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为了探讨激光重熔对等离子喷涂常规和纳米热障涂层(TBCs)的影响,采用等离子喷涂工艺在γ-TiAl合金表面制备了常规和纳米ZrO2-7%Y2O3TBCs,并对其进行激光重熔处理,研究了等离子喷涂常规TBCs、激光重熔-等离子喷涂常规TBCs、等离子喷涂纳米TBCs及激光重熔-等离子喷涂纳米TBCs 4种涂层在850℃下的抗热震性能。结果表明:4种TBCs热震失效次数依次为73,118,146,163次,相应的热震破坏形式分别为整体剥落、局部剥落、边角剥落和局部剥落;纳米结构有利于提高涂层的抗热震性能;激光重熔在一定程度上改善了等离子喷涂层的抗热震性能。 相似文献
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研究了等离子喷涂ZrO2-NiCoCrA1Y不同结构热障涂层的硬度分布800℃和1000℃温度下的热震性能。并进一步研究了去应力退火对涂层热震性能的影响。结果表明,与非梯度涂层相比,梯度涂层具有较平缓的硬度分布,不存在金属与陶瓷层界面间的硬度突变。热循环温度增加,使抗热震性能降低,但梯度涂层在两种温度下均具有较高的抗热震性。去应力退火处理较显著地提高了涂层的抗震性。 相似文献
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为提高7YSZ纳米热障涂层的热震性能, 实验中采用超音速火焰喷涂(HVOF)在涡轮叶片模拟工件上制备了粘结层NiCrCrAlYTa, 再使用大气等离子喷涂(APS)在粘结层上制备了7YSZ纳米陶瓷层。采用磁控溅射在7YSZ热障涂层样品表面镀铝, 并在不同压力下(200、250、300 Pa)对镀铝样品进行热处理表面改性。对喷涂态样品和镀铝改性后样品进行水淬热震实验, 1050℃保温10 min+水冷5 min为一个热循环, 观察热障涂层镀铝改性前后样品在水淬热循环过程中形貌和结构演变。实验结果表明, 镀铝改性后样品表面存在铝薄膜蒸发、凝固后形成的疏松纳米Al晶粒表层以及由Al和ZrO2原位反应形成的致密α-Al2O3底层。在镀铝样品热处理过程中, 随着压力升高, 疏松层致密度逐渐增加。不同热处理压力下镀铝表面改性后样品经过73次水淬热循环后剥落面积均小于喷涂态样品, 显示出良好的抗热震性。 相似文献
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采用等离子喷涂技术在GH4169镍基高温合金表面制备CoCrAlY粘结层,利用电子束蒸发镀膜在CoCrAlY表面蒸镀纳米铝膜并使用强流脉冲电子束熔敷纳米铝膜进行表面改性,使用APS技术在CoCrAlY表面沉积陶瓷层制备改性热障涂层。对粘结层蒸镀铝膜表面改性涂层和普通涂层分别进行热震实验、结合强度测试和残余应力分析。实验发现,在1 050 ℃高温加热后10 ℃水淬的冷热循环条件下,改性涂层的抗热震性能优于普通涂层;热震过程中改性涂层和普通涂层热生长氧化物内产生的残余应力均为压应力,且随热震次数的增加而增大,改性涂层热生长氧化物内残余压应力增长速度小于普通涂层。拉伸结果显示,普通涂层的断裂属于混合断裂,而改性涂层断裂基本发生在陶瓷层和薄膜胶界面,未发现层间断裂。改性涂层结合强度优于普通涂层。实验结果表明,采用电子束蒸发镀膜和强流脉冲电子束技术相结合对粘结层进行熔敷铝膜的表面改性处理,可以显著提高热障涂层冷热循环服役寿命。 相似文献
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氧化锆纳米等离子涂层的结构与热震性能研究 总被引:16,自引:0,他引:16
利用大气等离子喷涂技术, 制备了氧化锆纳米结构和常规结构涂层, 并对涂层的显微结构进行了探查. 结果表明: 纳米结构涂层是由直径为100nm左右的柱状晶粒组成的层状结构; 涂层中存在大量的微裂纹和分布均匀的细小圆气孔. 纳米结构的涂层具有比常规涂层更好的抗热震性能, 其热震行为与常规涂层不同. 相似文献
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等离子喷涂纳米ZrO2-8%Y2O3涂层的结构及性能 总被引:2,自引:0,他引:2
热障涂层能提高工件的性能,延长其使用寿命,但目前对其厚度0.5 mm以上的研究报道不多.为此,以纳米ZrO2-8%(质量分数)Y2O3粉末(YSZ)为原料,用等离子体喷涂法制备了3种厚度(0.6,0.8,1.2 mm)的热障涂层,并对涂层的结构和性能进行了研究.结果表明:纳米涂层主要由未熔粉末及周围的柱状晶、等轴晶组成,可观察到大量纳米晶,喷涂电流对组织结构的影响远大于喷涂距离;热障涂层结合强度随涂层厚度的增加而降低;涂层隔热性能随涂层厚度的增加而提高,温度越高优势越明显. 相似文献
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降低热障涂层面层中的低熔点杂质含量,可提高涂层的高温稳定性和延长服役寿命。SiO2、Al2O3和Fe2O3是氧化钇稳定氧化锆(Yttria-Stabilized Zirconia, YSZ)热障涂层中几种常见的低熔点氧化物杂质,均会对涂层的性能产生一定的影响。本研究采用大气等离子喷涂法,制备SiO2、Al2O3和Fe2O3的含量从小于0.01wt%增加至1.00wt%的YSZ热障涂层。采用扫描电镜(SEM)和透射电镜(TEM)研究了上述涂层的微观结构;采用激光热导仪测试了涂层的热扩散系数和抗热震次数。研究结果表明,低熔点氧化物杂质对YSZ涂层的导热性、热处理状态的孔隙率具有明显影响,且更容易引起涂层的热震失效。当杂质氧化物含量在小于0.2wt%范围内变化时,涂层的性能变化更为显著。 相似文献
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本文根据热空间模型、人体热生理模型和人体热心理模型的分类标准,对非对称热环境下人体热舒适度研究进行全面综述。热空间模型通过空调、环境参数直接预测人体客观、主观反应,人体热生理模型通过研究人体内部主动、被动生理调节预测人体生理参数,人体热心理模型侧重研究生理参数和主观反应的联系或人体如何适应热环境,最后概述了各模型的优点及局限。结果表明:热空间模型与选用的空间结构具有重大联系,一旦空间结构改变,模型建立的很多关系便无法成立,在车辆的应用领域价值更大;大多数热生理及热心理模型不够全面或仅限于特定环境,只有少数能够通过详细的体温调节解决人类对非均匀和瞬态条件的反应; Berkeley热舒适模型同时涵盖了热生理及热心理模型,但其耦合模拟过程过于复杂,而等效温度模型虽然精度相对较低,但由于其运算简便受到更广泛的应用;自适应模型充分考虑了人的主观能动性,但仍处于初级研究阶段。 相似文献
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人体热适应性与热舒适 总被引:7,自引:0,他引:7
本文参阅国内外研究成果,讨论了人体热适应性与热舒适的关系,介绍了实验室研究中的适应性和实测调查研究的适应性,对影响人体热舒适的行为调节适应、心理调节适应以及生理调节适应进行了分析,认为热适应性研究对人体的热舒适具有重要意义. 相似文献
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The temperature dependence of the thermal expansion characteristics of the AS21 magnesium alloy, AS21–25 vol% Saffil fiber composite and the Mg-10 vol% Saffil fiber composite has been measured in the temperature range from 20 to 380°C. The expansion characteristics were influenced by the residual and thermal strains. The residual strain was removed within the first thermal cycle. The relative elongation of the tensile pre-deformed AS21–25 vol% Saffil fiber composite is lower than that for the sample without deformation and for the composite pre-deformed in compression. The anisotropy of the thermal expansion is demonstrated on the Mg-10 vol% Saffil fiber composite. The coefficient of thermal expansion (CTE) in the transverse direction (TD) (the planes of the short Saffil fibers are laid perpendicular to the axis of the sample) is higher than the CTE in the longitudinal direction (LD) (the planes of the short Saffil fibers are laid parallel to the axis of the sample). The anisotropy and the thermal strain influence the thermal diffusivity for AS21 composites investigated at temperatures between 20 and 380°C.Paper presented at the Seventeenth European Conference on Thermophysical Properties, September 5-8, 2005, Bratislava, Slovak Republic. 相似文献
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Qingqing Zhang Wei Zhu Jie Zhou Yuan Deng 《Small (Weinheim an der Bergstrasse, Germany)》2023,19(32):2300968
Quantitative thermal performance measurements and thermal management at the micro-/nano scale are becoming increasingly important as the size of electronic components shrinks. Scanning thermal microscopy (SThM) is an emerging method with high spatial resolution that accurately reflects changes in local thermal signals based on a thermally sensitive probe. However, because of the unclear thermal resistance at the probe-sample interface, quantitative characterization of thermal conductivity for different kinds of materials still remains limited. In this paper, the heat transfer process considering the thermal contact resistance between the probe and sample surface is analyzed using finite element simulation and thermal resistance network model. On this basis, a mathematical empirical function is developed applicable to a variety of material systems, which depicts the relationship between the thermal conductivity of the sample and the probe temperature. The proposed model is verified by measuring ten materials with a wide thermal conductivity range, and then further validated by two materials with unknown thermal conductivity. In conclusion, this work provides the prospect of achieving quantitative characterization of thermal conductivity over a wide range and further enables the mapping of local thermal conductivity to microstructures or phases of materials. 相似文献
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Lin Jing Rui Cheng Muzaffer Tasoglu Zexiao Wang Qixian Wang Hannah Zhai Sheng Shen Tzahi Cohen-Karni Raghav Garg Inkyu Lee 《Small (Weinheim an der Bergstrasse, Germany)》2023,19(11):2207015
Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich-structured thermal interface material (TIM) is developed that simultaneously possesses record-low thermal resistance and high flexibility. Frequency-domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom-up fabrication process, excellent contacts between the graphene-coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2 K W−1. This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics. 相似文献
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为评估氧化剂硝酸羟胺的热稳定性,使用标准液体铝皿于3K/min、4K/min、5K/min加热速率下进行热分析。借助非等温DSC曲线的参数值,应用Kissinger法和Ozawa法求得热分解反应的表观活化能和指前因子,根据Zhang-Hu-Xie-Li公式、Hu-Yang-Liang-Xie公式、Hu-Zhao-Gao公式以及Zhao-Hu-Gao公式,计算硝酸羟胺的自加速分解温度和热爆炸临界温度,并对热分解机理函数进行了研究。设计了7条热分解反应路径,采用密度泛函理论B3LYP/6-311++G(d,p)方法对硝酸羟胺的热分解进行了动力学和热力学计算。计算结果表明,硝酸羟胺热分解的自加速分解温度TSADT=370.05K,热爆炸临界温度Tbe0=388.68K,Tbp0=397.54K,热分解最可几机理函数的微分形式为f(α)=17×(1-α)18/17。硝酸羟胺热分解各路径中,动力学优先支持路径Path 6、Path 5、Path 4和Path 1生成NO和NO_2,其次是Path 2、Path 7和Path 3生成N2和N_2O。温度在373K以下时,Path 1′反应无法自发进行,硝酸羟胺无法进行自发的热分解。从热力学的角度来看,硝酸羟胺在370.05K以下储存是安全的。 相似文献