基于速度载荷法的板级电子封装跌落失效分析

在ABAQUS软件中,建立了板级TSOP(thin small outline package)封装跌落/冲击问题的三维有限元模型.采用速度载荷法,研究了PCB(printed circuit board)、芯片引脚等的动力学响应,分析了不同支撑条件对仿真结果的影响,并结合板级TSOP封装跌落破坏实验对TSOP封装芯片的焊点失效机理进行了研究.实验结果表明,芯片的惯性力和芯片安装部位PCB的弯曲变形对焊点应力都有较大影响,焊点应力峰值出现在冲击后2ms到3ms之间,这与PCB跌落变形过程中中心部位和碰撞面"二次碰撞"所产生的芯片安装部位弯曲变形密切相关,TSOP封装芯片引脚部位的瞬时拉应力和剪切应力是导致焊点失效的主要原因.     

随机振动载荷下电子箱PCBA焊点疲劳寿命分析

电子箱在力学载荷环境下,振动引起的高周循环疲劳应力会造成箱体中电路焊点失效,影响电子箱整机可靠性;针对一种印制电路板组件焊点进行整机级振动试验,通过建立电子箱整机有限元模型,进行与试验状态一致的随机振动试验仿真分析,提取焊点上的应力、加速度响应水平;基于Basquin模型,建立了PCBA疲劳寿命预测模型,将几种不同振动载荷下的焊点响应结果代入到预测模型,计算得到电子箱在不同振动载荷下的寿命分析结果,得到电子箱PCBA焊点的应力-寿命（S-N）曲线;结果表明,在工况随机振动条件下电子箱PCBA焊点具有足够可靠性,随着振动激励增大,焊点疲劳寿命显著缩短,该方法可用于电子箱整机级PCBA焊点随机振动疲劳寿命分析。     

CBGA与PBGA封装焊点热循环失效特性研究

陶瓷球栅阵列(CBGA)与塑料焊球阵列(PBGA)是系统级封装(SIP)器件主流的两种封装形式。主要对CBGA和PBGA两种系统级封装器件的焊点在热循环试验中寿命进行分析研究。通过对锡(Sn)合金焊料的粘塑性特性进行研究,对热循环疲劳寿命Coffin-Manson方程理论进行分析,结合仿真软件的计算,对两种封装形式焊点寿命进行定量预测。预测结果表明,CBGA封装焊点热循环条件下失效寿命约240余次,远低于PBGA封装焊点寿命1900余次。     

基于道路载荷谱的车身焊点疲劳寿命分析

针对目前汽车焊点疲劳分析方法精度低、建模复杂等问题,以某自主SUV车身焊点为研究对象,采集道路载荷谱,通过载荷虚拟迭代得到底盘与车身连接点的载荷.研究结果表明,对车身焊点分别使用基于力(载荷)和应力的疲劳分析,可以准确预测试验样车焊点开裂位置,缩短焊点疲劳分析周期.改进后的样车顺利通过耐久试验场验证.     

爆炸冲击条件下的加速度传感器结构分析

针对加速度传感器在爆炸与冲击测试中的应用,从理论与有限元仿真出发,分析传感器结构的静态响应与冲击响应.在15.4×104gn的静态载荷下,传感器结构最大应力超过材料的许用应力,将会发生结构断裂.在静态载荷下,加速度传感器在15.4×104gn的冲击加速度载荷下结构最大应力超过材料的许用应力,将会发生结构断裂.在加速度传感器的工作方向上施加幅值为15×104gn,半周期为5μs、10μs、20μs、30μs、40μs的半正弦加速度冲击载荷.在幅值为15×104gn、半周期为30μs的冲击载荷下,传感器的固定端处应力为334MPa,将会使传感器断裂失效.在幅值为15×104gn、半周期为5μs、10μs、20μs的冲击载荷下,固定端处应力超过材料许用应力,将也会发生结构断裂.悬臂梁在半周期为5μs、10μs、20μs的冲击下,将会出现断裂.大体上,冲击载荷的周期越小,固定端的应力越大集中越严重.由于传感器固有周期为9.5μs,加速度传感器在半周期为10μs的冲击载荷下出现谐振,固定端处应力变大集中加剧.分析加速度传感器在冲击载荷下的结构响应为传感器的结构设计与具体应用时的可靠性分析提供了理论依据.     

基于色彩特征与邻域信息的焊点定位方法

为防止集成电路由于元件相互影响及受到外部干扰而无法正常工作,对高集成度电路板进行绝缘封装必不可少.针对印刷电路板(printed circuit board,PCB)上焊点区域小、数量多、位置密集、形态多样等问题,提出基于色彩特征与邻域信息的多形态焊点定位方法.首先通过建立色彩特征模型,提取PCB的单色色度区间特征与多色色差特征;然后提出了基于色彩特征的多形态焊点定位方法,在完成焊点初定位的基础上,采用窗口扫描法提取像素点的邻域信息,进一步提出基于邻域信息的焊点精确定位优化方法,能够有效地提高PCB焊点区域的定位精度.实验结果表明,该方法能大幅提高焊点区域的填充率及滤除误判像素点,满足对PCB上多形态焊点区域的精确定位需求.     

应力对硅悬空薄膜的机械灵敏度的影响

运用四周固支薄板小挠度理论,分析了存在较大残余应力的浓硼重掺杂硅悬空薄膜的力学特性.给出了小挠度下,在外界载荷作用下总应力表达式和薄膜机械灵敏度表达式,并分析了残余应力对二者的影响.研究表明,对存在较大残余应力的硅薄膜,总应力和机械灵敏度主要由残余应力决定,其中机械灵敏度较忽略残余应力时的值减小三个数量级.     

静态与冲击载荷作用下偏斜齿轮的有限元分析

利用大型有限元分析软件ANSYS对一个因预紧力不够而偏斜的输出齿轮建立了有限元模型．利用通用ANSYS进行了静态分析,其中在施加力的载荷时．只加在1／4的齿宽上,得到了静态下的应力及变形．利用ANSYSStructural／LS-DYNA对齿轮进行了显式动力分析,得到了该齿轮在冲击载荷作用下所受到的冲击力的值,随后进行了瞬态响应的研究,得到了齿轮在冲击载荷作用下的应力和变形。通过比较可知,冲击载荷的危害是静态载荷的数倍,证实了齿轮在该工况下必然发生断裂,为齿轮的合理设计提供了依据。     

传感器冲击问题的探讨

重点探讨了传感器的冲击机理,通过分析冲击过程中减小的动能和位能应符合传感器的变形能平衡原理,得出冲击载荷是静载荷二倍的结论.针对冲击力的影响,文中提出,提高传感器自身抗冲击性能和外部保护措施,可提高传感器的使用寿命.     

刮板输送机中部槽冲击特性研究

为了研究煤料、刮板及刮板链对刮板输送机中部槽的冲击特性,首先基于赫兹接触理论,对煤料冲击中部槽过程中的法向冲击载荷和冲击能量进行了理论分析;然后采用EDEM仿真软件模拟了采煤工况下煤料对中部槽的冲击过程,得到了不同链速、不同采煤高度下中部槽所受的法向冲击载荷曲线,以及中部槽中板所受的冲击力分布;最后在空载工况下对刮板及刮板链对中部槽中板的冲击载荷进行了现场试验。研究结果表明:在不同链速和采煤高度下,煤料对刮板输送机中部槽的法向冲击载荷均先迅速增大,然后减小至一定区间内波动,且法向冲击载荷随链速和采煤高度的增大而增大;煤料对中部槽中板的冲击力主要集中在两链道处;刮板及刮板链对中部槽的冲击载荷呈周期性阶跃变化,且采煤侧链道处、采空侧链道处、非链道处的冲击载荷依次减小。     

Automated extraction of PCB components based on specularity using layered illumination

This paper investigates the methodologies for locating and identifying components on a printed circuit board (PCB) used for surface mount device inspection. It’s the foundation of other inspections, such as solder joint inspection, component type recognization and so on. The proposed scheme consists of two stages: solder joint extraction and protective coating extraction. This work uses automatic multilevel thresholding approach for detecting specular areas which contain solder joints. Some invalid specular areas, such as markings and via-holes are recognized and removed by comparing the colour distribution features of the target objects and the reference objects. A novel approach based on connection graph and the segmented gray-scale PCB images is developed to classify all recognized solder joints as several clusters. And then, the protective coating is extracted by the positions of the clustered solder joints. Experimental results show that the proposed method can recognize most of components effectively.     

How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments

Fabrication of modern microelectronic components requires miscellaneous solder materials for joining. In order to guarantee the quality of the manufacturing process and the reliability of the resulting solder joint it is necessary to know the material properties of the joining parts and of the solder materials. In particular Young’s modulus, yield stress, and the hardness are of great interest. Moreover, a complete stress-strain curve is important for a detailed material characterization and simulation of a component, e.g., by Finite Elements (FE). The miniaturization of modern electronic products with small solder joints allows only fabrication of very small-sized specimens. Because of this miniature tests are used for measuring the mechanical properties of the solders in the experimental investigations of this paper. More specifically two miniature tests are presented and discussed, a mini-uniaxial-tension-test and a nanoindenter experiment. In the tensile test the axial loading is prescribed, the corresponding extension of the specimen length is recorded, both of which determines the stress-strain- curve directly. The stress-strain curves are then mathematically analyzed by assuming a non-linear relationship between stress and strain of the Ramberg-Osgood type and fitting the corresponding parameters to the experimental data by means of an optimization routine. For a detailed analysis of very local mechanical properties nanoindentation is used, resulting primarily in load vs. indentation-depth data. According to the procedure of Pharr and Oliver this data can be used to obtain hardness and Young’s modulus but not a complete stress-strain curve, at least not directly. In order to obtain such a stress-strain-curve, the nanoindentation experiment is combined with FE and the coefficients involved in the corresponding constitutive equation for stress and strain are obtained by means of the inverse method. Finally in this paper, the stress-strain curves from nanoindentation and tensile tests are compared for two materials, namely aluminum and steel and differences are explained in terms of the locality of the measured properties.     

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

The soldering process of interconnecting crystalline silicon solar cells to form photovoltaic (PV) module is a key manufacturing process. However, during the soldering process, stress is induced in the solar cell solder joints and remains in the joint as residual stress after soldering. Furthermore, during the module service life time, thermo-mechanical degradation of the solder joints occurs due to thermal cycling of the joints which induce stress, creep strain and strain energy. The resultant effect of damage on the solder joint is premature failure, hence shortened fatigue life. This study seeks to determine accumulated thermo-mechanical damage and fatigue life of solder interconnection in solar cell assembly under thermo-mechanical cycling conditions. In this investigation, finite element modelling (FEM) and simulations are carried out in order to determine nonlinear degradation of SnAgCu solder joints. The degradation of the solder material is simulated using Garofalo-Arrhenius creep model. A three dimensional (3D) geometric model is subjected to six accelerated thermal cycles (ATCs) utilising IEC 61215 standard for photovoltaic panels. The results demonstrate that induced stress, strain and strain energy impacts the solder joints during operations. Furthermore, the larger the accumulated creep strain and creep strain energy in the joints, the shorter the fatigue life. This indicates that creep strain and creep strain energy in the solder joints significantly impacts the thermo-mechanical reliability of the assembly joints. Regions of solder joint with critical stress, strain and strain energy values including their distribution are determined. Analysis of results demonstrates that creep energy density is a better parameter than creep strain in predicting interconnection fatigue life. The use of six ATCs yields significant data which enable better understanding of the response of the solder joints to the induced loads. Moreover, information obtained from this study can be used for improved design and better-quality fabrication of solder interconnections in solar cell assembly for enhanced thermo-mechanical reliability.     

基于PCA和粒子群优化算法的焊点缺陷识别

针对生产线上的表面贴装技术(SMT）焊点图像的特点,提出了一种基于PCA和粒子群算法-误差反向传播（PSO-BP）神经网络的焊点缺陷识别方法。首先使用图像处理技术和CCD传感器对PCB焊点图像进行预处理,采用中值滤波、灰度图像增强、全局阈值法等方法,有效抑制噪声干扰并提高了图像对比度,提取出较好的图像特征。然后运用主成分分析法提取包含焊点86.6%特征信息的5个主成分,并输入到经粒子群算法改进后的BP神经网络。通过具体的实验分析,结果表明改进的BP神经网络具有较好的识别分类效果,能够对正常、多锡、少锡、漏焊四种不同类型的焊点进行识别,准确率达93.22%,算法可靠,在实际生产中能够有效的提高检测效率。     

焊点质量检测新方法

提出一种基于小波神经网络的焊点质量检测算法。首先对焊点图像进行预处理,然后提出采用形态因子和曲率作为焊点图像特征,最后建立焊点质量检测的小波神经网络模型。实验结果表明,提出的焊点质量检测算法具有较快的处理速度以及较高的准确率。     

Structural improvement for solder joint failure in ultrasonic plastic assembly

This paper presents a method of structural dynamic analysis with finite element method to identify the cause failure of solder joint caused by the vibration of ultrasonic welding. In this method, explicit FE method and its contact algorithm are used to simulate the energy transmission from vibrational energy to internal energy under some assumptions. Therefore, firstly, its feasibility is verified by 2D coupled thermal–mechanical analysis. Then, based on a certain type of cell phone battery, a 3D FE model is established for analyzing the vibration of the solder joints during ultrasonic welding. According to the simulation, we analyze the cause of the failure from three aspects: the location of the chip, the shape of the PCB and the structure of the housing. Correspondingly, the improvements are presented and applied to trial manufacture. The result from mass production shows that the improvements can decrease the reject ratio by 90% compared with the original design.     

非均匀分布双面SMT及PBGA焊后塌陷高度控制

为了将大型计算机内部的热量及时传导出去，需采用一种新型的散热器，并将印制板上的发热元件集中安放在某一面，因此要求严格控制PBGA焊后塌陷高度，以保证散热器的合理安装和紧密接触。此外，如何保证非均匀分布印制板双面焊接的可靠性，也是表面贴装过程中的一个难题。     

Pattern classification of solder joint images using a correlation neural network

This paper presents a method of classifying solder joints on printed-circuit boards (PCB), using a neural-network approach. Inherently, the surface of the solder joints is curved, tiny and specularly reflective; it induces a difficulty of taking good images of the solder joints. The shapes of the solder joints tend to vary greatly with soldering conditions; solder joints, even when classified into the same soldering quality, have very different shapes. Furthermore, the position of the joints is not consistent within a registered solder pad on the PCB. Due to these aspects, it has been difficult to determine the visual features and classification criteria for automatic solder-joint inspection. In this research, the solder joints, imaged by using a circular, tiered illumination system of three colored lamps, are represented as red, green and blue colored patterns, showing their surface-slopes. Cross-correlation and auto-correlation of the colored patterns are used to classify the 3D shapes of the solder joints by their soldering qualities. To achieve this, a neural network is proposed, based on a functional link net, with two processing modules. The first preprocessing module is designed to implement the calculation of the correlations in functional terms. The subsequent, trainable module classifies the solder joints, based upon the capability learned from a human supervisor. The practical feasibility of the proposed method is demonstrated by testing numerous commercially manufactured PCBs.     

基于彩色图像分割技术的SMT焊点质量检测

图像分割的策略和方法是SMT焊点图像处理的一项关键技术,也一直是SMT焊点计算机质量检测的瓶颈;以SMT焊点的颜色和几何特征作为分析对象,在灰度图像分割所用二维阈值化的分割方法的基础上,提出一种从颜色直方图的量化级数和二维直方图概率密度不均匀化两个方面改进后的适用于HSV彩色空间图像分割技术,并将其应用于SMT焊点的质量检测;通过其得到SMT片式元器件焊点的图像,对其进行形态学处理后,利用Matlab软件将SMT焊点成功地从PCB板上分离出来,为三维重建提供良好的基础。