Ni/Cu metallization for low-cost high-efficiency PERC cells

Low-cost metallization process with excellent performance for high-efficiency passivated emitter and rear cell (PERC) is described. The fabrication processes of the high-efficiency silicon solar cell are too expensive and complicated to be commercialized widely. It is necessary to develop inexpensive metallization technique without degradation of the cell performance. In this paper, Ni/Cu contact system was used to fabricate low-cost high-efficiency solar cells instead of traditional solution that are based on evaporated Ti/Pd/Ag. The electroless plated Ni is utilized as the contact to silicon and the electroplated Cu served as the primary conductor layer. This metallization scheme has proven to be successful.     

High Efficiency Large Area Back Contact Concentrator Solar Cells with a Multilevel Interconnection

Very high efficiencies have been demonstrated under concentration with silicon solar cells having interdigitated contacts on the backside. However, only laboratory cells of small dimension have reached very high efficiencies. The need for developing a multilevel metallization technology for back contact concentrator solar cells of large area is demonstrated. The particular features required for such a multilevel interconnection are studied and a process using anodic oxidation of aluminum is presented. Back contact silicon solar cells of 0.64 cm² have been processed in this technology resulting in 26.2% efficiencies at 10W/cm² (100 suns AM1.5, 25.5 ^°C). the highest efficiency reported to date for a solar cell of this area. The one-sun efficiency of this cell is 21.7% (AMI.5, 25.2^°C). We propose also a new design for the metallization of back contact cells which allows an increase in the size of the cell without increasing the series resistance.     

Improved LDSE processing for the avoidance of overplating yielding 19.2% efficiency on commercial grade crystalline Si solar cell

A record in laser doped selective emitter (LDSE) solar cells with an efficiency η=19.2% is reported. In this study, we investigate the effect of SiN_x films for laser doped selective emitter solar cells with plated front contacts. It is observed that the condition of processes such as silicon nitride and laser doping (LD) is of critical importance prior to light induced plating. If these processes are not performed optimally, localized shunts may form during the light induced plating (LIP) process that then inhibit plating in the surrounding areas. In the previous work an efficiency of 18.3% has been achieved, even though the fill factor was only 74.2% and the cell suffered from additional shunting and shading losses due to overplating. However, in this work, we demonstrate that with the optimization of the PECVD SiN_x and metallization processes, cells have reached efficiencies of more than 19% on commercial grade p-type CZ Si substrates.     

SiOx(C)/SiNx dual-layer anti-reflectance film coating for improved cell efficiency

Light-induced plating (LIP), in which the current driving the metal reduction process is derived from illuminated solar cells, is an attractive technique for solar cell metallization because of its potential simplicity. However, applying the LIP techniques on standard acidic-textured multicrystalline silicon wafers with a silicon nitride-coated surface presents a challenge. The use of a spray-on carbon-doped non-stoichiometric silicon oxide [SiO_x(C)] dielectric film before nickel and silver plating can greatly reduce background plating while helping decrease the reflectance on the front of silicon solar cells. The sprayed dielectric films have low refractive indices of 1.3–1.4, depending on the annealing temperature. Simulation studies show that the SiO_x(C)/SiN_x dual-layer anti-reflective coating has a lower weighted reflectance against an AM 1.5 G spectrum compared with the SiN_x single coating. Finally, the performance of the laser-doped solar cells with a standard SiN_x as an anti-reflectance coating were compared with those with the SiO_x(C)/SiN_x double-layer stack. An efficiency of 16.74% on a large, commercial-grade, p-type, multicrystalline silicon substrate was achieved.     

High-efficiency low-cost integral screen-printing multicrystalline silicon solar cells

This paper describes how the efficiency and throughput of industrial screen-printed multi-Si solar cells can be increased far beyond the state-of-the-art production cells. Implementation of novel processes of isotropic texturing, shallow emitter or single diffusion selective emitter, combined with screen-printed metallization fired through a PECVD SiN_x ARC layer, have been described. Novel dedicated fabrication equipment for emitter diffusion and a PECVD SiN_x deposition system are developed and implemented thereby removing the processing bottlenecks linked to the diffusion and bulk passivation processes. Several types of back-contacted solar cells with improved visual appeal required for building integrated photovoltaic (BIPV) application have been developed.     

Simulation of an efficient silicon heterostructure solar cell concept featuring molybdenum oxide carrier‐selective contact

Transition metal oxides/silicon heterocontact solar cells are the subject of intense research efforts owing to their simpler processing steps and reduced parasitic absorption as compared with the traditional silicon heterostructure counterparts. Recently, molybdenum oxide (MoO_x, x < 3) has emerged as an integral transition metal oxide for crystalline silicon (cSi)‐based solar cell based on carrier‐selective contacts (CSCs). In this paper, we physically modelled the CSC‐based cSi solar cell featuring MoO_x/intrinsic a‐Si:H/n‐type cSi/intrinsic a‐Si:H/n⁺‐type a‐Si:H for the first time using Silvaco technology computer‐aided design simulator. To analyse the optical and electrical properties of the proposed solar cell, several technological parameters such as work function and thickness of MoO_x contact layer, intrinsic a‐Si:H band gap, interface recombination, series resistance, and temperature coefficient have been evaluated. It has been shown that higher work function of MoO _x induces the formation of a favourable Schottky barrier height as well as an inversion at the front interface, stimulating least resistive path for holes. Utilising thinner MoO_x layer implies reduced tunnelling of minority charge carriers, thus enabling the device to numerically attain 25.33% efficiency. With an optimised interface recombination velocity and reduced parasitic absorption, the proposed device exhibited higher V_oc of 752 mV, J_sc of 38.8 mA/cm², fill‐factor of 79.0%, and an efficiency of 25.6%, which can be termed as the harbinger for industrial production of next‐generation efficient solar cell technology.     

The influence of porous silicon on junction formation in silicon solar cells

In this work the results of a structural investigation by SEM of porous silicon (PS) before and after diffusion processes are reported. The formation of PS n⁺/p structures were carried out on PS p/p silicon wafers with two methods: from POCl₃ in a conventional furnace and from a phosphorous doped paste in an infrared furnace. Sheet resistance was found to be a strong function of PS structure. Further details on sheet resistance distribution are reported. The electrical contacts in prepared solar cells were obtained by screen printing process, with a Du Ponte photovoltaic silver paste for front contacts and home-prepared silver with 3% aluminium paste for the back ones. Metallization was done in the infrared furnace. Solar cell current–voltage characteristics were measured under an AM 1.5 global spectrum sun simulator. The average results for multi-crystalline silicon solar cells without antireflection coating are: I_sc=720 (mA), V_oc=560 (mV), FF=69%, Eff=10.6% (area 25 cm²).     

Analysis of series resistance of crystalline silicon solar cell with two-layer front metallization based on light-induced plating

Improving the front metallization quality of silicon solar cells should be a key to enhance cell performance. In this work, we investigated a two-layer metallization scheme involving light-induced plating (LIP) and tried to quantify its impact on the series resistance of the front grid metals and FFs on finished cells. To estimate the effect of LIP processing on a printed and fired seed layer, individual components of series resistance were measured before and after LIP processing. Among them, grid resistance and contact resistance were closely observed because of their large contribution to series resistance. To optimize the plating on the seed metal grid, the grid resistance of the two-layer metal grid structure was calculated as a function of cross section area of the plated layer. Contact resistivity of the grid before and after LIP processing was analyzed to understand the contact resistance reduction, as well. As a result, the efficiency of solar cells with 80 μm seed metal grid width increased by 0.3% absolute compared with conventional solar cells of 120 μm metal grid width. The total area of electrodes in conventional cells was 1800 mm² and electrodes area of LIP processed solar cells was 1400 mm². The efficiency gain was due to reduction of shadowing loss from 7.7% to 6.0% without the increase of resistance due to two-layer front metallization.     

Defect passivation of industrial multicrystalline solar cells based on PECVD silicon nitride

Low surface recombination velocity and significant improvements in bulk quality are key issues for efficiency improvements of solar cells based on a large variety of multicrystalline silicon materials. It has been proven that PECVD silicon nitride layers provide excellent surface and bulk passivation and their deposition processes can be executed with a high throughput as required by the PV industry. The paper discusses the various deposition techniques of PECVD silicon nitride layers and also gives results on material and device properties characterisation. Furthermore the paper focuses on the benefits achieved from the passivation properties of PECVD SiN_x layers on the multi-Si solar cells performance. This paper takes a closer look at the interaction between bulk passivation of multi-Si by PECVD SiN_x and the alloying process when forming an Al-BSF layer. Experiments on state-of-the-art multicrystalline silicon solar cells have shown an enhanced passivation effect if the creation of the alloy and the sintering of a silicon nitride layer (to free hydrogen from its bonds) happen simultaneously. The enhanced passivation is very beneficial for multicrystalline silicon, especially if the defect density is high, but it poses processing problems when considering thin (<200 μm) cells.     

The infrared processing in multicrystalline silicon solar cell low-cost technology

New directions in photovoltaics depend very often on financial possibilities and new equipment. In this paper, we present the modification of a standard screen-printing technology by using an infrared (IR) furnace for forming a n⁺/p structure with phosphorus-doped silica paste on 100 cm² multicrystalline silicon wafers. The solar cells were fabricated on 300 μm thick 1 Ω cm p-type multicrystalline Bayer silicon. The average results for 100 cm² multicrystalline silicon solar cells are: I_sc=2589 mA, V_oc=599 mV, FF=0.74, E_ff=11.5%. The cross-sections of the contacts metallized in the IR furnace, as determined by scanning electron microscopy, and the phosphorus profile measured by an electrochemical profiler are shown. IR processing offers many advantages, such as a small overall thermal budget, low power and time consumption, in terms of a cost-effective technology for the continuous preparation of solar cells.     

Double porous silicon layer on multi-crystalline Si for photovoltaic application

Double porous silicon (d-PS) layers formed by acid chemical etching on a top surface of n⁺/p multi-crystalline silicon solar cells were investigated with the aim to improve the performance of standard screen-printed silicon solar cells. First a macro-porous layer is formed on mc-Si. The role of this layer is texturization of surface. Next, the cells have been manufactured using standard technology based on screen-printing metallization. Finally, a second mezo-porous layer in n⁺ emitter of cell has been produced. The role of this PS layer is to serve as an antireflection coating. In this way, we have obtained d-PS layers on these solar cells. The paper present observation of d-PS microstructure with SEM as well as measurements of its effective reflectance at the level of 2.5% in the 400–1000 nm length wave range. The efficiency of the solar cells with this structure is about 12%.     

Experimental evidence of very high open-circuit voltages of inversion–layer silicon solar cells

In this paper the first experimental evidence of the high V_oc-potential of inversion-layer silicon solar cells is given. Minority-carrier lifetime measurements on inversion-layer emitters have been performed and the diffused p–n contact of PN-IL silicon solar cells has been optimized for high open-circuit voltages. PN-IL silicon solar cells with open-circuit voltages of 693 mV have been fabricated on 0.2 and 0.5-Ω cm FZ p-Silicon wafers. These values are the highest ever reported V_oc's for inversion-layer silicon solar cells on p-Silicon. This demonstrates that inversion-layer silicon solar cells exhibit a similar potential for achieving high open-circuit voltages as silicon solar cells with a diffused p–n junction.     

Screen printed boron emitters for solar cells

Screen printed (SP) boron emitters are presented as a useful option for the manufacturing of p-type emitters of solar cells. Details are provided on the diffusion process, including deposition, drying and firing steps, the latter performed in an infrared belt furnace. Besides their main dependences on the firing conditions, the sheet resistances and dopant profiles of the resulting emitters reveal the relevance of the drying step and the exhaustion limits of the doping source. A characterization of the recombination concludes that moderate emitter saturation currents (J_oe<0.5 pA/cm²) and acceptable bulk lifetimes (τ_B>40 μs) can be obtained on Czochralski silicon wafers. Finally, Cz n-type 0.7 Ω cm solar cells are presented, which once again prove the feasibility of SP boron emitters and point to issues regarding their metallization.     

Latest results on semitransparent POWER silicon solar cells

The paper presents the latest results of the polycrystalline wafer engineering result (POWER) silicon solar cell research (G. Willeke, P. Fath, The POWER silicon solar cell, Proceedings of the 12th EPVSEC, Amsterdam, 1994, pp. 766–768). Mono – as well as bifacially active semitransparent silicon solar cells have been created by forming perpendicularly overlapping grooves on the front and the rear side of a silicon wafer resulting in a regular pattern of holes. The developed very simple manufacturing process is fully compatible with an industrial production and uses POCl₃-tube diffusion, PECVD silicon nitride as single ARC and screen-printing metallization. Maximum efficiencies of η=11.2% for monofacial POWER cells on 0.4 Ω cm Cz material with a transparency of 18.2% and η=12.9% for bifacial cells on 1 Ω cm Cz material with a transparency of 16% have been obtained. Results for multicrystalline (mc) semitransparent mono- and bifacially active silicon solar cells are also presented.     

Polycrystalline silicon solar cells with V-grooved surface

Mechanical grooving techniques are effective to uniform reduction of surface reflectance over all polycrystalline silicon solar cells. Furthermore, to reduce the surface reflectance, a V-shaped grooving technique was newly examined. To improve the short-circuit current (I_sc) and the open-circuit voltage (V_oc), a shallow n⁺/p junction was also examined for the grooved surface. By forming the shallower junction, both I_sc and V_oc remarkably increased. Consequently, a record high conversion efficiency of 17.2% has been confirmed at Japan Quality Assurance Organization (JQA) for a 10 × 10 cm² area polycrystalline silicon solar cell.     

Concentrator silicon solar cells from silicon industry rejects

Two types of silicon (Si) substrates (40 n-type with uniform base doping and 40 n/n⁺ epitaxial wafers) from the silicon industry rejects were chosen as the starting material for low-cost concentrator solar cells. They were divided into four groups, each consisting of 20 substrates: 10 are n/n⁺ and 10 are n substrates, and the solar cells were prepared for different diffusion times (45, 60, 75 and 90 min). The fabricated solar cells on n/n⁺ substrates (prepared with a diffusion time of 75 min) showed better parameters. In order to improve their performances, particularly the fill factor, 20 new solar cells on n/n⁺ substrates were fabricated using the same procedure (the diffusion time was 75 min)—but with four new front contact patterns. Investigation of current–voltage (I–V) characteristics under AM 1.5 showed that the parameters of these 20 new solar cells have improved in comparison to previous solar cells' parameters, and were as follows: open-circuit voltage (V_OC=0.57 V); short circuit current (I_SC=910 mA), and efficiency (η=9.1%). Their fill factor has increased about 33%. The I–V characteristics of these solar cells were also investigated under different concentration ratios (X), and they exhibited the following parameters (under X=100 suns): V_OC=0.62 V and I_SC=36 A.     

Effect of temperature on dark current characteristics of silicon solar cells and diodes

The influence of temperature on the dark forward current–voltage characteristics of a single crystalline silicon solar cell and a small silicon diode within the range from 295–373 K has been analysed. It was shown that the forward voltage of the solar cell degrades 2 mV and in the case of diode 1 mV per 1 K temperature increases at constant forward current of 100 mA. Thermal resistance and heat transfer from the solar cell by using a thick copper plate as a heat sink have also been discussed. For the series resistance determination the current–voltage I–U characteristics of single crystalline silicon solar cells in different temperatures were measured in the dark. It was proved that series resistance of the silicon solar cells and diodes is temperature dependent and increases with temperature increase 0.65% K^?1. Therefore, protection of silicon solar cells as well as silicon diodes against overheating is essential during their exploitation. Copyright © 2005 John Wiley & Sons, Ltd.     

Progress in monolithic series connection of wafer-based crystalline silicon solar cells by the novel ‘HighVo’ (High Voltage) cell concept

Progress in the development of the new HighVo cell concept for monolithic series connection of wafer-based crystalline silicon solar cells is presented. HighVo cells have been produced using standard low-cost silicon wafer technology without any photo lithographic masking step. The cells obtained with a total area of 21 cm² exhibited a voltage at the maximum power point V_MPP of 2.8 V and a conversion efficiency η of 11.4 %. To our knowledge this is the highest conversion efficiency reported so far for monolithically integrated non-thin-film silicon solar cells.     

High-efficiency μc-Si/c-Si heterojunction solar cells

P-type microcrystalline silicon (μc-Si (p)) on n-type crystalline silicon (c-Si(n)) heterojunction solar cells is investigated. Thin boron-doped μc-Si layers are deposited by plasma-enhanced chemical vapor deposition on CZ-Si and the V_oc of μc-Si/c-Si heterojunction solar cells is higher than that produced by a conventional thermal diffusion process. Under the appropriate conditions, the structure of thin μc-Si films on (1 0 0), (1 1 0), and (1 1 1) CZ-Si is ordered, so high V_oc of 0.579 V is achieved for 2×2 cm² μc-Si/multi-crystalline silicon (mc-Si) solar cells. The epitaxial-like growth is important in the fabrication of high-efficiency μc-Si/mc-Si heterojunction solar cells.     

Photoelectrochemical characteristics of brush plated tin sulfide thin films

Thin films of tin sulfide find wide applications in optoelectronic devices and window materials for heterojunction solar cells. Thin films of p-SnS were brush plated onto tin oxide coated glass substrates from aqueous solution containing SnCl₂ and Na₂S₂O₃. Deposits have been characterized with XRD and SEM for structural analysis. Hot probe method showed invariably p-type nature for all the brush plated SnS films. The variation of space charge capacitance, C_sc, with applied potential, V, was recorded for the PEC cell with p-SnS/Fe³⁺, Fe²⁺/Pt system. The spectral response of the PEC cell formed with SnS photoelectrode was studied and reported.