AlN with high strength and high thermal conductivity based on an MCAS-Y2O3-YSZ multi-additive system

The additive composition of an AlN ceramic substrate material was optimized to achieve high strength and thermal conductivity. MgO-CaO-Al₂O₃-SiO₂ (MCAS) glass and Y₂O₃ were used as basic additives for improved sintering properties and thermal conductivity, thereby allowing for AlN to be sintered at a relatively low temperature of 1600 °C without pressurization. Yttria-stabilized zirconia (YSZ) was added (0–3 wt%) to further improve the strength of the AlN ceramic. YSZ and Y₂O₃ reacted with AlN to produce ZrN, Y₄Al₂O₉, and Y₃Al₅O₁₂ secondary phases. The formation of these yttrium aluminate phases improved the thermal conductivity by removing oxygen impurities, while ZrN formed at the AlN grain boundaries provided resistance to grain boundary fractures for improved strength. Overall, the AlN ceramic with 1 wt% MCAS, 3 wt% Y₂O₃, and 1 wt% YSZ exhibited excellent thermal and mechanical properties, including a thermal conductivity of 109 W/mK and flexural strength of 608 MPa.     

AC Impedance Spectroscopy of CaF2‐doped AlN Ceramics

The electrical conductivity of CaF₂‐doped aluminum nitride (AlN) ceramics was characterized at high temperatures, up to 500°C, by AC impedance spectroscopy. High thermal conductive CaF₂‐doped AlN ceramics were sintered with a second additive, Al₂O₃, added to control the electrical conductivity. The effects of calcium fluoride (CaF₂) on microstructure and related electrical conductivity of AlN ceramics were examined. Investigation into the microstructure of specimens by TEM analysis showed that AlN ceramics sintered with only CaF₂ additive have no secondary phases at grain boundaries. Addition of Al₂O₃ caused the formation of amorphous phases at grain boundaries. Addition of Al₂O₃ to CaF₂‐doped AlN ceramics at temperatures 200°C–500°C revealed a variation in electrical resistivity that was four orders of magnitude larger than for the specimen without Al₂O_3. The amorphous phase at the grain boundary greatly increases the electrical resistivity of AlN ceramics without causing a significant deterioration of thermal conductivity.     

Mechanical and Thermal Properties of Pressureless Sintered Silicon Carbide Ceramics with Alumina–Yttria–Calcia

The effect of sintering temperature on the mechanical and thermal properties of SiC ceramics sintered with Al₂O₃–Y₂O₃–CaO without applied pressure was investigated. SiC ceramics containing A₂O₃–Y₂O₃–CaO as sintering additives can be sintered to >97% theoretical density at temperatures between 1750°C and 1900°C without applied pressure. A toughened microstructure, consisting of relatively large elongated grains and relatively small equiaxed grains, has been obtained when sintered at temperatures as low as 1800°C for 2 h in an argon atmosphere without applied pressure. The achievement of toughened microstructures under such mild conditions is the result of the additive composition. The thermal conductivity of the SiC ceramics increased with increasing sintering temperature because of the decrease in the lattice oxygen content of the SiC grains. Typical sintered density, flexural strength, fracture toughness, hardness, and thermal conductivity of the 1850°C‐sintered SiC, which consisted of 62.2% 4H, 35.7% 6H, and 2.1% 3C, were 99.0%, 628 MPa, 5.3 MPa·m^1/2, 29.1 GPa, and 80 W·(m·K)^?1, respectively.     

Thermal conductivity of liquid-phase sintered silicon carbide ceramics: A review

Silicon carbide (SiC) exhibits excellent thermal conductivity. Recently, thermal conductivity that amounts to 261.5 W/m-K has been obtained in polycrystalline SiC ceramic liquid-phase sintered (LPS) with Y₂O₃-Sc₂O₃ additives at 2050 °C under a nitrogen atmosphere. From the additive used to the sintering atmosphere selected, many factors affect the thermal conductivity of the SiC. In this review, important factors that are known to determine the thermal conductivity of LPS-SiC (lattice oxygen/nitrogen content, porosity, grain size, grain boundary structure, phase transformation, and additive composition) have been evaluated. While reviewing the impact of each factor on thermal conductivity, hidden correlations among different factors are also discussed. Among the factors that are claimed to be important, we suggest a few factors that are more critical to thermal conductivity than others. Based on the most critical factors on the thermal conductivity of LPS-SiC, a complete engineers’ guide for high thermal conductivity LPS-SiC is proposed.     

Thermal conductivity of spark plasma sintered SiC ceramics with Alumina and Yttria

In this study, dense SiC ceramics were fabricated at 1650?1750 °C for 10?60 min by spark plasma sintering (SPS) using 3?10 wt.% Al₂O₃-Y₂O₃ as sintering additives. Effects of sintering temperature, sintering additive content and holding time on microstructure as well as correlations between microstructure and thermal conductivity were investigated. An increase in the sintering temperature promotes grain growth. Extending holding time has little influence on grain size but results in formation of continuous network of sintering additive, which increases interfacial thermal resistance and thus decreases thermal conductivity. For SiC ceramics composed of continuous SiC matrix and discrete secondary phase (yttrium aluminum garnet, YAG), an increase in the sintering additive content results in smaller grain size and lower thermal conductivity. The lower thermal conductivity of the SiC ceramic with higher sintering additive content is mainly due to the smaller grain size rather than the low intrinsic thermal conductivity of YAG.     

The effect of rare earth oxides on the pressureless liquid phase sintering of α-SiC

Silicon carbide (SiC) ceramics have been fabricated by pressureless liquid phase sintering with Al₂O₃ and rare-earth oxides (Lu₂O₃, Er₂O₃ and CeO₂) as sintering additives. The effect was investigated of the different types of rare earth oxides on the mechanical property, thermal conductivity and microstructure of pressureless liquid phase sintered SiC ceramics. The room temperature mechanical properties of the ceramics were affected by the type of rare earth oxides. The high temperature performances of the ceramics were influenced by the triple junction grain boundary phases. With well crystallized triple junction grain boundary phase, the SiC ceramic with Al₂O₃–Lu₂O₃ as sintering additive showed good high temperature (1300 °C) performance. With clean SiC grain boundary, the SiC ceramic with Al₂O₃–CeO₂ as sintering additive showed good room temperature thermal conductivity. By using appropriate rare earth oxide, targeted tailoring of the demanding properties of pressureless liquid phase sintered SiC ceramics can be achieved.     

Theoretical and experimental analyses of relationship between processing and thermal conductivity of SiC with oxide additives

This paper analyzes theoretically and experimentally the thermal conductivity of the SiC-oxide additive-pore system. In the developed 6 model structures, the thermal conductivity of an SiC compact (κ_b) with oxide was calculated as functions of the volume fractions of SiC, oxide additive and pores. The calculated κ_b decreases in the order of a continuous phase where the other two particulate phases are dispersed: SiC>oxide additive>pores. The measured κ_b values of SiC compacts hot-pressed with 4–50 mass% oxide additive (mixture of 33.3 mass% Al₂O₃-33.3 mass% Y₂O₃-33.3 mass% SiO₂) were well explained by the calculated κ_b in two types of oxide continuous phase models. The thermal conductivities for only SiC grains in SiC compacts hot-pressed with 4 mass% Al₂O₃, Y₂O₃, SiO₂, Al₂O₃-Y₂O₃, Y₂O₃-SiO₂ and Al₂O₃-Y₂O₃-SiO₂ at 1950 °C were also estimated theoretically in the developed two model structures using the measured κ_b (oxide continuous phase model and SiC continuous phase model). Based on the calculated results, the following key factors are identified to achieve a high κ_b: (1) high sintered density, (2) a small amount of oxide additive with a high thermal conductivity, (3) no dissolution of foreign atoms from a liquid phase into SiC grains during solidification process.     

Grain boundary phase in AlN ceramics fired under reducing N2 atmosphere with carbon

An AlN ceramic was prepared with a dopant Y₂O₃ under a reducing nitrogen atmosphere with carbon at 1900 °C for 20 h. The AlN ceramic had thermal conductivity, 220 W/m°C, which contained crystalline Y₂O₃ and an amorphous intergranular film. The intergranular phase decreased during the isothermal hold period by the migration of a liquid phase that consisted of Y₂O₃, Al₂O₃, and AlN. The liquid phase composition was maintained during the firing process. Comparison of the microstructures of the ceramics prepared with different isothermal hold times revealed that the lower the quantity of intergranular phase, the higher the thermal conductivity attained.     

Effects of microstructure and intergranular glassy phases on thermal conductivity of silicon nitride

In this study, the binary sintering additives Y₂O₃-Sc₂O₃, were first applied to the Si₃N₄ system to investigate their effects on microstructure and thermal conductivity. The microstructure and thermal conductivity of both sintered silicon nitride (SSN) and sintered reaction-bonded silicon nitride (SRBSN) were found to be significantly dependent on the additive composition. Among various combinations of Y₂O₃ and Sc₂O₃, 1 mol% Y₂O₃−3 mol% Sc₂O₃ prominently enhanced thermal conductivity, and the enhancement could not be attributed to any difference in microstructure or lattice defects. TEM observation revealed that this composition was more liable to devitrify the glassy phase with a lower degree of stress accumulation, and to possibly produce a grain boundary that was cleaner or with a higher order of atomic arrangement. A microstructure model for thermal conductivity was proposed which took the thermal resistance of the grain boundaries into account. The grain boundary state exerted a remarkable influence on the thermal conductivity of fine microstructures, and the experimentally measured thermal conductivity values were consistent with those given by the proposed model.     

Secondary phases,microstructures and properties of AlN ceramics sintered by adding nitrate sintering additives

AlN ceramics were sintered at a temperature range from 1650 to 1800°C through adding the Ca and Y nitrate sintering additives. Secondary phases, microstructures and properties of the AlN ceramics were studied. When the AlN ceramics are sintered at 1650 or 1675°C, CaO and Y₂O₃ from the sintering additives react with Al₂O₃ in the AlN powder to generate CaAl₄O₇ and Y₃Al₅O₁₂. Part of Y₃Al₅O₁₂ reacts with CaO and Al₂O₃ to form CaYAl₃O₇ at 1700°C. At 1800°C, CaYAl₃O₇ decomposes into CaAl₄O₇ and Y₃Al₅O₁₂. Finally, CaAl₄O₇ volatilises and only Y₃Al₅O₁₂ remains. As the sintering temperature increases, the AlN grains grow continuously and the bending strength and thermal conductivity of the AlN ceramics increase first and then decrease. The AlN ceramics sintered at 1700°C are fully dense and have the highest bending strength and thermal conductivity of 373·7 MPa and 136·7 W m^?1 K^?1 in this work.     

Effect of YF3 on densification behavior and thermal conductivity of AlN ceramics with Y2O3–YF3 additives under reducing atmosphere

The effect of yttrium fluoride (YF₃) on the densification behavior, microstructure, phase composition and thermal conductivity of aluminium nitride (AlN) ceramics with yttrium oxide (Y₂O₃) and YF₃ additives were studied. Since YF₃ provided liquid phases and promoted densification at a lower temperature, the sintering temperature required to reach the full density of AlN samples decreased with the increase in YF₃ content. Appropriate addition of YF₃ could improve the thermal conductivity of AlN ceramics, but the values of thermal conductivity decreased as YF₃ increased further. It is attributed to the ability of YF₃ to react with oxygen impurity was worse than that of Y₂O₃. Moreover, the reducing atmosphere significantly affected the phase composition, and the oxygen content in grain boundary phases decreased at 1750 °C and 1800 °C. Therefore, the proper proportion of Y₂O₃–YF₃ additives could simultaneously improve densification and the thermal conductivity of AlN samples at a low sintering temperature.     

An investigation of conductivity,microstructure and stability of HfO2–ZrO2–Y2O3–Al2O3 electrolyte compositions for high-temperature oxygen measurement

In search of better ionically conducting ceramics for high temperature oxygen fuel cells and sensors, the conductivity and microstructure of the HfO₂–ZrO₂–Y₂O₃ system with 15 mol% of Y₂O₃ and the HfO₂–ZrO₂–Y₂O₃–Al₂O₃ system with 50 mol% of Al₂O₃ have been investigated with X-ray diffractometry (XRD), scanning electron microscopy (SEM) and conductivity measurements as a function of temperature. The stability of electrolyte compositions was studied by continuously monitoring conductivity as a function of time at 1000°C. A majority of the investigated samples exhibited linear Arrhenius plots of the lattice conductivity as a function of temperature. In the HfO₂–ZrO₂–Y₂O₃–Al₂O₃ electrolyte systems the parameter pe′ was measured at a temperature range of 1000–1400°C. The HfO₂–ZrO₂–Y₂O₃–Al₂O₃ electrolyte systems have also showed better thermal shock resistance than the ZrO₂–Y₂O₃ systems. A comparison between the ageing of ZrO₂- and HfO₂-based electrolyte systems, as a result of long time annealing at a temperature of 1000°C, indicated that the degradation of the HfO₂-based system at a temperature of 1000°C and above is 1.5 times lower than the degradation of the ZrO₂-based systems.     

Process induced alignment of carbon nanotube decreases longitudinal thermal conductivity of Al2O3 based porous composites

Alumina (Al₂O₃) based porous composites, reinforced with zirconia (ZrO₂), 3 and 8 mol% Y₂O₃ stabilized ZrO₂ (YSZ) and 4 wt% carbon nanotube (CNT) are processed via spark plasma sintering. The normalized linear shrinkage during sintering process of Al₂O₃-based composite shows minimum value (19.2–20.4%) for CNT reinforced composites at the temperature between 1650 °C and 575 °C. Further, the combined effect of porosity, phase-content and its crystallite size in sintered Al₂O₃-based porous composite have elicited lowest thermal conductivity of 1.2 Wm⁻¹K⁻¹ (Al₂O₃-8YSZ composite) at 900 °C. Despite high thermal conductivity of CNT (∼3000 Wm⁻¹K⁻¹), only a marginal thermal conductivity increase (∼1.4 times) to 7.3–13.4 Wm⁻¹K⁻¹ was observed for CNT reinforced composite along the longitudinal direction at 25 °C. The conventional models overestimated the thermal conductivity of CNT reinforced composites by up to ∼6.7 times, which include the crystallite size, porosity, and interfacial thermal resistance of Al₂O₃, YSZ and, CNT. But, incorporation of a new process induced CNT-alignment factor, the estimated thermal conductivity (of <6.6 Wm⁻¹K⁻¹) closely matched with the experimental values. Moreover, the high thermal conductivity (<76.1 Wm⁻¹K⁻¹) of the CNT reinforced porous composites along transverse direction confirms the process induced alignment of CNT in the spark plasma sintered composites.     

Fabrication of highly dense Si3N4 via record low-content additive system for low-temperature pressureless sintering

Dense Si₃N₄ ceramics were fabricated by pressureless sintering at a low temperature of 1650°C with a short holding period of 1 h under a nitrogen atmosphere. The role of ternary oxide additives (Y₂O₃–MgO–Al₂O₃, Y₂O₃–MgO–SiO₂, Y₂O₃–MgO–ZrO₂) on the phase, microstructure, and mechanical properties of Si₃N₄ was examined. Only 5 wt.% of Y₂O₃–MgO–Al₂O₃ additive was sufficient to achieve >98% of theoretical density with remarkably high biaxial strength (∼1200 MPa) and prominent hardness (∼15.5 GPa). Among the three additives used, Y₂O₃–MgO–Al₂O₃ displayed the finest grain diameter (0.54 μm), whereas Y₂O₃–MgO–ZrO₂ produced the largest average grain diameter (∼0.95 μm); the influence was seen on their mechanical properties. The low additive content Si₃N₄ system is expected to have superior high-temperature properties compared to the system with high additive content. This study shows a cost-effective fabrication of highly dense Si₃N₄ with excellent mechanical properties.     

Influence of alumina content and thermal treatment on the thermal conductivity of UPE/Al2O3 composite

Ultra high molecular weight polyethylene/alumina (UPE/Al₂O₃) microcomposites with high loading micro alumina (Al₂O₃, 20 to 100 phr) were prepared by casting method. The composites were thermal treated (cooled slowly) and then the thermal properties were studied at temperatures from 25 to 125°C. Thermogravimetric analysis (TGA) and scanning electron microscopic (SEM) proves the homodispersion of Al₂O₃ microparticles in UPE. TGA indicates that the temperature of 5% weight loss of UPE/Al₂O₃ (100 phr) composite is 467.0°C, 10.5°C higher than that of pure UPE. Differential scanning calorimetry (DSC) shows that the melting point and the real degree of crystal (X_rc) of treated UPE/Al₂O₃ composite (100 phr) are 141.4°C and 65.7%, respectively, all higher than that of untreated composite, which can be described by crystal bridge mechanism. The density of the composite is also be enhanced because of crystal volume shrinkage induced by thermal treatment. The thermal conductivity of the treated UPE/Al₂O₃ composite (100 phr) is 1.920 W (m K)^?1 at 25°C, 23.6% higher than that of the untreated composite. Crystal bridge thermal conduction mechanism is proposed. The thermal conductivity of UPE/Al₂O₃ composite has some dependency on the increasing Al₂O₃ content and also thermal treatment. These results can give some advice to design formulations for practical applications in pipe area and other wear area. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40528.     

Influence of oxygen on the joining between copper and aluminium nitride

Aluminium nitride has been developed for electronic ceramic packaging applications because of its high thermal conductivity and high electrical resistivity. To improve the heat dissipation at the metal/ceramic interface, a high quality bonding between the substrate and the copper conductor is needed. This process requires a previous step of AIN pre-oxidation of the substrates by oxygen gas at 1200 °C, in order to form a thin layer of Al₂O₃ at the surface of AlN. The junction between Cu and the substrate is carried out at 1075 °C in controlled oxygen atmosphere which promote the oxidation of the copper and the formation of an eutectic phase which can form a strong junction with AlN via the layer of Al₂O₃. The goal of the current work is to study the influence of oxygen supplied by gaseous phase to form the exact amount of the eutectic phase needed to get a strong junction. First, in order to fix conditions for joining, the wetting behaviour of copper has been studied using the sessile drop method. The influence of oxygen brought by surrounding gas is given in terms of wettability of the liquid, interfacial tension and chemical reactions. According to previous results, copper foils and copper cylinders have been directly joined to AIN substrates. Interfacial reactions, mechanical and thermal properties have been investigated.     

Influence of component manipulation on the structural,mechanical, thermophysical and electrical properties of La0·2Ce0.2Nd0.2(ZrxY1−x)0.4O2−δ high-entropy ceramics

A series of high-entropy ceramics (HECs) with compositions of La_0·2Ce_0.2Nd_0.2(Zr_xY_1−x)_0.4O_2−δ (x = 0.5, 0.6, 0.7, 0.8, 0.9 and 1.0, the corresponding names being HEC(Zr_0·5/Y_0.5, Zr_0·6/Y_0.4, Zr_0·7/Y_0.3, Zr_0·8/Y_0.2, Zr_0·9/Y_0.1, Zr_1·0/Y₀)) were sintered in air at 1600 ^°C for 10 h. When x is in the range of 0.5–0.7, a fluorite phase is formed. Then, as x exceeds 0.7, a second pyrochlore-structured phase appears, and its content gradually increases with the increasing x. The grain growth of the samples is inhibited by increasing in the relative Zr content. The grain refinement and the formation of second phase reduce the thermal conductivity and reinforce the mechanical properties of the samples. HEC(Zr_0.9/Y_0.1) has the lowest thermal conductivity (50–500 °C) and brittleness index, as well as the highest fracture toughness among all samples. In addition, La_0·2Ce_0.2Nd_0.2(Zr_xY_1−x)_0.4O_2−δ ceramics have excellent thermal stability under Ar atmosphere in 50–1400 °C. The thermal expansion coefficients of the samples marginally change regardless of the variation in x. All samples show higher oxygen barrier property than Y₂O₃-stabilized ZrO₂.     

Increased electrical conductivity and the mechanism of samarium‐doped ceria/Al2O3 nanocomposite electrolyte

To further enhance the electrical conductivity of doped ceria, the samarium‐doped ceria (SDC)/Al₂O₃ nanocomposites were prepared through sintering the coprecipitated powders in 1100°C‐1300°C. The grain sizes of all composites are less than 100 nm and decrease with alumina addition. Besides the main phases of SDC and Al₂O₃, the SmAlO₃ can precipitate in the composites if sintered at higher temperatures or for longer dwell time. The deviations of SDC diffraction peak positions demonstrate the solid solution of alumina into SDC lattice. The total electrical conductivities of the composites increase with alumina content until 30% alumina is added. The SDC/30%Al₂O₃ presents the higher total conductivity than the pure SDC by about five times. Specifically, the grain interior conductivity generally decreases with the alumina addition while the grain‐boundary conductivity increases with that. The introduction of the conductive SDC/Al₂O₃ interface can contribute to the rise of total conductivity, yet the excessive alumina addition also blocks the oxygen ion conduction. The SmAlO₃ precipitation is detrimental to the ion conduction for it consumes part of alumina and leads to the decrement in Sm concentration of SDC grain. Appropriate alumina addition not only enhances the conductivity of SDC but also lowers the material cost.     

Influences of Bi0.75Y0.25O1.5 addition on the microstructure and ionic conductivity of Ce0.8Y0.2O1.9 ceramics

A second phase of Y₂O₃-stabilized Bi₂O₃ (Bi_0.75Y_0.25O_1.5,YSB) is introduced into Y₂O₃-doped CeO₂ (Ce_0.8Y_0.2O_1.9,YDC) as a sintering additive and the composite ceramics of YDC-xYSB (x = 0, 5, 10, 20, 30, 40 wt%) are prepared through sintering at 1100°C for 6 h in air atmosphere. The YDC-xYSB ceramics are composed of both YDC and YSB with cubic fluorite structure, and no other impurity phases are detected in XRD patterns. The relative density of YDC-xYSB rises firstly for x ≤5 wt%, and then it declines with YSB addition from 5 to 40 wt%. The average grain size of YDC decreases from 270 nm to 85.7 nm with YSB addition from 0 to 40 wt%. The YSB phase segregates at the grain boundaries of YDC based on the TEM analysis result. The ionic conductivity of YDC-xYSB (x ≥5 wt%) is lower than that of YDC in the test temperature of 200°C–500°C, while it gradually exceeds that of YDC in 500°C–750°C. At 750°C, the conductivity of YDC-30%YSB (6.22 × 10⁻² S/cm) is 1.35 times higher than that of YDC (4.6 × 10⁻² S/cm). The YSB addition can improve the ionic conductivity of YDC in 500°C–750°C and decrease its sintering temperature.     

Thermal properties of field-assisted-sintered SiCN–Y2O3 composites

Polymer-derived amorphous SiCN has excellent high-temperature stability and properties. To reduce the shrinkage during pyrolysis and to improve the high-temperature oxidation resistance, Y₂O₃ was added as a filler. In this study, polymer-derived SiCN–Y₂O₃ composites were fabricated by mixing a polymeric precursor of SiCN with Y₂O₃ submicron powders in different ratios. The mixtures were cross-linked and pyrolyzed in argon. SiCN–Y₂O₃ composites were processed using field-assisted sintering technology at 1350°C for 5 min under vacuum. Dense SiCN–Y₂O₃ composite pellets were successfully made with relative density higher than 98% and homogeneous microstructure. Due to low temperature and short time of the heat-treatment, the grain growth of Y₂O₃ was substantially inhibited. The Y₂O₃ grain size was ∼1 μm after sintering. The composites’ heat capacity, thermal diffusivity, and thermal expansion coefficients were characterized as a function of temperature. The thermal conductivity of the composites ceramics decreased as the amount of amorphous SiCN increased and the coefficient of thermal expansion (CTE) of the composites increased with Y₂O₃ content. However, the thermal conductivity and CTE did not follow the rule of mixture. This is likely due to the partial oxidation of SiCN and the resultant impurity phases such as Y₂SiO₅, Y₂Si₂O₇, and Y_4.67(SiO₄)₃O.