Effects of annealing on the structural properties of indium rich InGaN films

Indium rich (In-rich) InGaN films were grown on Ge (111) substrate by plasma assisted molecular beam epitaxy with thin GaN as a buffer layer. The effects of annealing temperature and annealing time on the structural properties of In-rich InGaN films were investigated by X-ray diffraction (XRD). XRD results indicate that the as-grown InGaN films annealed at different temperatures for 1 min and 1 h respectively did not improve the film crystalline quality. But with the annealing at 750 °C and 800 °C for 1 min respectively the metallic indium was desorbed from the InGaN structure. The InGaN films annealed at higher than 660 °C for 1 h also showed the indium desorption. The InGaN film has the best film quality after annealed at 660 °C for 6 h with the full-width at half-maximum of InGaN (002) peak to be 879 arcsec. The InGaN crystalline quality started to degrade after annealed at the temperatures higher than 660 °C for 6 h.     

Effect of annealing atmosphere (Ar vs. air) and temperature on the electrical and optical properties of spin-coated colloidal indium tin oxide films

Colloidal indium tin oxide (ITO) ~6 nm nanoparticles synthesized in-house were deposited by spin coating on fused silica substrates, resulting in high resistivity films due to the presence of passivating organics. These films were annealed at various temperatures ranging from 150 to 750 °C in air and argon atmospheres. The films are very transparent in the as-coated form, and they retain high transparency upon annealing, except the films annealed at 300 °C in argon, which became brown due to incomplete pyrolysis of the organics. Thermogravimetric analysis and Raman characterization showed that the removal of organics increases with an increase in the annealing temperature, and that this removal is more efficient in the oxidizing atmosphere of air, especially in the 300–450 °C temperature range than in Ar. Although ITO defect chemistry suggests that argon annealing should result in higher carrier concentration than air annealing, the faster removal of insulating organics upon annealing in air resulted in significantly lower film resistivity at intermediate annealing temperatures for films annealed in air than in Ar. At higher annealing temperatures, both Ar and air annealing, resulted in comparable film resistivities (the lowest achieved was ~10⁰ Ω cm).     

Characterization of poly(vinylidene fluoride-trifluoroethylene) 50/50 copolymer films as a gate dielectric

Thin films of poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) 50/50 copolymer were prepared by spin coating on p-Si substrate. Thermal behavior of the film was observed by measuring the film thickness with ellipsometry as a function of the temperature and abrupt volume expansion was observed at 130–150 °C. Capacitance-voltage (C-V) and current-voltage (I-V) behavior of the aluminum/P(VDF-TrFE)/p-Si MIS (metal-insulator-semiconductor) structures were studied and dielectric constant of the P(VDF-TrFE) film was measured to be about 15.3 at optimum condition. No hysteresis was observed in the C-V curve for films as deposited and annealed (70–200 °C). Films annealed at temperatures higher than the volume expansion temperature showed substantial surface roughness due to the crystallization. Flat band voltage (V_FB) of the MIS structure with as deposited films was about −0.3 V and increased up to −2.0 V with annealing. This suggested that positive charges were generated in the film. Electronic properties of the annealed P(VDF-TrFE) film at above melting temperature were degraded substantially with larger shift in flat band voltage, low dielectric constant and low breakdown voltage. Organic thin film transistor with pentacene active layer and P(VDF-TrFE) as a gate dielectric layer showed a mobility of 0.31 cm²/V·s and threshold voltage of −0.45 V.     

Fabrication of robust Bi3.25La0.75Ti3O12 thin film resistant to hydrogen damage

Ferroelectric bismuth lanthanum titanate (Bi_3.25La_0.75Ti₃O₁₂; BLT) thin films were deposited on Pt/TiO₂/SiO₂/Si substrate by chemical solution deposition method. The films were crystallized in the temperature range of 600–700 °C. The spontaneous polarization (P_s) and the switching polarization (2P_r) of BLT film annealed at 700 °C for 30 min were 22.6 μC/cm² and 29.1 μC/cm², respectively. Moreover, the BLT capacitor did not show any significant reduction of hysteresis for 90 min at 300 °C in the forming gas atmosphere.     

Post deposition annealing of aluminum oxide deposited by atomic layer deposition using tris(diethylamino)aluminum and water vapor on Si(100)

Thin stoichiometric aluminum oxide films were deposited using tris(diethylamino)aluminum precursor and water. Changes in aluminum oxide film and interfacial regions were studied after post deposition annealing under inert ambience at 600, 800 and 1000 °C using Fourier Transform InfraRed (FTIR) spectroscopy, X-ray Photoelectron Spectroscopy, and Scanning Transmission Electron Microscopy (STEM)/Electron Energy Loss spectroscopy (EELS) techniques. STEM/EELS analyses were also done on samples annealed in situ, i.e., inside the electron microscope at temperatures as high as 800 °C. Up to an annealing temperature of 600 °C, the atomic layer deposited alumina film was thermally stable and remained amorphous with no interfacial silica growth observed. After annealing at 800 °C for 5 min, the only change observed was a small increase in the interfacial layer thickness which was found to be mainly silicon oxide without any significant silicate content. Annealing at 1000 °C induced a significant increase in the interfacial layer thickness which consisted of a mixture of silicon oxide and aluminum silicate. The composition of the interfacial layer was found to change with depth, with silicate concentration decreasing with distance from the Si substrate. Also, the FTIR spectra exhibited strong absorption features due to Al-O stretching in condensed AlO₆ octahedra which indicate crystallization of the alumina film after annealing at 1000 °C for 5 min.     

Effect of annealing pressure on structure and properties of ferroelectric Bi3.25La0.75Ti3O12 thin films prepared by sol�Cgel method

The effect of annealing pressure was investigated for Bi_3.25La_0.75Ti₃O₁₂ (BLT) thin films prepared on Pt/TiO₂/SiO₂/p-Si(100) substrates by sol?Cgel method. The amorphous films were annealed at 750 °C for 30 min under different oxygen pressures varying from 10^?4 to 3 atm. The largest P _r of 17.8 ??C/cm² with the E _c of 73.6 kV/cm was obtained for the film annealed under 0.1 atm P_O2. Then the structure, crystallization degree, and morphology were characterized by X-ray diffraction (XRD), Raman spectroscopy, and field-emission scanning electron microscope (FSEM) to clarify the effect of annealing pressure on the ferroelectric properties. The XRD and Raman spectroscopy results indicated a clear decreasing of the crystallization degree of the films annealed under 10^?4 and 3 atm P_O2. FSEM results showed the different growth orientation of grains under different oxygen pressures. This study indicated some important effects of annealing pressure on the physical properties of BLT thin films.     

The structure and photoluminescence properties of ZnO/SiC multilayer film on Si substrate

ZnO/SiC multilayer film has been fabricated on a Si (111) substrate with a silicon carbide (SiC) buffer layer using the RF (radio frequency)-magnetron technique with targets of a ceramic polycrystalline zinc oxide (ZnO) and a composite target of pure C plate with attached Si chips on the surface. The as-deposited films were annealed at a temperature range of 600–1000°C under nitrogen atmosphere. The structure and photoluminescence (PL) properties of the samples were measured using X-ray diffractometry (XRD), Fourier transform infrared (FTIR) spectroscopy and PL spectrophotometry. By increasing the annealing temperature to 800°C, it is found that all the ZnO peaks have the strongest intensities, and the crystallinity of ZnO is more consistent on the SiC buffer layer. Further increase of the annealing temperature allows the ZnO and SiC layers to penetrate one another, which makes the interface between ZnO and SiC layer become more and more complicated, thus reduces the crystallinities of ZnO and SiC. The PL properties of a ZnO/SiC multilayer are investigated in detail. It is discovered that the PL intensities of these bands reach their maximum after being annealed at 800°C. The PL peaks shift with an increase in the annealing temperature, which is due to the ZnO and SiC layers penetrating reciprocally. This makes the interface more impacted and complicated, which induces band structure deformation resulting from lattice deformation.     

Damping properties of epoxy-based composite embedded with sol–gel-derived Pb(Zr<Subscript>0.53</Subscript>Ti<Subscript>0.47</Subscript>)O<Subscript>3</Subscript> thin film annealed at different temperatures

Pb(Zr_0.53Ti_0.47)O₃ (PZT) thin films were prepared on Pt/Ti/SiO₂/Si substrate by sol–gel method. The effect of annealing temperature on microstructure, ferroelectric and dielectric properties of PZT films was investigated. When the films were annealed at 550–850 °C, the single-phase PZT films were obtained. PZT films annealed at 650–750 °C had better dielectric and ferroelectric properties. The sandwich composites with epoxy resin/PZT film with substrate/epoxy resin were prepared. The annealing temperature of PZT films influenced their damping properties, and the epoxy-based composites embedded with PZT film annealed at 700 °C had the largest damping loss factor of 0.923.     

Effects of composition and thickness on the electrical properties of indium oxide/tin oxide multilayered films

Indium oxide/tin oxide multilayered films with a 2 nm pair thickness were deposited on glass substrates at temperatures lower than 100° C by an ion-beam sputtering method. The structure, electrical properties and visible transmissivity were investigated as a function of composition and the total thickness on as-deposited and annealed films. X-ray diffraction analysis showed that the as-deposited 200 nm thick film (with 0.15 nm tin oxide layers) was partially crystalline and films thinner than 100 nm were amorphous or microcrystalline. The roomtemperature resistivity of as-prepared films increased with the increase of an average tin oxide layer thickness from ∼0.05 to ∼0.3 nm (ideal monolayer thickness) under a constant total thickness ∼100 nm. We observed a decrease of the Hall mobility with the increase of the total film thickness from 10 to 200 nm in as-deposited samples containing 0.15 nm tin oxide layers.     

Excellent ferroelectricity of thin poly(vinylidene fluoride-trifluoroethylene) copolymer films and low voltage operation of capacitors and diodes

Characteristics of metal-ferroelectrics-metal (MFM) capacitors and meta -ferroelectrics-insulator-semiconductor (MFIS) diodes with poly(vinylidene fluoridetrifluoroethylene) [P(VDF-TrFE)] copolymer films thinner than 100 nm were investigated. The films were prepared by spin cast process and were annealed at 140 degrees C in air for crystallization. The ferroelectric properties are equivalent to those of oxide ferroelectrics, even under low voltage or high frequency operation.     

Interfacial titanium oxide between hydroxyapatite and TiAlFe substrate

The interface between nano-crystalline hydroxyapatite (HA) thin films and a titanium alloy (Ti5Al2.5Fe) has been studied by means of Fourier transform infrared spectrophotometry and X-ray diffraction at grazing incidence. The HA thin films were deposited by radio-frequency magnetron sputtering in low pressure dry argon on substrates kept at low temperature or heated at 550 °C. The effect of film treatment by sputtering and annealing in humid air, as a simple, effective way of restoring the crystallinity and stoichiometry of the HA bulk, was studied in correlation with the development of a titanium oxide layer at the film-substrate interface. An interfacial TiO₂ film grew at the interface during annealing in moist air, while a TiO₂ layer diffused into the HA films when directly sputtered at 550 °C. The formation of an interfacial titanium oxide layer was inhibited by the insertion of a crystalline TiN buffer interlayer between the substrate and the HA film. Separately, the mechanical characteristics of the different HA films were monitored by nanoindentation to find out how they had been affected.     

Microstructural and electrical characteristics of rapidly annealed Ni/Mo Schottky rectifiers on cleaned n-type GaN (0001) surface

We have investigated the electrical and microstructural properties of Ni/Mo Schottky rectifiers to n-type GaN by current–voltage (I–V) and transmission electron microscopy (TEM) before and after annealing at 600 °C. The obtained barrier height for as-deposited Ni/Mo contact is 0.66 eV. It is observed that the barrier height increases with annealing temperature up to 500 °C, reaching a maximum value of 0.75 eV at this temperature. However, the Schottky barrier height of the Ni/Mo Schottky contact slightly decreased to 0.67 eV (I–V) when the contact was annealed at 600 °C. According to the HRTEM, STEM and EDX analysis, the formation of Ga-Ni interfacial layer at the interface results in the accumulation of gallium vacancies near the surface of the GaN layer. This could be the reason for increase in barrier heights upon annealing at elevated temperatures. The variation in the measured barrier height after annealing at 600 °C may be due to the formation of native oxide layer at the interface compared to the 500 °C annealed contact.     

Aluminum-doped zinc oxide electrode for robust (Pb,La)(Zr,Ti)O3 capacitors: effect of oxide insulator encapsulation and oxide buffer layer

Conductive aluminum-doped zinc oxide (AZO) was deposited by pulsed laser deposition as top electrodes for chemical solution deposition derived lanthanum modified lead zirconate titanate (PLZT) capacitors. Compared with PLZT capacitors with Pt top electrodes (Pt/PLZT/Pt), PLZT capacitors with AZO as top electrodes (AZO/PLZT/Pt) showed improved fatigue endurance after cycles of 200 kV/cm (10 V) were applied with a 100 μs pulse width at 1 ms intervals. By using a combination of AZO as the top electrode and as a thin buffer layer (10 nm) under PLZT thin films (AZO/PLZT/AZO/Pt), fatigue behavior was also improved compared with the case without an AZO buffer layer. The addition of either an Al₂O₃ or HfO₂ encapsulation layer increased the remnant polarization ratio of PLZT capacitors (after annealing at 200 °C, 1 Torr, 3 % hydrogen atmosphere) to 0.80 and 0.57, respectively, comparing with 0.52 without an encapsulation layer.     

Properties of electrochemically deposited CdTe thin films: annealing effect

CdTe thin film have been deposited onto stainless steel and fluorine doped tin oxide coated glass substrates from aqueous acidic bath using electrodeposition technique. The different preparative parameters, such as deposition time, bath temperature, pH of the bath have been optimized by photoelectrochemical (PEC) technique get good quality photosensitive material. The deposited films are annealed at different temperature in presence of air. Annealing temperature is also optimized by PEC technique. The film annealed at 200 °C showed maximum photosensitivity. Different techniques have been used to characterize the as deposited and also annealed (at 200 °C) CdTe thin film. The X-ray diffraction (XRD) analysis showed the polycrystalline nature and a significant increase in the XRD peak intensities is observed for the CdTe films after annealing. Optical absorption shows the presence of direct transition with band gap energy 1.64 eV and after annealing it decreases to 1.50 eV. Energy dispersive analysis by X-ray study for the as-deposited and annealed films showed nearly stoichiometric compound formation. Scanning electron microscopy reveals that spherically shaped grains are more uniformly distributed over the surface of the substrate for the annealed CdTe film. Photovoltaic output characteristics and spectral response of the annealed film have been carried. The fill factor and power conversion efficiency (η) of the cell are found to be 71 and 3.89 %.     

Annealing effect on the structural,electrical and 1/f noise properties of Mn–Co–Ni–O thin films

Thin films of Mn_1.4Co_1.0Ni_0.6O₄ (MCN) spinel oxide are grown by radio frequency (RF) magnetron sputtering method on amorphous Al₂O₃ substrate. We investigate the annealing effect on the micro structural and electrical properties of RF sputtered MCN films. It is found that the crystallinity of MCN film is improved with increasing annealing time at 750 °C, and the annealed films present excellent cubic spinel (220) preferred orientation in X-ray diffraction patterns. Comparing to as-sputtered thin film, the annealed films show a decrease of 60 to 70 % in resistivity at 300 K. The annealed samples with post annealing time longer than 18 min acquire a negative temperature coefficient of resistance of about ?3.73 %K^?1 and resistivity of about 210–220 Ω cm at 300 K. 1/f noise of MCN films are also studied and the Hooge’s parameters (γ/n) are calculated. After annealing for 18 to 90 min, the γ/n values of the films are on the order of 10^?21 cm³, which ranks about two orders lower than that of amorphous silicon.     

Effect of sputtering power and annealing temperature on the properties of indium tin oxide thin films prepared from radio frequency sputtering using powder target

Indium tin oxide (ITO) thin films were deposited on quartz substrates by radio frequency (RF) sputtering with different RF power (100–250 W) using the powder target at room temperature. The effect of sputtering power on their structural, electrical and optical properties was systematically investigated. The intensity of (400) orientation clearly increases with the sputtering power increases, although the films have (222) preferred orientation. Increasing sputtering power is benefit for lower resistivity and transmittance. The films were annealed at different temperature (500–800 °C), then we explored the relationship between their electro-optical and structural properties and temperature. It has been observed that the annealed films tend to have (400) orientation and then show the lower resistivity and transmittance. The ITO thin film prepared by RF sputtering using powder target at 700 °C annealing temperature and 200 W sputtering power has the resistivity of 2.08 × 10^?4 Ω cm and the transmittance of 83.2 %, which specializes for the transparent conductive layers.     

Effects of post-deposition annealing temperature and ambient on RF magnetron sputtered Sm<Subscript>2</Subscript>O<Subscript>3</Subscript> gate on n-type silicon substrate

Samarium oxide (Sm₂O₃) thin films with thicknesses in the range of 15–30 nm are deposited on n-type silicon (100) substrate via radio frequency magnetron sputtering. Effects of post-deposition annealing ambient [argon and forming gas (FG) (90% N₂ + 10% H₂)] and temperatures (500, 600, 700, and 800 °C) on the structural and electrical properties of deposited films are investigated and reported. X-ray diffraction revealed that all of the annealed samples possessed polycrystalline structure with C-type cubic phase. Atomic force microscope results indicated root-mean-square surface roughness of the oxide film being annealed in argon ambient are lower than that of FG annealed samples, but they are comparable at the annealing temperature of 700 °C (Argon—0.378 nm, FG—0.395 nm). High frequency capacitance–voltage measurements are carried out to determine effective oxide charge, dielectric constant and semiconductor-oxide interface trap density of the annealed oxide films. Sm₂O₃ thin films annealed in FG have smaller amount of effective oxide charge and semiconductor-oxide interface trap density than those oxide films annealed in argon. Current–voltage measurements are conducted to obtain barrier heights of the annealed oxide films during Fowler–Nordheim tunneling.     

The growth behavior of GaN film on Si(111) substrate by an ion-beam assisted evaporation process

Highly oriented GaN thin films were grown on Si(111) substrate using an ion beam assisted evaporation method. Nitrogen ions, with a kinetic energy of about 40 eV, was supplied by a Kaufman ion source; and Ga vapor was supplied by thermal evaporation. The surface morphology of the nucleation layer, and the crystalline properties of 200–300 nm thick GaN epi-layer were investigated by atomic force microscopy, transmission electron microscopy, and X-ray diffraction. Film grown under a Ga-rich flux condition produced film growth behavior of large islands of hexagonal configuration. Crystallinity on such film, however, was of poorer quality than other films with smaller islands, grown under high nitrogen ion flux conditions. The full width at half-maximum of (0002) diffraction peak was measured at 52 arcminutes for the GaN epilayer single-stepwise grown at 660°C. Ion-enhanced decomposition occurred, causing no film formation at substrate temperatures above 710°C. Additionally, the effect of predeposition of a buffer layer on GaN crystallinity was investigated for surface roughness. AFM measurement revealed that the GaN buffer layer grown on Si(111) showed smooth surface under the relatively N₂⁺-sufficient condition. The introduction of thin GaN buffer layer, grown at 600°C under N₂⁺-sufficient condition, worked on reducing the lattice-mismatch stress and in-plane misorientation of grains, and thus enhancing the crystallinity of the two-stepwise grown GaN epi-layer. Characteristic behavior of GaN epi-layers, single or two stepwise grown on Si(111), show a type of granular (columnar) epitaxy.     

Synthesis of SiOF nanoporous ultra low-k thin film

In this work, we have investigated the effect of annealing temperature on physical, chemical and electrical properties of Fluorine (F) incorporated porous SiO₂ xerogel low-k films. The SiO₂ xerogel thin films were prepared by sol–gel spin-on method using tetraethylorthosilicate as a source of Si. The hydrofluoric acid was used as a catalyst for the incorporation of F ion in the film matrix. The thickness and refractive index (RI) of the films were observed to be decreasing with increase in annealing temperature with minimum value 156 nm and 1.31 respectively for film annealed at 400 °C. Based on measured RI value, the 34 % porosity and 1.53 gm/cm³ density of the film annealed at 400 °C have been determined. The roughness of the films as a function of annealing temperature measured through AFM was found to be increased from 0.9 to 1.95 nm. The Electrical properties such as dielectric constant and leakage current density were evaluated with capacitance–voltage (C–V) and leakage current density–voltage (J–V) measurements of fabricated Al/SiO₂ xerogel/P–Si metal–insulator-semiconductor (MIS) structure. Film annealed at 400 °C, was observed to be with the lowest dielectric constant value (k = 2) and with the lowest leakage current (3.4 × 10^?8 A/cm²) with high dielectric breakdown.     

Effects of annealing ambient on ferroelectric properties and surface chemistry of sol–gel derived Bi3.25La0.75Ti3O12 thin films

In this work, Bi_3.25La_0.75Ti₃O₁₂ (BLT) thin films were prepared by sol–gel coatings followed by rapid thermal annealing in Ar or O₂ ambient. The correlation among annealing ambient, ferroelectric characteristics and surface chemistry of the BLT thin films were investigated. The BLT thin film annealed in Ar showed weaker crystallization, less dense surface and smaller polarization value than that annealed in O₂. After 10⁹ cycles, the remnant polarization of the BLT film annealed in Ar decreased to 83.5 % of the initial value while it remained 89.5 % for the sample annealed in O₂. X-ray photoelectron spectroscopy results indicated the inferior fatigue characteristics of the sample annealed in Ar was the comprehensive result of oxygen vacancies vicinity to Bi and Ti ion in the thin film.