Infrared brazing of Ti–6Al–4V using two silver-based braze alloys

Infrared brazing of Ti–6Al–4V using two silver-based alloys is evaluated in the study. For the 72Ag–28Cu brazed specimen, Ag-rich matrix, eutectic Ag–Cu and Cu–Ti interfacial reaction layer(s) are observed in the experiment. In contrast, both Ag-rich matrix and interfacial titanium aluminides, TiAl or Ti₃Al, are found in the 95Ag–5Al brazed joint. In general, the shear strength of 72Ag–28Cu brazed joint is much higher than that of 95Ag–5Al brazed specimen. Additionally, the use of infrared brazing with lower brazing temperature and/or less time can significantly decrease both dissolution of the substrate into molten braze as well as excessive growth of the interfacial reaction layer(s) in the joint. Therefore, infrared brazing has the potential to be applied in industry.     

TiAl与Si3N4f/Si3N4复合材料钎焊接头界面结构及性能研究

采用AgCuTi钎料实现了TiAl与Si3N4f/Si3N4复合材料的钎焊,确定了钎焊接头的典型界面组织结构为TiAl/AlCuTi/Ag(s,s)/TiN/Si3N4f/Si3N4。钎焊过程中,液相钎料在Si3N4f/Si3N4复合材料表面发生较好润湿,钎料中活性元素Ti与Si3N4基体及纤维发生反应形成连续的TiN化合物层。过高的钎焊温度或过长的保温时间导致钎缝中脆性的AlCuTi化合物增加,且由于接头应力的作用在钎缝中产生微裂纹甚至开裂,严重地降低了钎焊接头性能。当钎焊温度T=850℃,保温时间为10min时,接头抗剪强度达到最大,为9.4MPa,超过Si3N4f/Si3N4母材层间抗剪强度的60%。断口分析表明:压剪过程中,断裂发生在Si3N4f/Si3N4复合材料一侧。     

Infrared brazing of Ti50Ni50 shape memory alloy using two Ag–Cu–Ti active braze alloys

Microstructural evolution, shape memory effect and shear strength of infrared brazed Ti₅₀Ni₅₀ shape memory alloy using Cusil-ABA^® and Ticusil^® active braze alloys are investigated. The Ag–Cu eutectic braze alloy can readily wet Ti₅₀Ni₅₀ substrate by minor titanium additions. The brazed Ti₅₀Ni₅₀/Cusil-ABA^®/Ti₅₀Ni₅₀ joint is mainly comprised of Cu-rich, Ag-rich and CuNiTi phases. On the other hand, the brazed Ti₅₀Ni₅₀/Ticusil^®/Ti₅₀Ni₅₀ joint consists of Ag-rich, Cu-rich and TiCu₂ phases. Because the chemical composition of Ticusil braze alloy is located inside the huge miscibility gap, the molten braze tends to be separated into two liquids during brazing. One is rich in Ag, and the other is rich in both Cu and Ti. The Ag-rich liquid does not react with Ti₅₀Ni₅₀ substrate. In contrast, the copper content is depleted from the matrix of brazed joint due to the formation of interfacial TiCu₂ phase. The TiCu₂ phase is less detrimental to the shape memory effect than CuNiTi phase during the shape recovery bending test. Shear strength of brazed joints exceeds 200 MPa for both braze alloys if the brazing time exceeds 180 s. However, thick interfacial CuNiTi and TiCu₂ layers can deteriorate the shear strength.     

TiAl与Ni基合金接触反应钎焊接头界面组织及性能

以Ti为中间层实现了TiAl与Ni基合金的接触反应钎焊。采用扫描电镜和电子探针等手段对钎焊接头的界面结构及生成相进行分析,并对接头剪切强度进行测试。结果表明:当钎焊温度为960℃时,钎缝主要由Tiss和Ti2Ni组成;当钎焊温度从960℃升高到1000℃时,钎缝中生成Ti-Al及Al-Ni-Ti化合物,典型界面结构为:GH99/(Ni,Cr)ss/Ti2Ni+AlNi2Ti+TiNi/Ti3Al+Al3NiTi2/Ti3Al+Al3NiTi2/TiAl;钎焊温度继续升高,Ti3Al和Al3NiTi2变得粗大,导致接头性能下降。当钎焊温度为1000℃,保温10min时,接头剪切强度达到最大值233MPa。随钎焊温度的升高,钎缝厚度先增加后减小。     

Effect of brazing temperature and brazing time on the microstructure and tensile strength of TiAl-based alloy joints with Ti-Zr-Cu-Ni amorphous alloy as filler metal

An amorphous Ti-37.5Zr-15Cu-15Ni (wt.%) ribbon fabricated by vacuum arc remelting and rapid solidification was used as filler metal to vacuum braze TiAl alloy (Ti-45Al-2Mn-2Nb-1B (at.%)). The effects of brazing temperature and time on the microstructure and strength of the joints were investigated in details. The typical brazed joint major consisted of three zones and the brazed joints mainly consisted of α_2-Ti₃Al phase, α-Ti phase and (Ti, Zr)₂(Cu, Ni) phase. When the brazing temperature varied from 910 °C to 1010 °C for 30 min, the tensile strength of the joint first increased and then decreased. With increasing the brazing time, the tensile strength of the joint increased. The maximum room temperature tensile strength was 468 MPa when the specimen was brazed at 930 °C for 60 min. All the fracture surfaces assumed typical brittle cleavage fracture characteristic. The fracture path varied with the brazing parameter and cracks preferred to initiate at (Ti, Zr)₂(Cu, Ni) phase and propagation path were mainly determined by the content and distribution of α-Ti phase and (Ti, Zr)₂(Cu, Ni) phase.     

Ni-Ti 钎料高温钎焊TZM晶间渗入行为研究

采用SEM,EDS,XRD和力学试验机等分析测试方法,研究了Ni-Ti钎料对TZM合金钎缝组织和性能的影响。结果表明：Ni-Ti钎料可实现TZM的高温真空钎焊连接。Ni-13.7Ti/TZM界面区,母材中的Mo与钎料中的Ni形成MoNi相,是钎料与TZM形成冶金结合的主要原因。TZM/Ni-44Ti/TZM界面区Ni-44Ti钎料中的Ti与Mo反应,Mo-Ti固溶体,使钎料和TZM形成冶金结合。Ni-44Ti钎料钎焊TZM合金产生严重晶间渗入现象。降低钎料中Ti的含量,晶间渗入和母材溶蚀现象大幅减弱;TZM/Ni-13.7Ti/TZM钎焊接头剪切强度193MPa,TZM/Ni-44Ti/TZM钎焊接头剪切强度167MPa,晶间渗入使钎缝强度降低,降低钎料中的Ti含量,钎焊接头强度提高。     

Microstructure and strength of brazed joints of TiB2 cermet to TiAl-based alloys

In this study, TiB2 cermet and TiAl-based alloy are vacuum brazed successfully by using Ag-Cu-Ti filler metal.The microstructural analyses indicate that two reaction products, Ti ( Cu, Al ) 2 and Ag bused solid solution ( Ag ( s. s ) ) , are present in the brazing seam, and the iuterface structure of the brazed joint is TiB2/TiB2 Ag ( s. s ) /Ag ( s. s ) Ti ( Cu,Al)2/Ti( Cu, Al)2/TiAl. The experimental results show that the shear strength of the brazed TiB2/TiAl joints decreases us thebrazing time increases at a definite brazing temperature. When the joint is brazed at 1 223 K for 5 min, a joint strength up to 173 MPa is achieved.     

气流磨处理钨粉的研究

在1143～1213 K、120～1500 s参数范围内以Ag-Cu-Ti箔为钎料对TiAl合金与42CrMo钢进行了真空钎焊试验.采用光学显微镜、扫描电镜、元素面扫描和能谱分析等方法对界面组织进行了分析,测量了界面反应层厚度.分析了界面反应层的形成过程及受控因素,计算了反应层成长的动力学参数.结果表明,接头界面反应层包括靠近TiAl合金的AlCuTi+Ti3Al层、AlCu2Ti层以及靠近42CrMo钢的TiC层,其成长活化能分别为324.97、207.97、338.03 kJ/mol.TiAl合金与钎科的界面反应层受控于液态钎料中的Cu元素,成长较快:42CrMo钢与钎料间的TiC层受控于固态钢中C元素,成长较慢.脆性反应层AlCuTi+Ti3Al层厚度为3.3μm时接头强度最高,脆性层厚度继续增大,接头强度显著下降.     

生成相性质及其对TiAl合金/42CrMo钢钎焊接头力学性能影响

在钎焊温度1123~1273 K,保温时间120~1500 s参数范围内对TiAl合金与42CrMo钢进行了真空扩散钎焊.用光学显微镜、扫描电镜和能谱分析等方法对界面组织进行了分析,用图像分析软件工具测量了反应层厚度;采用纳米压痕仪和显微硬度仪对TiAl合金/42CrMo钢钎焊接头的两种母材和接头界面反应相进行了硬度测试,对结果进行了对比,为了确定接头的薄弱环节,进行了扫描电镜原位观察下的接头拉伸试验.结果表明,AlCuTi,Ti₃Al,AlCu₂Ti和TiC的硬度较高,而银的固溶体硬度较低;纳米压痕的硬度结果比显微硬度值略高;扫描电镜下的原位拉伸试验结果表明,Al-Cu-Ti系反应层在受外力作用下容易发生脆性断裂,为接头的薄弱环节.     

基于银合金先导润湿的铜磷钎料钎焊钢分析

基于低熔点合金先导润湿的原理,设计制备了一种表面覆盖低熔点银合金层的新型铜磷焊片.采用该焊片钎焊45碳钢,分析了界面反应机理及钎焊接头性能,并和使用普通铜磷焊片钎焊的碳钢接头进行了对比.结果表明,表面覆盖的低熔点银合金早于铜磷合金熔化润湿碳钢基体,并形成反应层,铜磷钎料熔化后与银合金层反应熔合,冷却后形成良好的冶金连接;与使用铜磷钎料直接钎焊的接头相比,银合金先导润湿钎焊的铜磷/碳钢界面化合物层厚度明显减小,抗剪强度超过160 MPa,断裂发生在靠近连接界面的钎焊材料内部,接头强韧性显著改善.     

TiAl/Ni基合金反应钎焊接头的微观组织及剪切强度(英文)

以Ti为中间层,对TiAl基金属间化合物与Ni基高温合金进行反应钎焊连接,研究反应钎焊接头的界面微观结构及剪切强度。通过实验发现,熔融中间层与两侧母材反应剧烈,生成连续的界面反应层。典型的界面微观结构为GH99/(Ni,Cr)ss(γ)/TiNi(β2)+TiNi2Al(τ4)+Ti2Ni(δ)/δ+Ti3Al(α2)+Al3NiTi2(τ3)/α2+τ3/TiAl。当钎焊温度为1000°C,保温时间10min时,所得接头的剪切强度最高为258MPa。进一步升高钎焊温度或延长保温时间,会引起钎缝组织中组成相粗化和脆性金属间化合物层的生成,从而导致接头剪切强度的降低。     

Ni-34Ti钎料钎焊TiAl合金接头界面结构及性能

采用Ni-34Ti共晶钎料实现了TiAl合金的钎焊连接,分析了TiAl合金钎焊接头的界面结构,重点研究了钎焊温度对接头组织及性能的影响规律.结果表明,Ni-34Ti共晶钎料主要由TiNi相和TiNi3相组成,钎料熔点为1 120 ℃.不同钎焊温度下获得的接头界面组织均呈现对称特征,无气孔和裂纹等缺陷,接头中主要形成了TiNiAl2,B2,TiNiAl和TiNi2Al四种物相.Al元素在钎缝中的快速扩散,促进了钎缝中Ti-Ni-Al三元化合物的形成.钎焊温度为1 180 ℃保温10 min条件下,TiAl合金接头获得了最大的室温抗剪强度87 MPa.剪切过程中,裂纹容易在富含TiNi2Al相的区域产生和扩展,大量脆性TiNi2Al相的存在对接头的性能是有害的.     

一种新型钛基钎料合金对γ-TiAl合金的钎焊性

在钎焊温度范围为1050 ~ 1125 ℃下保温10 min,采用非晶Ti-Zr-Cu-Ni-Co-Mo钎料成功地实现了Ti-47Al-2Nb-2Cr-0.15B (原子分数,%)合金钎焊连接. 运用SEM,EDS,XRD,TEM和维氏硬度仪等分析研究了铸态和箔带钎料显微组织、温度(900 ~ 1125 ℃)和保温时间(0 ~ 15 min)对铸态钎料在TiAl基合金表面上润湿铺展面积的影响,以及钎焊接头中界面显微组织和维氏硬度在不同钎焊温度下的变化规律. 结果表明,随着温度和保温时间的增加,铸态钎料在TiAl合金母材表面润湿铺展面积的增幅先增大后减小. 钎焊接头界面组织主要包括TiAl母材层,α₂-Ti₃Al+AlCuTi (层Ⅰ)和γ-(Ti, Zr)₂(Ni, Cu)+α-(Ti, Zr)(层Ⅱ). 钎缝中各区域的硬度均随着钎焊温度的增加而增加,1125 ℃时获得最大值为872(±8) HV,主要与钎缝中生成的硬脆金属间化合物(Ti, Zr)₂(Ni, Cu)和α₂-Ti₃Al有关.     

采用Ti/Ag-Cu/Cu中间层钎焊连接Si3N4陶瓷和TiAl合金的界面结构及性能

采用Ti/Ag-Cu/Cu中间层实现了Si₃N₄陶瓷与TiAl合金的钎焊连接,获得了良好的接头.利用SEM,EDS等微观手段,分析了接头界面结构和元素分布情况.结果表明,Si₃N₄陶瓷/Ti/Ag-Cu/Cu/TiAl典型界面微观结构可能为:Si₃N₄/TiN/Ti-Si/Cu-Ti+Ag（s,s）+Cu（s,s）/AlCuTi/TiAl.在连接温度1 133 K、保温时间30 min、接头压力0.040 MPa时,接头四点弯曲强度达到最大值170 MPa.     

Interfacial features of TiAl alloy/316L stainless steel joint brazed with Zr−Cu−Ni−Al amorphous filler metal

TiAl alloy and 316L stainless steel were vacuum-brazed with Zr?50.0Cu?7.1Ni?7.1Al (at.%) amorphous filler metal. The influence of brazing time and temperature on the interfacial microstructure and shear strength of the resultant joints was investigated. The brazed seam consisted of three layers, including two diffusion layers and one residual filler metal layer. The typical microstructure of brazed TiAl alloy/316L stainless steel joint was TiAl alloy substrate/α₂-(Ti₃Al)/AlCuTi/residual filler metal/Cu₉Zr₁₁+Fe₂₃Zr₆/Laves-Fe₂Zr/α-(Fe,Cr)/316L stainless steel substrate. Discontinuous brittle Fe₂Zr layer formed near the interface between the residual filler metal layer and α-(Fe,Cr) layer. The maximum shear strength of brazed joints reached 129 MPa when brazed at 1020 °C for 10 min. The diffusion activation energies of α₂-(Ti₃Al) and α-(Fe,Cr) phases were ?195.769 and ?112.420 kJ/mol, respectively, the diffusion constants for these two phases were 3.639×10^?6 and 7.502×10^?10 μm²/s, respectively. Cracks initiated at Fe₂Zr layer and propagated into the residual filler metal layer during the shear test. The Laves-Fe₂Zr phase existing on the fracture surface suggested the brittle fracture mode of the brazed joints.     

Strong bonding of infrared brazed α2-Ti3Al and Ti–6Al–4V using Ti–Cu–Ni fillers

Infrared dissimilar brazing of α₂-Ti₃Al and Ti–6Al–4V using Ti–15Cu–25Ni and Ti–15Cu–15Ni filler metals has been performed in this study. The brazed joint consists primarily of Ti-rich and Ti₂Ni phases, and there is no interfacial phase among the braze alloy, α₂-Ti₃Al and Ti–6Al–4V substrates. The existence of the Ti₂Ni intermetallic compound is detrimental to the bonding strength of the joint. The amount of Ti₂Ni decreases with increasing brazing temperature and/or time due to the depletion of Ni content from the braze alloy into the Ti–6Al–4V substrate during brazing. The shear strength of the brazed joint free of the blocky Ti₂Ni phase is comparable with that of the α₂-Ti₃Al substrate, and strong bonding can thus be obtained.     

SiC陶瓷与TiAI合金的真空钎焊

采用Ag-Cu-Ti钎料对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空钎焊,并对接头的微观组织和室温强度进行了研究。结果表明,利用Ag-Cu-Ti钎料可以实现SiC与TiAl的连接;接头界面具有明显的层状结构,即由Ti-Cu-Si合金层、富Cu相与富Ag相的双相层和Ti-Al-Cu合金层组成;在1173K和10min的钎焊条件下,接头室温剪切强度达到173MPa。     

TiZrNiCu/Ti60润湿性及与TiBw-TC4钎焊研究

本文采用座滴法在真空下系统研究了硼含量对TiZrNiCu/Ti60润湿性的影响,且在940°C保温10分钟条件下实现了与的钎焊。通过SEM、XRD以及剪切实验研究了界面显微组织及剪切力学性能。添加B元素可以与Ti原位合成TiBw,从而细化界面的显微组织。当B含量为0.3 wt %时,TiBw-TC4 /TiZrNiCu-B/Ti60接头的最大剪切强度为177 MPa,比无B含量的接头强度高65%。然而,过量的B含量使TiZrNiCu-B在Ti60合金基体上产生大量的TiBw,导致润湿性恶化,在钎焊接头形成微孔和未焊合区域,从而使剪切强度下降。     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

控制气氛下的AgCuTi/TiAl润湿铺展动力学

采用热台原位加热法系统研究了不同保护气体流量对润湿铺展过程、润湿铺展最大半径、润湿铺展动力学以及界面组织结构的影响.保护气体为氩气,保护气体流量分别为5,10,15 mL/s;加热曲线设定最高温度为1273 K,保温时间120 s;采用扫描电镜、能谱分析、光学显微镜等分析了界面组织结构.结果表明,保护气体流量为15 mL/s时,润湿铺展等效半径最大,原始半径0.9 mm的钎料铺展半径达到约1.4 mm.各种保护条件下,AgCuTi/TiAl体系的润湿铺展动力学过程相似,铺展半径与时间之间呈n次幂关系,即rn~kt;润湿铺展中钎料熔敷/TiAl的界面结构为:残余钎料的富银相/AlCuTi三元相层(AlCu₂Ti, AlCuTi, Ti₃Al)/TiAl母材,保护条件对其影响不大.