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1.
采用X射线衍射三轴二维倒空间衍射图研究了InP(100)衬底上分子束外延生长的压应变InAsP材料和张应变InGaAsP材料.实验测定了两种材料的(004)面、(224)面的倒空间衍射图,得到了处于部分弛豫状态的InGaAsP在不同方向呈现不同的应变状态.排除了外延层倾斜及应变对确定失配度的影响,准确计算得到InAsP外延层体失配度为1.446%,InGaAsP外延层体失配度为-0.5849%,并且生长了高质量的应变补偿8阱多量子阱.  相似文献   

2.
采用X射线衍射三轴二维倒空间衍射图研究了InP(100)衬底上分子束外延生长的压应变InAsP材料和张应变InGaAsP材料.实验测定了两种材料的(004)面、(224)面的倒空间衍射图,得到了处于部分弛豫状态的InGaAsP在不同方向呈现不同的应变状态.排除了外延层倾斜及应变对确定失配度的影响,准确计算得到InAsP外延层体失配度为1.446%,InGaAsP外延层体失配度为-0.5849%,并且生长了高质量的应变补偿8阱多量子阱.  相似文献   

3.
采用气态源分子束外延(GSMBE)生长了具有不同阱宽的InAsP/InGaAsP应变多量子阱,并对干法刻蚀前、干法刻蚀及湿法腐蚀不同厚度覆盖层后的多量子阱光致发光(PL)谱进行了表征.测量发现干法刻蚀量子阱覆盖层一定厚度后量子阱光致发光强度得到了明显的增强.这与干法刻蚀后量子阱覆盖层表面粗糙度变化及量子阱内部微结构变化有关.  相似文献   

4.
采用气态源分子束外延(GSMBE)生长了具有不同阱宽的InAsP/InGaAsP应变多量子阱,并对干法刻蚀前、干法刻蚀及湿法腐蚀不同厚度覆盖层后的多量子阱光致发光(PL)谱进行了表征.测量发现干法刻蚀量子阱覆盖层一定厚度后量子阱光致发光强度得到了明显的增强.这与干法刻蚀后量子阱覆盖层表面粗糙度变化及量子阱内部微结构变化有关.  相似文献   

5.
本文采用X射线衍射方法测定了在(001)取向的InP衬底上,用LPE法生长的InGaAsP外延层晶格完整性和应变状态,给出了InGaAsP/InP异质结X射线回摆曲线测量方法和测量结果,提出了用普通X射线衍射仪测量外延层晶格失配在实验方法上的改进,从而提供了在没有双晶衍射仪情况下,测量外延层晶格失配的可行途径。  相似文献   

6.
采用气态源分子束外延(GSMBE)技术在InP衬底上生长发光波长为131μm的InAsP/InGaAsP应变补偿多量子阱和在GaAs衬底上生长GaAs/AlGaAs分布布拉格反射镜(DBR) ,并用直接键合技术将生长在InP基上的InAsP/InGaAsP应变补偿多量子阱结构组装到GaAs衬底上生长的DBR结构上,对其微结构和发光等特性进行了比较系统的研究.发现500~620℃的高温键合过程和后续的剥离工艺不仅没有引起量子阱发光效率的降低,反而由于键合过程中的退火改进了晶体质量,大大提高了量子阱的发光强度,其中620℃退火处理后的光致发光强度是原生样品的3倍.  相似文献   

7.
采用气态源分子束外延(GSMBE)技术在InP衬底上生长发光波长为1.31μm的InAsP/InGaAsP应变补偿多量子阱和在GaAs衬底上生长GaAs/AlGaAs分布布拉格反射镜(DBR),并用直接键合技术将生长在InP基上的InAsP/InGaAsP应变补偿多量子阱结构组装到GaAs衬底上生长的DBR结构上,对其微结构和发光等特性进行了比较系统的研究.发现500~620℃的高温键合过程和后续的剥离工艺不仅没有引起量子阱发光效率的降低,反而由于键合过程中的退火改进了晶体质量,大大提高了量子阱的发光强度,其中620℃退火处理后的光致发光强度是原生样品的3倍.  相似文献   

8.
采用气态源分子束外延(GSMBE)技术在InP衬底上生长发光波长为1.31μm的InAsP/InGaAsP应变补偿多量子阱和在GaAs衬底上生长GaAs/AlGaAs分布布拉格反射镜(DBR),并用直接键合技术将生长在InP基上的InAsP/InGaAsP应变补偿多量子阱结构组装到GaAs衬底上生长的DBR结构上,对其微结构和发光等特性进行了比较系统的研究.发现500~620℃的高温键合过程和后续的剥离工艺不仅没有引起量子阱发光效率的降低,反而由于键合过程中的退火改进了晶体质量,大大提高了量子阱的发光强度,其中620℃退火处理后的光致发光强度是原生样品的3倍.  相似文献   

9.
运用高分辨X射线双晶衍射(DCD) 、三轴晶衍射(TAD)和TAD图谱对绝缘体上Si/SiGe/Si异质结构进行表征. 利用TAD结合DCD (TAD-DCD)对称和非对称衍射测定了体Si衬底和外延层以及外延层之间的取向关系、SiGe外延层的Ge含量及其弛豫度等异质外延生长的重要参数. TAD倒易空间图谱能够给出全面的晶体结构信息. 高分辨率TAD倒易空间图谱可实现对应变Si层应变量的测定.  相似文献   

10.
对不同衬底上外延生长的HgCdTe薄膜进行了倒易点二维图测试,分析了外延层与衬底之间的结构取向关系以及晶格常数的失配现象.通过测定Cd1-yZnyTe衬底上的HgCdTe外延层的应变弛豫状况,获得了晶格匹配条件时衬底Zn组分的准确值.实验结果还表明:HgCdTe外延层与晶格失配的衬底之间存在着倾角,该倾角随失配度的增大而增大;当衬底失配度较小时,非对称倒易点二维图显示外延层并不处于全应变状态,而是处于应力部分释放状态;相反,当外延层晶格失配产生的应力全部释放时,外延层包含着较大的失配位错,摇摆曲线半峰宽展宽较大。  相似文献   

11.
In this article, we describe the growth and characterization for 1.3 μm InAsP/InP strained multiple quantum well (SMQW) laser diodes (LDs) with separate confinement heterostructure grown at 580°C by metalorganic chemical vapor deposition. The grown strained single quantum well (SSQW) stack and strained multiple quantum well (SMQW) structures are characterized using double-crystal X-ray diffraction and photoluminescence (PL) to confirm the structural and optical qualities for practical device applications. The InAsP/InP SSQW stack grown at 580°C appears to be extremely abrupt, uniform, free of misfit dislocations and narrow PL half width. Although the InAsP/InP SMQWs grown at 580°C maintain its structural integrity throughout the deposition sequence, the slightly broader PL half width for InAsP/InP SMQW structure is attributed to the dislocations resulted from a large net strain. Laser emission can be achieved by using the InAsP/InP SMQWs and the lasing wavelength is in a good agreement with our designed structure. The experimental data of broad-area and ridge waveguide LDs are described in detail.  相似文献   

12.
InAsP/InP multiquantum well structures were grown by solid source molecular beam epitaxy using either As2 or As4 over a substrate temperature range of 420–535°C. All quantum wells had similar arsenic compositions with a 2.2% standard deviation regardless of arsenic species or growth temperature. This temperature insensitivity of arsenic incorporation in InAsP is in sharp contrast to InGaAsP in which arsenic composition is very sensitive to both substrate temperature and gallium percentage in the compound. The insensitivity of arsenic incorporation in InAsP to substrate temperature may result from growth in a phosphorus rich condition with indium as the only available cation.  相似文献   

13.
An experimental way for the thermal characterization of semiconductor lasers based on I-V method under pulse driving conditions has been developed, with which the thermal characteristics of strain compensated 1.3μm InAsP/InGaAsP ridge waveguide MQW laser chips have been investigated. The results show that, by measuring and analyzing the I-V characteristics under appropriate pulse driving conditions at different heat sink temperatures, the thermal resistance of the laser diodes could be easily deduced. The driving current and junction voltage waveforms of the laser chips under different pulse driving conditions are also discussed.  相似文献   

14.
利用新型全固源分子束外延技术 ,对 1 .5 5 μm波段的 In As P/ In Ga As P应变多量子阱结构的生长进行了研究。实验表明 ,较低的生长温度或较大的 / 束流比有利于提高应变多量子阱材料的结构质量 ,而生长温度对材料的光学特性有较大的影响。在此基础上生长了分别限制多量子阱激光器结构 ,制作的氧化物条形宽接触激光器实现了室温脉冲工作 ,激射波长为 1 5 63 nm,阈值电流密度为 1 .4k A/ cm2 。这是国际上首次基于全固源分子束外延的 1 .5 5 μm波段 In As P/ In Ga As P多量子阱激光器的报道  相似文献   

15.
Low-bandgap, lattice-mismatched GaxIn1−xAs (GaInAs) grown using InAsyP1−y (InAsP) compositional-step grades on InP is a primary choice for lightabsorbing, active layers in high-efficiency thermophotovoltaic (TPV) devices. The GaInAs/InAsP double heterostructures (DHs) show exceptional minority carrier lifetimes of up to several microseconds. We have performed a characterization survey of 0.4–0.6-eV GaInAs/InAsP DHs using a variety of techniques, including transmission electron microscopy (TEM). Dislocations are rarely observed to thread into the GaInAs active layers from the InAsP buffer layers that terminate the graded regions. Nearly complete strain relaxation occurs in buried regions of the InAsP grades. The buffer-layer strain prior to deposition of the active layer is virtually independent of the net misfit. Foreknowledge of this buffer-layer strain is essential to correctly lattice match the buffer to the GaInAs active layer.  相似文献   

16.
Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-favoring position due to the slow growth rate from SiH 4. In this case, a Si buffer that isolates the effect of substrate on epilayer could not be grown, which results in a pit penetrating into epilayer and buffer. The FWHM is 0.055° in DCXRD from SiH 4. The presence of diffraction fringes is an indication of an excellent crystalline quality. The roughness of the surface is improved if grown by Si 2H 6; however, the crystal quality of the Ge x Si 1- x material became worse than that from SiH 4 due to much larger growth rate from Si 2H 6. The content of Ge is obtained from DCXRD, which indicates the growth rate from Si 2H 6 is largest, then GeH 4, and that from SiH 4 is least.  相似文献   

17.
Uncooled 10 Gbit/s direct modulation of high-power 1.3 μm InAsP/InGaAsP directly modulated multiple quantum well distributed feedback (DFB) lasers is demonstrated. High resonant frequencies and high efficiency at 85°C are obtained due to the high epitaxial quality of ternary, aluminium-free, quantum wells. Floor-free transmission on 90 and 140 ps/nm within ITU recommendations are demonstrated  相似文献   

18.
We present results of the growth of InAsxP1−x/InP strained heterostructures by low pressure metalorganic vapor phase epitaxy. A large incorporation of arsenic into the InAsP ternary was observed using tertiarylbutylarsine as precursor. High resolution x-ray diffraction, photoluminescence, and optical absorption measurements for InAsP/InP strained multiple quantum wells reveal that the InAsP/InP interface is very sensitive to growth interruption. A systematic study of a growth in terruption sequence designed to improve the InAs/InP interface was carried out. For nonoptimal growth interruption procedures a large density of interface states is created, probably as a consequence of compositional modifications within the interface region. We find that the absorption spectrum may reveal a significant density of interface states. Thus, photoluminescence on its own is insufficient to characterize the interface roughness even for structures showing narrow low-temperature photoluminescence peaks. We also observe an enhancement of the As content for structures grown on InP (001) relative to those simultaneously grown on InP(001) two degrees off toward [100], which suggests that the composition of As in the ternary is limited by its surface diffusion.  相似文献   

19.
X-ray double crystal diffractometry has been used to assess the crystal quality of InGaAsP/ InP single heterostructures grown by liquid phase epitaxy. Diffraction profiles have been obtained in the parallel non-dispersive configuration, using Cu Kα1 radiation, 004 symmetric reflection and a perfect InP crystal as a monochromator. Several structures, with different lattice mismatches, ranging from positive to negative values, have been investigated. The epilayer Bragg peak was found to be as narrow as theoretically predicted, if thickness effects are taken into account. Pendellosung fringes have been observed at the low angle side of the peak, thus the epilayer thickness could be measured. Finally, the sample curvature has been evaluated from the broadening of the substrate Bragg peak and, when the broadening was sufficiently large, a good agreement with that calculated from the elastic theory has been found. All the results demonstrate that the structures investigated are characterized by a very high crystal quality.  相似文献   

20.
An experimental way to analyze the thermal characterization of semiconductor lasers based on spectroscopy method under pulse driving conditions has been developed. By using this way the thermal characteristics of strain compensated 1.3μm InAsP/InGaAsP ridge waveguide MQW laser diodes have been investigated. Results show that by measuring and analyzing the lasing spectra under appropriate driving parameters and temperature ranges, the thermal resistance of the laser diodes could be deduced easily. A higher thermal resistance of 640K/W has been measured on a narrow ridge laser chip without soldering. Other thermal and spectral properties of the lasers have also been measured and discussed.  相似文献   

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