Preparation,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and ¹H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Kinetic analysis of curing behavior of diglycidyl ether of bisphenol A with imidazoles using differential scanning calorimetry techniques

The curing kinetics and mechanisms of diglycidyl ether of bisphenol A (DGEBA) using imidazole (H‐NI) and 1‐methyl imidazole (1‐MI) as curing agents are studied with differential scanning calorimetry (DSC) under isothermal (90–120°C) and dynamic conditions (50–250°C). The isothermal DSC thermograms of curing DGEBA with H‐NI and 1‐MI curing agents show two exothermic peaks. These peaks are assigned to the processes of adduct formation and etherification. These results indicate that there is no difference in the initiation mechanism of 1‐unsubstituted (H‐NI) and 1‐substituted (1‐MI) imidazoles in the curing reaction with epoxy resin. A kinetic analysis is performed using different kinetic models. The activation energies obtained from DSC scanning runs using the Ozawa and Kissinger methods are similar and in the range of 75–79 and 76–82 kJ/mol for DGEBA/H‐NI and DGEBA/1‐MI systems, respectively. These values compare well with the activation energies obtained from isothermal DSC experiments using the autocatalytic method (74–77 kJ/mol). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2634–2641, 2006     

Using PA11 and 12 as curing agents for epoxy networks: Influence of reactivity on miscibility and properties

The Rilsan PA11 prepolymer was evaluated as a curing agent of a diepoxy prepolymer (DGEBA). The miscibility, the glass transition temperature, and the melting of the blend were studied as a function of time at 200°C. A gelation phenomenon was evidenced by dynamic mechanical analysis and the gel time was determined at 200°C. The participation of amide groups to the reaction process at this temperature was confirmed by the study of the PA12 Orgasol®/DGEBA system and a reaction mechanism was elucidated by the study of a model system composed of ethylacetamide/phenyl glycidyl ether. The mechanical properties of DGEBA/Rilsan networks cured 7 h at 200°C were evaluated and indicate very high Young's modulus and critical stress intensity factor. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 857–865, 2000     

Improving the curing process and thermal stability of phthalonitrile resin via novel mixed curing agents

High curing temperature (including post‐curing temperature) and long curing time of phthalonitrile resins make them thermally stable but difficult to process. In this paper, novel mixed curing agents (CuCl/4,4′‐diaminodiphenylsulfone (DDS) and ZnCl₂/DDS) were firstly designed for solving these problems. Bisphenol‐based phthalonitrile monomer (BP‐Ph; melting point: 228–235 °C) was synthesized and used as the curing precursor. Differential scanning calorimetry results indicated that BP‐Ph cured with CuCl/DDS and ZnCl₂/DDS exhibited curing temperatures close to the melting point of BP‐Ph with curing ending temperatures of 225.4 and 287.1 °C, respectively. Rheologic investigations demonstrated obvious curing reactions of BP‐Ph occurred with the mixed curing agents at 220 °C. Thermogravimetric analysis showed that BP‐Ph cured by CuCl/DDS or ZnCl₂/DDS maintained 95% mass at 573 or 546 °C, respectively, at a post‐curing temperature of 350 °C for 2 h. Reasonable long‐term thermo‐oxidative stability was also demonstrated. When the post‐curing temperature decreased to 290 °C, char yield at 800 °C of BP‐Ph cured by CuCl/DDS was 77.0%, suggesting the curing procedure can be milder when using mixed curing agents. © 2017 Society of Chemical Industry     

Effect of curing order on the curing kinetics and morphology of bisGMA/DGEBA interpenetrating polymer networks

The curing kinetics and morphology of an interpenetrating polymer network (IPN) formed from an epoxy resin (DGEBA) cured by an imidazole (1‐MeI) and a dimethacrylate resin (bisGMA), cured by low‐ and high‐temperature peroxide initiators (TBPEH and DHPB, respectively) have been studied by temperature‐ramping DSC, isothermal near‐infrared (NIR), DMTA and small‐angle neutron scattering (SANS). bisGMA and DGEBA are polar and chemically similar thermosetting resins which should enhance the miscibility of their IPNs. The phase structure was controlled by varying the curing procedure: the order of gelation of the components is dependent on the choice of low‐ and high‐temperature initiators for bisGMA and this affects the morphology formation. In the cure of the bisGMA/TBPEH:DGEBA/1‐MeI system, the dimethacrylate cures first. For isothermal cure studies at 80 °C, the final conversion of the epoxy is reduced by high crosslinking of the methacrylate groups in the IPN causing vitrification before full cure. The dimethacrylate conversion is enhanced due to plasticisation with unreacted DGEBA, and its cure rate is increased due to accelerated decomposition of TBPEH initiator by 1‐MeI. SANS revealed that phase separation occurs in these IPNs with domains on the scale of 6–7 nm. In the cure of the bisGMA/DHBP:DGEBA/1‐MeI system, the epoxy cures at a similar rate to that of the methacrylate groups. For isothermal cure studies at 80 °C, similar final conversions of the epoxy have been observed except for the 75:25 IPN. The cure rate of the methacrylate groups in the IPN is increased also due to accelerated decomposition of DHBP initiator by 1‐MeI, and the extent of accelerated decomposition for DHBP is stronger than that in the TBPEH‐based systems. SANS studies revealed that this system is more homogeneous due to the rapid formation of the dimethacrylate gel in the presence of the preformed epoxy network which interlocks the networks at low degrees of methacrylate conversion. Copyright © 2006 Society of Chemical Industry     

Microencapsulation of imidazole curing agents by spray‐drying method

An epoxy resin–imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, imidazoles were microencapsulated for the latent curing system. Polycaprolactone (PCL) was used as the wall material, and the spray‐drying method was used to form the microcapsule. The imidazoles used in this study were imidazole, 2‐methylimidazole, and 2‐phenylimidazole. The effect of the ratio of PCL to imidazoles, and the effect of PCL molecular weight were investigated during the microcapsule formation. The amount of imidazoles in the microcapsule was measured using thermogravimetric analyzer and elemental analysis. The permeability of the microcapsules was measured in ethanol, and the shelf life of the microcapsules was studied for the epoxy resin. The curing behavior of these microcapsules to epoxy resin was examined using differential scanning calorimeter. In the curing reaction, the microcapsule of imidazoles exhibited delayed kinetic behaviors compared to pure imidazoles. And the curing times were estimated at 150 and 180°C using an indentation method. These microcapsules of imidazoles exhibited a long shelf life, and the curing did not occur in some of the microcapsule–epoxy resin systems at 20°C for 15 days. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Studies on the curing and thermal behaviour of DGEBA in the presence of bis(4‐carboxyphenyl) dimethyl silane

The curing behaviour of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry using bis(4‐carboxyphenyl) dimethyl silane (CPA) as a crosslinking agent and imidazole as a catalyst. Two exotherms were observed in the absence of catalyst in the temperature range 166–328 °C. A significant decrease in the curing temperature was observed when 0.1% imidazole was used as catalyst. Further increase in the concentration of imidazole resulted in a decrease in the peak exotherm temperature. The effect of stoichiometry of functional groups on the curing behaviour of DGEBA was investigated by taking varying mole ratios of CPA, ranging from 1 to 2.5, keeping the concentration of imidazole as 0.1% w/w. The heat of polymerization (ΔH) was found to be maximum at a molar ratio of 1:1.75 (DGEBA:CPA). Mixtures of diaminodiphenyl sulfone (DDS and CPA or phthalic anhydride (PA) and CPA in ratios of 1:0, 0.25:0.75, 0.5:0.5, 0.75:0.25) were also used to investigate the curing behaviour of DGEBA. A significant decrease in curing temperature of DGEBA/DDS was observed on partially replacing DDS with CPA, whereas marginal change in the curing temperatures was observed on replacing phthalic anhydride with CPA. The thermal stability of epoxy resin, cured isothermally, was evaluated by recording thermogravimetry/dynamic thermogravimetry traces in nitrogen atmosphere. The percentage char yield was highest for the sample cured using 1.75 mole of CPA. Copyright © 2003 Society of Chemical Industry     

Studies on the curing kinetics and thermal stability of diglycidyl ether of bisphenol‐A using mixture of novel,environment friendly sulphur containing amino acids and 4,4′‐diaminodiphenylsulfone

This article describes the curing behavior of diglycidyl ether of bisphenol‐A using Cysteine (A)/ Methionine (B)/Cystine (C)/ mixture of 4,4′‐diaminodiphenyl sulfone (DDS) and Cysteine/DDS and Methionine/DDS and Cystine in various molar ratios as curing agent. Differential scanning calorimetry was used to study the cure kinetics by recording the DSC scans at heating rates of 5, 10, 15, and 20°C/min. The peak exotherm temperature was found to be dependent on the heating rate, structure of the amino acids and on the DDS/amino acids molar ratio. A broad exotherm was observed in the temperature range of 150–245°C (EA), 155–240°C (EB), and 190–250°C (EC). Curing of DGEBA with mixture of amino acids and 4, 4′‐diaminodiphenyl sulfone (DDS) resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction is determined in accordance to Ozawa's method and was found to be dependent on the structure of the amino acids and on the ratio of 4,4′‐diaminodiphenyl sulfone (DDS) to amino acid. Thermal stability of the isothermally cured resins was evaluated using dynamic thermogravimetry in nitrogen atmosphere. No significant change has been observed in the char yield of all the samples, but it was highest in the system cured using either Cystine alone (EC‐1) or a mixture of DDS/Cystine (EC‐2, EC‐3, and EC‐4). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Preparation of 2‐ethyl‐4‐methylimidazole derivatives as latent curing agents and their application in curing epoxy resin

Three kinds of 2‐ethyl‐4‐methylimidazole (EMI) derivatives (N‐acetyl EMI, N‐benzoyl EMI, and N‐benzenesulfonyl EMI) were synthesized through the reaction of EMI with acetyl chloride, benzoyl chloride, and benzenesulfonyl chloride, respectively. And the structure was confirmed by Fourier transform infrared spectroscopy (FTIR) and ¹H‐nuclear magnetic resonance spectroscopy (¹H NMR) spectra. Furthermore, the synthesized EMI derivatives were applied in diglycidyl ether of bisphenol A epoxy resin (DGEBA) as latent curing agent. Differential scanning calorimeter (DSC) was used to analyze the curing behavior of DGEBA/EMI derivative systems, indicating DGEBA could be efficiently cured by the EMI derivatives at 110～160°C, and the corresponding curing activation energy ranged from 71 to 86 kJ/mol. Viscosity data proves that the storage life of DGEBA with N‐acetyl EMI (NAEMI), N‐benzoyl EMI (NBEMI), and N‐benzenesulfonyl EMI (NBSEMI) at room temperature was 38 d, 50 d, and 80 d, and that at 10°C was 90 d, 115 d, and 170 d, respectively. Besides, thermogravimetry (TG), izod impact strength (IIS), and tensile shear strength (TSS) were tested to characterize the thermal stability and mechanical properties of DGEBA cured by EMI derivatives. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42563.     

Studies on epoxy/calcium carbonate nanocomposites

The article describes the preparation of epoxy‐calcium carbonate nanocomposites using diaminodiphenyl sulfone (DDS) as a curing agent. The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) (1 mol) in the presence of varying amounts of nanocalcium carbonate was investigated by differential scanning calorimetry (DSC) using stoichiometric amounts of diaminodiphenyl sulphone (0.5 mol) as curing agent. The amount of calcium carbonate (～ 44 nm) was varied from 2% to 10% (w/w). In the DSC scans of these samples, a broad exothermic transition due to curing was observed in the temperature range of 110–335°C. As expected, heat of curing decreased with increasing amount of nanocalcium carbonate; however it did not affect the curing characteristics, thereby indicating that the filler did not hinder the curing reaction. Thermal stability of DGEBA in the presence of varying amounts of nano‐CaCO₃ after isothermal curing [(i.e., by heating in an air oven at 80°C (1 h), 100°C (1 h), 120°C (1.5 h), and 180°C (4 h)] was evaluated by thermogravimetry. All the samples were stable upto 350°C, and char yield at 800°C increased with increasing amount of nanocalcium carbonate. Rectangular bars were prepared by mixing DGEBA, DDS, and varying amounts of CaCO₃ using silicone mold. The nanocomposites were characterized by X‐ray, scanning electron microscopy (morphological characterization), and dynamic mechanical analysis. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Study of the isothermal curing of an epoxy prepreg by near‐infrared spectroscopy

The commercial epoxy prepreg SPX 8800, containing diglycidyl ether of bisphenol A, dicyanodiamide, diuron, and reinforcing glass fibers, was isothermally cured at different temperatures from 75 to 110°C and monitored via in situ near‐infrared Fourier transform spectroscopy. Two cure conditions were investigated: curing the epoxy prepreg directly (condition 1) and curing the epoxy prepreg between two glass plates (condition 2). Under both curing conditions, the epoxy group could not reach 100% conversion with curing at low temperatures (75–80°C) for 24 h. A comparison of the changes in the epoxy, primary amine, and hydroxyl groups during the curing showed that the samples cured under condition 2 had lower initial epoxy conversion rates than those cured under condition 1 and that more primary amine–epoxy addition occurred under condition 2. In addition, the activation energy under cure condition 2 (104–97 kJ/mol) was higher than that under condition 1 (93–86 kJ/mol), but a lower glass‐transition temperature of the cured samples was observed via differential scanning calorimetry. The moisture in the prepreg was assumed to account for the different reaction kinetics observed and to have led to different reaction mechanisms. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 87: 2295–2305, 2003     

Study on curing kinetics and curing mechanism of epoxy resin based on diglycidyl ether of bisphenol a and melamine phosphate

The curing kinetics of the diglycidyl ether of bisphenol A/melamine phosphate (DGEBA/MP) was analyzed by the DSC technique. The Kissinger and Flynn–Wall–Ozawa methods were applied to determine the dynamic kinetics of the DGEBA/MP system. The activation energies obtained by these two methods were 83.9 and 85.6 kJ/mol, respectively. An autocatalytic equation was applied to determine the isothermal curing kinetics of the DGEBA/MP system. The DGEBA/MP system exhibits autocatalytic behavior in the isothermal curing procedure, whose kinetics fits well with the autocatalytic mechanism. The obtained isothermal curing activation energy of the DGEBA/MP system was 110.0 kJ/mol. The curing mechanism of DGEBA with melamine phosphate was investigated using FTIR, ¹³C solid‐state NMR, and ³¹P solid‐state NMR. It involved an epoxide–amine reaction, etherification of phosphoric acid and epoxy, dehydration, and thermal oxidation of the hydroxyl group of the DGEBA/MP system. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 892–900, 2004     

Effect of structure of aromatic diamines on curing characteristics,thermal stability,and mechanical properties of epoxy resins. I

The curing behavior of diglycidyl ether of bisphenol-A (DGEBA) with aromatic diamines having aryl–ether, aryl–ether–carbonyl, and aryl–ether–sulfone linkages was studied using differential scanning calorimetry (DSC). Aromatic diaminessuch as 1,3-bis(aminophenoxy)benzene (R), 1,4-bis(aminophenoxy)benzene (H),2,2′-bis[4-(4-aminophenoxy)phenyl]propane (B), 4,4′-bis(4-aminophenoxy)benzo-phenone (P), and bis[4-(4-aminophenoxy)phenyl]sulfone (S) were synthesized and characterized in the laboratory. Curing of DGEBA was done using both stoichiometric and nonstoichiometric amounts of diamines and the reaction was monitored using DSC. The reactivity of the diamines depended on the structure. The presence of electron withdrawing groups, even though significantly apart from the reaction site, reduced the nucleophilicity. No significant change was observed in the activation energy for curing, which was around 56 ± 2 kJ/mol. The glass transition temperature of the epoxy network depended on the structure and was higher when diamines P and S were used in comparison to diamines R, H, and B. The cured resins were stable up to 300°C, and maximum char yield (i.e., 32% at 600°C) was obtained in DGEBA cured with diamine P. The room temperature mechanical properties only changed marginally with the structure of the diamines. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1759–1766, 1998     

Effects of amino‐functionalized carbon nanotubes on the properties of amine‐terminated butadiene–acrylonitrile rubber‐toughened epoxy resins

Amino‐functionalized multiwalled carbon nanotubes (MWCNT‐NH₂s) as nanofillers were incorporated into diglycidyl ether of bisphenol A (DGEBA) toughened with amine‐terminated butadiene–acrylonitrile (ATBN). The curing kinetics, glass‐transition temperature (T_g), thermal stability, mechanical properties, and morphology of DGEBA/ATBN/MWCNT‐NH₂ nanocomposites were investigated by differential scanning calorimetry (DSC), thermogravimetric analysis, a universal test machine, and scanning electron microscopy. DSC dynamic kinetic studies showed that the addition of MWCNT‐NH₂s accelerated the curing reaction of the ATBN‐toughened epoxy resin. DSC results revealed that the T_g of the rubber‐toughened epoxy nanocomposites decreased nearly 10°C with 2 wt % MWCNT‐NH₂s. The thermogravimetric results show that the addition of MWCNT‐NH₂s enhanced the thermal stability of the ATBN‐toughened epoxy resin. The tensile strength, flexural strength, and flexural modulus of the DGEBA/ATBN/MWCNT‐NH₂ nanocomposites increased increasing MWCNT‐NH₂ contents, whereas the addition of the MWCNT‐NH₂s slightly decreased the elongation at break of the rubber‐toughened epoxy. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40472.     

Preparation and properties of soybean oil–based curing agents for epoxy resin

In order to improve the flexibility properties of conventional epoxy resin, two novel soybean oil–based curing agents were synthesized. The curing agent obtained from the reaction between epoxy soybean oil and ethylene diamine was named EEDA, and another curing agent derived from epoxy soybean oil and isophorone diamine was named EIPDA. Several techniques were used to systematically investigate the effects of the structure and content of the two curing agents on the properties of the cured products. The Fourier transform infrared analysis demonstrated that epoxy resin reacted with soybean oil–based curing agents. The differential scanning calorimetry analysis showed that the curing process between diglycidyl ether of bisphenol‐A (DGEBA) and soybean oil–based curing agents only had an exothermic peak. Thermogravimetric analysis indicated that the cured DGEBA/EIPDA system was more stable than the DGEBA/EEDA system below 300 °C. Mechanical tests and Shore D hardness tests suggested that excessive EEDA greatly enhanced the toughness of cured products because of the introduction of aliphatic chains.© 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44754.     

Latent curing agent DDM-PMMA microcapsule for epoxy resin

A microcapsule-type latent curing agent is prepared by solvent evaporation method with diaminodiphenylmethane (DDM) as the core material and PMMA as the wall material. The chemical structure, surface morphology, core content, and curing characteristics of as-prepared microcapsule-type curing agent are characterized by FTIR, SEM, TGA, and DSC. The results show that the obtained microcapsules have smooth surface and the core content is about 20 wt %. The one-component adhesive consisting of DDM-PMMA microcapsule and epoxy resin can be cured within 30 min at 130 °C, and the room temperature latent period is more than 30 days. In addition, the internal reasons influencing the core content of microcapsules are analyzed by comparing and analyzing the structural compatibility of three kinds of wall material PMMA, PS, and polyetherimide with DDM. The results show that the core content is affected by the compatibility of wall material and core material. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47757.     

Influence of rubber on the curing kinetics of DGEBA epoxy and the effect on the morphology and hardness of the composites

The influence of the end groups of two liquid rubbers on curing kinetics, morphology, and hardness behavior of diglycidyl ether of bisphenol-A based epoxy resin (DGEBA) has been studied. The rubbers are silyl-dihydroxy terminated (PDMS-co-DPS-OH) and silyl-diglycidyl ether terminated (PDMS-DGE). Crosslinking reactions, investigated by shear rheometry, ranged 90–110 °C, using a constant concentration (5 phr) of liquid rubbers and 1,2-Diamino cyclohexane (1,2-DCH) as hardener agent. The gel time, t _gel, of the neat epoxy significantly decreased when adding the elastomers, more so for the silyl-dihydroxy terminated elastomer; at 110 °C the reaction was nearly complete before rheological test started. The results suggest that the elastomers induced a catalytic effect on the curing reaction. Scanning electron microscopy revealed phase separation of the elastomer during the curing reaction with rubber domains about 5 μm size. However, the DGEBA/dihydroxy terminated elastomer composite cured at 110 °C exhibited a homogenous morphology, that is, the rapid reaction time would not allow for phase separation. Water contact angle tests evidenced either more hydrophilic (silyl-diglycidyl ether terminated rubber) or more hydrophobic (silyl-dihydroxy terminated rubber) behavior than the neat epoxy. The latter effect is attributed to the presence of aromatic rings in the backbone structure of PDMS-co-DPS-OH. Microindentation measurements show that the elastomers significantly reduced the hardness of the epoxy resin, the DGEBA/ether terminated composite exhibiting the lowest hardness values. Moreover, hardness increased as reaction temperature did, correlating with a reduction of microdomains size thus enabling the tuning of mechanical properties with reaction temperature.     

Effects of poly(methyl methacrylate)‐based low‐profile additives on the properties of cured unsaturated polyester resins. I. Miscibility,curing behavior,and glass‐transition temperatures

The effects of three series of self‐synthesized poly(methyl methacrylate) (PMMA)‐based low‐profile additives (LPAs), including PMMA, poly(methyl methacrylate‐co‐butyl acrylate), and poly(methyl methacrylate‐co‐butyl acrylate‐co‐maleic anhydride), with different chemical structures and MWs on the miscibility, cured‐sample morphology, curing kinetics, and glass‐transition temperatures for styrene (ST)/unsaturated polyester (UP) resin/LPA ternary systems were investigated by group contribution methods, scanning electron microscopy, differential scanning calorimetry (DSC), and dynamic mechanical analysis, respectively. Before curing at room temperature, the degree of phase separation for the ST/UP/LPA systems was generally explainable by the calculated polarity difference per unit volume between the UP resin and LPA. During curing at 110°C, the compatibility of the ST/UP/LPA systems, as revealed by cured‐sample morphology, was judged from the relative magnitude of the DSC peak reaction rate and the broadness of the peak. On the basis of Takayanagi's mechanical models, the effects of LPA on the final cure conversion and the glass‐transition temperature in the major continuous phase of ST‐crosslinked polyester for the ST/UP/LPA systems was also examined. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3369–3387, 2004     

Effects of composition of hardener on the curing and aging for an epoxy resin system

Different mixture ratios of Shell Epon 828 (based on diglycidyl ether of bisphenol A, DGEBA) and Shell EPI‐CURE 3046 (based on triethylenetetramine, TETA) were evaluated under different environments of isothermal curing at 80°C in DSC, room temperature curing in air, and aging in water at 45°C. The curing reactions were monitored using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and infrared spectroscopy (IR). It was shown that the initial curing rate increased with the amount of hardener. However, the epoxy groups in samples with excess hardener were prone to reaction with primary amines located at the ends of TETA molecules, resulting in a less dense epoxy network. During aging in water at 45°C, significant effects of water on the postcure and the increased water absorption with an increase of hardener amount were observed. The DMA results show that the samples with hardener around stoichiometric composition have the greatest storage modulus while curing in air environment. However, the samples with hardener much less than stoichiometric composition have greater storage modulus under aging in water at 45°C. in water at 45°C. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 580–588, 2006