An experimental study of edge radius effect on cutting single crystal silicon

According to the hypothesis of ductile machining, brittle materials undergo a transition from brittle to ductile mode once a critical undeformed chip thickness is reached. Below this threshold, the energy required to propagate cracks is believed to be larger than the energy required for plastic deformation, so that plastic deformation is the predominant mechanism of material removal in machining these materials in this mode. An experimental study is conducted using diamond cutting for machining single crystal silicon. Analysis of the machined surfaces under a scanning electron microscope (SEM) and an atomic force microscope (AFM) identifies the brittle region and the ductile region. The study shows that the effect of the cutting edge radius possesses a critical importance in the cutting operation. Experimental results of taper cutting show a substantial difference in surface topography with diamond cutting tools of 0° rake angle and an extreme negative rake angle. Cutting with a diamond cutting tool of 0° rake angle could be in a ductile mode if the undeformed chip thickness is less than a critical value, while a ductile mode cutting using the latter tool could not be found in various undeformed chip thicknesses.     

Micromechanical machining of soda lime glass

Micromechanical machining, which is the mechanical removal of materials using miniature cutting tools, is one of the fabrication methods in the microrealm that has recently attracted a great deal of attention because it has the advantage of being able to machine complex shapes from brittle materials. The most challenging problem in the mechanical machining of brittle material is the fabrication of fracture-free surfaces. To avoid brittle fractures, a thorough investigation is required to find the machining parameters in the ductile cutting regime, which is characterized by plastic deformation of the material when the chip thickness is smaller than the critical value. In this study, cutting forces and surface characteristics of soda lime glass are examined in detail. Conical scratch tests are performed to identify the critical chip thickness, and the cutting forces in the ductile regime are modeled. In addition, coated ball end mill cutters were used to perform machining on inclined soda lime glass to investigate the feed rate effects, up and down milling, and depth of cuts on the surface finish and to examine tool wear.     

A study on the effect of tool-edge radius on critical machining characteristics in ultra-precision milling of tungsten carbide

A crack-free surface can be finished on brittle materials by a specialized but traditional machining technique known as ductile-mode machining. In ductile-mode machining of brittle material, crack propagation is suppressed by selecting a suitable combination of tool and machining parameters leading to the removal of material through plastic deformation enabled by dislocation motion. In ductile-mode machining, the tool–workpiece interaction is of critical significance for the capability of the cutting process to finish a crack-free surface on a brittle material. This interaction is largely dictated by the cutting-edge radius of the tool when the undeformed chip thickness is comparable to the edge radius as is the case of ductile-mode machining. This paper presents the experimental results of ductile-mode milling of tungsten carbide to investigate the effect of cutting-edge radius on certain critical machining characteristics associated with the ductile–brittle transition specific to milling process of brittle material. The experimental results have established that an increase in the cutting-edge radius within a certain range increases the critical feed per edge leading to the improvement of material removal rate in ductile-mode milling. An increasingly negative effective rake angle is desired during milling with larger edge-radiused tool to suppress the crack propagation in the cutting zone to achieve ductile-mode machining. The results also identify the effect of the edge radius on certain other parameters such as critical specific cutting energy, plowing effect and subsurface damage depth to comprehend the ductile–brittle transition phenomenon in ductile-mode milling.     

Brittle–ductile mode cutting of glass based on controlling cracks initiation and propagation

Owing to brittleness and hardness, functional glass is one of the most difficult to cut materials. This paper proposes a new machining method—brittle–ductile mode machining combining both properties of brittle breakage and plastic flow of glass. Edge-indention experiments are first conducted in order to deduce the laws of crack initiation and propagation in the process of glass cutting, then a single-straight tool with big inclination angle is designed for glass cutting based on the laws of crack initiation and propagation and properties of plastic flow. With this new tool, the lateral and subsurface cracks initiation can be suppressed, and media cracks propagate away from machined surface. At the same time, the requirements for machining glass in ductile manner can be fulfilled. Validation experiments show that highly efficient and precise glass cutting can be achieved at the cutting depth of sub-millimeter level, and an integral and crack-free surface with good finish can be obtained. This method overcomes the process restriction on critical cutting depth and tool feed for ductile regime turning technology and can be transferred to mass production.     

Ultraprecision machining of polymers

The single-point diamond machining of several polymeric materials has been investigated. The final surface structure and roughness of the workpiece is determined by well-established fundamentals of polymer mechanics. Material is removed via ductile, brittle, or transitional mechanisms that depend on polymer properties such as glass transition temperature, relaxation time, degree of crosslinking, and viscosity. For some materials, the mechanism could be changed from ductile to brittle with a change of operating and tool parameters. In brittle materials, the surface roughness is largely controlled by the rake face angle of the diamond. For ductile workpieces, the melt viscosity of the polymer is important. Crosslinked materials are restricted from ductile behavior by the presence of chemical bonds. As a result, material removal occurs by rupture or an extreme fracture process. With an understanding of polymer behavior, suitability of new materials for single-point diamond machining can be assessed. The change of successful processing within the operating range of the tool can be determined with a minimum number of trial and error experiments.     

<Emphasis Type="Bold">Ductile or Partial Ductile Mode Machining of Brittle Materials</Emphasis>

This paper reports ductile or partial ductile mode machining of silicon, glass and some advanced ceramics. Results are presented using scanning electron micrographs of the machined surfaces. Grinding and lapping operations using inexpensive machine tools could produce ductile streaks on surfaces of these brittle materials under good conditions. Manufacture of spherical glass lenses by the fracture mode or partial ductile mode grinding followed by partial ductile mode lapping and ductile mode polishing is fast and economical. Using partial ductile mode grinding and ductile mode polishing has also been very successful for manufacturing aspherical glass lenses. Reduced polishing time and improved surface quality are due to the presence of ductile streaks. Ground silicon, ZrO2 and Al2O3 also showed ductile streaks. Toroidal SiC surfaces ground with flat-face cup wheels indicated 100% ductile machining, and did not require polishing.     

An experimental study on the machining characteristics in ductile-mode milling of BK-7 glass

Glass is considered as one of the most challenging materials to machine because of its high hardness coupled with high brittleness. The challenge, in machining such a brittle material, lies in achieving the material removal through plastic deformation rather than characteristic brittle fracture. It has already been established that every brittle material, no matter how brittle it is, can be machined in ductile mode under certain critical conditions. The critical conditions are material specific, and hence, every material tends to show unique behavior in terms of critical conditions during machining process. This paper outlines the results of an experimental study to determine the critical chip thickness for ductile–brittle transition, chip morphology, and the effect of cutting speed on the critical conditions in peripheral milling process of BK-7 glass. It is established experimentally that the cutting speed affects the chip morphology, machined surface quality, and critical conditions due to possible thermal effects in such a way that ductile–brittle transition phenomenon is facilitated at high cutting speeds.     

Characteristics of chip generation by ultrasonic vibration cutting with extremely low cutting velocity

Recently, mirror-surface machining of brittle materials such as ferrite, glass, and optical plastics has become more important, as these materials are used in optical communications and precision devices. Non-ferrous metals such as aluminium and copper were readily turned with diamond tools, but as the need for both infra-red and reflective optics escalated, the need to machine brittle materials arose. In this paper, ultrasonic vibration cutting at 20 kHz at extremely low cutting velocity for the precision machining of brittle plastics used for optical lenses is suggested and tested. The mechanism of chip generation, and characteristics of surfaces in the ductile mode, machined by ultrasonic vibration cutting are investigated. As a result, when micro cutting by ultrasonic vibration, it was confirmed that the chips generated by ductile mode cutting are obtained at 1/40 of the critical cutting velocity of the ultrasonic vibration cutting system, which is an extremely low cutting velocity.     

A review on ductile mode cutting of brittle materials

Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.     

Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials

Elliptic ultrasonic vibration-assisted grinding has been proven to be a high-efficiency machining technique for some brittle materials. This paper aims to investigate the chip generating characteristics in grinding of brittle materials with vertical elliptic vibration assistance. Vertical elliptic ultrasonic vibration-assisted grinding for precision machining brittle polysilicon is suggested and tested. The mechanism of chip generation and characteristics of surfaces in ductile mode, machined by ultrasonic vibration-assisted grinding, are investigated. As a result, when microgrinding by ultrasonic vibration, it was confirmed that the continuous chips generated by ductile mode can be more easily be fully developed.     

An experimental study on microcutting of silicon using a micromilling machine

Micro-end-milling can potentially create desired 3D free-form surface features on silicon using ductile machining technology. A number of technological barriers must be overcome for micro-end-milling to be applied in the cutting of single crystal silicon. To produce smooth surfaces on brittle materials, such as silicon, it is important that the material be machined in the ductile mode. A major limitation of machining brittle materials is that the process of removing the material can generate subsurface damage. We have carried out an experimental study to find the optimum cutting conditions for obtaining ductile regime machining using a micromilling machine. The ductile and brittle regimes in the machining of silicon using diamond-coated end mills were demonstrated by machining grooves. The force ratio, F_t/F_c, was used to determine the milling performance on silicon. The experimental data show that the dominant ductile cutting mode was achieved when F_t/F_c?>?1.0.     

AN EXPERIMENTAL STUDY OF ORTHOGONAL MACHINING OF GLASS

An experimental study of machining glass with a geometrically defined cutting tool is presented. Orthogonal cutting conditions are employed to permit a focus on the fundamental modes of chip and surface formation. Analysis of the machined surfaces under an optical microscope identifies four regimes that are distinctly different with respect to either chip formation or surface formation. For a very small target uncut chip thickness, one on the order of the cutting edge radius, pure rubbing of the edge with no chip formation is observed. Edge rubbing imparts light scuffmarks on the machined surface giving it a frosted appearance. At a larger uncut chip thickness, ductile-mode chip formation occurs ahead of the cutting edge and a scuffed surface remains after the subsequent rubbing of the edge across the freshly machined surface. A further increase in uncut chip thickness maintains a ductile-mode of chip formation, but surface damage initiates in the form of surface cracks that grow down into the machined surface and ahead of the tool. The transition to this machining mode is highly dependent on rake angle. Increasing the uncut chip thickness further causes brittle spalling of chips leaving half-clamshell shaped divots on the surface. This experimental identification of the machining modes and their dependence on uncut chip thickness and rake angle supports the use of geometrically defined cutting tools to machine glass in a rough-semi-finish-finish machining strategy as is traditionally employed for machining metals.     

Diamond Turning of Soft Semiconductors to Obtain Nanometric Mirror Surfaces

Diamond cutting is a viable alternative to grinding and polishing in the fabrication of high-quality soft semiconductors. Investigation of indentation provides useful information for understanding the practical diamond cutting process of brittle materials. Cutting forces and temperatures were analysed using a Kistler dynamometer and an infrared technique. A zero rake angle cutting tool was found to be most efficient, partly because the effective rake is really a strong negative rake brought about by the peculiar configuration of very low feeds and depths of cut. This is explained by means of the comparison of the force distribution between conventional turning and ultraprecision machining. Atomic force microscopy and scanning electron microscopy were used to study the surfaces. Zinc sulfide gave subnanometric surfaces (0.88 m) and zinc selenide gave Ra values of 2.91 nm.     

Analysis and monitoring of mode transitions during afm nanomachining of IZO-Coated pyrex glass

The goal of this research is to investigate and monitor machining mode transitions during nanoscale scratching of IZO-coated Pyrex glasses using atomic force microscope (AFM). Among the AFM nanomachining mode features, which include elastic/plastic deformations and crack generation, pile-up (by ploughing) is a key surface phenomenon that can represent plastic deformation characteristics, such as a sign of chip making. Moreover, because the pile-up formation mechanism of coated materials is reported to be distinct from that of bulk materials, the examination of pile-up in coated materials is challenging, along with brittle transition (crack initiation). In this research, the pile-up formation and crack initiation, that occur during nanoscratching, were examined and analyzed near the coating-substrate (glass) boundary. In addition, acoustic emission (AE), a sensing scheme with nanoscale sensitivity, was introduced to detect significant machining state variations and mode transitions. Experimental and analysis results indicate that the proposed scheme is viable for characterizing/monitoring the nanoscale machining of coated materials.     

Research on single-point diamond fly-grooving of brittle materials

The purpose of this paper is to investigate the machining mechanisms that accompany the single-point diamond fly-cutting operation in grooving of brittle materials. Single-point diamond fly-cutting is widely used in precision machining of free-form optics, semiconductor devices, and micro-electromechanical system (MEMS) components among many others. The undeformed chip zone was analyzed and its relation to the critical brittle/ductile transition depth of cut was discussed. Then, a mechanics-based model was proposed to describe the material stress condition under the diamond tool. The machining parameters were incorporated into the model to understand fly-cutting behavior. It was shown that the fly-cutting technique is highly suitable for the ductile removal of brittle materials by generating large compressive pressures in the chip formation zone. This condition can be further enhanced by a small feedrate and a large negative rake angle of the diamond tool used. The theoretical results were substantiated and verified by fly-grooving experiments performed on mono-crystalline silicon.     

AN EXPERIMENTAL STUDY OF ORTHOGONAL MACHINING OF GLASS

Abstract

An experimental study of machining glass with a geometrically defined cutting tool is presented. Orthogonal cutting conditions are employed to permit a focus on the fundamental modes of chip and surface formation. Analysis of the machined surfaces under an optical microscope identifies four regimes that are distinctly different with respect to either chip formation or surface formation. For a very small target uncut chip thickness, one on the order of the cutting edge radius, pure rubbing of the edge with no chip formation is observed. Edge rubbing imparts light scuffmarks on the machined surface giving it a frosted appearance. At a larger uncut chip thickness, ductile-mode chip formation occurs ahead of the cutting edge and a scuffed surface remains after the subsequent rubbing of the edge across the freshly machined surface. A further increase in uncut chip thickness maintains a ductile-mode of chip formation, but surface damage initiates in the form of surface cracks that grow down into the machined surface and ahead of the tool. The transition to this machining mode is highly dependent on rake angle. Increasing the uncut chip thickness further causes brittle spalling of chips leaving half-clamshell shaped divots on the surface. This experimental identification of the machining modes and their dependence on uncut chip thickness and rake angle supports the use of geometrically defined cutting tools to machine glass in a rough-semi-finish-finish machining strategy as is traditionally employed for machining metals.     

脆性金属切屑形成过程的试验研究

通过大量的切削试验研究,得到了脆性金属切屑形状和变形系数与切削用量、刀具前角等之间的关系。指出了切削速度和刀具前角对切屑形状和变形影响的复杂性。明确了脆性金属与塑性金属切屑形状和变形规律的不同点。阐明了脆性金属切屑形状和变形的特殊性。     

A review on the current research trends in ductile regime machining

Ductile regime machining is an alternative method for polishing of brittle materials to obtain a high quality surface finish by a ductile or plastic material removal process. Hence, there is a growing interest to study ductile regime machining over several decades. This paper reviews current state of research and development in ductile regime machining. The research and development associated with mechanism of brittle–ductile transition, surface integrity, and the factors influencing ductile regime machining are discussed in details in this paper.     

Extreme negative rake angle technique for single point diamond nano-cutting of silicon

Experiments were conducted to evaluate cuts made with the rake face of the tool and the clearance face. The technique involved cutting in the corresponding opposite directions, i.e., forward with the rake face and backward with the clearance face. Cutting of single crystal silicon with both the rake and the clearance face resulted in a smooth ductile cut, with no evidence of fracture. This cutting technique may prove useful for furthering our understanding of the ductile machining of brittle materials.     

DETECTION OF DUCTILE TO BRITTLE TRANSITION IN MICROINDENTATION AND MICROSCRATCHING OF SINGLE CRYSTAL SILICON USING ACOUSTIC EMISSION

Machining of brittle materials entails two modes of material removal: pure plastic deformation and brittle fracture. The mode of material removal is generally identified by surface quality observations in a scanning electron microscope (SEM) or an atomic force microscope (AFM) after machining. Hence, there is a need for the development of in-process monitoring technology in order to detect whether the mode of material removal is ductile or brittle, and thereby predict surface quality. In the present paper, acoustic emission (AE) is proposed as a means of monitoring the ductile to brittle transition. Microindentation and microscratching tests of single crystal silicon were conducted using an ultrafine-motion table with very small motion error. The obtained AE signals were correlated with crack initiation and the ductile to brittle transition. The critical force f_c defined as the force at which AE was induced during the microindentation and microscratching tests was measured to be 40 ∼ 50 mN. AFM observations revealed the critical depth of cut d_c to be 0.20 μm in the microscratching test.