毛细作用驱动的MEMS流体自组装模拟仿真

介绍了毛细作用驱动的MEMS流体微器件自组装技术的研究和发展概况,并对组装中的自对准过程进行了模拟仿真。通过仿真模拟,证明即使在器件与衬底组装区域形状大小不同时,仍可能实现自对准。这说明自组装对组装器件和衬底粘合层的形状尺寸匹配精度的要求不苛刻。同一个衬底粘合层的版图将可能适用于具有不同尺寸粘合层的器件进行安装,反之拥有同样粘合层的器件则可能安装到不同的衬底中。这些结论有助于未来更合理地设计自组装系统。     

毛细作用驱动的MEMS流休自组装模拟仿真

介绍了毛细作用驱动的MEMS流体微器件自组装技术的研究和发展概况，并对组装中的自对准过程进行了模拟仿真。通过仿真模拟，证明即使在器件与衬底组装区域形状大小不同时，仍可能实现自对准。这说明自组装对组装器件和衬底粘合层的形状尺寸匹配精度的要求不苛刻。同一个衬底粘合层的版图将可能适用于具有不同尺寸粘合层的器件进行安装，反之拥有同样粘合层的器件则可能安装到不同的衬底中。这些结论有助于未来更合理地设计自组装系统。     

片状组装技术在混合微电子电路中的应用

1978年,日本在国际微电子学会(ISHM)上发表了《Hi-MIC新型混合微电子电路》的论文.揭示了片状元件及其组装技术的发展和前景.所谓“HiMIC”电路,实质上就是将传统分立元件的组装思想与厚薄膜混合集成电路相结合而形成的一门新的微电子电路组装工艺.其基本概念为:采用标准尺寸的微型化无引线片状元件,引用计算机控制技术生产外形,形     

自组装技术在MEMS中的应用

起源于生物化学领域的自组装技术正被广泛地应用到了化学、材料、生物、电子、机械等不同的学科中。在MEMS和NEMS中,自组装作为一种新型的“自下而上”的微(纳)结构制备和装配技术而得到积极的关注,并显示出良好的应用前景。在阐述自组装技术发展的基础上,介绍了该技术在MEMS中的典型应用,讨论一些待解决的关键问题,最后展望了自组装技术的发展趋势。     

电子电路的微组装技术

本文首先简要介绍国外电子电路微组装技术的发展概况、关键课题、几种主要微组装结构、微组装技术及其优缺点,然后比较详细地讨论微组装的一些关键技术,着重概述基板和互连技术的最新进展,最后扼要介绍和评述国内微组装技术的现状和问题,提出加速发展我国电子电路微组装技术的几点建议。     

微接触印刷法制备图形化自组装膜

复微接触印刷技术成功地制备了由不同末端官能团组成的图形化自组装膜。详细讨论了“印章”上图案的高度以及作为“印尼”的自组装分子的性质对制备图形化自组装膜的影响,结果表明,选择具有低蒸气压,在金表面非反应铺展的自斥性硫醇分子溶液作“印泥”有利于自组装人在接触区形成。“印章”上图案的凸起应有一定高度,否则“图形”难以形成。     

电子产品的微组装技术

随着微电子技术领域的新工艺、新技术的不断实用化,电子产品的组装技术从手工操作阶段迈入了微组装时代,电子产品实现了小型化、便携式、高可靠。国际半导体技术发展路线图对未来组装技术的走向也做了定位,指出组装和封装技术是影响集成电路（IC）工作频率、功耗、复杂度、可靠性和成本的重要因素。本文简要介绍微组装技术的发展过程,对微组装技术的发展现状、发展趋势及应用前景进行综述。     

微组装关键工艺设备技术平台研究

介绍了微组装设备技术发展现状,重点论述了微组装关键设备工程化技术、先进微组装工艺技术和微组装工艺设备标准规范等微组装设备技术平台研究。通过该技术平台的研究,提升了微组装关键设备的先进性、稳定性和工艺系统集成能力。     

自组装方法制作三维微纳米结构现状与展望

MOEMS在很多领域有着潜在的应用,然而制作三维MOEMS是一个很复杂的过程。利用晶格失配的外延层自组装制作三维微纳米结构是一种很有发展前景的方法。该方法主要应用由于应变层中晶格常数不同而带来的应变效应。利用这种技术可以完成在同一平台上自组装不同元件,在MOEMS中有广阔的应用前景。我们分析了该技术存在的问题并对今后发展前景进行了展望。     

导电岛微电极系统中纳米线介电组装行为研究

为了获得导电岛微电极系统中纳米线的介电组装特性,基于平面微电极对和导电岛微电极系统,进行了两种系统中纳米线操控的对比实验。分别建立了平面微电极对和导电岛微电极系统的纳米线介电组装模型,探究了两种模型下的纳米线从初始位置到最终桥接上微间隙过程中的运动轨迹;分析了导电岛微电极系统中纳米线所受的介电泳力、交流电热流以及两者合作用的电动力学行为。导电岛微电极系统对纳米线有着较强的介电俘获作用,导电岛的加入能够让纳米线更好地俘获到微间隙;同时纳米线的介电组装会受到频率的影响,当频率达到翻转频率,在微间隙上方产生的微流体漩涡能够把远场区域纳米线输送到组装区,使得纳米线受到正介电泳力的作用而被组装至微间隙。     

Influence of pad shape on self-alignment in electronic packaging

Anisotropic self-alignment of the noncircular pads is investigated to reduce the misalignment in electronic packaging, and the effects of the direction and length ratio of the noncircular pads are analyzed. The restoring forces of circular and noncircular pads are calculated numerically using the surface evolver and are compared with the experimental data. The restoring force in the minor-axis direction of the noncircular pad becomes largest followed by the circular pad and the major-axis direction of the noncircular pad. Directionality increases with the length ratio, which implies that more accurate alignment can be achieved in the specific direction.     

Adhesive joint design for minimizing fiber alignment shift during UV curing

In fiber-optic device packaging using UV curable adhesive bonding, the curing process often causes fiber alignment shift-distortion of the already aligned fiber-optic setups, and thus reduce the assembly yield. A new method for the adhesive joint design for minimizing fiber alignment shift during adhesive curing is reported in this paper. It is demonstrated that for any adhesive, the bonding joint can be designed to alleviate the alignment shift, regardless of adhesives used. The approach provides guideline for high yield and low-cost assembly of fiber-optic devices using adhesive bonding.     

Integrated microendeffector for micromanipulation

Micromanipulation is needed for assembly and maintenance of micromachines and their parts. If the handled objects are miniaturized, interactive forces, such as the van der Waals force, surface tension force, and electrostatic force between microobjects and gripper surface become dominant in the air, and they act as adhesive forces. We cannot neglect such adhesive forces in micromanipulation. Considering the physical phenomena in the microworld, we propose reduction methods for adhesive forces. Surface roughness of the endeffector surface is effective to reduce the van der Waals force. We propose making the micropyramids on the endeffector surface by micromachining techniques. We designed and made a prototype of the microgripper with a microendeffector, the gripping surface of which is formed to have several micropyramids. Experimental results show effectiveness of the micropyramids for reduction of the adhesive force. We also made a semiconductor strain gauge at the end of the microendeffector for grasping force measurement. Both micropyramids and integrated piezoresistive force sensor are fabricated on the microendeffector by the micromachining techniques. Performance of this force sensor is shown     

A novel fiber alignment shift measurement and correction technique in laser-welded laser module packaging

A novel measurement and correction technique employing an ultra-high-precision laser displacement meter (LDM) with a 20-nm resolution to probe the postweld-shift (PWS)-induced fiber alignment shifts in laser-welded laser module packaging is presented. The results show that the direction and magnitude of the fiber alignment shifts induced by the PWS in laser-welded laser module packaging can be quantitatively determined by four parameters: the lateral position (r), the position angle (/spl alpha/), the swing angle (/spl theta/), and the tilt angle (/spl psi/). Further studies show that the deformation of the lateral shift and the position angle are the dominant mechanisms that determine the fiber alignment shifts induced by the PWS. This clearly indicates that the PWS can be quantitatively corrected timely by applying a single weld spot on the negative lateral shift and the position angle to compensate for the fiber alignment shifts. In comparison with previous studies of the PWS correction by a qualitatively estimated technique, this LDM technique has significantly provided an important tool for quantitative measurement and correction to the effect of the PWS on the fiber alignment shifts in laser-welded laser module packaging. Therefore, the reliable laser modules with high yield and high performance used in low-cost lightwave transmission systems may be developed and fabricated.     

The evolution of packages for monolithic microwave andmillimeter-wave circuits

The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As-a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas     

Automatic Microassembly Using Visual Servo Control

We propose an automatic microassembly method that can be used to construct three-dimensional microelectromechanical system (MEMS) structures. A six degree-of-freedom micromanipulator, equipped with a passive microgripper, is employed to grasp, manipulate, and join the micropart using visual feedback from an optical microscope. The proposed process utilizes a two-stage alignment strategy to perform the micro-grasping and micro-joining tasks. Using a vision-based localization method, the Cartesian coordinates of the manipulated micropart in three-dimensional space are determined. Further, a vision-based contact sensor determines the contact state between two micro-components in three dimensions to facilitating the micro-joining tasks. Visual servo control is used for accurate position feedback in three Cartesian coordinates during microassembly tasks. The necessary steps towards construction of complex three-dimensional MEMS devices, i.e., grasping a micropart, manipulating it, joining it to another micropart, and finally releasing it from the microgripper, have been successfully carried out using a six degree-of-freedom micromanipulator. Experiments demonstrate both the efficiency and validity of the proposed automatic assembly approach.     

Self‐Alignment of Patterned Wafers Using Capillary Forces at a Water–Air Interface

Capillary interactions at a water–air interface were used to align a two‐inch glass wafer to a three‐inch silicon wafer. Flat, smooth silica surfaces were patterned with gold millimeter‐scale borders enclosing micrometer‐scale features. The gold features were rendered hydrophobic through the use of self‐assembled monolayers, the silica was wetted with water, and the wafers were pressed together. The assembly snapped into alignment based upon the minimization of the curvature of the meniscus formed at the water–air interface. The accuracy of this alignment was better than one micrometer. Gravitational energy was used to systematically study the alignment force as a function of pattern parameters. These data can be modeled by interfacial energy theory. These experiments identify a clear set of conditions necessary for the use of this technique for high‐precision alignment.     

划片机视觉识别系统设计原理分析

自动对准技术是集成电路后封装设备中的一项重要单元技术,是全自动划片机与普通划片机的最大区别之一。国际上主要划片机制造商的全自动设备都配有实时高效的图像识别对准单元。作为提高其设备性能的一种有力手段,长期以来在划片机的研制过程中我们已逐渐形成了适合划片机应用的视觉识别技术,取得了显著的阶段性成果。     

FOW在叠层CSP封装中的应用

随着电子封装微型化、多功能化的发展,三维封装已成为封装技术的主要发展方向,叠层CSP封装具有封装密度高、互连性能好等特性,是实现三维封装的重要技术。针对超薄芯片传统叠层CSP封装过程中容易产生圆片翘曲、金线键合过程中容易出现0BOP不良、以及线孤（wireloop）的CPK值达不到工艺要求等问题,文中简要介绍了芯片减薄方法对圆片翘曲的影响,利用有限元（FEA）的方法进行芯片减薄后对悬空功能芯片金线键合（Wirebond）的影响进行分析,Filmon Wire（FOW）的贴片（DieAttach）方法在解决悬空功能芯片金线键合中的应用,以及FOW贴片方式对叠层CSP封装流程的简化。采用FOW贴片技术可以达到30％的成本节约,具有很好的经济效益。