGaN/GaN multiple quantum well green light-emitting diodes prepared by temperature ramping

High-quality InGaN/GaN multiple-quantum well (MQW) light-emitting diode (LED) structures were prepared by a temperature-ramping method during metal-organic chemical-vapor deposition (MOCVD) growth. Two photoluminescence (PL) peaks, one originating from well-sensitive emission and one originating from an InGaN quasi-wetting layer on the GaN-barrier surface, were observed at room temperature (RT). The observation of high-order double-crystal x-ray diffraction (DCXRD) satellite peaks indicates that the interfaces between InGaN-well layers and GaN-barrier layers were not degraded as we increased the growth temperature of the GaN-barrier layers. With a 20-mA and 160-mA current injection, it was found that the output power could reach 2.2 mW and 8.9 mW, respectively. Furthermore, it was found that the reliability of the fabricated green LEDs prepared by temperature ramping was also reasonably good.     

生长停顿改善MOCVD生长InGaN/GaN多量子阱的特性

利用金属有机物化学气相淀积(MOCVD)生长了InGaN/GaN多量子阱(MQWs)结构,研究了生长停顿对InGaN/GaN MQWs特性的影响.结果表明,采用生长停顿,可以改善MQWs界面质量,提高MQWs的光致发光(PL)与电致发光(EL)强度;但生长停顿的时间过长,阱的厚度会变薄,界面质量变差,不仅In组分变低,富In的发光中心减少,而且会引入杂质,致使EL强度下降.     

InGaN/GaN超晶格垒层用于InGaN发光二极管发光增强研究

设计了InGaN/GaN超晶格垒层替代p-GaN和n-GaN附近传统GaN垒层的InGaN/GaN多量子阱(MQW)发光二极管(LEDs)结构。通过数值方法模拟出两种LED结构的光功率-电压(L-V)曲线、电致发光(EL)谱、能带图、电子浓度分布和辐射复合速率。结果表明InGaN/GaN超晶格替代n-GaN附近GaN垒层的LED结构比替代p-GaN附近GaN垒层的LED显示出更高的发光强度。这种发光增强的原因是InGaN/GaN超晶格替代n-GaN附近GaN垒层可以提高电子注入效率和辐射复合速率。     

Investigation of GaN-based light-emitting diodes using double photonic crystal patterns

GaN-based LEDs with photonic crystal (PhC) patterns on an n- and a p-GaN layer by nano-imprint lithography (NIL) are fabricated and investigated. At a driving current of 20 mA on Transistor Outline (TO)-can package, the light output power of the GaN-based LED with PhC patterns on an n- and a p-GaN layer is enhanced by a factor of 1.30, and the wall-plug efficiency is increased by 24%. In addition, the higher output power of the LED with PhC patterns on the n- and p-GaN layer is due to better crystal quality on n-GaN and higher scattering effect on p-GaN surface using PhC pattern structure.     

Optical and electrical characterization of (Ga,Mn)N/InGaN multiquantum well light-emitting diodes

(Ga,Mn)/N/InGaN multiquantum well (MQW) diodes were grown by molecular beam epitaxy (MBE). The current-voltage characteristics of the diodes show the presence of a parasitic junction between the (Ga,Mn)N and the n-GaN in the top contact layer due to the low conductivity of the former layer. Both the (Ga,Mn)N/InGaN diodes and control samples without Mn doping show no or very low (up to 10% at the lowest temperatures) optical (spin) polarization at zero field or 5 T, respectively. The observed polarization is shown to correspond to the intrinsic optical polarization of the InGaN MQW, due to population distribution between spin sublevels at low temperature, as separately studied by resonant optical excitation with a photon energy lower than the bandgap of both the GaN and (Ga,Mn)N. This indicates efficient losses in the studied structures of any spin polarization generated by optical spin orientation or electrical spin injection. The observed vanishing spin injection efficiency of the spin light-emitting diode (LED) is tentatively attributed to spin losses during the energy relaxation process to the ground state of the excitons giving rise to the light emission.     

非对称InGaN多量子阱发光二极管的发光分布和空穴输运

为研究多量子阱中的发光分布和空穴输运,制备了非对称InGaN/GaN 多量子阱（MQW）发光二极管。在电注入下,具有wNQW有源区结构（靠近p的第一个阱QW1比其他QWs较宽）的样品只有一个来自QW1的发光峰,而具有nWQW有源区结构的样品具有一个短波长发光峰和一个长波长发光峰,分别来自QW1和后面的QWs。增加QW1和后面QWs之间的势垒厚度,来自后面QWs的长波长发光峰减弱,总的发光强度也随之减弱。结论是具有nWQW和薄势垒的非对称耦合MQW结构可以改善空穴输运,从而增强后面QW的发光,提高LED内量子效率。     

InGaN/GaN light-emitting diodes with a reflector at the backside of sapphire substrates

Nitride-based light-emitting diodes (LEDs) with a reflector at the backside of the sapphire substrates have been demonstrated. It was found that an SiO₂/TiO₂ distributed-Bragg reflector (DBR) structure could reflect more downward-emitting photons than an Al-mirror layer. It was also found that the 20-mA output power was 2.76 mW, 2.65 mW, and 2.45 mW for the DBR LED, Al-reflector LED, and conventional LED, respectively. With the same 50-mA current injection, the integrated-electroluminescence (EL) intensity of a DBR LED and an Al-reflector LED was 19% and 15% larger than that observed from a conventional LED.     

InGaN/GaN LEDs with a Si-doped InGaN/GaN short-period superlattice tunneling contact layer

Nitride-based light-emitting diodes (LEDs) with Si-doped n⁺-In_0.23Ga_0.77N/GaN short-period superlattice (SPS) tunneling contact top layer were fabricated. It was found that although the measured specific-contact resistance is around 1 × 10⁻² Ω-cm² for samples with an SPS tunneling contact layer, the measured specific-contact resistance is around 1.5×10⁰ Ω-cm² for samples without an SPS tunneling contact layer. Furthermore, it was found that one could lower the LED-operation voltage from 3.75 V to 3.4 V by introducing the SPS structure. It was also found that the LED-operation voltage is almost independent of the CP₂Mg flow rate when we grow the underneath p-type GaN layer. The LED-output intensity was also found to be larger for samples with the SPS structure.     

Improved efficiency in green polymer light-emitting diodes with air-stable electrodes

By dispersing an electron transporting molecular dopant into the active semiconducting luminescent polymer, we have achieved improved efficiencies for green light-emitting diodes (LEDs). These green emitting LEDs were fabricated by adding an electron transporting molecular dopant, 2-(4-biphenylyl)-5-(4-tert-butylphenyl)-l,3,4-oxadiazole (PBD), into the semiconducting luminescent polymer as the emitting layer in the polymer LEDs. The devices used poly(2-cholestanoxy-5-thexyldimethylsilyl-l,4-phenylene vinylene) (CS-PPV), a new soluble green light emitter, as the semiconducting luminescent polymer and either aluminum or indium as the electron injection electrodes. Quantum efficiencies of LEDs with the electron transporting molecular additive in the luminescent polymer and an Al electrode are about 0.3% photons per electron, better by a factor of 18 than similar devices made without the addition of the electron transport molecular dopant; quantum efficiencies of similar LEDs fabricated with an In electrode are 0.23% photons per electron, better by a factor of 16 than devices without the electron transport molecular additive.     

高亮度微腔有机电致发光器件

为了实现有机电致发光器件(OLED)发射光谱的窄化和高亮度,真空热蒸镀具有不同微腔结构的OLED(MOLED):玻璃衬底/分布式布拉格反射器(DBR)(1～4对的SiO2/Ta2O5层)/ITO/空穴传输层(HTL,α-NPD)/发光层(EML,Alq3:Rubrene或Alq3:Coumarin6)/电子传输层(ERL,Alq3)LiF/Mg/Ag,其中沉积DBR结构采用电子束沉积法。实验表明:该MOLED的发射光谱半波长宽度(FWHM)随DBR层数的增加而减小至最小值10nm;并且在2层DBR时,掺杂Rubrene器件得到更大的电流效率,约20cd/A,最大亮度为2.6×105cd/m2。研究发现,蓝光MOLED能够对自发光产生吸收现象,降低了出光效率。     

InGaN/GaN多量子阱蓝光LED电学特性研究

对不同温度(120～363 K)下InGaN/GaN多量子阱(MQW)结构蓝光发光二极管(LED)的电学特性进行了测试与深入的研究.发现对数坐标下I-V特性曲线斜率随温度变化不大.分别用载流子扩散-复合模型和隧道复合模型对其进行计算,发现室温下其理想因子远大于2,并且随着温度的下降而升高;而隧穿能量参数随温度变化不大.这说明传统的扩散-复合载流子输运模型不再适用于InGaN/GaN MQW蓝光LED.分析指出由于晶格失配以及生长工艺的制约,外延层中具有较高的缺陷密度和界面能级密度,导致其主要输运机制为载流子的隧穿.     

Edge-emitting electroluminescence polarization investigation of InGaN/GaN light-emitting diodes grown by metal-organic chemical vapor deposition on sapphire (0001)

The edge-emitting electroluminescence (FL) state of polarization of blue and green InGaN/GaN light-emitting diodes (LEDs) grown in EMCORE’s commercial reactors was studied and compared to theoretical evaluations. Blue (∼475 nm) LEDs exhibit strong EL polarization, up to a 3:1 distinction ratio. Green (∼530 nm) LEDs exhibit smaller ratios of about 1.5:1. Theoretical evaluations for similar InGaN/GaN superlattices predicted a 3:1 ratio between light polarized perpendicular (E⊥c) and light polarized parallel (E‖c) to the c axis. For the blue LEDs, a quantum well-like behavior is suggested because the E⊥c mode dominates the E‖c mode 3:1. In contrast, for the green LEDs, a mixed quantum well (QW)-quantum dot (QD) behavior is proposed, as the ratio of E⊥c to E‖c modes drops to 1.5:1. The EL polarization fringes were also observed, and their occurrence may be attributed to a symmetric waveguide-like behavior of the InGaN/GaN LED structure. A large 40%/50% drop in the surface root mean square (RMS) from atomic force microscopy (AFM) scans on blue/green LEDs with and without EL fringes points out that better surfaces were achieved for the samples exhibiting fringing. At the same time, a 25%/10% increase in the blue/green LED photoluminescence (PL) intensity signal was found for samples displaying EL interference fringes, indicating superior material quality and improved LED structures.     

Investigation of light output performance for gallium nitride-based light-emitting diodes grown on different shapes of patterned sapphire substrate

GaN-based blue light-emitting diodes (LEDs) on various patterned sapphire substrates (PSSs) are investigated in detail. Hemispherical and triangular pyramidal PSSs have been applied to improve the performance of LEDs compared with conventional LEDs grown on planar sapphire substrate. The structural, electrical, and optical properties of these LEDs are investigated. The leakage current is related to the crystalline quality of epitaxial GaN films, and it is improved by using the PSS technique. The light output power and emission efficiency of the LED grown on triangular pyramidal PSS with optimized fill factor show the best performance in all the samples, which indicates that the pattern structure and fill factor of the PSS are related to the capability of light extraction.     

p型InGaN/GaN超晶格N面GaN基LED的光电特性

随着氮(N)面GaN材料生长技术的发展,基于N面GaN衬底的高亮度发光二极管(LED)的研究具有重要的科学意义.研究了具有高发光功率的N面GaN基蓝光LED的新型结构设计,通过在N面LED的电子阻挡层和多量子阱有源层之间插入p型InGaN/GaN超晶格来提高有源层中的载流子注入效率.为了对比N面GaN基LED优异的器件性能,同时设计了具有相同结构的Ga面LED.通过对两种LED结构的电致发光特性、有源层中能带图、电场和载流子浓度分布进行比较可以发现,N面LED在输出功率和载流子注入效率上比Ga面LED有明显的提升,从而表明N面GaN基LED具有潜在的应用前景.     

AlGaN/GaN层叠结构插入层改善氮化镓基发光二极管抗静电性能研究

在GaN基发光二极管的uGaN与nGaN之间插入AlGaN/GaN层叠结构,增大了外延层的张应力,降低了外延层中的穿透位错密度,改善了外延材料的质量。对比了AlGaN/GaN层叠结构中不同Al组分对LED的抗静电能力的影响,含6.8%铝组分AlGaN/GaN层叠结构的LED人体模式抗静电能力提高到了6000V,合格率超过了95%。     

图形化蓝宝石衬底结构对GaN基LED发光性能的影响

为了研究图形化蓝宝石衬底(PSS)的结构和形貌对GaN基发光二极管(LED)光学性能的影响,对PSS的制备工艺和参数进 行了调控,从而 形成具有不同填充因子的蒙古包形PSS(HPSS)和金字塔形PSS(TPSS)两种衬底,用于生长 和制备蓝光LED 芯片。通过对TPSS-LED的光学性能测试和分析得到,随着PSS填充因子的增大, LED的 光输出功 率也增大;进而比较具有相同填充因子的HPSS和TPSS的光学性能表明,HPSS明显优于TPSS。 因此, PSS填充因子的增大,能够提高LED的光输出功率;优化PSS的结构可以改善LED中光出射途径 ,从而更有效提高LED的光发射效率。     

Improved III-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Through insertion of an AlGaN/GaN stack between the u-GaN and n-GaN of GaN-based light-emitting diodes(LEDs),the strain in the epilayer was increased,the dislocation density was reduced.GaN-based LEDs with different Al compositions were compared.6.8%Al composition in the stacks showed the highest electrostatic discharge(ESD) endurance ability at the human body mode up to 6000 V and the pass yield exceeded 95%.     

Changes in electrical characteristics associated with degradation of InGaN blue light-emitting diodes

Because of the high concentration of threading dislocations, the reverse current-voltage (I–V) characteristics for either homo- or heterojunctions made on GaN-based materials grown on sapphire often show a strong electric field dependence (called a soft breakdown characteristic), which can be described by a power law I=Vⁿ, with n between 4 to 5. We find a significant increase of reverse currents associated with the early degradation of emission in InGaN blue single-quantum-well light-emitting diodes (LEDs) subjected to aging tests (injected current of 70 mA over a total time of about 300 h). The formation of dislocations might be due to the relaxation of strain in the thin InGaN active layer during the aging tests.