涂层导体用Ni-7%W合金基带的织构分析

采用先进的放电等离子烧结技术(SPS)制备Ni7W合金初始坯锭,通过优化高能球磨和烧结工艺以及后续和热处理工艺制备出高度立方织构的Ni7W合金基带.利用电子背散射衍射(EBSD)技术对Ni7W合金基带的晶粒取向、晶界特征等信息进行采集和分析,对其织构进行了表征.该基带无需抛光,即可获得高花样质量的电子背散射衍射图像.EBSD测试结果表明:该Ni7W基带表面10°以内立方织构晶粒质量分数高达99.4%,10°以内晶界长度质量分数为93.6%,具有高质量的立方织构.     

Cube texture of recrystallization in three-layer ribbon substrates composed of nickel alloys Ni-4.8 at % W/Ni-11 at % Cr/Ni-4.8 at % W

The processes of the formation of recrystallization texture in the three-layer composite Ni-4.8 at % W/Ni-11 at % Cr/Ni-4.8 at % W ribbon, which was subjected to cold rolling with degrees of deformation of 98.4–99.3% and subsequent high-temperature annealing, are studied. The composite ribbon was found to be suitable for use as a substrate in manufacturing second-generation high-temperature ribbon superconductors. The estimation of magnetic properties showed that the specific magnetization of annealed composite ribbon at operating temperatures of high-temperature superconductors is lower than that of the Ni-5 at % W ribbon, which is currently widely used in practice.     

Dispersion strengthened and highly cube textured Ni alloy tapes as possible substrates for coated conductors

Ni and Ni base alloys are good candidate substrate materials in the development of long lengths of coated superconductors due to the development of strong cube texture following heavy cold working and recrystallisation. Increasing the tape strength is an important issue in order to facilitate the production of very thin and long lengths of high current carrying superconductors. The present paper reports the development of strongly cube textured and thin tapes (40 and 20 μm thickness) of an Ni–1 at.% Al alloy and strengthening of these tapes through controlled internal oxidation. Precipitation of finely dispersed Al₂O₃ particles increased the yield strength by a factor of 3–5 compared to pure Ni tapes without losing the strong cube texture. The problem of surface degradation due to precipitation of Al₂O₃ particles during internal oxidation was sought to overcome by the design of an Ni–Ni–1.5 at.% Al composite tape.     

涂层导体用织构复合基带的界面及其扩散行为

复合基带是一种高强、低磁并较易形成锐利立方织构的高性能织构金属基带,能够较好地满足制备高性能涂层导体用织构基带的要求.采用放电等离子烧结方法制备了Ni5W/Ni12W/Ni5W复合基带并对其内外层界面进行了研究,发现扩散界面有利于外层合金立方织构的形成.同时,将基带在1250℃分别经60,120和180 min热处理后,基带外层合金立方织构含量均保持在98％以上.分析表明,在高温热处理阶段复合基带中界面处发生了元素互扩散行为,W元素由芯层扩散至基带表层并在晶界出形成钉扎点,抑制了晶粒的异常长大现象,使复合基带外层合金立方织构在高温热处理阶段具有较好的稳定性.     

超细晶纯钛材电化学抛光表面生物相容性研究

制备具有高强度、低磁性的双轴织构金属基带是获得高性能涂层超导体的基础.目前,传统的Ni5at％W (Ni5W)合金基带已经可以工业化生产,但其立方织构的形成机理尚不明确.以真空熔炼方法制备的大形变量(约99％)冷轧Ni5W合金基带作为研究对象,采用EBSD技术进行表征,系统的研究了其形变织构的演变、再结晶形核和晶粒长大等过程.研究发现,Ni5W合金基带的形变织构为典型的铜型轧制织构;在再结晶初期阶段,立方取向晶粒优先在靠近基带表层的区域形核,且具有一定的尺寸优势,其形核在厚度方向上表现出梯度分布的特点;在完全再结晶阶段,立方取向的晶粒通过“尺寸优势”和“取向长大优势”逐渐吞并其它取向的晶粒,形成强的立方织构.     

热等静压法制备高立方织构的镍基合金复合基带

采用热等静压(HIP)法制备芯层为Ni-12％W(Ni12W,摩尔分数)合金、外层为Ni-5％W(Ni5W,摩尔分数)合金的Ni5W/Ni12W/Ni5W 3层复合初始坯锭:采用压延辅助双轴织构技术(RABiTSTM)通过直接冷轧及再结晶退火获得Ni5W/Ni12W/NiSW复合基带;采用X射线四环衍射技术(XRD)及背散射电子衍射技术(EBSD)对复合基带表面冷轧及再结晶织构进行分析.结果表明:冷轧复合基带表面形成较强的铜型形变织构,再结晶退火后复合基带表面形成锐利的立方织构,其立方织构含量达到99.1％(≤10°),与商业用Ni5W合金基带水平相当.     

Recrystallization of Ni-5%W Alloy Substrates by Reel-to-Reel Method

基于轧制态Ni-5%W(原子分数)合金基带短样品在不同温度退火的结果,对Ni-5%W合金长带进行了辊到辊退火处理。分析不同温度下退火后的硬度,通过X射线极图法评价再结晶织构,采用光学显微镜分析基带的微观结构,讨论退火温度对再结晶织构的影响,考察短带与长带再结晶织构的差异。结果发现：长带和短带都具有很强的立方织构     

涂层导体用织构铜镍合金基带热处理工艺的研究

铜镍合金基带是制备双轴织构钇钡铜氧(YBCO)涂层超导体的优良合金基带之一。采用轧制辅助双轴织构基带技术(RABiTS)制备无磁性的CuNi金属合金基带。采用X射线衍射技术(XRD)及背散衍射技术(EBSD)对CuNi合金基带再结晶热处理后的织构表征分析发现,热处理工艺是影响合金基带再结晶晶粒取向的重要因素之一。结果表明,对CuNi合金基带进行950℃下保温60min的最佳热处理工艺后,CuNi合金基带表面形成了锐利的立方织构,其立方织构的含量高达97%(≤10o)。     

形变细化晶粒和润滑轧制对Ni-9.3at.%W合金基带立方织构形成的影响

采用光学显微镜(OM)、X射线四环衍射(XRD)技术、电子背散射衍射(EBSD)技术分析研究了形变细化晶粒、润滑轧制对Ni-9.3at.%W(Ni9.3W)合金基带立方织构形成的影响。结果表明,采用形变细化晶粒的方法能有效提高Ni9.3W合金基带的立方织构含量,并且随着初始形变量的增加,晶粒细化程度越大,立方织构含量越高,采用优化的形变细化晶粒工艺使得Ni9.3W合金基带立方织构含量提高了9.8%。另外,增加形变细化晶粒后的轧制总变形量,立方织构含量进一步提升了24.7%,根据以上结果,确定了初始坯锭制备阶段的参数。在此基础上,研究了轧制变形的润滑与非润滑对立方织构形成的影响,相比非润滑轧制而言,采用润滑轧制,轧制织构中获得了较多的S取向与Copper取向,经再结晶退火后,润滑轧制基带的立方织构含量比非润滑轧制基带的立方织构含量高9.6%,达到了86.7%(<15°),而且孪晶界数量、小角度晶界含量均要优于非润滑轧制,说明润滑轧制对立方织构形成有着积极的影响。     

Effect of Annealing Ways on the Formation of Cube Texture in Ni-5at% W Substrates for YBCO Coated Conductors

Two annealing ways, single-step annealing (SSA) and two-step annealing (TSA), were carried out to investigate the formation of the cube texture during recrystallization in the highly rolled Ni-5at%W alloy by means of EBSD and XRD techniques. It was found that both the microstructure and cube texture of the highly rolled substrates depended strongly on the annealing ways. The TSA method yields sharper cube texture and higher proportion of low-angle grain boundaries compared with SSA method. In addition, the ...     

Preparation and Performance of the Sm0.2Ce0.8O1.9-x Single Buffer Layer Fabricated with Dip-Coating

在双轴织构的Ni-5％W合金基带上,采用高分子辅助化学溶液沉积法通过提拉涂敷法,制备了厚度达250 nm的Sm0.2Ce0.8O1.9(SCO)外延织构单层缓冲层.通过严格控制前驱溶液的浓度、提拉速度、成相温度和热处理时间,所获的SCO单层缓冲层涂层平整、无微裂纹、且具有较强的(200)c轴外延织构.在其他条件假设不变的情况下,主要研究不同提拉速度对SCO缓冲层薄膜性能的影响.在此基础上,采用化学溶液法在SCO/NiW缓冲层上制备了YBCO超导层,其具有高度的双轴织构和均匀的表面形貌.结果表明:用提拉法获得的SCO单层缓冲层在具有适度的厚度下,仍然具有很好的织构传递特性,为低层本制造YBCO涂层导体长带提供了一条可靠的路线.     

加工率和热处理制度对Ni5W合金基带立方织构形成的影响

为了制作能满足YBCO涂层导体所需要的高强度、低磁性的立方织构基带，用粉末冶金方法制作了Ni-5W（at％）合金基带。研究结果表明，随总加工率和热处理温度的提高，基带中立方织构百分数明显增高。X射线衍射结果说明，提高总加工率实际增加了冷加工试样中立方织构晶粒或立方核心的数量。在热处理时间和（200）择优取向度的关系曲线中，可以明显看出，随热处理温度的提高，曲线达到峰值的时间缩短，说明热处理温度增加了立方核心的长大速度。通过加工率和热处理对试样立方织构形成影响的研究，得到了较好和实用的工艺制度，用这种工艺可以制作出具有99％-100％立方织构的Ni5W基带。     

温轧对Ni9W合金基带织构形成的影响

采用X射线四环衍射及电子背散射衍射技术对Ni-9.3at%W(Ni9W)温轧基带表面进行轧制织构与再结晶织构分析,研究了Ni9W合金基带温轧织构的形成与转变。结果表明,轧制过程采用温轧的方法能有效提高Ni9W合金基带轧制织构中的S取向与C取向的含量,并且随着变形量的增加Ni9W合金基带的形变织构由黄铜型织构向黄铜型和铜型的混合型织构转变,这有利于再结晶之后形成较强的立方织构。     

LZO covered Cu-based substrates

A Cu-based substrate has been made by electrodepositing a Ni layer on top of cube-textured Cu tape obtained by an alternating mechanical/thermal treatment. It could be found that the volume fraction of the cube texture component of Cu tapes increased with the annealing temperatures for an optimized rolling process. When the annealing temperature is at 800 °C, the sharpness of cube texture is best. In order to fabricate LZO films on the Cu-based substrate, a Ni layer was added on top of the Cu tape by electroplating. The thickness of Ni layer not only affects the texture sharpness of the substrate, but also affects its thermal stability of texture. A thickness of 15 μm was efficient to protect the Cu tapes. Fabricating well bi-axially textured LZO film on this bi-metallic substrate proves that this new Cu-based substrate is a good choice for coated conductor.     

Creation of a sharp cube texture in ribbon substrates of Cu–40% Ni–<Emphasis Type="Italic">M</Emphasis> (<Emphasis Type="Italic">M</Emphasis> = Fe,Cr, V) ternary alloys for high-temperature second generation superconductors

The structure and the process of texture formation in ribbons made of Cu–Ni–M (M = Fe, Cr, V) ternary alloys have been studied upon cold rolling deformation to a degree of ~99% and subsequent recrystallization annealing. The possibility of obtaining a perfect cube texture in a thin ribbon made of copper–nickel-based ternary alloys with additives of iron, chromium, and vanadium has been shown, which opens the prospects of the use of these alloys as substrates in the technology of production of tapes of high-temperature second-generation superconductors. Optimal annealing regimes have been determined, which make it possible to obtain a perfect biaxial texture close to single-crystalline one with the content of cube-oriented grains {001}〈100〉±10° more than 99% on the surface of the textured ribbon.     

Textured tape substrates from binary copper alloys with vanadium and yttrium for the epitaxial deposition of buffer and superconducting layers

The structure of tapes of binary Cu–0.6 wt % V and Cu–1 wt % Y alloys and texturing process of them in the course of cold deformation by rolling to ~99% and subsequent recrystallizing annealing have been studied. The possibility of achieving the perfect cube texture in thin tapes made from binary copper-based alloys with vanadium and yttrium additions has in principle been shown. This opens the prospect of using them as substrates when manufacturing tapes of second-generation high-temperature superconductors. Optimum annealing conditions for the studied alloys have been determined, which have made it possible to produce the perfect biaxial texture with a content of cube {001}〈100〉 ± 10° grains on the surfaces of textured tapes of more than 95%.     

热处理工艺对Ni-7W合金基带立方织构的影响

采用先进的放电等离子烧结技术(SPS)制备Ni-7W(at%, 下同)(Ni7W)合金初始锭,通过高能球磨使Ni、W粉末充分混合,优化冷轧和热处理工艺制备出高立方织构的Ni7W合金基带。基带晶粒大小均匀,电子背散射衍射技术(EBSD)测试结果显示：该Ni7W基带表面10°以内立方织构晶粒含量高达99.4%,10°以内晶界长度含量为93.6%;XRD测得的基带(111)Phi扫描和(200)摇摆曲线表明：基带的面内和面外半高宽分别是6.32°和5.4°,表明基带具有锐利的立方织构。在该基带上制备的La2Zr2O7(LZO)过渡层显示,LZO很好地外延生长了基底的织构,LZO薄膜(222)面φ扫描和(400)面摇摆曲线的半高宽值分别为7.57o°和5.73°     

Characterization and properties of an advanced composite substrate for YBCO-coated conductors

Thin, biaxially textured Ni5W/Ni12W/Ni5W composite substrates for coated conductor applications have been fabricated. The particularity of this three-layer composite configuration resides in the elemental diffusion between the outer layer and the core layer. Due to the migration of elemental W, the diffusion layer in the as-annealed substrate becomes broader than that of the as-rolled substrate. The obtained tape has a sharp cubic texture on the Ni5W outer layers, and the volume fraction of cubic grains exceeds 98.8% (<10°) at the outer surfaces. In situ electron backscatter diffraction strain–stress analysis shows that the high-quality cubic texture was stable until elongations as high as 2%. The yield strength of the composite substrate approaches 240 MPa and its saturation magnetization at 77 K has been strongly reduced with respect to pure Ni and Ni5W substrates. The present results demonstrate that this advanced three-layer substrate is suitable for the epitaxial growth of the LZO buffer layers.     

涂层导体用Ni9W合金基带再结晶及强立方织构的形成研究

采用X射线四环衍射技术对比分析了通过冷轧和轧制中间热处理制备的2种Ni-9.3at%W(Ni9W)合金基带的轧制织构和再结晶织构,研究了不同Ni9W合金基带在热处理过程中轧制织构向再结晶织构的演变。其次,采用背散射电子衍射(EBSD)技术对以上2种Ni9W合金基带的微观组织和立方织构进行了表征。结果表明,与传统冷轧Ni9W合金基带的轧制织构相比,经轧制中间热处理后其轧制织构中S取向和Copper取向的含量增加、Brass取向的含量减少,使其轧制织构的类型介于Brass型轧制织构与Copper型轧制织构之间。2种Ni9W合金基带经低温回复后,其轧制织构含量均有一定的增加;另外,再结晶过程中轧制织构的含量均迅速降低,但立方取向的含量并没有明显增加,而是出现大量的随机取向,Ni9W的再结晶具有了连续再结晶的特征,这也是导致Ni9W合金基带较难形成立方织构的一个主要原因。虽然经过轧制中间热处理后Ni9W合金基带在初始再结晶完成后并没有形成一定强度的立方织构,但其立方取向的含量仍然能在进一步热处理过程中通过立方取向晶粒的长大而得到加强。最后,采用轧制中间热处理制备的Ni9W合金基带经两步高温热处理后其立方织构的含量达到84.5%(15°)。     

W含量对Ni-W合金基带取向及织构形成的影响

采用压延辅助双轴织构基板制备路线,结合X射线衍射和电子背散射衍射技术,系统研究了W量(原子分数)分别为5%、7%和9.3%的Ni-W合金基带在冷轧形变和再结晶热处理过程中的取向及织构形成的变化规律。研究发现,在冷轧形变过程中,随着W含量的增加,Ni-W合金基带中S和Copper取向含量的增量逐渐降低,而Brass取向含量的增量则呈现上升趋势,最终低W合金获得Copper型轧制织构,而高W合金获得Brass型轧制织构。在再结晶热处理过程中,低W合金立方晶粒形核较早并迅速长大,吞并其它取向,容易获得立方织构;高W合金的立方取向晶粒则和其它取向晶粒一同形核和长大,且长大速度不及其它取向晶粒,最后形成杂乱取向。