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利用XRD及TEM方法测定了真空气压渗流法制备的四种基体复合材料及其界面区域的相组成。 相似文献
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采用干压成形将200μm与10μm的SiC颗粒按不同配比混合制得多孔陶瓷预制体,当粗、细颗粒质量比为8∶2时,预制体相对密度达到最大值75%。采用挤压铸造工艺制得陶瓷含量为75%的SiC/2024Al复合材料,研究了预制体氧化处理对复合材料力学性能的影响。未氧化处理的预制体经挤压铸造所得的复合材料抗弯强度达到288MPa,断裂韧性达到8.7MPa.m1/2;预制体经氧化处理后所得的复合材料的相对密度、抗弯强度和断裂韧性较未氧化处理的有所降低,但硬度变化不大,HRA约为70。复合材料失效破坏的主要机制是SiC大颗粒解理断裂和小颗粒与金属基体界面解离。 相似文献
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时效是提高金属基复合材料力学性能和增强材料稳定性的重要方法,颗粒增强铝基复合材料的时效带来的强化效果有时甚至大于颗粒添加带来的弥散增强效果,深入研究时效析出行为对改进热处理工艺和复合材料的优化设计有至关重要的指导性作用.在当前开展的颗粒增强铝基复合材料时效行为研究的基础上,从时效机理出发,重点分析了基体、颗粒增强体、热处理工艺及加工工艺等对陶瓷颗粒增强铝基复合材料时效析出的影响,评述了当前主要采用的几种颗粒增强铝基复合材料时效析出行为的研究方法,展望了未来颗粒增强铝基复合材料时效行为可能的研究方向. 相似文献
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采用粒径为1μm的SiC颗粒,用挤压铸造法制备出体积分数为45 %的SiCP/2024Al复合材料,研究了位错对高体积分数SiCP/2024Al时效行为的影响。结果表明,复合材料中的高密度位错可以湮灭大量的淬火空位,这在一定程度上抑制了GP区的析出。但是,高密度位错的存在降低了其它析出相的热扩散激活能,促进了析出相形核;还能为原子的管道扩散提供通道,促进了溶质原子的扩散,加速析出相的长大,在宏观上表现为对时效行为的促进,使峰时效提前。高密度的位错为强烈依赖于位错等缺陷形核的θ'和S'相提供许多优先形核的场所,使复合材料中的形核密度增加,同时使析出相的尺寸减小,所以复合材料中的析出相呈现细小弥散的分布特点。 相似文献
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高体积分数SiCp/Al复合材料具有优异的热物理性能,且密度较低,是非常理想的电子封装材料。但是由于其本身高的脆性和硬度,使得该材料很难通过二次机械加工成所需要的形状,严重制约了该材料的应用。采用粉末注射成形-无压熔渗工艺成功实现了高体积分数SiCp/Al复合材料的近净成形。采用该工艺所制备的复合材料的致密度高于99%,可实现热膨胀系数在(5~7)×10-6K-1范围内进行调节,材料的热导率高于185 W/(m.K),抗弯强度高于370 MPa,气密性可达10-11Pa.m3.s-1,各项指标均可以满足电子封装对材料的性能要求,另外为了实现SiCp/Al复合材料与其他材料的封接,项目成功开发了一种Al-Si-Cu系焊料,封接后器件的各项性能指标尤其是气密性也均能满足使用要求。 相似文献
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采用微波烧结的方法,在烧结温度分别为680℃,710℃,740℃,770℃,800℃制备了15%的SiCp/Al复合材料。探讨温度对材料的致密度和力学性能的影响。结果表明:致密度和材料硬度及冲击韧性随温度变化呈马鞍形,在770℃样品的密度和硬度及冲击韧性达到最佳值,分别为2.62g/cm3,42.6MPa,40J/cm2。结论:用微波烧结SiCp/Al复合材料可在短时间内使样品达到烧结致密化,缩短烧结时间,节约能源。 相似文献
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应用ABAQUS软件对SiC_p/Al复合材料薄壁板的变形进行仿真研究,得出了载荷施加位置、SiC颗粒体积分数对SiC_p/Al复合材料薄壁板变形及应力的影响规律。结果表明:随载荷施加位置沿约束方向从薄壁板的中间向端部移动,薄壁板的最大变形和最大应力增加趋势越来越明显;随着载荷施加位置距约束端距离的增加,薄壁板的最大变形和最大应力呈增加趋势。随着SiC颗粒体积分数从5%增加到40%,薄壁板的变形和应力均变化不大,当体积分数从40%增加到56%时,应力明显减小,载荷作用位置距离约束端越远,最大变形减小的趋势越大。 相似文献
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7075Al/SiCp复合材料的热压缩变形流变应力和组织行为 总被引:3,自引:0,他引:3
采用圆柱试样在Gleeble-1500热模拟机上对喷射沉积7075Al/SiCp复合材料进行高温压缩变形实验,实验条件为:变形温度300~450℃,应变速率0.001~1s-1.结果表明:7075Al/SiCp复合材料的流变应力大小受到变形温度和应变速率的强烈影响,流变应力随应变的增加而逐渐增加,出现一峰值后逐渐下降;流变应力随变形温度的升高、应变速率的降低而降低.可用Zener-Hollomon参数的双曲正弦形式来描述7075Al/SiCp复合材料高温压缩变形流变应力.随着变形温度的升高和应变速率的降低,7075Al/SiCp复合材料热变形过程中SiCp的分布逐渐均匀化,有利其热加工性能的改善. 相似文献
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Xiufang WANG Gaohui WU Dongli SUN Longtao JIANG Yuanyuan HANSchool of Materials Science Engineering Harbin Institute of Technology Harbin ChinaSchool of Materials Science Engineering Harbin Institute of Science Technology Harbin China 《材料科学技术学报》2004,(2)
2024 Al matrix composite reinforced by SiC particles with 45% volume fraction and 1μm diameter was successfully fabricated by squeeze-exhaust casting method. The aging behavior of SiCp/2024AI composite at four temperatures was investigated and compared to 2024 alloy. It was found that the addition of high volume fraction SiC particles does not alter the aging sequence, but it significantly accelerates the kinetics of precipitation in the composite matrices. Therefore, the aging peak of the composite appears earlier than that of 2024AI alloy. This is attributed to the decrease in the activation energy for the precipitate formation and the increase in the precipitate growth rate due to the high density dislocations in the composite with high volume fraction particles. The high density dislocations, as preferential nucleation sites for precipitates, bring about the tiny and dense precipitates in the composite. 相似文献
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许晓静 《理化检验(物理分册)》2002,38(5):194-196
对SiCp/2024Al复合材料在不同温度下超塑性变形后的断口形貌进行了分析,结果表明,变形温度愈高,晶界结合强度愈低,沿晶断裂愈明显,晶界滑动愈易实现;超塑性变形需要强度适中的晶界结合;典型超塑变形条件下的断口呈晶界圆滑型沿晶断裂。 相似文献
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数值模拟SiCp/Al复合材料的微观结构对力学性能的影响 总被引:1,自引:0,他引:1
本文运用有限元法模拟了SiC颗粒体积分数和颗粒尺寸对SiCp/Al复合材料弹性模量、屈服强度、延伸率的影响。为了建立与真实显微结构相似的复合材料模型,假定任意尺寸的SiC颗粒随机地分布在SiCp/Al复合材料中。计算结果表明:SiC颗粒体积分数对复合材料的力学性能的影响更加显著。随着体积分数的增加,SiCp/Al复合材料的弹性模量和屈服强度逐渐增加;而其延伸率会相应降低。其应力应变曲线由韧性材料的特性向脆性材料的特性逐渐过渡。相反,当平均颗粒尺寸在一定的范围内变化时,颗粒尺寸对其应力-应变曲线的影响并不显著。 相似文献
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Y. T. Yao 《Materials and Manufacturing Processes》2016,31(10):1286-1291
In order to improve the wettability between Al melt and B4C ceramic preform during fabricating B4C/Al composites by pressureless infiltration technique, trace amount of Ti particulates with high melting point was added into the starting materials as infiltration inducer. A simple and cost-effective method, metal-assisted pressureless infiltration technique, was developed to fabricate light-weight B4C/Al composites. The microstructure, phases, and mechanical behavior of B4C/Al composites were characterized by SEM, XRD, and mechanical property test. The density of the as-fabricated B4C/Al composites was about 2.75 g/cm3 and the relative density of this kind of composites was over 97%. The as-fabricated B4C/Al composites exhibited rather well wear resistance. The flexural and compressive strengths of the as-fabricated B4C/Al composites were about 200 MPa and 670 MPa, respectively. 相似文献
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《Materials Science & Technology》2013,29(12):1397-1401
AbstractThe coefficient of thermal expansion (CTE) of spark plasma sintering consolidated SiCp/Al composites with various size distributions was investigated with the combination of experimental measurements and modelling analyses. The CTE of the composites decreased with increasing particle volume fraction, and large particles played a major role in the decline of CTE. The measured CTE lay between the predictions of Kerner model and Schapery lower bound, but the possible formation of percolating particle network and the influence of matrix plasticisation led to the slight deviation of the experimental values from model predictions. A CTE peak appeared for all the composites with increasing temperature to about 250–300°C due to the action of matrix plasticisation filling the microvoids in the composites. The composites with mixed particles of substantially different sizes were prone to concentrate thermal stresses on large particles, which induced an early appearance of matrix plastic deformation that can result in a comparably low CTE peak temperature. 相似文献
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A functionally Graded 15-35 volume% silicon carbide particulate (SiCp) reinforced Al359 metal matrix composite (SiCp/Al MMC) was drilled by electrical discharge machining (EDM) to assess the machinability and workpiece quality. The machining conditions were identified for both the machining performance and workpiece quality of the EDM process, including some aspects of material removal mechanisms, material removal rate (MRR), electrode tool wear, and subsequent drilled hole quality including surface texture and roundness by using surface profilometry, coordinate measuring machine (CMM), and scanning electron microscopy (SEM). It was observed that the material removal rate increases with increasing peak current and pulse-on-time up to the optimal points and drops drastically thereafter. Higher peak current and/or pulse-on-time result in both the greater tool wear and the larger average diameter error. As the percentage of the SiC particles increases, MRR was increased and electrode wear was found to be decreased. At the EDM machined subsurface layer, the fragmented and melted SiC particles were observed under the SEM and EDX-ray examination. 相似文献