Low thermal conductivity of atomic layer deposition yttria-stabilized zirconia (YSZ) thin films for thermal insulation applications

Thermal insulation applications have long required materials with low thermal conductivity, and one example is yttria (Y₂O₃)-stabilized zirconia (ZrO₂) (YSZ) as thermal barrier coatings used in gas turbine engines. Although porosity has been a route to the low thermal conductivity of YSZ coatings, nonporous and conformal coating of YSZ thin films with low thermal conductivity may find a great impact on various thermal insulation applications in nanostructured materials and nanoscale devices. Here, we report on measurements of the thermal conductivity of atomic layer deposition-grown, nonporous YSZ thin films of thickness down to 35 nm using time-domain thermoreflectance. We find that the measured thermal conductivities are 1.35–1.5 W m⁻¹ K⁻¹ and do not strongly vary with film thickness. Without any reduction in thermal conductivity associated with porosity, the conductivities we report approach the minimum, amorphous limit, 1.25 W m⁻¹ K⁻¹, predicted by the minimum thermal conductivity model.     

Fabrication of highly insulating foam glass made from CRT panel glass

We prepared low-density foam glasses from cathode-ray-tube panel glass using carbon and MnO₂ as the foaming agents. We investigated the influence of the carbon and MnO₂ concentrations, the glass-powder preparation and the foaming conditions on the density and homogeneity of the pore structure and the dependence of the thermal conductivity on the foam density. The results show that the moderate foaming effect of the carbon is greatly improved by the addition of MnO₂. A density as low as 131 kg m⁻³ can be achieved with fine glass powder. The foam density has a slight dependence on the carbon and MnO₂ concentrations, but it is mainly affected by the foaming temperature and the time. The thermal conductivity of the foam-glass samples is lower than that of commercial foam glasses with the same density. The lowest value was determined to be 42 mW m⁻¹ K⁻¹ for a foam glass with a density of 131 kg m⁻³. A further improvement in the closed porosity could potentially decrease the thermal conductivity even further, and thus our approach has great potential in terms of a thermal insulation material.     

Thermal conductivity of ceramic/metal composites from preforms produced by freeze casting

Porous alumina and zirconia preforms, processed by ice templating, have been used to manufacture ceramic/metal composites by aluminium alloy infiltration. The aim of the present work is to study the influence of the ceramic material nature and of the initial porous structure on the thermal conductivity anisotropy of the composite in order to assess potential applications in the field of thermal management. The materials are characterised in terms of pore volume fraction and pore size before and after metal infiltration. The freeze casted preforms exhibit anisotropic lamellar structures with ellipsoidal pores ranging from 35 µm to 40 µm and porosity fractions from 64 to 67%. After metal infiltration, composite parts present the same anisotropic morphology, which correspond to alternating ceramic and metal layers. Thermal conductivities have been determined, with an average of 80 W m⁻¹ K⁻¹ and 13 W m⁻¹ K⁻¹ parallel and perpendicular to the freezing direction respectively, for zirconia/metal composites. Theoretical values of thermal conductivity can be calculated using the Maxwell-Eucken relation, to handle the residual porosity, in combination with series and parallel resistance models to describe the overall anisotropic character. These give good agreement to experiment.     

Low cost preparation of high thermal conductivity carbon blocks with ultra-high anisotropy from a commercial graphite paper

A carbon block with ultra-high anisotropy was produced from a commercial graphite paper as the thermal reinforcement and a thermosetting phenolic resin as the binder. Hot-pressing at a maximum temperature of 200 °C was used to densify and integrate the graphite paper stacks. It has been found that the graphite paper blocks have high thermal conductivities in the paper direction and low ones perpendicular. An anisotropy of 98.8% and a thermal conductivity of 197.8 W m^?1 K^?1 in the paper direction were achieved when the density was 1.1 g cm^?3. The thermal conductivity increased to 284.8 W m^?1 K^?1 with a decrease of anisotropy to 98.3% with a density of 1.56 g cm^?3.     

Thermal,mechanical and electrical properties of hard B4C,BCN, ZrBC and ZrBCN ceramics

We study the thermal, mechanical and electrical properties of B₄C, BCN, ZrBC and ZrBCN ceramics prepared in the form of thin films by magnetron sputtering. We focus on the effect of Zr_x(B₄C)_1−x sputter target composition, the N₂+Ar discharge gas mixture composition, the deposition temperature and the annealing temperature after the deposition. The thermal properties of interest include thermal conductivity (observed in the range 1.3–7.3 W m⁻¹ K⁻¹), heat capacity (0.37–1.6×10³ J kg⁻¹ K⁻¹ or 1.9–4.1×10⁶ Jm⁻³ K⁻¹), thermal effusivity (1.6–4.5×10³ J m⁻² s^−1/2 K⁻¹) and thermal diffusivity (0.38–2.6×10⁻⁶ m² s⁻¹). We discuss the relationships between materials composition, preparation conditions, structure, thermal properties, temperature dependence of the thermal properties and other (mechanical and electrical) properties. We find that the materials structure (amorphous×crystalline hexagonal ZrB₂-like×nanocrystalline cubic ZrN-like), more than the composition, is the crucial factor determining the thermal conductivity and other properties. The results are particularly important for the design of future ceramic materials combining tailored thermal properties, mechanical properties, electrical conductivity and oxidation resistance.     

Thermal analysis of submicron nanocrystalline diamond films

The thermal properties of sub-μm nanocrystalline diamond films in the range of 0.37–1.1 μm grown by hot filament CVD, initiated by bias enhanced nucleation on a nm-thin Si-nucleation layer on various substrates, have been characterized by scanning thermal microscopy. After coalescence, the films have been outgrown with a columnar grain structure. The results indicate that even in the sub-μm range, the average thermal conductivity of these NCD films approaches 400 W m^− 1 K^− 1. By patterning the films into membranes and step-like mesas, the lateral component and the vertical component of the thermal conductivity, k_lateral and k_vertical, have been isolated showing an anisotropy between vertical conduction along the columns, with k_vertical ≈ 1000 W m^− 1 K^− 1, and a weaker lateral conduction across the columns, with k_lateral ≈ 300 W m^− 1 K^− 1.     

Dielectric properties of silicon nitride ceramics produced by free sintering

The silicon nitride ceramics with a beneficial combination of low dielectric losses and improved physical properties was fabricated by cold isostatic pressing and pressureless sintering. The fine grain microstructure, three-phase composition based on the β-SiAlON, the small amount of the glass phase and relatively small porosity promote a unique combination of a low thermal conductivity 14.51 W m⁻¹ K⁻¹ and low dielectric loss 1.4·10⁻³. A novel method is proposed to overcome the main drawbacks of the commercial and high-cost technologies.     

Highly thermal conductive composites with polyamide-6 covalently-grafted graphene by an in situ polymerization and thermal reduction process

The thermal conductive polyamide-6/graphene (PG) composite is synthesized by in situ ring-opening polymerization reaction using ε-caprolactam as the monomer, 6-aminocaproic acid as the initiator and reduced graphene oxide (RGO) as the thermal conductive filler. The generated polyamide-6 (PA6) chains are covalently grafted onto graphene oxide (GO) sheets through the “grafting to” strategy with the simultaneous thermal reduction reaction from GO to RGO. The homogeneous dispersion of RGO sheets in PG composite favors the formation of the consecutive thermal conductive paths or networks at a relatively low GO sheets loading, which improves the thermal conductivity (λ) from 0.196 W m⁻¹ K⁻¹ of neat PA6 to 0.416 W m⁻¹ K⁻¹ of PG composite with only 10 wt% GO sheets loading.     

Porous Ca3Co4O9 with enhanced thermoelectric properties derived from Sol–Gel synthesis

Highly porous Ca₃Co₄O₉ thermoelectric oxide ceramics for high-temperature application were fabricated by sol–gel synthesis and subsequent conventional sintering. Growth mechanism of misfit-layered Ca₃Co₄O₉ phase, from sol–gel synthesis educts and upcoming intermediates, was characterized by in-situ X-ray diffraction, scanning electron microscopy and transmission electron microscopy investigations. The Ca₃Co₄O₉ ceramic exhibits a relative density of 67.7%. Thermoelectric properties were measured from 373 K to 1073 K. At 1073 K a power factor of 2.46 μW cm⁻¹ K⁻², a very low heat conductivity of 0.63 W m⁻¹ K⁻¹ and entropy conductivity of 0.61 mW m⁻¹ K⁻² were achieved. The maintained figure of merit ZT of 0.4 from sol–gel synthesized Ca₃Co₄O₉ is the highest obtained from conventional, non-doped Ca₃Co₄O₉. The high porosity and consequently reduced thermal conductivity leads to a high ZT value.     

A new estimation method for the intrinsic thermal conductivity of nonmetallic compounds: A case study for MgSiN2, AlN and β-Si3N4 ceramics

A new method for estimating the maximum achievable thermal conductivity of non-electrically conducting materials is presented. The method is based on temperature dependent thermal diffusivity data using a linear extrapolation method enabling discrimination between phonon-phonon and phonon-defect scattering. The thermal conductivities estimated in this way for MgSiN₂, AlN and β-Si₃N₄ ceramics at 300 K equal 28, 200 and 105 W m⁻¹ K⁻¹, respectively in favourable agreement with the highest experimental values of 23, 266 and 106–122 W m⁻¹ K⁻¹. This suggests the general applicability of the proposed estimation method for non-metallic compounds. It is expected that when optic phonons contribute to the heat conduction (as is the case for AlN) the intrinsic thermal conductivity at lower temperatures (e.g. 300 K) is underestimated. However, the reliability and accuracy of the presented ‘easy to use’ estimation method seems to be much better than several other estimation methods. Furthermore the needed input for this method can provide information about which processing parameters should be optimised to obtain the highest thermal conductivity.     

Effect of seeding on the thermal conductivity of self-reinforced silicon nitride

Thermal conductivity of Si₃N₄ containing large β-Si₃N₄ particles as seeds for grain growth was investigated. Seeds addition promotes growth of β-Si₃N₄ grains during sintering to develop the duplex microstructure. The thermal conductivity of the material sintered at 1900 °C improved up to 106 W m⁻¹ K⁻¹, although that of unseeded material was 77 Wm⁻¹ K⁻¹. Seeds addition leads to reduction of the sintering temperature with developing the duplex microstructure and with improving the thermal conductivity, which benefits in terms of production cost of Si₃N₄ ceramics with thermal conductivity. ©     

Ultralow cost reticulated carbon foams from household cleaning pad wastes

A very simple method is described for preparing ultra lightweight and ultralow cost carbon foams (density 0.04–0.075 g cm⁻³ and porosity 98–96%) by impregnation with sucrose of household cleaning pad wastes used as sacrificial templates, followed by pyrolysis in inert atmosphere. Scanning electron microscopy showed that the resultant reticulated vitreous carbon (RVC) foams had a fully open and interconnected porous structure. These materials are more thermally insulating (thermal conductivity 0.042–0.065 W m⁻¹ K⁻¹) than commercial RVC foams having similar compressive strengths (0.11–0.23 MPa) and similar densities.     

Large-area reduced graphene oxide thin film with excellent thermal conductivity and electromagnetic interference shielding effectiveness

In this work, we fabricated reduced large-area graphene oxide (rLGO) with maximum surface area of 1592 μm² through a cost-effective chemical reduction process at low temperature. The product revealed large electrical conductivity of 243 ± 12 S cm⁻¹ and thermal conductivity of 1390 ± 65 W m⁻¹ K⁻¹, values much superior to those of a conventional reduced small-area graphene oxide (with electrical conductivity of 152 ± 7.5 S cm⁻¹ and thermal conductivity of 900 ± 45 W m⁻¹ K⁻¹). The rLGO thin film also exhibited not only excellent stiffness and flexibility with Young’s modulus of 6.3 GPa and tensile strength of 77.7 MPa, but also an efficient electromagnetic interference (EMI) shielding effectiveness of ∼20 dB at 1 GHz. The excellent performance of rLGO is attributed to the fact that the larger area LGO sheets include much fewer defects that are mostly caused by the damage of graphene sp² structure around edge boundaries, resulting in large electrical conductivity. The manufacturing process of rLGO is an economical and facile approach for the large scale production of highly thermally conducting graphene thin films with efficient EMI shielding properties, greatly desirable for future portable electronic devices.     

Improvement on characteristics of porous alumina from platelets using a TEOS treatment

A porous alumina body was synthesized from anisotropic alumina particles, namely platelets. When green compacts, which had been uniaxially pressed at 1 MPa, were heated at 1200 and 1500 °C for 1 h, the average porosity of the resulting alumina bodies was 75.5 and 71.0%, respectively. The thermal conductivity of the porous alumina fabricated at 1400 °C for 1 h with 72.3% in porosity was 0.8 W m^?1 K^?1. In an attempt to increase the compressive strength of the porous alumina bodies, TEOS (tetraethyl orthosilicate) solution treatment was carried out, followed by reheating to 1400 °C for 1 h. The compressive strength of the porous alumina body increased from 3.8 MPa (without TEOS solution treatment) to 10.2 MPa (with three rounds of TEOS treatment), with the porosity decreasing to 65.5% and the thermal conductivity increasing to1.2 W m^?1 K^?1.     

Dense carbon monoliths for supercapacitors with outstanding volumetric capacitances

A commercially available dense carbon monolith (CM) and four carbon monoliths obtained from it have been studied as electrochemical capacitor electrodes in a two-electrode cell. CM has: (i) very high density (1.17 g cm⁻³), (ii) high electrical conductivity (9.3 S cm⁻¹), (iii) well-compacted and interconnected carbon spheres, (iv) homogeneous microporous structure and (v) apparent BET surface area of 957 m²g⁻¹. It presents interesting electrochemical behaviors (e.g., excellent gravimetric capacitance and outstanding volumetric capacitance). The textural characteristics of CM (porosity and surface chemistry) have been modified by means of different treatments. The electrochemical performances of the starting and treated monoliths have been analyzed as a function of their porous textures and surface chemistry, both on gravimetric and volumetric basis. The monoliths present high specific and volumetric capacitances (292 F g⁻¹ and 342 F cm⁻³), high energy densities (38 Wh kg⁻¹ and 44 Wh L⁻¹), and high power densities (176 W kg⁻¹ and 183 W L⁻¹). The specific and volumetric capacitances, especially the volumetric capacitance, are the highest ever reported for carbon monoliths. The high values are achieved due to a suitable combination of density, electrical conductivity, porosity and oxygen surface content.     

Fabrication and thermal conductivity of highly porous alumina body from platelets with yeast fungi as a pore forming agent

A highly porous alumina body was fabricated by heating a green clinker body consisting of platelets and yeast fungi as a pore forming agent. Four kinds of alumina platelets were used. When green clinker bodies of platelet aggregates (A11) with 10 and 30 mass% of yeast fungi were heated at 1500 °C for 2 h, their porosities reached 72% and 78%, respectively. In contrast, when the green clinker bodies composed of platelets with an average size of 10 µm and an aspect ratio of 25–30 (SERATH①), and 20 mass% of yeast fungi were heated at 1400 °C for 2 h, the porosity of the resultant porous alumina body was also approximately 72%. However, the room temperature thermal conductivities of the porous alumina bodies with 72% porosity derived from A11 and SERATH① were 0.86 and 0.50 W m⁻¹ K⁻¹, respectively. The decrease in the thermal conductivity of the porous alumina body produced from SERATH① is caused by the long path route for heat transfer.     

Supercapacitors based on carbons with tuned porosity derived from paper pulp mill sludge biowaste

Hydrothermal carbonization followed by chemical activation is utilized to convert paper pulp mill sludge biowaste into high surface area (up to 2980 m² g⁻¹) carbons. This synthesis process employs an otherwise unusable byproduct of paper manufacturing that is generated in thousands of tons per year. The textural properties of the carbons are tunable by the activation process, yielding controlled levels of micro and mesoporosity. The electrochemical results for the optimized carbon are very promising. An organic electrolyte yields a maximum capacitance of 166 F g⁻¹, and a Ragone curve with 30 W h kg⁻¹ at 57 W kg⁻¹ and 20 W h kg⁻¹ at 5450 W kg⁻¹. Two ionic liquid electrolytes result in maximum capacitances of 180–190 F g⁻¹ with up to 62% retention between 2 and 200 mV s⁻¹. The ionic liquids yielded energy density–power density combinations of 51 W h kg⁻¹ at 375 W kg⁻¹ and 26–31 W h kg⁻¹ at 6760–7000 W kg⁻¹. After 5000 plus charge–discharge cycles the capacitance retention is as high at 91%. The scan rate dependence of the surface area normalized capacitance highlights the rich interplay of the electrolyte ions with pores of various sizes.     

Preparation by tape casting and hot pressing of copper carbon composites films

During this last decade, the use of metal matrix composites (MMCs) such as AlSiC or CuW for heat dissipation in microelectronic devices has been leading to the improvement of the reliability of electronic power modules. Today, the continuous increasing complexity, miniaturization and density of components in modern devices requires new heat dissipating films with high thermal conductivity, low coefficient of thermal expansion (CTE), and good machinability. This article presents the original use of copper carbon composites, made by tape casting and hot pressing, as heat dissipation materials. The tape casting process and the sintering have been adapted and optimised to obtain near fully dense, flat and homogeneous Cu/C composites.A good electrical contact between carbon fibres and copper matrix and a low porosity at matrix/copper interfaces allow obtaining a low electrical resistivity of 3.8 μΩ cm⁻¹ for 35 vol.% carbon fibre (electrical resistivity of copper = 1.7 μΩ cm⁻¹). The CTE and the thermal conductivity are strongly anisotropic due to the preferential orientation of carbon fibres in the plan of laminated sheets. Values in the parallel plan are, respectively, 9 × 10⁻⁶ °C⁻¹ and 160–210 W m⁻¹ K⁻¹ for 40 vol.% fibres. These CTE and thermal conductivity values are in agreement with the thermo-elastic Kerner's model and with the Hashin and Shtrikman model, respectively.     

The phase stability and thermophysical properties of InFeO3(ZnO)m (m = 2, 3, 4, 5)

The phase stability and thermophysical properties of InFeO₃(ZnO)_m (m = 2, 3, 4, 5) compounds were investigated, which are a general family of homologous layered compounds with general formula InFeO₃(ZnO)_m (m = 1–19). InFeO₃(ZnO)_m (m = 2, 3, 4, 5) ceramics were synthesized using cold pressing followed by solid-state sintering. They revealed an excellent thermal stability after annealing at 1450 °C for 48 h. No phase transformation occurred during heating to 1400 °C. InFeO₃(ZnO)₃ exhibited a thermal conductivity of 1.38 W m⁻¹ K⁻¹ at 1000 °C, which is about 30% lower than that of 8 wt.% yttria stabilized zirconia (8YSZ) thermal barrier coatings. The thermal expansion coefficients (TECs) of InFeO₃(ZnO)m bulk ceramics were in a range of (10.97 ± 0.33) × 10⁻⁶ K⁻¹ to (11.46 ± 0.35) × 10⁻⁶ K⁻¹ at 900 °C, which are comparable to those of 8YSZ ceramics.     

Microstructural dependence of the thermal and mechanical properties of monazite LnPO4 (Ln = La to Gd)

In this work are given some thermal and mechanical properties of monazite, related to the microstructure. This compound is a poor thermal conductive (λ < 5 W m⁻¹ K⁻¹), with a thermal expansion in between 9 and 10 × 10⁻⁶ K⁻¹ according to the considered crystallographic direction, and a relatively high specific heat (C_p ≈ 110 J mol⁻¹ K⁻¹). Mechanical properties of monazite are characteristic of a brittle behavior: bending strength is of about 100 MPa and fracture toughness is close to 1 MPa m^1/2. Porosity plays a large role on both thermal and mechanical properties pointing out the importance of controlling the whole elaboration process.