C波段CMOS射频前端电路设计与实现

设计了一款工作在C波段(4.2 GHz)的CMOS射频前端电路,电路包括低噪声放大器和Gilbert型有源双平衡混频器.其中低噪声放大器采用共源和共栅放大器方式,实现了单端输入到差分输出的变换;而混频器的输出端采用电感负载形式.电路采用SMIC 0.18μmRF工艺实现,测试结果表明,混频器的输出频率约为700 MHz,电路的功率增益为24 dB,单边带噪声指数为8 dB,在1.8 V工作电压下,电路总功耗为36 mW.     

0.1 GHz～18 GHz单电源宽带低噪声放大器

基于GaAs增强型pHEMT工艺,设计了一款单电源供电、工作频率覆盖0.1 GHz～18 GHz单片集成宽带低噪声放大器芯片。在同一芯片上集成分布式低噪声放大器和有源偏置电路,通过有源偏置电路为分布式放大器提供栅压实现放大器单电源供电。在片测试结果表明,放大器在+5 V工作电压下,工作电流60 mA,在0.1 GHz～18 GHz工作频段范围内实现小信号增益18 dB,输出P1 dB（1 dB压缩点输出功率）典型值12 dBm,噪声系数典型值2.5 dB。放大器的芯片尺寸为2.4 mm×1.0 mm×0.07 mm。     

Ka波段单片自偏压低噪声放大器

本文介绍了一款基于0.15μm PHEMT工艺的Ka波段自偏压单片低噪声放大器(LNA)。该款低噪声放大器采用四级级联的电路结构,前两级采用源极电感负反馈同时获得较好的输入驻波和噪声;采用电阻自偏压技术,单电源供电,使用方便。该款低噪声放大器在26~40GHz频段内增益为22±1dB,噪声优于3dB;在36GHz处噪声优于2.5dB。芯片尺寸为2.0mm×1.0mm×0.1mm。     

基于WCDMA接收机系统的低噪声放大器设计

介绍了低噪声放大器的基本工作原理,并对噪声源进行了分析。提出了采用先进的TSMC90 nm工艺,设计了一种基于WCDMA接收机系统的全差分拓扑共源共栅型低噪声放大器。该放大器片内集成了电感、电容,片外配置匹配网络。芯片测试结果表明:电路在2 GHz工作频率下,电压增益达到20 dB、噪声系数NF为1.4 dB、IIP3为-3.43 dBm。综合各项数据表明,该低噪声放大器具备良好的性能,可广泛适用于通讯系统之中。     

0.6～18.0 GHz超宽带低噪声放大器MMIC

基于0.15μm GaAs E-pHEMT工艺设计并制备了一款0.6～18.0 GHz的低噪声放大器单片微波集成电路。该放大器使用一级共源共栅结构,通过负反馈实现宽带的匹配设计。同时在共栅晶体管栅极增加到地电容,共源管和共栅管漏极增加峰化电感,以提高高频增益,扩展带宽,改善噪声。常温在片测试结果表明,在3.3 V单电源供电下,0.6～18.0 GHz频带内该款低噪声放大器噪声系数典型值1.5 dB,小信号增益约15 dB,增益平坦度小于±0.9 dB,输入、输出电压驻波比典型值分别为1.7和1.8,1 dB压缩点输出功率典型值14 dBm,功耗72.6 mW,芯片面积1.5 mm×1.2 mm。     

有源电感复用型2.4GHz/5.2GHz双频段LNA

采用可调谐有源电感复用结构,设计了一款用于3G TD-SCDMA和WLAN的2.4GHz/5.2GHz双频段低噪声放大器(DB-LNA)。2.4GHz频段电路采用折叠共源共栅(FC)结构,5.2GHz频段电路采用共栅(CG)结构。FC和CG结构均采用可调谐有源电感,通过调谐有源电感的等效阻抗,优化匹配到源阻抗。基于TSMC 0.18μm CMOS工艺,实现了有源电感复用型DB-LNA。ADS仿真结果表明,频率为2.4GHz时,S21=35dB,NF=4.42~4.59dB,IIP3=0dBm,P-1dB=-14dBm;频率为5.2GHz时,S21=34dB,NF=2.74~2.75dB,IIP3=-5dBm,P-1dB=-9dBm。     

S波段平衡式限幅MMIC低噪声放大器设计

结合混合微波集成电路(HMIC)工艺和砷化镓单片微波集成电路(MMIC)工艺各自优势,设计制作了一款小型化大功率S波段平衡式限幅MMIC低噪声放大器.采用平衡式结构,提高了限幅功率容量和可靠性.由于金丝键合线的等效电感具有更高Q值,低噪声放大器单片的输入匹配采用外部金丝键合线匹配,有效降低了低噪声放大器单片的噪声系数.限幅器采用混合集成工艺制成,能够耐受较大功率.利用微波仿真软件,设计制作了兰格(Lange)电桥、限幅电路和低噪声放大器输入匹配等电路.最终产品尺寸仅为22 mm×16 mm×6 mm,在2.7～3.5 GHz内增益27 ～ 28 dB,噪声系数小于1.3 dB,驻波比小于1.3,该平衡限幅MMIC低噪声放大器可承受功率超过200 W、占空比为15％的脉冲功率冲击.     

有源电感的应用

介绍了3种由理想运算放大器组成的有源电感电路原理,利用理想运算放大器的特性推导出有源电感电路的等效阻抗。以50比陷波器为例讨论了有源电感的应用,用Multisim10对这3种有源电感构成的50Hz陷波器进行了仿真。仿真结果,证实了有源电感可以代替滤波器中的实际电感,同时分析了有源电感的损耗同滤波器滤波能力的关系。     

一种5~6 GHz宽带全集成CMOS低噪声放大器

采用55 nm标准CMOS工艺,设计并流片实现了一种应用于Wi-Fi 6(5 GHz)频段的宽带全集成CMOS低噪声放大器(LNA)芯片,包括源极退化共源共栅放大器、负载Balun及增益切换单元。在该设计中,所有电感均为片上实现;采用Balun负载,实现信号的单端转差分输出;具备高低增益模式,以满足输入信号动态范围要求。测试结果表明,在高增益模式下该放大器的最大电压增益为20.2 dB,最小噪声系数为2.2 dB;在低增益模式下该放大器的最大电压增益为15 dB,最大输入1 dB压缩点为-3.2 dBm。芯片核心面积为0.28 mm²,静态功耗为10.2 mW。     

用于蓝牙系统的0.18μm CMOS低噪声放大器设计

本文给出了一个利用中芯国际0.18μm CMOS工艺设计的用于蓝牙应用的单片低噪声放大器。放大器采用片内集成的螺旋电感实现单片集成的低噪声放大。在1．8V伏电源下,工作电流为2mA,在频率2．4GHz下功率增益大于10dB,输入反射小于-20dB。     

A novel noise optimization technique for inductively degenerated CMOS LNA

This paper proposes a novel noise optimization technique. The technique gives analytical formulae for the noise performance of inductively degenerated CMOS low noise amplifier (LNA) circuits with an ideal gate inductor for a fixed bias voltage and nonideal gate inductor for a fixed power dissipation, respectively, by mathematical analysis and reasonable approximation methods. LNA circuits with required noise figure can be designed effectively and rapidly just by using hand calculations of the proposed formulae. We design a 1.8 GHz LNA in a TSMC 0.25 pan CMOS process. The measured results show a noise figure of 1.6 dB with a forward gain of 14.4 dB at a power consumption of 5 mW, demonstrating that the designed LNA circuits can achieve low noise figure levels at low power dissipation.     

A Reconfigurable Low-Noise Amplifier Using a Tunable Active Inductor for Multistandard Receivers

A reconfigurable low-noise amplifier (LNA) based on a high-value active inductor (AI) is presented in this paper. Instead of using a passive on-chip inductor, a high-value on-chip inductor with a wide tuning range is used in this circuit and results in a decrease in the physical silicon area when compared to a passive inductor-based implementation. The LNA is a common source cascade amplifier with RC feedback. A tunable active inductor is used as the amplifier output load, and for input and output impedance matching, a source follower with an RC network is used to provide a 50 Ω impedance. The amplifier circuit has been designed in 0.18 µm CMOS process and simulated using the Cadence Spectra circuit simulator. The simulation results show a reconfigurable frequency from 0.8 to 2.5 GHz, and tuning of the frequency band is achieved by using a CMOS voltage controlled variable resistor. For a selected 1.5 GHz frequency band, simulation results show S ₂₁ (Gain) of 22 dB, S ₁₁ of ?18 dB, S ₂₂ of ?16 dB, NF of 3.02 dB, and a minimum NF (NFmin) of 1.7 dB. Power dissipation is 19.6 mW using a 1.8 V dc power supply. The total LNA physical silicon area is (200×150) µm².     

A Packaged and ESD-Protected Inductorless 0.1–8 GHz Wideband CMOS LNA

In this letter, an inductorless 0.1-8 GHz wideband CMOS differential low noise amplifier (LNA) based on a modified resistive feedback topology is proposed. Without using any passive inductors, the modified resistive feedback technique implemented with a parallel R-C feedback, an active inductor load, and neutralization capacitors achieves high gain, low noise, and good return loss over a wide bandwidth. To ensure the robustness in the system integration, electro-static discharge diodes are added to the radio frequency pads. The LNA was fabricated using a digital 90 nm CMOS technology. It achieves a 3 dB bandwidth of 8 GHz with a 16 dB voltage gain, noise figures from 3.4 dB to 5.8 dB across the whole band, and an input third-order intermodulation product (IIP3) of -9 dBm. The active area of the chip is 0.034 mm². The chip was packaged and tested on an FR4 PCB using the chip-on-board approach.     

一种极低噪声高增益微波单片低噪声放大器

报道了一种用于卫星通讯系统,基于0.5μm栅长增强型赝配高电子迁移率晶体管的两级级联微波单片低噪声放大器.采用集总参数元件来缩小电路面积进而在整个芯片内完成阻抗匹配.在50Ω端口测试条件下,该低噪声放大器在3.5～4.3GHz频率范围内,噪声系数小于0.9dB,增益大于26dB,回波损耗小于-10dB.这是至今为止报道的增益高于20dB的低噪声放大器中具有最小噪声系数的微波单片低噪声放大器,它主要归因于采用具有优异噪声性能的增强型赝配高电子迁移率晶体管以及本文提出的源极串联电感结合漏极应用一个小的稳定电阻来减小输入匹配网络寄生电阻的电路结构.     

Design of a High Performance 2-GHz Direct-Conversion Front-End With a Single-Ended RF Input in 0.13 $mu$m CMOS

A 2.1 GHz CMOS front-end with a single-ended low-noise amplifier (LNA) and a double balanced, current-driven passive mixer is presented. The LNA drives an on-chip transformer load that performs single-ended to differential conversion. A detailed comparison in gain, noise, and second and third order linearity performance is presented to motivate the choice of a current-driven passive mixer over an active mixer. The front-end prototype was implemented on a 0.13 $mu$m CMOS process and occupies an active chip area of 1.1 mm $^{2}$. It achieves 30 dB conversion gain, a low noise figure of 3.1 dB (integrated from 40 KHz to 1.92 MHz), an in-band IIP3 of ${-}$12 dBm, and IIP2 better than 39 dBm, while consuming only 12 mW from a 1.5 V power supply.      

Design of on-chip 15-18 GHz ultra low noise amplifier

With rapid development communication system, high signal to noise ratio （SNR） system is required. In high frequency bandwidth, high loss, low Q inductors and high noise figure is a significant challenge with on-chip monolithic microwave integrated circuits （MMICs）. To overcome this problem, high Q, low loss transmission line characteristics was analyzed. Compared with the same inductor value of the lumped component and the transmission line, it has a higher Q value and lower loss performance in high frequency, and a 2-stage common-source low noise amplifier （LNA） was presented, which employs source inductor feedback technology and high Q low loss transmission line matching network technique with over 17.6 dB small signal gain and 1.1 dB noise figure in 15 GHz-18 GHz. The LNA was fabricated by WIN semiconductors company 0.15 μm gallium arsenide （GaAs） P high electron mobility transistor （P-HEMT） process. The total Current is 15 mA, while the DC power consumption is only 45 mW.     

Design of integrated low noise amplifiers (LNA) using embedded passives in organic substrates

The noise figure of a low noise amplifier (LNA) is a function of the quality factor of its inductors. The lack of high-Q inductors in silicon has prevented the development of completely integrated complementary metal oxide semiconductor (CMOS) LNAs for high sensitivity applications like global system for mobile communications (GSM) (1.9 GHz) and wideband code-division multiple-access (W-CDMA) (2.1GHz). Recent developments in the design of high-Q inductors (embedded in low cost integrated circuit (IC) packages) have made single-package integration of RF front-ends feasible. These embedded passives provide a viable alternative to using discrete elements or low-Q on-chip passives, for achieving completely integrated solutions. Compared to on-chip inductors with low Q values and discrete passives with fixed Q/sub s/, the use of these embedded passives also leads to the development of the passive Q as a new variable in circuit design. However, higher Q values also result in new tradeoffs, particularly with respect to device size. This paper presents a novel optimization strategy for the design of completely integrated CMOS LNAs using embedded passives. The tradeoff of higher inductor size for higher Q has been adopted into the LNA design methodology. The paper also presents design issues involved in the use of multiple embedded components in the packaging substrate, particularly with reference to mutual coupling between the passives and reference ground layout.     

一种应用于GPS接收机的全单片CMOS低噪声放大器

采用0.18μm1.8V mixed CMOS工艺设计并实现了一种应用于GPS接收机的CMOS低噪声放大器,采用片内螺旋电感实现输入匹配和单片集成。测试结果表明在1.575GHz时,工作电流8mA,增益20dB,噪声系数小于1.7dB,IIP3为-10dBm。     

A CMOS low noise amplifier with integrated front-side micromachined inductor

The paper presents the design and characterization of a low noise amplifier (LNA) in a 0.18 μm CMOS process with a novel micromachined integrated stacked inductor. The inductor is released from the silicon substrate by a low-cost CMOS compatible dry front-side micromachining process that enables higher inductor quality factor and self-resonance frequency. The post-processed micromachined inductor is used in the matching network of a single stage cascode 4 GHz LNA to improve its RF performance. This study compares performance of the fabricated LNA prior to and after post-processing of the inductor. The measurement results show a 0.5 dB improvement in the minimum noise figure and a 1 dB increase in gain, while good input matching is maintained. These results show that the novel low-cost CMOS compatible front-side dry micromachining process reported here significantly improves performance and is very promising for System-On-Chip (SOC) applications.     

Narrow-band low-noise amplifier synthesis for high-performance system-on-chip design

In this paper, we present a systematic synthesis methodology for fully integrated narrow-band CMOS low-noise amplifiers (LNAs) in high-performance system-on-chip (SoC) designs. The methodology is based on deterministic gradient-based numerical nonlinear optimization and the normal boundary intersection (NBI) method for Pareto optimization. We simultaneously optimize transistor widths, bias voltages, and input and output matching network passive components, which yields integrated inductor values that are more than one order of magnitude less than those generated by several existing equation-based LNA design techniques. By generating significantly smaller inductor values, we enable the SoC integration of the complete LNA. When the synthesized LNAs are characterized using circuit-level simulation, our methodology yields up to 35% and 58% improvement in noise figure and gain, respectively.