SiC纤维表面去碳处理对PIP-SiCf/SiC复合材料力学性能以及界面影响

采用强度测试、SEM、HRTEM等分析测试手段对纤维表面去碳前后SiC纤维强度、复合材料力学性能、纤维表面形貌、复合材料断口形貌以及复合材料界面特征进行分析表征.结果表明,去碳处理后,纤维表面的固有缺陷暴露出来,纤维强度下降约15%,但由其制备的复合材料强度下降只有原纤维制备复合材料的1/6;复合材料断口非常平整,纤维...     

不同工艺对SiC／Cu复合材料界面结合的影响

采用包裹法和机械合金法制备了SiC：Cu为20：80（体积比）的SiC／Cu复合材料。采用XRD，SEM及EDAX能谱对粉体和烧成样品的物相、断口显微形貌及断口物质成分进行了表征。结果表明：采用包裹法在制备复合粉体过程中出现Cu2O，其含量在烧结过程中减少，包裹法制备的烧成样品SiC颗粒和Cu结合成“核．壳”结构，两相分布比机械合金法更均匀，界面结合更好，强度更高。     

Cu/Mo双涂层改性SiCf/Ti6Al4V复合材料的界面与性能

采用箔-纤维-箔(FFF)法分别制备无涂层、C涂层和Cu/Mo双涂层改性的SiCf/Ti6Al4V复合材料,对制备态复合材料的力学性能和界面微观组织进行对比分析,进一步研究不同真空热暴露处理对Cu/Mo双涂层改性复合材料的界面微区的影响规律。结果表明,制备态下Cu/Mo涂层比C涂层较好地改善了复合材料的界面组织和性能,且对基体和纤维中元素扩散均具有一定的阻挡作用;求得900℃下SiCf/Cu/Mo/Ti6Al4V界面反应的生长动力学公式为H=1.380t1/2+5.397。     

Preparation of SiCp/Cu composites by Ti-activated pressureless infiltration

Sessile drop technique was used to investigate the influence of Ti on the wetting behaviour of copper alloy on SiC substrate. A low contact angle of 15° for Cu alloy on SiC substrate is obtained at the temperature of 1 100℃. The interfacial energy is lowered by the segregation of Ti and the formation of reaction product TiC, resulting in the significant enhancement of wettability. Ti is found to almost completely segregate to Cu/SiC interface. This agrees well with a coverage of 99.8%Ti at the Cu/SiC interface predicted fi＇om a simple model based on Gibbs adsorption isotherm. SiCp/Cu composites are produced by pressureless infiltration of copper alloy into Ti-activated SiC preform. The volume fraction of SiC reaches 57%. The densiflcation achieves 97.5%. The bending strength varies fi＇om 150 MPa to 250 MPa and increases with decreasing particle size.     

Ni-P镀层对Cu/Al钎焊界面结构及性能的影响机制

为了研究Ni-P镀层对Cu/Al异种金属钎焊界面反应的影响,首次采用Zn98Al和BAl67CuSi两种钎料对含/不含Ni-P镀层的T2紫铜与3003铝合金进行了高频钎焊,获得4种不同的钎焊接头,分别对接头Cu侧界面结构、抗剪强度、断口形貌、显微硬度及弯曲形貌进行了系统研究,并与无镀层接头进行对比. 结果表明,T2表面镀覆Ni-P后,Cu/Zn98Al/Al接头中Cu基体/钎缝界面结构由扩散层+8.8 μm厚的Cu_3.2Zn_4.2Al_0.7化合物转变为1.5 μm厚的Al₃Ni化合物,而Cu/BAl67CuSi/Al接头中Cu基体/钎缝界面结构由扩散层+15 μm厚CuAl₂转变为1.8 μm厚Cu₃NiAl₆;与无镀层接头相比,镀覆Ni-P后,Cu/Zn98Al/Al接头强度略有上升,Cu/BAl67CuSi/Al接头强度略有下降,但两种接头的韧性均明显增强,力学性能试验结果与接头Cu侧界面微观组织转变规律相符. 最后建立了Cu/Al接头的界面反应模型,并阐明了Ni-P镀层对Cu/Al接头界面结构和力学性能的影响机制.     

Effects of SiC interfacial coating on mechanical properties of carbon fiber needled felt reinforced sol-derived Al2O3 composites

3D carbon fiber needled felt and polycarbosilane-derived SiC coating were selected as reinforcement and interfacial coating, respectively, and the sol−impregnation−drying−heating (SIDH) route was used to fabricate C/Al₂O₃ composites. The effects of SiC interfacial coating on the mechanical properties, oxidation resistance and thermal shock resistance of C/Al₂O₃ composites were investigated. It is found that the fracture toughness of C/Al₂O₃ composites was remarkably superior to that of monolithic Al₂O₃ ceramics. The introduction of SiC interfacial coating obviously improved the strengths of C/Al₂O₃ composites although the fracture work diminished to some extent. Owing to the tight bonding between SiC coating and carbon fiber, the C/SiC/Al₂O₃ composites showed much better oxidation and thermal shock resistance over C/Al₂O₃ composites under static air.     

碳纤维增强Cu-Ti3SiC2复合材料的研究

采用电镀Cu碳纤维（Cf）与化学镀Cu的Ti3SiC2粉及Cu粉进行湿混,通过真空热压烧结法制备Cf增强的Cu-Ti3SiC2复合材料。研究了其致密度、电阻率、维氏硬度随Cf,Ti3SiC2含量变化的规律。实验结果表明,Ti3SiC2体积含量为20％,Cf体积含量为8％时,制备的Cf增强Cu-Ti3SiC2复合材料综合性能最好。Cf镀Cu和Ti3SiC2镀Cu改善了它们和Cu的润湿性,从而提高了相互之间的结合强度是复合材料获得良好综合性能的基本原因。     

Wetting of molten Sn-3.5Ag-0.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite

The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC) coated SiC_p/Al substrates was investigated by electroless Ni plating process, and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed. The SiC particles are evenly distributed in the coating and enveloped with Ni. No reaction layer is observed at the coating/SiC_p/Al composite interfaces. The contact angle increases from ～19° with the Ni-P coating to 29°, 43° and 113° with the corresponding Ni-P-3SiC, Ni-P-6SiC and Ni-P-9SiC coatings, respectively. An interaction layer containing Cu, Ni, Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiC_p/Al interfaces, and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer. Moreover, the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC) coatings through the Ni-P/SiC interface and dissolve them to contact the SiC_p/Al substrate.     

SiCf/Ti-6Al-4V复合材料界面反应动力学

SiC纤维增强Ti基复合材料（SiCf／Ti）容易发生界面反应，从而影响其力学性能。开展界面反应和动力学的研究，对于SiCdTi复合材料的制备和服役具有指导意义。采用扫描电镜、透射电镜和X射线衍射分析了SICf／Ti-6Al—4V复合材料的界面反应及其动力学，发现SiC纤维的C涂层与Ti-6Al—4V反应形成粗晶粒的和细晶粒的TiC，长期高温热处理使得界面反应加剧，TiC层加厚，当C涂层完全消耗后，界面反应层中除了TiC外，还出现了Ti3SiC2。研究表明，界面反应层的加厚受元素扩散控制，服从抛物线规律，求出的动力学参数Q为268．8kJ／mol，k为0．0057m/s1/2。     

导电陶瓷Ti3SiC2颗粒表面无敏化活化的化学镀铜

利用无敏化、活化的化学镀覆技术能成功地在Ti3SiC2颗粒表面均匀地化学镀铜。实验表明：镀前对陶瓷颗粒进行严格的粗化处理,使其表面具有很强的催化中心,通过采用合适的镀液配方和工艺,能成功地在Ti3SiC2颗粒表面镀覆一层铜,从而增强了陶瓷TisSiC2颗粒和铜基体之间的界面结合力,为Ti3SiC2在复合材料领域中的应用开辟了更广阔的前景。     

SiCf/Ti-6Al-4V复合材料的界面研究

采用扫描电镜、透射电镜和X射线衍射仪研究了用中国制备SiC纤维增强的Ti-6Al-4V复合材料的界面反应,发现在SiC纤维的C涂层和Ti-6Al-4V基体之间形成的界面反应产物为细晶粒和粗晶粒的TiC,而无C涂层的SiCf/Ti-6Al-4V的界面反应产物,从SiC纤维到Ti-6Al-4V基体,依次为细晶粒的TiC+Ti5Si3、粗晶粒的TiC和Ti3SiC2.还测量了界面反应区厚度并讨论了界面反应机理.     

SiCf／Ti-6AI-4V复合材料的界面研究

采用扫描电镜、透射电镜和x射线衍射仪研究了用中国制备SiC纤维增强的Ti-6AI-4V复合材料的界面反应，发现在SiC纤维的C涂层和Ti-6AI-4V基体之间形成的界面反应产物为细晶粒和粗晶粒的TiC，而无C涂层的SiCf／Ti．6AI．4V的界面反应产物，从SiC纤维到Ti-6AI-4V基体，依次为细晶粒的TiC＋Ti5Si3、粗晶粒的TiC和Ti3SiC2。还测量了界面反应区厚度并讨论了界面反应机理。     

激光熔覆ZrB2-SiC增强Cu基复合涂层的微观结构与摩擦学性能

为了提高铜表面的强度和耐磨性,以复合粉末(Zr、Si、Ni包B4C、Cu)为原料,采用激光辅助原位合成技术,在纯铜基体表面制备了ZrB₂-SiC/Cu复合涂层。通过XRD、SEM和TEM分析了复合涂层的表面形貌、微观结构、相组成和界面结合,并测试了不同增强相含量熔覆层的硬度和摩擦学性能。结果表明：通过设计的原位化学反应成功在铜基体内合成了微米级针状ZrB₂和纳米级颗粒状SiC。增强相均与基体形成了清洁、无杂相的界面。2种不同维度与尺寸的增强体,通过多种强化机制,显著改善了复合涂层的力学性能;通过调整激光工艺参数可实现增强体尺寸的控制,随着增强相含量的提高,复合涂层的平均硬度和耐磨损性逐渐增加。当增强相含量为30%(质量分数,下同)时,复合涂层的平均硬度(HV0.2)为3028 MPa,约为纯铜的5.6倍。30%增强相涂层的载流磨损率与10%增强相的涂层相比,降低了约80%。较高含量增强相的复合涂层表现出优异的摩擦学性能。     

表面硅化对C/C复合材料组织结构的影响

采用表面固相渗硅工艺在C/C复合材料表面制备SiC涂层 ,研究了制备工艺对涂层和C/C复合材料组织结构的影响。结果表明 :硅化反应时间对C/C复合材料的SiC涂层厚度影响不大 ;C/C复合材料组织中热解碳基体与碳纤维相比 ,更易与Si反应生成SiC ,说明碳纤维的稳定性高于热解碳 ,Si通过界面和材料缺陷扩散深入基体内部。     

原位生长碳纳米管及其在SiC_f/SiC复合材料中的应用

采用碳纳米管改善纤维与基体间的界面结合,同时利用碳纳米管自身的优异性能对碳化硅纤维增强碳化硅复合材料(SiCf/SiC)进行二次增强。通过化学气相沉积工艺(CVD)在SiC纤维编织件内原位生长碳纳米管,优化碳纳米管原位生长过程中的碳源流量、反应温度和反应时间等工艺参数,对碳纳米管的原位生长工艺及机理进行系统分析,并结合先驱体浸渍裂解工艺(PIP)制备CNTs-SiCf/SiC复合材料,探讨原位生长碳纳米管的引入对复合材料力学性能的影响。结果表明,优化后的工艺参数如下:反应温度750℃,C2H2、H2和N2流量比1/1/3,C2H2流量100~150 mL/min,反应时间60 min;碳纳米管的引入使SiCf/SiC复合材料的弯曲强度、弯曲模量和断裂韧性分别提高了16.3%、90.4%和106.3%。     

TENSILE PROPERTIES OF COATED CARBON FIBER REINFORCED MAGNESIUM COMPOSITES

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Cold spray of SiC and Al<Subscript>2</Subscript>O<Subscript>3</Subscript> with soft metal incorporation: A technical contribution

Al + SiC, Al + Al₂O₃ composites as well as pure Al, SiC, and Al₂O₃ coatings were prepared on Si substrates by the cold gas dynamic spray process (CGDS or cold spray). The powder composition of metal (Al) and ceramic (SiC, Al₂O₃) was varied into 1:1 and 10:1 wt.%, respectively. The propellant gas was air heated up to 330 °C and the gas pressure was fixed at 0.7 MPa. SiC and Al₂O₃ have been successfully sprayed producing coatings with more than 50 μm in thickness with the incorporation of Al as a binder. Also, hard ceramic particles showed peening effects on the coating surfaces. In the case of pure Al metal coating, there was no crater formation on hard Si substrates. However, when Al mixed with SiC and Al₂O₃, craters were observed and their quantities and sizes depended on the composition, aggregation and size of raw materials.     

Evaluation of the interfacial bonding between fibrous substrate and sputter coated copper

The sputter coatings provide new approaches to the functionalization of textile materials. One of the key issues in the use of sputter coatings onto textiles is the interfacial adhesion between the coated layer and the fiber substrate. The interfacial bonding between polypropylene (PP) fibrous substrate and sputter coated copper was investigated and discussed by abrasion test and peel-off test in this study. It was found that the plasma pretreatment and heating during the sputter coating process obviously improved the adhesion of the coating layer to the PP fibrous substrate. The mechanism of the interfacial adhesion between copper and PP substrate was also examined by atomic force microscopy. The AFM observations revealed the surface and interfacial structures of the PP fibers.     

The concept of a strong interface applied to SiC/SiC composites with a BN interphase

Strong interfaces have been shown to allow improvement of the mechanical properties of ceramic matrix composites (CMC). The concept of a strong interface has been established in SiC/SiC composites with pyrocarbon (PyC) or multilayered (PyC/SiC) fiber coatings (also referred to as interphases). The present paper reports an attempt directed at applying the concept of a strong interface to SiC/SiC composites with a BN coating (referred to as SiC/BN/SiC). Fiber bonding and frictional sliding were investigated by means of push-out tests performed on 2D-composites as well as on microcomposite samples, and tensile tests performed on microcomposites. The stress–strain behavior of the SiC/BN/SiC composites and microcomposites is discussed with respect to interface characteristics and location of debonding either in the coating or in the fiber/coating interface.     

Interfacial characterization of a slurry-cast melt-infiltrated SiC/SiC ceramic-matrix composite

An SiC-particulate, silicon-metal melt-infiltration-matrix composite reinforced with SiC fibers is being developed for combustor applications under the High Speed Civil Transport (HSCT) Enabling Propulsion Material (EPM) Program. A major part of this effort has dealt with the characterization and optimization of the boron nitride (BN) based fiber/matrix interface. BN was chosen as the primary interfacial material due to its inherently weak structure and thus good crack-deflecting ability, ease of deposition by chemical vapor infiltration (CVI) into woven fiber preforms, and relatively good environmental stability. Topics discussed in this paper include an overview of the differences in composite microstructure between the EPM SiC/SiC material and a more conventional CVI SiC/SiC composite material, the microstructure/property relationships for the EPM SiC/SiC composite with two different types of SiC fiber (High-Nicalon and Sylramic^™), and the effect of moist, high-temperature environments on the stability of the BN interface.