浅谈水基石墨烯-铜复合导电浆料的制备及性能分析

自2020年以来,国内的原材料价格就迅速飞涨,价格波动较大,在电子领域中,银是最贵的一张金属,电子商业面临着成本的材料压力,势必会造成金属材料的贱金属化,就目前我国的金属资源来看,贵金属的资源利用力越来越大,导致了金属资源的稀缺,再加上人们的需求量过大,价格也随之逐渐上调.铜复合导年电浆料作为电子元器件的基础材料,它的...     

铜/钢双金属复合制备工艺技术研究现状

介绍了目前国内外生产铜/钢双金属复合材料的主要制备工艺以及它们的原理和特点,在此基础上分析了铜/钢复合界面的冶金结合行为和铜/钢双金属复合材料制备的研究动态,并对铜/钢复合材料在各方面的应用做了简单介绍,最后对各制备工艺的未来发展趋势进行总结。     

铜系复合涂料导电稳定性的研究

本文研究了硅烷偶联剂对电磁屏蔽用铜系导电复合涂料导电稳定性的影响,结果表明,由于偶联剂在铜粉表面可形成隔绝空气的保护膜,导电涂料的导电性能及导电稳定性均得到显著的提高,当偶联剂的含量为铜粉含量的３％（质量分数）时达到最佳值。     

铜系复合涂料的制备及导电性能

采用醇酸树脂为基料 ,金属铜粉和金属纤维为导电填料以及溶剂和助剂 ,研制成电磁屏蔽导电涂料 ;讨论了铜粉和金属纤维的含量以及固化工艺对涂料导电性能的影响 ,并通过涂层的导电机理 ,探讨了造成这些影响的原因     

钨铜化合物氢还原制备钨铜复合粉研究

通过对钨铜化合物氢还原过程进行热力学分析,找到了制备均匀细颗粒钨铜复合粉的热力学途径--彻底快速除去还原系统中的水分.设计了封闭还原系统,用此系统进行氢气热还原,不仅使氢气得到充分利用,而且容易判断反应终点.通过系统内的特殊装置除水,降低了还原温度,在600℃下还原得到了混合均匀的钨铜复合粉.系统能彻底快速除去反应生成的水分,使反应物的湿度大大降低,确保得到细颗粒的钨铜复合粉,其平均粒径小于80nm.     

内嵌叠氮化铜碳纳米管复合含能材料的制备与表征

叠氮化铜是一种绿色环保的高能含能材料，其极高的静电感度限制了它在MEMS火工品微型装药中的应用。碳纳米管优异的导电性可以有效地降低叠氮化铜的静电感度，而且取向一致、高机械强度的碳纳米管可以有效地提高叠氮化铜的安全性和爆轰输出能量。本文中，设计并制备了基于硅基底及多孔氧化铝模板的内嵌叠氮化铜碳纳米管复合含能材料，探究了合适的制备条件，并对样品进行了表征分析。结果表明:在氧化电压45 V、沉积电流密度0.1 mA/cm²条件下制备的复合材料,经72 h叠氮化反应后得到的内嵌叠氮化铜碳纳米管复合含能材料在静电感度仪测试范围（≤25 kV）内均未发火，有望作为一种新型含能装药应用于MEMS器件中。     

超细钼铜复合粉末的制备工艺研究

钼铜合金是两种互不相溶的假合金,与钨铜合金相比,钼铜材料的密度较低,且其容易变形加工,被广泛用于航空航天、电力、电子等行业.研究了制备钼铜合金原料粉末--超细钼铜复合粉的制备工艺.用SEM和TEM的选区电子衍射图观察了不同球磨方式和不同球磨时间钼铜复合粉末的粒度和形貌.结果表明:①普通球磨、行星球磨无法得到结构和成分分布均匀的纳米合金粉,而高能球磨方式可以得到;②经过25 h高能球磨可以得到结构和成分分布均匀,尺寸为30mm的合金粉末.     

铜/钢液固相复合界面的结合强度

用液－固相复合法制备铜包钢线,研究了钢线表面的处理方法,预热温度,铜液的温度和复合时间等工艺参数对铜包钢线中界面结合强度的影响。结果表明,表面经酸洗、机械打磨并覆助镀剂的钢线,在４００℃预热复合后,钢线与铜层之间的结合效果好,界面结合强度达到９５ＭＰａ。     

铜铬复合氧化物纳米粉的制备与表征

报道了自创铜氨铬合物溶液沉淀法（简称络合法）制备铜铬复合氧化物纳米粉的方法,并采用化学分析、ＢＥＴ比表面积测定、ＸＲＤ、ＸＰＳ、ＳＥＭ和ＴＥＭ等对该纳米粉进行了表征。结果表明,采用铜氨络合物溶液沉淀法制备的铜铬复合氧化物钠米粉的比表面积高达９６．６ｍ＾２／ｇ;样品中权有ＣｕＯ和ＣｕＣｒＯ２微晶,无尖晶石型的ＣｕＣｒ２Ｏ４晶粒;Ｃｕ只以Ｃｕ＾＋和Ｃｕ＾２＋状态存在,Ｃｒ只以Ｃｒ＾３＋状态存在;样品的     

各向异性导电胶用新型导电复合粒子的制备

采用无钯活化的化学镀的方法成功地制备出外镀银/铜/环氧树脂新型导电复合粒子,并对导电复合粒子进行了光学显微镜、SEM和EDS分析.结果表明:制备的导电微粒密度小,具有良好的导电性能,可以满足各向异性导电胶应用需求.     

316L不锈钢、铜、锡复合框架材料研究

设计并采用电刷镀复合工艺制造了一种316L不锈钢、铜、锡复合框架功能材料，此功能材料具有良好的弹性、导电、导热性能和优异的钎焊性能，且无磁性，可满足某大型机组控制系统的要求，同时对此材料的组织性能等进行了研究。     

Microstructural evolution of copper clad steel bimetallic wire

We investigated the microstructure of two different bimetallic wires of Copper Clad Low Carbon Steel Wire (LCSW), which had a 1006 steel core, and Copper Clad High Carbon Steel Wire (HCSW), which had a 1055 steel core. The HCSW generally showed higher hardness than LCSW because of the pearlitic grain structure. A low temperature annealing at 720 °C to the drawn HCSW caused a significant reduction of hardness, which was as low as that of an annealed LCSW. In general, both LCSW and HCSW showed strong global textured features after drawing, with the steel having a strong 〈1 1 0〉 fiber texture and the copper having a 〈1 1 1 〉-〈1 1 2〉 deformation direction. At the interface, a grain size discrepancy at the steel-copper interface was observed. Post-drawing, the LCSW copper grains exhibited refined grain sizes near the interface and has been explained in terms of shear strain gradient. The HCSW did not exhibit this copper grain size distribution but did exhibit a coarsening of the steel grains near the interface after a subsequent 720 °C heat treatment. This is attributed to the large localized stress concentration at the perimeter of the steel region during the drawing process. The strain induced regions at the steel-copper interface have been simulated by finite element modeling. These grain size discrepancies caused the smooth variation in nanohardness across the interface.     

EG/SSF/ABS复合材料的导电性能与力学性能

采用硅烷偶联剂（KH550）改性膨胀石墨（EG）和不锈钢纤维（SSF）,将表面处理前后的EG和SSF与丙烯晴-丁二烯-苯乙烯（ABS）树脂通过混炼挤出制备了复合材料,分析了EG、SSF含量及改性处理EG、SSF对复合材料导电性能和力学性能的影响。结果表明,随着EG含量增加,复合材料的体积电阻率逐渐下降,且变化规律符合＂渗滤效应＂;EG改性后,复合材料的体积电阻率减小,拉伸强度增大,冲击强度减小。改性EG含量保持20%不变,加入SSF后,复合材料的导电性能有较大提高;SSF改性后,复合材料的体积电阻率变大,拉伸强度和抗冲击强度均提高,当改性后SSF含量为16%时,体积电阻率为5190Ω.cm,拉伸强度和抗冲击强度分别为50.11MPa和2.1kJ/m2。     

A study on diffusion bonding of steel and copper alloy

In combustion chamber of liquid propellant launch vehicle, the inner shell of the chamber is copper alloy with cooling channels for regenerative cooling and outer shell is steel to maintain high pressure inside the chamber. The purpose of this study is to find the optimum condition for diffusion bonding of copper and steel and the experimental conditions were 3 different pressures at temperatures from 800°C to 950°C. In order to characterize the flow strength of materials at high temperatures, several tensile tests were performed at several temperatures from 800°C to 950°C. This information is used to estimate the test condition for diffusion bonding and superplastic forming. Mechanical properties of bonded specimen were evaluated with single lap joint tests and shear tests. Microstructure of bonded layer has been also observed with SEM with EDX. It is shown that the optimum condition of diffusion bonding is 7 MPa at 890°C, for one hour. Pressurization test of bonded specimen with cooling channels was performed with hydraulic pressure of 87 MPa without failure.     

制备参数对不锈钢丝网催化剂结构和性能的影响

采用阳极氧化工艺在不锈钢丝网载体上自生长一层氧化膜,再在其上负载活性组分铈、铂和钯,制备了金属丝网催化剂.研究了阳极氧化的电流密度和电解液种类等因素对阳极氧化膜形成的影响,以及还原时间和焙烧温度对催化剂氧化活性的影响.结果表明,改变制备参数对氧化膜结构有较大影响,进而影响到催化剂的活性.采用10%H2SO4电解液,控制电流密度为1.0 A时得到的氧化膜载体浸渍活性组分后,具有良好的催化活性和稳定性.     

Advances in synthesizing copper/graphene composite material

Graphene exhibits both excellent stretch and specific surface area. As a consequence, graphene has attracted immense attention for its applications lately. It worked well when bonded with copper composites. Unfortunately, however, there are little of such composites. To facilitate researchers to work better in the future, this article reviews its synthesis. There are two routes, including direct synthesis and indirect synthesis, which could be used to prepare copper/graphene. Simultaneously, the development and prospects of copper/graphene composite material have been discussed.     

铜丝球焊技术研究进展

在微电子器件封装第一级互连技术中,丝球焊技术占据着重要地位.随着封装技术的不断发展以及铜芯片技术的逐步应用,铜丝球焊技术开始部分替代金丝球焊应用在一些分立器件、大功率器件等电子元器件的封装中,并在精密封装领域得到推广和应用.本文主要对近年来铜丝球焊技术的相关研究进行了综述,介绍了铜丝球焊技术的发展现状.     

纯铜/铜合金高反射材料粉末床激光熔融技术进展EI北大核心CSCD

纯铜/铜合金具有优异的导热、导电性能,是重要的工业材料。以粉末床激光熔融为代表的激光增材制造技术具有优良的设计自由度及成形精度,是增材制造的主流发展方向。纯铜/铜合金的粉末床激光熔融与传统加工制造技术相比,前者能够更好地发挥铜优异的性能,在电子电气、汽车、航空航天等导热/导电高需求领域具有广阔的应用前景。本文综述了以纯铜/铜合金为代表的激光高反射材料的粉末床激光熔融的研究现状、面临的重要问题以及相应的解决对策分析。在此基础上,结合本课题组在纯铜/铜合金粉末床激光熔融过程的经验,指出运用蓝光、绿光等短波长激光器进行纯铜/铜合金等高反射材料的粉末床激光熔融是未来的研究热点与发展方向。     

Aging of a copper bearing HSLA-100 steel

Investigations were carried out on aging of a HSLA-100 steel after varying amounts of cold deformation. Mechanical properties (hardness, tensile properties and toughness) were measured and structural changes were studied using optical, TEM and SEM techniques. As a result of various treatments, the hardness and UTS could be significantly improved, but with drastic fall in ductility and impact strength, especially in peak aged conditions. The parameters affecting impact strength were examined and it was concluded that various microstructural features affected toughness through their influence on tensile properties. In this steel the impact strength could be improved by lowering the UTS and increasing the ductility (pct elongation). The improvement in hardness and UTS was attributed to formation of thick precipitate-dislocation tangles. The aging process caused a slow transformation of lath martensite into acicular ferrite due to occurrence of in situ recrystallization. The concentration of Cu in particles precipitating on aging was followed using EDAX technique.