共查询到20条相似文献,搜索用时 31 毫秒
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报道了一种用于卫星通讯系统,基于0.5μm栅长增强型赝配高电子迁移率晶体管的两级级联微波单片低噪声放大器.采用集总参数元件来缩小电路面积进而在整个芯片内完成阻抗匹配.在50Ω端口测试条件下,该低噪声放大器在3.5~4.3GHz频率范围内,噪声系数小于0.9dB,增益大于26dB,回波损耗小于-10dB.这是至今为止报道的增益高于20dB的低噪声放大器中具有最小噪声系数的微波单片低噪声放大器,它主要归因于采用具有优异噪声性能的增强型赝配高电子迁移率晶体管以及本文提出的源极串联电感结合漏极应用一个小的稳定电阻来减小输入匹配网络寄生电阻的电路结构. 相似文献
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戴水胜 《电子科学学刊(英文版)》1993,10(3):279-283
A novel Ku-band low noise amplifier with a high electron mobility transistor (HEMT)and a GaAs monolithic microwave integrated circuit (MMIC) has been demonstrated. Its noisefigure is less-than 1.9dB with an associated gain larger than 27dB and an input/output VSWRless than 1.4 in the frequency range of 11.7-12.2GHz. The HEMT and the microwave series in-ductance feedback technique are used in the first stage of the amplifier, and a Ku-band MMIC isemployed in the last stage. The key to this design is to achieve an optimum noise match and a min-imum input VSWR matching simultaneously by using the microwave series inductance feedbackmethod. The B J-120 waveguides are used in both input and output of the amplifier. 相似文献
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采用GaAs赝配HEMT单片微波集成电路(MMIC)工艺和堆栈偏置技术设计实现了一款Q波段低噪声放大器(LNA)芯片.该放大器采用4级级联的堆栈偏置拓扑结构,前两级电路在确保较低输入回波损耗的同时优化了放大器的噪声系数,后两级电路则采用最大增益的匹配方式,确保放大器具有良好的增益平坦度和较小的输出回波损耗.该LNA芯片最终尺寸为3 250 μm×1 500 μm,实测结果表明在40~46 GHz工作频率内放大器工作稳定,小信号增益大于23 dB,噪声系数小于3.0 dB,在4.5V工作电压下消耗电流约6 mA.此外,在片实测结果和设计结果符合良好. 相似文献
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Kobayashi K.W. Umemoto D.K. Block T.R. Oki A.K. Streit D.C. 《Solid-State Circuits, IEEE Journal of》1996,31(5):714-718
We report on a 1-6 GHz HEMT-HBT three-stage variable gain amplifier (VGA), which is realized using selective molecular beam epitaxy (MBE). The VGA integrates an HEMT low noise amplifier with an HBT analog current-steer variable gain cell and output driver stage to achieve a combination of low noise figure, wide gain control, and high linearity. The HEMT-HBT VGA MMIC obtains a maximum gain of 21 dB with a gain control range >30 dB, a minimum noise figure of 4.3 dB, and an input IP3 (IIP3) greater than -4 dBm over 25 dB of gain central range. By integrating an HEMT instead of on HBT preamplifier stage, the VGA noise figure is improved by as much as 2 dB compared to an all-HBT single-technology design. The HEMT-HBT MMIC demonstrates the functional utility and RF performance advantage of monolithically integrating both HEMT and HBT devices on a single substrate 相似文献
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由电路和噪声基本定义出发,导出了二端口网络的噪声相关矩阵的转移表示式和导纳表示式.并推导了两个二端口网络的级联和并联后的噪声相关矩阵.然后在此基础上得出了并联反馈放大器的噪声参数(Rn,NFmin和Yopt)和其S参数表达式.由此设计和制造了1~7GHz两级单片低噪声放大器.在工作频率1~7GHz内,测得增益G>20dB,带内增益波动ΔG≤±0.75dB,噪声系数NF≤2.5dB,输入输出驻波VSWR≤2.0,1分贝压缩点输出功率P1dB≥15dBm.测试结果验证了设计的正确性. 相似文献
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Ultra-wideband CMOS low noise amplifier 总被引:2,自引:0,他引:2
A two-stage ultra-wideband CMOS low noise amplifier (LNA) is proposed. The first stage is optimised for wideband input matching and low noise figure, while the second stage is optimised to extend the -3 dB bandwidth of the overall amplifier. The combination of stages can provide lower noise figure and wider bandwidth simultaneously over that of previously reported feedback-based CMOS amplifiers. The implemented LNA shows a peak gain of 13.5 dB, more than 8.5 dB of input return loss, and a noise figure of 2.5-7.4 dB over a -3 dB bandwidth from 2 to 9 GHz with DC power consumption of 25.2 mW. 相似文献
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报道了基于0.25μm GaAs PHEMT工艺的2.8~4.2GHz MMIC低噪声放大器,详细介绍和分析了低噪声放大器的器件基础和设计原理,设计采用源极串联电感负反馈方法使输入阻抗共轭匹配和最小噪声匹配趋于一致,偏置网络采用自偏置栅压、单电源供电,并用ADS软件仿真。电路评估板选用Rogers RO4350B,在2.8~4.2GHz频段内测得增益大于20dB、增益平坦度小于2.5dB、噪声系数小于2.3dB、输入输出驻波比小于2.0。 相似文献
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X波段及DBS接收用PHEMT单片低噪声放大器 总被引:3,自引:0,他引:3
报道了X波段及DBS接收用单片低噪声放大器的研制结果。利用CAD软件对单片电路进行优化设计,设计工作包括MBE材料、PHEMT器件和单片电路三部分。在研制过程中,开展了关键工艺的专题研究。研究结果为:单级单片放大器在10:5-11.6GHz范围内,NF≤1.82dB,G≥7.72dB;在11.7-12.2GHz范围内,NF≤1.80dB,G≥6.8dB;双级放大器在10.4-11.1GHz范围内,NF≤1.96dB,G≥15.3dB,最低噪声系数为1.63dB,最高增益为16.07dB。 相似文献
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Tokumitsu T. Piernas B. Oya A. Sakai K. Hasegawa Y. 《Microwave and Wireless Components Letters, IEEE》2005,15(5):318-320
Three-dimensional (3-D) microwave monolithic integrated circuit (MMIC) technology, that incorporates slits in the ground metal, was applied to K-band low noise amplifier (LNA) and I/Q mixer to provide a low cost solution for various K-band receivers such as for P-to-P radio, WLAN, and UWB sensors. The LNA incorporates a quasicoplanar stub in the input-matching network, improving the noise figure by 1 dB. This low-noise amplifier (LNA) exhibits a noise figure of 2.5 dB with an associated gain of 16 dB and an area of 0.75/spl times/0.65 mm/sup 2/. The I/Q resistive mixer incorporates a broadside 3-dB coupler with a 22-/spl mu/m-wide slit in the ground metal beneath the coupled thin-film micro-strip (TFMS) lines (patent pending). The insertion loss of the 3 dB coupler is 0.75 dB. The I/Q mixer exhibits a conversion loss of less than 14 dB at 0.1-2.0GHz IF frequencies for 2-dBm local input power. These LNA and mixer potentially make it easier to integrate receiver functions in a die. 相似文献
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X波段宽带单片低噪声放大器 总被引:13,自引:1,他引:12
从获取放大器的等噪声系数圆最大半径的角度来进行电路设计,设计了工作于X波段9~14GHz的宽带低噪声单片放大器,采用法国OMMIC公司的0.2μmGaAsPHEMT工艺(fT=60GHz)研制了芯片。在片测试结果为在9~14GHz,噪声系数<2.5dB,最小噪声系数在10.4GHz为2.0dB,功率增益在所需频段9~14GHz大于21dB,输入回波损耗<-10dB,输出回波损耗<-6dB。在11.5GHz,输出1dB压缩点功率为19dBm。 相似文献
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报道了一种基于商用0.15um赝配高电子迁移率晶体管工艺的单片低噪声放大器,工作频率范围为23~36GHz.它采用自偏置结构.对晶体管栅宽进行了优化设计减小栅极电阻,以得到低的噪声系数.采用吸收回路和加电阻电容网络的直流偏置结构提高电路稳定性,用多谐振点方法和负反馈技术扩展带宽.测试结果表明,其噪声系数低于2.0dB,在31GHz处,噪声系数仅为1.6dB.在整个工作频带范崮内,增益大于26dB,输入回波损耗大于11dB,输出回波损耗大于13dB.36GHz处的ldB压缩点输出功率为14dBm.芯片尺寸为2.4mm×1mm. 相似文献
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5~22GHz平坦高增益单片低噪声放大器 总被引:1,自引:1,他引:1
使用0.25μm G aA s PHEM T工艺技术,设计和制造了性能优良的5-22 GH z两级并联反馈单片低噪声放大器。在工作频率5-22 GH z内,测得增益G≥18 dB,带内增益波动ΔG≤±0.35 dB,噪声系数N F≤3.2 dB,输入输出驻波V SW R≤1.7,最小分贝压缩点输出功率P1dB≥10.5 dBm,电流增益效率达2.77 mA/dB。测试结果验证了设计的正确性。 相似文献
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彭龙新 《固体电子学研究与进展》2009,29(3)
利用0.25μmGaAsPHEMT低噪声工艺,设计并制造了2种毫米波大动态宽带单片低噪声放大器。第1种为低增益大动态低噪声放大器,单电源+5V工作,测得在26~40GHz范围内,增益G=10±0.5dB,噪声系数NF≤2.2dB,1分贝压缩点输出功率P1dB≥15dBm;第2种为低压大动态低噪声放大器,工作电压为3.6V,静态电流0.6A(输出功率饱和时,动态直流电流约为0.9A),在28~35GHz范围内,测得增益G=14~17dB,噪声系数约4.0dB,1分贝压缩点输出功率P1dB≥24.5dBm,最大饱和输出功率≥26.8dBm,附加效率约10%~13.6%。结果中还给出了2种放大器直接级联的情况。 相似文献
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2~8 GHz微波单片可变增益低噪声放大器 总被引:1,自引:0,他引:1
报道了一种微波宽带 Ga As单片可变增益低噪声放大器芯片。该芯片采用南京电子器件研究所 76mm圆片 0 .5μm PHEMT标准工艺制作而成。工作频率范围为 2~ 8GHz,在零衰减时 ,整个带内增益大于 2 5d B,噪声系数最大为 3 .5 d B,增益平坦度小于± 0 .75 d B,输入驻波小于 2 .0 ,输出驻波小于 2 .5 ,输出功率大于 1 0d Bm。放大器增益可控大于 3 0 d B。实验发现 ,芯片具有良好的温度特性。该芯片面积为 3 .6mm× 2 .2 mm。 相似文献
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基于RC-CR多相网络技术研制了一款S波段镜频抑制接收机单片微波集成电路(MMIC),在MMIC芯片上集成S波段低噪声放大器(LNA)、差分IQ混频器、本振(LO)驱动放大器、RC-CR多相网络滤波器等电路单元,实现了S波段单片镜频抑制接收机,解决了镜频接收机小型化的问题.电路、电磁场软件仿真以及采用GaAs赝配高电子迁移率晶体管(PHEMT)工艺流片后的结果表明,在S波段实现了噪声系数小于1.8 dB,增益大于12 dB,中频(150±5) MHz带内镜频抑制大于35 dBc的技术指标.MMIC的芯片尺寸为4.8 mn×2.5 mm×0.07 mm.此镜频抑制接收机MMIC具有指标优异、体积小、集成度高的特点,可广泛用于各种需小型化的相控阵雷达和通信系统中. 相似文献
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Chang-Wan Kim Min-Suk Kang Phan Tuan Anh Hoon-Tae Kim Sang-Gug Lee 《Solid-State Circuits, IEEE Journal of》2005,40(2):544-547
An ultra-wideband (UWB) CMOS low noise amplifier (LNA) topology that combines a narrowband LNA with a resistive shunt-feedback is proposed. The resistive shunt-feedback provides wideband input matching with small noise figure (NF) degradation by reducing the Q-factor of the narrowband LNA input and flattens the passband gain. The proposed UWB amplifier is implemented in 0.18-/spl mu/m CMOS technology for a 3.1-5-GHz UWB system. Measurements show a -3-dB gain bandwidth of 2-4.6GHz, a minimum NF of 2.3 dB, a power gain of 9.8 dB, better than -9 dB of input matching, and an input IP3 of -7dBm, while consuming only 12.6 mW of power. 相似文献
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Roee Ben Yishay Sara Stolyarova Moshe Musiya Yossi Shiloh 《Microelectronics Journal》2011,42(5):754-757
The paper presents the design and characterization of a low noise amplifier (LNA) in a 0.18 μm CMOS process with a novel micromachined integrated stacked inductor. The inductor is released from the silicon substrate by a low-cost CMOS compatible dry front-side micromachining process that enables higher inductor quality factor and self-resonance frequency. The post-processed micromachined inductor is used in the matching network of a single stage cascode 4 GHz LNA to improve its RF performance. This study compares performance of the fabricated LNA prior to and after post-processing of the inductor. The measurement results show a 0.5 dB improvement in the minimum noise figure and a 1 dB increase in gain, while good input matching is maintained. These results show that the novel low-cost CMOS compatible front-side dry micromachining process reported here significantly improves performance and is very promising for System-On-Chip (SOC) applications. 相似文献
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Wu C.S. Pao C.K. Yau W. Kanber H. Hu M. Bar S.X. Kurdoghlian A. Bardai Z. Bosch D. Seashore C. Gawronski M. 《Microwave Theory and Techniques》1995,43(2):257-266
We have demonstrated very good performance, high yield Ka-band multifunctional MMIC results using our recently developed 0.25-μm gate length pseudomorphic HEMT (PHEMT) manufacturing technology. Four types of MMIC transceiver components-low noise amplifiers, power amplifiers, mixers, and voltage controlled oscillators-were processed on the same PHEMT wafer, and all were fabricated using a common gate recess process. High performance and high producibility for all four MMIC components was achieved through the optimization of the device epitaxial structure, a process with wide margins for critical process steps and circuit designs that allow for anticipated process variations, resulting in significant performance margins. We obtained excellent results for the Ka-band power amplifier: greater than 26 dBm output power at center frequency with 4.0% standard deviation over the 3-in. wafer, 2-GHz bandwidth, greater than 20 pet-cent power-added efficiency, over 8 dB associated gain, and over 10 dB linear gain. The best performance for the Ka-band LNA was over 17 dB gain and 3.5 dB noise figure at Ka-band. In this paper, we report our device, process, and circuit approach to achieve the state-of-the-art performance and producibility of our MMIC chips 相似文献