Band gap engineered resistor for mitigating linear energy transfer sensitivities in scaled submiron CMOS technology SRAM cells

Use of cross-coupling latch resistors is a prime method of mitigating single event upsets (SEU). Scaling has dramatically reduced ability of using this technique because of the large area needed as well as high temperature coefficient of resistance (TCR) of lightly doped polysilicon resistors. We present results of a study of the electrical properties of Al_1?xIn_xN films resistor which offers distinct advantage over polysilicon resistors. The films were grown on silicon nitride by magnetron sputter deposition at room temperature. Sheet resistance in the range of 8–10 kΩ/□ was reproducibly grown. The resistor film is thermally stable with TCR of less than minus 0.09%/°C for temperature range of minus 55 °C to +125 °C.     

Effect of annealing on structural,optical and electrical properties of pulse electrodeposited tin sulfide films

Polycrystalline tin sulfide (SnS) thin films were grown on conducting glass substrates by pulse electrodeposition. The effect of annealing on the physical properties such as structure, morphology, optical, and opto-electronic properties were evaluated to understand the effect of post-deposition treatment for SnS films. Annealing at temperatures higher than 250 °°C resulted in the formation of SnS₂ as a second phase, however, no significant grain growth or morphological changes were observed for films after annealing at 350 °C. A small change in band gap of 0.1 eV observed for films annealed at 350 °C was interpreted as due to the formation of SnS₂ rather than due to morphological changes. This interpretation was supported by X-ray diffractometry, scanning electron microscopy, and Raman spectral data. The electric conduction in the films is controlled by three shallow trap levels with activation energies 0.1, 0.05, and 0.03 eV. The trap with energy 0.03 eV disappeared after annealing at higher temperature, however, the other two traps were unaffected by annealing.     

Properties of CuAlO2 thin films deposited by polyacrylamide gel route

CuAlO₂ films were deposited on clean glass substrates by the acrylamide sol–gel dip coating technique. The coated films were dried in air oven for 30 min followed by heat treatment in air at different temperatures in the range of 350–500 °C. The films annealed at low temperatures exhibited weak x-ray diffraction (XRD) peaks. As the post anneal temperature increased beyond 375 °C, the XRD pattern exhibited the diffraction peaks of rhombohedral CuAlO₂. Surface morphology of the films indicated that the films annealed at low temperatures exhibit small grains. As the annealing temperature increases larger grains are observed. The root mean square (rms) value of the surface roughness increases with annealing temperature. The films exhibited optical transmission above 75%. The films post annealed at low temperature exhibited lower transmission. Optical band gap in the range of 3.43–3.75 eV was obtained for the films annealed at different temperature. Hall measurements indicated p-type conductivity. Resistivity of the films decreased from 25.0 to 2.0 Ω cm as the anneal temperature increased. Mobility and carrier density increased with annealing temperature.     

Effect of thermal annealing on physical properties of vacuum evaporated In2S3 buffer layer for eco-friendly photovoltaic applications

The present communication reports the effect of thermal annealing on the physical properties of In₂S₃ thin films for eco-friendly buffer layer photovoltaic applications. The thin films of thickness 150 nm were deposited on glass and indium tin oxide (ITO) coated glass substrates employing thermal vacuum evaporation technique followed by post-deposition thermal annealing in air atmosphere within a low temperature range 150–450 °C. These as-deposited and annealed films were subjected to the X-ray diffraction (XRD), UV–vis spectrophotometer, current–voltage tests and scanning electron microscopy (SEM) for structural, optical, electrical and surface morphological analysis respectively. The compositional analysis of as-deposited film is also carried out using energy dispersive spectroscopy (EDS). The XRD patterns reveal that the as-deposited and annealed films (≤300 °C) have amorphous nature while films annealed at 450 °C show tetragonal phase of β-In₂S₃ with preferred orientation (109) and polycrystalline in nature. The crystallographic parameters like lattice constant, inter-planner spacing, grain size, internal strain, dislocation density and number of crystallites per unit area are calculated for thermally annealed (450 °C) thin films. The optical band gap was found in the range 2.84–3.04 eV and observed to increase with annealing temperature. The current–voltage characteristics show that the as-deposited and annealed films exhibit linear ohmic behavior. The SEM studies show that the as-deposited and annealed films are uniform, homogeneous and free from crystal defects and voids. The grains in the thin films are similar in size and densely packed and observed to increase with thermal annealing. The experimental results reveal that the thermal annealing play significant role in the structural, optical, electrical and morphological properties of deposited In₂S₃ thin films and may be used as cadmium-free eco-friendly buffer layer for thin films solar cells applications.     

Influence of thermal annealing on electrical and optical properties of indium tin oxide thin films

Transparent conducting indium tin oxide (ITO) thin films with the thickness of 300 nm were deposited on quartz substrates via electron beam evaporation, and five of them post-annealed in air atmosphere for 10 min at five selected temperature points from 200 °C to 600 °C, respectively. An UV–vis spectrophotometer and Hall measurement system were adopted to characterize the ITO thin films. Influence of thermal annealing in air atmosphere on electrical and optical properties was investigated in detail. The sheet resistance reached the minimum of 6.67 Ω/sq after annealed at 300 °C. It increased dramatically at even higher annealing temperature. The mean transmittance over the range from 400 nm to 800 nm reached the maximum of 89.03% after annealed at 400 °C, and the figure of merit reached the maximum of 17.79 (Unit: 10⁻³ Ω⁻¹) under the same annealing condition. With the annealing temperature increased from 400 °C to 600 °C, the variations of transmittance were negligible, but the figure of merit decreased significantly due to the deterioration of electrical conductivity. With increasing the annealing temperature, the absorption edge shifted towards longer wavelength. It could be explained on the basis of Burstein–Moss shift. The values of optical band gap varied in the range of 3.866–4.392 eV.     

Behavior of chemically deposited PbS thin films subjected to two different routes of post deposition annealing

Lead sulfide (PbS) thin films were prepared on soda lime glass substrates at room temperature by Chemical Bath Deposition (CBD) technique. This paper reports a comparative study of characteristic properties of as-prepared PbS thin films after thermal treatment through two different routes. Studies were carried out for as-prepared as well as rapidly and gradually annealed samples at 100, 200 and 300 °C. The characterizations of the films were carried out using X-ray diffraction, scanning electron microscopy and optical measurement techniques. The structural studies confirmed the polycrystalline nature and the cubic structure of the films. As-deposited films partly transformed to Pb₂O₃ when gradually annealed to 300 °C. The presence of nano crystallites was revealed by structural and optical absorption measurements. The values of average crystallite size were found to be in the range 18–20 nm. The variation in the microstructure, thickness, grain size, micro strain and optical band gap on two types of annealing were compared and analyzed. Data showed that post deposition parameters and thermal treatment strongly influence the optical properties of PbS films. Optical band gap of the film gets modified remarkably on annealing. Direct band gap energy values for rapidly and gradually annealed samples varied in the range of 1.68–2.01 eV and 1.68–2.12 eV respectively. Thus we were succeeded in tailoring direct band gap energies by post deposition annealing method.     

Investigation of structural and optoelectronic properties of annealed nickel phthalocyanine thin films

Thin films of nickel phthalocyanine (NiPc) were prepared by thermal evaporation and the effects of annealing temperature on the structural and optical properties of the samples were studied using different analytical methods. Structural analysis showed that the grain size and crystallinity of NiPc films improved as annealing temperature increased from 25 to 150 °C. Also, maximum grain size (71.3 nm) was obtained at 150 °C annealing temperature. In addition, NiPc films annealed at 150 °C had a very smooth surface with an RMS roughness of 0.41 nm. Optical analysis indicated that band gap energy of films at different annealing temperatures varied in the range of 3.22–3.28 eV. Schottky diode solar cells with a structure of ITO/PEDOT:PSS/NiPc/Al were fabricated. Measurement of the dark current density–voltage (J–V) characteristics of diodes showed that the current density of films annealed at 150 °C for a given bias was greater than that of other films. Furthermore, the films revealed the highest rectification ratio (23.1) and lowest barrier height (0.84 eV) demonstrating, respectively, 23% and 11% increase compared with those of the deposited NiPc films. Meanwhile, photoconversion behavior of films annealed at 150 °C under illumination showed the highest short circuit current density (0.070 mA/cm²) and open circuit voltage of (0.55 V).     

Effect of annealing temperature on optical and electrical properties of lead sulfide thin films

Lead sulfide (PbS) thin films with 150 nm thickness were prepared onto ultra-clean quartz substrate by the RF-sputtering deposition method. Deposited thin films of PbS were annealed at different temperatures 100 °C, 150 °C, 200 °C, 250 °C and 300 °C. X-ray diffraction pattern of thin films revealed that thin films crystallized at 150 °C. Crystalline thin films had cubic phase and rock salt structure. The average crystallite size of crystalline thin films was 22 nm, 28 nm and 29 nm for 150 °C, 200 °C and 250 °C respectively. From 150 °C to 250 °C increase in annealing temperature leads to increase in crystallite arrangement. FESEM images of thin films revealed that crystallite arrangement improved by increasing annealing temperature up to 250 °C. Increase in DC electrical conductivity by increasing temperature confirmed the semiconductor nature of crystalline thin films. Increase in dark current by increasing annealing temperature showed the effect of crystallite arrangement on carrier transport. Photosensitivity decreased by increasing annealing temperature for crystalline thin films that it was explained at the base of thermal quenching of photoconductivity and adsorption of oxygen at the surface of thin films that leads to the formation of PbO at higher temperatures.     

Dependence of the optoelectronic properties of selenium-hyperdoped silicon on the annealing temperature

Selenium-hyperdoped silicon was prepared by ion implantation at 100 eV to a dose of 6×10¹⁵ Se/cm², followed by furnace annealing at 500–900 °C for 30 min. A phase transition from amorphous to crystalline was observed for the sample annealed at 600 °C. Carrier density in the Se doping layer gradually increases with the annealing temperature and a high carrier/donor ratio of 7.5% was obtained at 900 °C. The effects of annealing temperature on the rectifying behavior and external quantum efficiency of n⁺p junctions formed on Se-hyperdoped silicon were also investigated. We found that 700 °C was the optimal annealing temperature for improving the crystallinity, below-bandgap absorption, junction rectification and external quantum efficiency of Se-doped samples.     

Stabilization of a very high-k tetragonal ZrO2 phase by direct doping with germanium

The influence of Ge incorporation on the structural phase transformation of ZrO₂ films was investigated with the aim to control the resulting dielectric properties. For this reason, Ge-doped ZrO₂ thin films were prepared by atomic oxygen beam deposition at 225 °C. Admixture of low Ge concentrations (3–6.2 at.%) stabilizes the tetragonal ZrO₂ phase, and concurrently increases the permittivity to a maximum value of 37.7. Structural analysis shows that the permittivity enhancement can be explained by the increase of the tetragonal distortion upon Ge doping. The tetragonal phase is stable upon post-deposition high temperature annealing up to 1050 °C under N₂.     

Investigation of oxygen annealing effects on RF sputter deposited SiC thin films

Amorphous silicon carbide films were deposited by RF sputtering technique using a SiC target. These films were annealed in dry oxygen ambient in the temperature range of 400–700 °C. Subsequently the films were characterized using X-ray photoelectron spectroscopy (XPS) to investigate the chemical composition at each annealing temperature. XPS indicated that increasing the anneal temperature results in a decrease in SiC phase, and an increase in SiO_x. Surface morphology of the oxidized films was characterized using atomic force microscope. Optical absorption studies indicated blue shifting effects as the annealing temperature was increased.     

Role of thermal annealing on SiGe thin films fabricated by PECVD

Amorphous Silicon Germanium (a-SiGe) thin films of 500 nm thickness are deposited on silicon substrates using Plasma Enhanced Chemical Vapour Deposition (PECVD). To obtain polycrystalline nature of films, thermal annealing is done at various temperature (450–600 °C) and time (1–10 h). The surface morphology of the pre- and post-annealed films is investigated using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The crystallographic structure of the film is obtained by X-ray diffraction method. Raman spectroscopy is carried out to quantify the Ge concentration and the degree of strain relaxation in the film. Nano-indentation is performed to obtain the mechanical properties of the film. It is found that annealing reduces the surface roughness of the film and increases the Ge concentration in the film. The grain size of the film increases with increase in annealing temperature. The grain size is found to decrease with increase in annealing time up to 5 h and then increased. The results show that 550 °C for 5 h is the critical annealing condition for variation of structural and mechanical properties of the film. Recrystallization starts at this condition and results in finer grains. An increase in hardness value of 7–8 GPa has been observed. Grain growth occurs above this critical annealing condition and degrades the mechanical properties of the film. The strain in the film is only relaxed to about 55% even for 10 h of annealing at 600 °C. Transmission Electron Microscopy (TEM) observations show that the strain relaxation occurs by forming misfit dislocations and these dislocations are confined to the SiGe/Si interface.     

Effects of thermal annealing on the morphology of the AlxGa(1−x)N films

Effects of thermal annealing on the morphology of the Al_xGa_(1−x)N films with two different high Al-contents (x=0.43 and 0.52) have been investigated by atomic force microscopy (AFM). The annealing treatments were performed in a nitrogen (N₂) gas ambient as short-time (4 min) and long-time (30 min). Firstly, the films were annealed as short-time in the range of 800–950 °C in steps of 50–100 °C. The surface root-mean-square (rms) roughness of the films reduced with increasing temperature at short-time annealing (up to 900 °C), while their surface morphologies were not changed. At the same time, the degradation appeared on the surface of the film with lower Al-content after 950 °C. Secondly, the Al_0.43Ga_0.57N film was annealed as long-time in the range of 1000–1200 °C in steps of 50 °C. The surface morphology and rms roughness of the film with increasing temperature up to 1150 °C did not significantly change. Above those temperatures, the surface morphology changed from step-flow to grain-like and the rms roughness significantly increased.     

Investigation of optical and electronic properties in Al–Sn co-doped ZnO thin films

Al-Sn co-doped ZnO thin films were deposited onto quartz substrates by sol-gel processing. The surface morphology and electrical and optical properties were investigated at different annealing temperatures. The surface morphology showed a closely packed arrangement of crystallites in all the doped films. As prepared co-doped films show a preferred orientation along an (0 0 2) plane. This preferred orientation was enhanced by increasing the annealing temperature to between 400 °C and 500 °C, but there was a shift to the (1 0 1) plane when the annealing temperature rose above 500 °C. These samples show, on average, 91.2% optical transmittance in the visible range. In this study, the optical band gap of all the doped films was broadened compared with pure ZnO, regardless of the different annealing temperature. The carrier concentration and carrier mobility of the thin films were also investigated.     

MEMS based low cost piezoresistive microcantilever force sensor and sensor module

In the present work, we report fabrication and characterization of a low-cost MEMS based piezoresistive micro-force sensor with SU-8 tip using laboratory made silicon-on-insulator (SOI) substrate. To prepare SOI wafer, silicon film (0.8 µm thick) was deposited on an oxidized silicon wafer using RF magnetron sputtering technique. The films were deposited in argon (Ar) ambient without external substrate heating. The material characteristics of the sputtered deposited silicon film and silicon film annealed at different temperatures (400–1050 °C) were studied using atomic force microscopy (AFM) and X-ray diffraction (XRD) techniques. The residual stress of the films was measured as a function of annealing temperature. The stress of the as-deposited films was observed to be compressive and annealing the film above 1050 °C resulted in a tensile stress. The stress of the film decreased gradually with increase in annealing temperature. The fabricated cantilevers were 130 μm in length, 40 μm wide and 1.0 μm thick. A series of force–displacement curves were obtained using fabricated microcantilever with commercial AFM setup and the data were analyzed to get the spring constant and the sensitivity of the fabricated microcantilever. The measured spring constant and sensitivity of the sensor was 0.1488 N/m and 2.7 mV/N. The microcantilever force sensor was integrated with an electronic module that detects the change in resistance of the sensor with respect to the applied force and displays it on the computer screen.     

The effects of carrier gas and substrate temperature on ZnO films prepared by ultrasonic spray pyrolysis

ZnO films were deposited on glass substrates in the temperature range of 350–470 °C under an atmosphere of compressed air or nitrogen (N₂) by using ultrasonic spray pyrolysis technique. Structural, electrical and optical properties of the ZnO films were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM), electrical two-probe and optical transmittance measurements. The ZnO films deposited in the range of 350–430 °C were polycrystalline with the wurtzite hexagonal structure having preferred orientation depending on the substrate temperature. The ZnO films deposited below 400 °C had a preferred (100) orientation while those deposited above 400 °C mostly had a preferred (002) orientation. The resistivity values of ZnO films depended on the types of carrier gas. The ZnO thin films deposited under N₂ atmosphere in the range of 370–410 °C showed dense surface morphologies and resistivity values of 0.6–1.1 Ω-cm, a few orders of magnitude lower than those deposited under compressed air. Hydrogen substition in ZnO possibly contributed to decreasing resistivity in ZnO thin films deposited under N₂ gas. The Hall measurements showed that the behavior of ZnO films deposited at 410 °C under the N₂ atmosphere was n-type with a carrier density of 8.9–9.2×10¹⁶ cm^-3 and mobility of ～70 cm²/Vs. ZnO thin films showed transmission values at 550 nm wavelength in a range of 70–80%. The values of band gaps extrapolated from the transmission results showed bandgap shrinkage in an order of milli electron volts in ZnO films deposited under N₂ compared to those deposited under compressed air. The calculation showed that the bandgap reduction was possibly a result of carrier–carrier interactions.     

Microstructure evolution of amorphous silicon thin films upon annealing studied by positron annihilation

Amorphous silicon (a-Si) thin films were prepared on glass substrates by plasma enhanced chemical vapor deposition (PECVD). Influence of annealing temperature on the microstructure, surface morphology, and defects evolution of the films were studied by X-ray diffraction (XRD), atomic force microscope (AFM) and positron annihilation Doppler broadening spectroscopy (DBS) based on a slow positron beam, respectively. The S parameter of the as-deposited a-Si thin film is high, indicative of amorphous state of Si film with many defects. The a-Si gradually grows into polycrystalline silicon with increasing temperature to 650 °C. For the films annealed below ~450 °C, positron diffusion lengths are rather small because most positrons are trapped in the defects of the a-Si films and annihilated there. With further rising the temperature to 600 °C, the diffusion length of positrons increases significantly due to the removal of vacancy-type defects upon annealing at a high temperature. The results indicate that the coalescence of small vacancy-type defects in a-Si thin film and the crystallization of a-Si occur around 450 °C and 650 °C, respectively.     

Study of sensitivity and selectivity of α-Fe2O3 thin films for different toxic gases and alcohols

This paper presents a detailed study on the sensitivity and selectivity of α-Fe₂O₃ thin films produced by deposition of Fe and post-deposition annealed at two temperatures of 600 °C and 800 °C with flow of oxygen for application as a sensor for toxic gases including CO, H₂S, NH₃ and NO₂ and alcohols such as C₃H₇OH, CH₃OH, and C₂H₅OH. The crystallographic structure of the samples was studied by X-ray diffraction (XRD) method while an atomic force microscope (AFM) was employed for surface morphology investigation. The electrical response of the films was measured while they were exposed to various toxic gases and alcohols in the temperature range of 50–300 °C. The sample annealed at higher temperature showed higher response for different gases and alcohols tested in this work which can be due to the higher resistance of this sample. Results also indicated that the α-Fe₂O₃ thin films show higher selectivity to NO₂ gas relative to the other gases and alcohols while the best sensitivity is obtained at 200 °C. The α-Fe₂O₃ thin film post-deposition annealed at 800 °C also showed a good stability and reproducibility and a detection limit of 10 ppm for NO₂ gas at the operating temperature of 200 °C.     

Optical and electrical measurement of FeSe2 thin films obtained at low temperature

FeSe₂ thin films were prepared at low temperature by thermal annealing at 350 °C during 6 h of sequentially evaporated iron and selenium films under selenium atmosphere. The structural, optical and electrical characteristics were investigated. The roughness of films (~76 nm) was confirmed by AFM images. Moreover, optical band gap of FeSe₂, which was evaluated as nearly 1.11 eV and confirmed by the electrical study which yielded a value in the order of 1.08 eV. The electrical conductivity, conduction mechanism, dielectric properties and relaxation model of theses thin films were studied using impedance spectroscopy technique in the frequency range 5 Hz–13 MHz under various temperatures (180–300 °C). Besides, complex impedance and AC conductivity have been investigated on the basis of frequency and temperature dependence.     

Structural and optoelectronic properties of nanostructured TiO2 thin films with annealing

About 480 nm thick titanium oxide (TiO₂) thin films have been deposited by electron beam evaporation followed by annealing in air at 300–600 °C with a step of 100 °C for a period of 2 h. Optical, electrical and structural properties are studied as a function of annealing temperature. All the films are crystalline (having tetragonal anatase structure) with small amount of amorphous phase. Crystallinity of the films improves with annealing at elevated temperatures. XRD and FESEM results suggest that the films are composed of nanoparticles of 25–35 nm. Raman analysis and optical measurements suggest quantum confinement effects since Raman peaks of the as-deposited films are blue-shifted as compared to those for bulk TiO₂ Optical band gap energy of the as-deposited TiO₂ film is 3.24 eV, which decreases to about 3.09 eV after annealing at 600 °C. Refractive index of the as-deposited TiO₂ film is 2.26, which increases to about 2.32 after annealing at 600 °C. However the films annealed at 500 °C present peculiar behavior as their band gap increases to the highest value of 3.27 eV whereas refractive index, RMS roughness and dc-resistance illustrate a drop as compared to all other films. Illumination to sunlight decreases the dc-resistance of the as-deposited and annealed films as compared to dark measurements possibly due to charge carrier enhancement by photon absorption.