ZnO上肖特基接触的研究进展

由于ZnO存在本征施主缺陷(锌间隙和氧空位),使得表面存在较高浓度的施主能级,难以获得肖特基接触.本文回顾了近年来在n型ZnO上制备肖特基接触的研究进展,对n型ZnO上制备肖特基接触的Au、Pt、Pd、Ag等金属方案的性能与特点,以及影响接触性能等因素,如表面处理和退火等进行了分析与归纳.同时,对P型ZnO上难以获得肖特基接触的原因进行了讨论.另外,由于Au、Pt等金属普遍存在热稳定差的问题,会降低ZnO基大功率器件的寿命,寻找能与n型ZnO能形成高热稳定性、低泄露电流、高势垒高度的肖特基接触材料是未来ZnO上肖特基光电器件的发展方向.     

Ti/Al/Ni/Au与n型GaN的欧姆接触研究

通过电流 电压 (I V)特性和传输线方法 (TLM )测量研究在n型GaN上淀积Ti/Al/Ni/Au电极形成欧姆接触的机制。Ni/Au作为Ti/Al的覆盖层起了阻止Ti ,Al,Au的互扩散及抗接触层氧化的作用。在 4 0 0℃到 90 0℃范围内 ,Ti/Al/Ni/Au与n型GaN的接触电阻随温度升高先略有上升 ,到 5 0 0℃以后单调下降。而表面形貌却在合金温度高于6 0 0℃以后随温度升高逐步变差。通过两步合金法得到了n GaN上Ti/Al/Ni/Au形成的接触电阻低达 9.6 5× 1 0 - 7Ωcm2 。最后还对两步合金法形成n GaN欧姆接触的机制进行了讨论。     

Si基n型GaN的欧姆接触研究

GaN材料在光电子器件领域的广泛应用前景使得金属与其欧姆接触的研究成为必然。本对Si基n型GaN上的A1单层及Ti/Al双层电极进行了研究。通过对不同退火条件下的I—U特性曲线，X射线衍射以及二次离子质谱分析，揭示了界面固相反应对欧姆接触的影响，提出了改善这两种电极欧姆接触的二次退火方法。     

两步镀膜Ti/Al/Ti/Au的n型GaN欧姆接触研究

报道了一种可靠稳定且低接触电阻的n型GaN欧姆接触。首先在掺硅的n型GaN(3×1018cm-3)蒸镀Ti(30nm)/Al(500nm),然后在氮气环境530℃合金化3min,最后蒸镀Ti(100nm)/Au(1000nm)用于保护Al层不被氧化。该接触电极有良好的欧姆接触特性,比接触电阻率为8.8×10-5Ωcm2,表面平坦、稳定、易焊线,可应用于制作高性能的GaN器件.     

p-GaN表面制备低阻欧姆接触电极的几个关键问题

优良的光电特性使得GaN材料成为当今半导体器件研究领域的热点,但高功函数和低载流子浓度使p-GaN表面难以制备低阻欧姆接触电极、严重妨害了GaN基器件的热稳定性和输出功率.如何制备具有低阻欧姆接触特性的p-GaN电极已成为一个关键的科学和技术问题.探讨了影响p-GaN欧姆接触特性的几个关键因素,如表面预处理工艺、电极材料的选择和厚度、退火工艺等,对此方面的最新进展进行评述和归纳,并提出自己的创新性研究思路.     

Si基n型GaN的欧姆接触研究

GaN材料在光电子器件领域的广泛应用前景使得金属与其欧姆接触的研究成为必然。本文对Si基n型GaN上的Al单层及Ti/Al双层电极进行了研究。通过对不同退火条件下的I U特性曲线 ,X射线衍射以及二次离子质谱分析 ,揭示了界面固相反应对欧姆接触的影响 ,提出了改善这两种电极欧姆接触的二次退火方法     

p型金刚石薄膜欧姆接触的研究

对p型金刚石薄膜上Ti／Au结构（金刚石-Ti／Au结构）的政姆接触和界面特性进行了研究。采用微波等离子体CVD方法在Si基片上制作出掺硼的金刚石薄膜，然后在金刚石薄膜表面上蒸发Ti／Au双层金属以形成接触电极。样品经700℃下氩气氛中热处理50min，可得到线性变化的I－U特性和比接触电阻率为2×10－4Ωcm2的欧姆接触。还采用X射线衍射图谱来分析金刚石薄膜与Ti／Au的界面，结果揭示了在金刚石-Ti／Au结构中形成欧姆接触的条件与规律。     

GaN基器件中的欧姆接触

GaN材料以其优良的光电性质，已成为制造发光器件和高温大功率器件的最有前途的材料。欧姆接触是制备GaN基器件的关键技术之一。着重论述了在n-GaN和p-GaN上制备欧姆接触的研究现状。     

M/HgI2接触特性分析

利用不同的电极材料和制备方法制备了3种M/HgI2。采用热电子发射模型计算了相应的接触势垒。采用比接触电阻法、电极系数法和欧姆系数法对比了M/HgI2的欧姆接触特性。结果表明,C/HgI2、AuCl3/HgI2和Au/HgI2的接触势垒均约为0.9eV;C/HgI2和AuCl3/HgI2具有良好的欧姆特性,Au/HgI2的欧姆特性相对较差。分析认为,HgI2晶体表面费米能级的钉扎导致了相近的接触势垒。但由于电极制备工艺没有显著影响AuCl3/HgI2和C/HgI2晶体表面质量,因而具有良好的欧姆接触特性。由于溅射Au电极在制备工艺中的温度升高和真空度造成Au/HgI2晶体表面质量下降,因此其欧姆接触特性较差。     

一种可增强光陷阱效应的多孔ZnO/PEIE电子传输层在高效有机太阳能电池中的应用

在本工作中,我们制备了一种多孔的有机/无机复合电子传输层(P-ZnO),并将其成功用于反向有机太阳能电池中.P-ZnO不仅拥有适宜的功函,且可形成较大欧姆接触面积的独特表面,有利于器件中的电荷提取.与ZnO基器件相比,P-ZnO基器件的活性层具有增强的光陷阱效应.在PBDB-T/DTPPSe-2F,PM6/Y6和PTB...     

Nb-Ti/Al/Ni/Au based ohmic contacts to AlGaN/GaN

In this paper, we report on a novel Nb-Ti/Al/Ni/Au metallic system proposed to form ohmic contact to AlGaN/GaN heterostructure. The metallic system uses deposition of thin niobium layer as the first layer in contact with the AlGaN barrier layer before deposition of the conventional Ti/Al/Ni/Au metallic system. The fabrication and electrical characterization of the Nb-Ti/Al/Ni/Au based ohmic contacts are presented. We have shown that Nb-based ohmic contacts at optimal alloying temperatures seem to be superior to that of conventional Ti/Al/Ni/Au in both surface morphology and contact resistivity evaluation. Auger Electron Spectroscopy (AES) and Secondary Ion Mass Spectroscopy (SIMS) are also used to evaluate the improved ohmic contact formation.     

Low-resistance ohmic contacts to SiC nanowires and their applications to field-effect transistors

We report on the electrical characterization of two ohmic contacts (Ti/Au and Ni/Au) to unintentionally doped silicon carbide nanowires (SiCNWs) using the modified transmission line model (TLM) method. Our results indicate that subsequently deposited Ni/Au ohmic contacts on SiCNWs had ～40 times lower specific contact resistances (SCRs) of 5.9 × 10(-6) ± 8.8 × 10(-6)?Ω?cm(2) compared to the values of Ti/Au ohmic contacts (2.6 × 10(-4) ± 3.4 × 10(-4)?Ω?cm(2)). We also conducted a comparison study of the electrical characteristics of top-gated SiCNW field-effect transistors (FETs) with two different ohmic contacts as used for ohmic contact studies. The electrical transport measurements on the SiCNW FET with Ni/Au ohmic contacts show much lower resistance contacts to SiC NWs and better FET performances than those for Ti/Au ohmic contact-based FETs.     

Thermal reliability of n-GaAs/Ti/Pt/Au Schottky contacts with thin Ti films for reduced gate resistance

The thermal stability of Ti/Pt/Au Schottky contacts on n-GaAs with Ti films 0–60 nm is investigated. The contacts with Ti films as small as 10 nm remain thermally stable with annealing up to 400°C. The changes induced by thermal treatment in the electrical characteristics of the contacts are correlated with the Rutherford backscattering and microscopic analysis of the annealed samples. It shows profuse interdiffusion and interfacial reaction with 300°C anneal for the GaAs/Pt/Au system. It has been found that introducing the Ti film between GaAs and Pt/Au, the interdiffusion of Pt and Au is also prevented. These results are useful for reducing the gate metallisation resistance of metal semiconductor field effect transistors.     

Microstructure evolution and development of annealed Ni/Au contacts to GaN nanowires

The development of Ni/Au contacts to Mg-doped GaN nanowires (NWs) is examined. Unlike Ni/Au contacts to planar GaN, current-voltage (I-V) measurements of Mg-doped nanowire devices frequently exhibit a strong degradation after annealing in N(2)/O(2). This degradation originates from the poor wetting behavior of Ni and Au on SiO(2) and the excessive void formation that occurs at the metal/NW and metal/oxide interfaces. The void formation can cause cracking and delamination of the metal film as well as reduce the contact area at the metal/NW interface, which increases the resistance. The morphology and composition of the annealed Ni/Au contacts on SiO(2) and the p-GaN films were investigated by scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS) and x-ray diffraction (XRD) measurements. Adhesion experiments were performed in order to determine the degree of adhesion of the Ni/Au films to the SiO(2) as well as observe and analyze the morphology of the film's underside by SEM. Device degradation from annealing was prevented through the use of a specific adhesion layer of Ti/Al/Ni deposited prior to the nanowire dispersal and Ni/Au deposition. I-V measurements of NW devices fabricated using this adhesion layer showed a decrease in resistance after annealing, whereas all others showed an increase in resistance. Transmission electron microscopy (TEM) on a cross-section of a NW with Ni/Au contacts and a Ti/Al/Ni adhesion layer showed a lack of void formation at the contact/NW interface. Results of the XRD and TEM analysis of the NW contact structure using a Ti/Al/Ni adhesion layer suggests Al alloying of the Ni/Au contact increases the adhesion and stability of the metal film as well as prevents excessive void formation at the contact/NW interface.     

Metallic contacts to nitrogen and boron doped diamond-like carbon films

Hydrogenated diamond-like carbon (DLC) was deposited using a radio-frequency plasma-enhanced chemical vapor deposition method. Electrical properties of Al, Au, Ti, and Zr contacts to nitrogen and boron doped DLC films have been studied, and mechanisms of the observed current-voltage (I-V) characteristics are investigated. Linear I-V characteristics were observed for Au, Ti, and Zr contacts to both nitrogen and boron doped DLC films. A band structure model for metal-DLC contact is proposed to explain the observed ohmic contacts. Fermi level shifting at the surface of DLC films produces an ohmic resistive layer instead of a Schottky barrier for metal-DLC contacts. Al contacts to both nitrogen and boron doped DLC films show nonlinear I-V characteristics, which are attributed to a dielectric layer of carbide (Al₄C₃) instead of a Schottky barrier suggested by other groups. Inert elements such as Au and Pt, and transition metals such as Ti, Zr and W, which form conductive carbides, are considered good contacting metals for electrical studies of DLC films.     

金属/Hg1-xMnxTe接触的I-V特性研究

分别采用溅射和蒸发镀膜法在Hg1-xMnxTe试样表面形成了Au/Hg1-xMnxTe和Al/Hg1-xMnxTe接触,并用Aligent4155c I-V测试仪对其I-V特性进行了测量,随后对试样在10%NH4F:10%H2O2:H2O中进行了钝化处理,并对处理后的试样再次进行了I-V测量,对于测试结果用热电子发射-扩散理论进行了分析.结果表明:Au与Hg1-xMnxTe形成了良好的欧姆接触,而Al与Hg1-xMnxTe形成了具有整流特性的肖特基接触,其肖特基势垒的理论推算值为0.38eV.钝化处理后的试样,其表面漏电现象明显降低,Au/Hg1-xMnxTe接触的电流下降幅度在0.1V时最大,为76.1%;而Al/Hg1-xMnxTe接触在0.2V时最大,为93.2%.随着偏压的进一步增大,两种接触的电流减小的幅度都逐渐变小.     

Improved Al/Si ohmic contacts to p-type 4H-SiC

An AlSi-based ohmic contact with a new composition is reported in this paper. AlSi(2%)Ti(0.15%) contacts are formed by evaporation on p-type 4H-SiC grown by liquid phase epitaxy (LPE) and annealed in the temperature range from 700 to 950°C. The ohmic behaviour has been checked by I–V characteristics and the contact resistivity has been measured by the linear transmission-line-model (TLM) method. The dependence of the contact resistivity on the annealing conditions has been studied. An ohmic behaviour has been established at 700°C while the lowest contact resistivity value of 9.6×10⁻⁵ Ω cm² has been obtained after annealing at 950°C. The thermal stability of both Al/Si/SiC and AlSiTi/SiC contacts at a temperature of 600°C has been studied. It has been found that the AlSiTi/SiC contacts are stable for 100 h at this ageing temperature while the Al/Si/SiC contacts deteriorate after 24 h.     

Improved thermal stability of GaN blue laser diode by Ti/Pt/Au, W/Au and Cu bonding layers

The thermal stabilities of Ti/Pt/Au, W/Au and Cu bonding layers on GaN blue laser diode were investigated by measuring the series resistances with respect to annealing temperatures from 250 °C to 500 °C and possible degradation mechanisms were suggested by Transmission Electron Microscopy and Energy Dispersive Spectroscopy analyses. The laser diode with Ti/Pt/Au bonding layer degraded after annealing at 250 °C but the laser diode with Cu and W/Au bonding layer showed good thermal stability up to 400 °C and 450 °C, respectively. Cu and W/Au layers are believed to improve the integrities of the ohmic contact and bonding layers and this would enhance the thermal stability of bonding layers. Therefore robust GaN blue laser diodes that have wide operation windows and long-term reliability would be obtained.     

Electrical contacts on photoconductive Sb2S3 films

Evaporated metal contacts to layers of deposited Sb₂S₃ 1 μm thick have been investigated. It has been found that Ni, Au and Pt make blocking contacts while contacts of In, Ga, Al and Bi are ohmic. Cu, Ag and Pd contacts show poor stability and have a very low breakdown voltage; they are not considered to be suitable contact materials. If Al is used care must be taken to avoid the formation of a layer of Al₂O₃ between the Al and the Sb₂S₃ which will result in a blocking contact. Au makes a very reproducible and reliable contact capable of withstanding fields up to about 6 x 10⁵ V/ cm.The type of contact made by any of these metals depends on the work function of the metal. The low work function metals In and Ga make the best ohmic contacts. The high work function metals Pt and Au make good blocking contacts. The results can be explained in terms of the conventional theory of contacts if the Sb₂S₃ layer is assumed to be n-type with a low density of surface states. On this basis it is expected that the work function of Sb₂S₃ lies in the range 4.7–4.9 eV.     

AlGaN/GaN high electron mobility transistors with implanted ohmic contacts

Selective area silicon implantation for source/drain regions was integrated into the fabrication of molecular beam epitaxy-grown AlGaN/GaN HEMTs. Dopant activation was achieved by rapid thermal annealing at 1100 °C in flowing N₂ ambient for 120 s with an AlN encapsulation. Linear transmission line measurements showed that the resistance of the overlay Ti/Al/Ni/Au ohmic contacts was reduced by 61% compared to the control sample. After the Schottky Ni/Au gate formation, the typical DC characteristics displayed a higher current drive, smaller knee voltage and better gate control properties for HEMTs with implanted source and drain regions.