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在红外成像过程中,目标边缘模糊化是影响红外目标识别效果的关键因素,也是红外目标识别算法的研究重点,故在光谱图像中合理补偿目标几何特征信息成为研究热点之一。结合包含目标几何特征信息的包围盒作为约束条件,对红外光谱图像进行分层限定滤波,降低原有图像数据中目标几何外形数据的丢失,提高目标可识别性。设计了在包围盒约束条件下的光谱聚类算法,设置参数η表征待测军用车辆目标的几何信息,设置参数m表征待测军用车辆目标的光谱特征信息。实验采用TEL-1000-MW型红外成像光谱仪获取多光谱图像,通过改变m和η值调整光谱特征值个数与包围盒范围,从而获得不同的目标识别图像。并与传统方法对同一幅红外目标图像的识别效果相比较,结果发现采用包围盒约束的待测目标图像几何边界信息保留效果明显优于传统方法,当m=10、η=0.7时,红外图像的目标识别效果最好,同时算法收敛速度也最优。由此可见,该算法在提高红外目标识别能力、避免误判伪目标和漏检目标方面具有很高的实用价值。 相似文献
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一种快速混合碰撞检测算法研究 总被引:1,自引:0,他引:1
为提高虚拟环境的临境感和真实感,对其中的关键技术碰撞检测进行研究,提出了一种快速碰撞检测算法。复合层次包围盒碰撞检测能发挥不同类型包围盒碰撞检测的优势进行检测,但不能充分利用当前图形硬件的快速并行计算的优势;基于流的碰撞检测算法可充分发挥后者的优势,但会造成许多冗余检测。提出的新算法将复合层次包围盒碰撞检测算法与基于流的碰撞检测算法相结合:在预处理阶段构造复合层次包围盒树,然后利用复合层次包围盒碰撞检测算法进行初步检测快速排除不可能相交的物体对,接着利用基于流的碰撞检测算法对得到的碰撞子集进行精确求交,得到碰撞检测的结果。实验通过与RAPID和原始的基于流的碰撞检测算法进行比较,证明该算法能有效进行实时碰撞检测。 相似文献
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文章从图像处理仿真系统出发,首先介绍了图像处理对仿真系统的要求,接着对红外图像处理仿真系统的构成进行了分析,然后利用理论模型对仿真系统的光学特性仿真部分,也即目标与背景的红外辐射特征进行了计算,生成了目标与背景的红外热图像。试验结果表明,本文提出的红外图像仿真系统能满足红外目标识别算法评价的要求,有利于提高红外目标识别算法研究的速度和识别算法的稳定性。 相似文献
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基于红外辐射理论,综合考虑自身辐射、反射辐射、大气长波辐射等因素,研究了目标的红外辐射特性仿真方法,编制了目标红外辐射仿真软件。以某钢板为例,建立了目标的仿真计算模型,确定了目标表面的边界条件,计算了目标表面的温度场分布,将仿真计算与试验测量的钢板表面温度数据进行了对比,结果显示:仿真计算的平均误差在1.5 ℃以下,验证了仿真方法的正确性,并在此基础上仿真计算了不同时刻目标的红外辐射特征分布,证明了红外仿真方法的合理性,为车辆与复杂背景的红外仿真计算奠定了基础。 相似文献
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Schaper L.W. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》1992,80(12):1955-1964
The process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, and repairable. The many aspects of MCM design are described, starting with system benefits, then system and MCM partitioning, chip environment, system constraints, and infrastructure/manufacturing issues 相似文献
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Max-SINR ISI/ICI-Shaping Multicarrier Communication Over the Doubly Dispersive Channel 总被引:2,自引:0,他引:2
For communication over doubly dispersive channels, we consider the design of multicarrier modulation (MCM) schemes based on time-frequency shifts of prototype pulses. We consider the case where the receiver knows the channel state and the transmitter knows the channel statistics (e.g., delay spread and Doppler spread) but not the channel state. Previous work has examined MCM pulses designed for suppression of inter-symbol/inter-carrier interference (ISI/ICI) subject to orthogonal or biorthogonal constraints. In doubly dispersive channels, however, complete suppression of ISI/ICI is impossible, and the ISI/ICI pattern generated by these (bi)orthogonal schemes can be difficult to equalize, especially when operating at high bandwidth efficiency. We propose a different approach to MCM pulse design, whereby a limited expanse of ISI/ICI is tolerated in modulation/demodulation and treated near-optimally by a downstream equalizer. Specifically, we propose MCM pulse designs that maximize a signal-to-interference-plus-noise ratio (SINR) which suppresses ISI/ICI outside a target pattern. In addition, we propose two low-complexity turbo equalizers, based on minimum mean-squared error and maximum likelihood criteria, respectively, that leverage the structure of the target ISI/ICI pattern. The resulting system exhibits an excellent combination of low complexity, low bit-error rate, and high spectral efficiency. 相似文献
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本文基于筛选平均(CM)和无偏筛选平均(UCM)提出了两种改进的恒虚警检测器MCM-CFAR和MUCM-CFAR,并应用了何友(1994)提出的自动筛选技术.在Swerling Ⅱ型目标假设下,并考虑瑞利分布杂波和单脉冲检测情形,本文推导出了MCM-CFAR和MUCM-CFAR检测器的Pfa、Pd和平均判决门限(ADT)的解析表达式,并与其它方案进行了比较.分析结果表明,它们在均匀背景和多目标环境中的性能均明显优于GOSCA和OS;当IL=4,IR=2时,MCM-CFAR比OS改善了2dB,MUCM-CFAR也比OS改善了1.5dB;MCM的性能略优于CM,MUCM与UCM接近,但它们的样本排序时间不足CM、UCM和OS的一半,便于工程实现. 相似文献
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Syed Arsalan Jawed Davide Cattin Nicola Massari Massimo Gottardi Andrea Baschirotto 《Analog Integrated Circuits and Signal Processing》2011,67(3):395-405
A single-package digital MEMS Capacitive Microphone (MCM) system is presented. The system consists of a MCM, which is wire-bonded
with its readout interface (RI). The MCM sensor is fabricated using a combination of surface and bulk micromachining, employing
diaphragm-stiffening to achieve piston-like diaphragm-movement and attaining required sensitivity with a smaller diaphragm-area.
The RI is designed in 0.35 μm CMOS and it consists of a preamplifier (PAMP), a sigma-delta modulator (SDM), integrated biasing
and digital control, converting the MCM capacitive variations into a single-bit over-sampled digital bitstream. The PAMP employs
a two-terminal bootstrapped source-follower buffer to make the readout insensitive to the MCM parasitics, subsequently feeding
a third-order single-loop single-bit modulator running at 2.5 MHz. The electrical measurements of the standalone RI demonstrate
55 dB A-weighted @ 1 Pa SNDR at the analog PAMP output and 80 dB A-weighted dynamic-range at the digital output, which corresponds
to a conversion range from 40 to 120 dB SPL. The SNDR for acoustic measurements is 33 dB A-weighted @ 1 Pa, limited by the
higher MCM thermal noise floor and reduced sensitivity (−53 dB V @ 1 Pa). The frequency characterization of the system for
the complete audio-band demonstrates the effect of the system package towards higher frequencies (>9 kHz), giving rise to
Helmholtz resonance, and reduction in sensitivity for low-frequencies (<400 Hz) because of acoustic short-circuiting inside
the MCM due to flow-by slots. The complete system consumes 460 μA of total current for a 1.8 V single-supply. The total system
dimensions are 4.5 × 2 mm2 (excluding the package), demonstrating the viability of a low-area, low-power and high dynamic-range implementation of digital
MCM. 相似文献
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Two novel nonlinear companding schemes with iterative receiver to reduce PAPR in multi-carrier modulation systems 总被引:2,自引:0,他引:2
Tao Jiang Wenbing Yao Peng Guo Yonghua Song Daiming Qu 《Broadcasting, IEEE Transactions on》2006,52(2):268-273
Companding transform is an efficient and simple method to reduce the Peak-to-Average Power Ratio (PAPR) for Multi-Carrier Modulation (MCM) systems. But if the MCM signal is only simply operated by inverse companding transform at the receiver, the resultant spectrum may exhibit severe in-band and out-of-band radiation of the distortion components, and considerable peak regrowth by excessive channel noises etc. In order to prevent these problems from occurring, in this paper, two novel nonlinear companding schemes with a iterative receiver are proposed to reduce the PAPR. By transforming the amplitude or power of the original MCM signals into uniform distributed signals, the novel schemes can effectively reduce PAPR for different modulation formats and sub-carrier sizes. Despite moderate complexity increasing at the receiver, but it is especially suitable to be combined with iterative channel estimation. Computer simulation results show that the proposed schemes can offer good system performances without any bandwidth expansion. 相似文献
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Tao Jiang Weidong Xiang Richardson P.C. Daiming Qu Guangxi Zhu 《Wireless Communications, IEEE Transactions on》2007,6(6):2017-2021
In this paper, we provide the design criteria of the nonlinear companding transforms for reduction in peak-to-average power ratio (PAPR) of multi-carrier modulation (MCM) signals, which can enable the original MCM signals to be transformed into the desirable distribution. As examples, some novel nonlinear companding transforms have been proposed to transform the amplitude or power of the original MCM signals into uniform distribution, which can effectively reduce the PAPR for different modulation formats and subcarrier sizes without any complexity increase and bandwidth expansion. It has been shown by computer simulations that the proposed schemes can significantly improve the performance of MCM systems including bit-error-rate and PAPR reduction. 相似文献
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Yervant Zorian 《Journal of Electronic Testing》1997,10(1-2):7-14
Products motivated by performance-driven and/or density-driven goals often use Multi-Chip Module (MCM) technology, even though it still faces several challenging problems that need to be resolvedbefore it becomes a widely adopted technology. Among its mostchallenging problems is achieving acceptable MCM assembly yieldswhile meeting quality requirements. This problem can be significantlyreduced by adopting adequate MCM test strategies: to guarantee thequality of incoming bare (unpackaged) dies prior to module assembly;to ensure the structural integrity and performance of assembled modules; and to help isolate the defective parts and apply the repair process.This paper describes todays MCM test problems and presents thecorresponding test and design-for-testability (DFT) strategies usedfor bare dies, substrates, and assembled MCMs. 相似文献
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3-D MCM封装技术及其应用 总被引:1,自引:0,他引:1
介绍了超大规模集成电路(VLSI)用的3-D MCM封装技术的最新发展,重点介绍了3-D MCM封装垂直互连工艺,分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题,并对3-D MCM封装的应用作了简要说明。 相似文献