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1.
An 8 M /spl times/ 32 GDDR (graphic DDR) SDRAM operating up to 800-MHz clock (CLK) frequency is described. The GDDR SDRAM demands an effective control of CAS latency due to the large and wide number of CAS latencies at the CLK frequency. A wave-pipelined CAS latency control circuit is proposed to provide stable operation for the large and wide number of CAS latencies. The increase of CAS latency also causes a degradation of data bus efficiency at high-speed operation due to the large gap between input data (DINs) and output data (DOUTs) at the operation of write followed by read. A gapless write to read scheme improves the data bus efficiency by separating write data-path from read data-path for different banks accesses. Partial array activation commands can reduce the peak current, preventing the reduction of the data retention time of DRAM cells at high-speed operation. The GDDR SDRAM operates successfully at the CLK frequency of 800 MHz at 2.1 V and 700 MHz at 1.8 V, respectively. The power consumption is measured to be /spl sim/2 W at 1.9 V.  相似文献   

2.
A 5-Gb/s/pin transceiver for DDR memory interface is proposed with a crosstalk suppression scheme. The proposed transceiver implements a staggered memory bus topology and a glitch canceller to suppress crosstalk-induced distortions in a memory channel. The transceiver is implemented using 0.18 $mu$m CMOS process and operates at 5 Gb/s. The results demonstrate widened eye diagram and lower bit error rate. The eye width and height of the proposed scheme increases 28.3% and 11.1% compared to the conventional memory transceiver, respectively. The peak-to-peak jitter of output data is 52.82 ps.   相似文献   

3.
This paper proposes a deca-data rate clocking scheme and relevant I/O circuit techniques for a multi-Gb/s/pin memory interface. A deca-data rate scheme transmits 10 bits in one external clock cycle to transfer an error control code along with original data seamlessly without a timing bubble. A 288 Mb SDRAM has been designed using the proposed scheme combined with fast cycling core techniques to have both high I/O bandwidth and fast random cycling. Measured results show that the chip exhibits per-pin data rate of 8 Gb/s and row cycle time of 9.6 ns  相似文献   

4.
This paper describes a 144-Mb DRAM that operates at a random cycle of 5.6 ns and is capable of producing data rates of 1.4 Gb/s/pin. The 121-mm/sup 2/ die is fabricated in a 0.13-/spl mu/m logic-based process with embedded DRAM. The cycle time is achieved using an early-write sensing technique that eliminates most of the timing overhead associated with the write cycle. Dynamic-precharge decoding in the subarray decode path is implemented to improve the access time. An improved data-formatting circuit is used to arrange the exit order of the eight-word burst. These circuit techniques produce latencies of 5.0 ns. The DRAM uses a DDR3-SRAM interface and is function and package compatible with industry-standard DDR3 SRAMs. Highlights of the DDR3 interface include the use of active termination circuitry on all inputs. The active termination improves the data-eye window and improves data capturing with minimum data setup and hold.  相似文献   

5.
Three circuit techniques for a 1.5 V, 512 Mb graphic DDR4 (GDDR4) SDRAM using a 90-nm DRAM process have been developed. First, a dual-clock system increases clocking accuracy and expands internal timing margins for harmonious core operation regardless of external clock frequency. Second, a four-phase data input strobe scheme helps to increase the input data valid window. Third, a fully analog delay-locked loop which provides a stable I/O clock and has 31.67 ps peak-to-peak jitter characteristics is designed. On the basis of these circuit techniques, the data rate is 3.2 Gbps/pin, which corresponds to 12.8 Gbps in times32 GDDR4-based I/O. Also, a multidivided architecture consisting of four independent 128 Mb core arrays is designed to reduce power line and output noise.  相似文献   

6.
This paper describes three circuit technologies indispensable for high-bandwidth multibank DRAM's. (1) A clock generator based on a bidirectional delay (BDD) eliminates the output skew. The BDD measures the cycle time as the quantity charged or discharged of an analog quantity, and replicates it in the next cycle. This achieves a 0.18-mm 2, two-cycle-lock clock generator operating from 25 to 167 MHz with a 30-ps resolution. (2) A quad-coupled receiver eliminates the internal skew caused by the difference between a rise input and a fall input by 40%. (3) An interbank shared redundancy scheme (ISR) with a variable unit redundancy (VUR) efficiently increases yield in multibank DRAM's. The ISR allows redundancy match circuits to be shared with two or more banks. The VUR allows the number of units replaced to be variable. These circuit technologies achieved a 250-Mb/s/pin, 8-bank, 1-Gb double-data-rate synchronous DRAM  相似文献   

7.
8.
This paper presents architecture, circuits, and test results for a single-ended, simultaneously bidirectional interface capable of a total throughput of 8 Gb/s per pin. The interface addresses noise reduction challenges by utilizing a pseudodifferential reference with noise immunity approaching that of a fully differential reference. The transmitter supports on-chip termination, predistortion, and low-skew near-end outgoing signal echo cancellation. The receiver's sense amplifier evaluates the average of two differential input signals without use of analog components and utilizes imbalanced charge injection to compensate for offset voltages. A test chip integrated in a 0.35-/spl mu/m digital CMOS technology uses the proposed techniques to implement an 8-bit wide single-ended voltage-mode simultaneous bidirectional interface and achieves a performance of 8 Gb/s per pin.  相似文献   

9.
A 1.2-V 72-Mb double data rate 3 (DDR3) SRAM achieves a data rate of 1.5 Gb/s using dynamic self-resetting circuits. Single-ended main data lines halve the data line precharging power dissipation and the number of data lines. Clocks phase shifted by 0/spl deg/, 90/spl deg/, and 270/spl deg/ are generated through the proposed clock adjustment circuits. The latter circuits make input data sampled with an optimized setup/hold window. On-chip input termination with a linearity error of /spl plusmn/4.1% is developed to improve signal integrity at higher data rates. A 1.2-V 1.5-Gb/s 72-Mb DDR3 SRAM is fabricated in a 0.10-/spl mu/m CMOS process with five metals. The cell size and the chip size are 0.845 /spl mu/m/sup 2/ and 151.1 mm/sup 2/, respectively.  相似文献   

10.
A mixed-mode delay-locked loop (MDLL) for a 512 Mb graphics SDRAM is presented in this paper. The MDLL extends its lock range into the gigahertz realm by applying clock division and analog phase generation (APG). The divided clock from the MDLL is used for clocking logic and tracking deterministic access latency in the SDRAM. A short discussion of some of the side effects and advantages of using a divided, multi-phase clock for logic operation is presented. A low-power clock distribution network (CDN) based on the presented MDLL is also disclosed. Fabricated in a 1.5 V 95 nm triple-metal CMOS process, the MDLL achieves a measured RMS jitter of 4.6 ps and peak-to-peak jitter of 38 ps at GDDR4 mode with a 1 GHz clock. Power consumption for the entire MDLL-based CDN is 107 mW at 800 MHz and 1.5 V.  相似文献   

11.
A 1.6 Gb/s/pin 4-pulse-amplitude-modulated (PAM) multidrop signaling system has been designed. The motivation for multi-PAM signaling is discussed. The system uses single-ended+reference current-mode signaling with three dc references for maximum bandwidth per pin. A test chip with six I/O pins was fabricated in 0.35-μm CMOS and tested in a 28-Ω evaluation system using on-chip 210 pseudorandom bit sequence (PRBS) generator/checkers. Two different 4-PAM transmitter structures were designed and measured. A high-gain windowed integrating input receiver with wide common-mode range was designed in order to improve signal-to-noise ratio when operating with smaller 4-PAM input levels. Gray coding allowed a folded preamplifier architecture to be used in the LSB input receiver to minimize area and power. In-system margins are measured via system voltage and timing shmoos with a master communicating with two slave devices  相似文献   

12.
This paper presents a simultaneous bi-directional (SBD) 4-level I/O interface for high-speed DRAMs. The data rate of 4 Gb/s/pin was demonstrated using a 500-MHz clock generator and a full CMOS rail-to-rail power swing. The power consumed by the I/O circuit was measured to be 28 mW/pin, when connected to a 10-pF load, at a 1.8-V supply voltage. The transmitter uses a 4-level push-pull linear output driver and a 4-level automatic impedance controller, achieving the reduction of driver currents and the voltage margin as large as 200 mV. The receiver employs a hierarchical sampling scheme, wherein a differential amplifier selects three out of six reference voltage levels. This scheme ensures minimized sampling power and a wide common-mode sampling range. The 6-level reference voltage for sampling is generated by the combination of the transmitter replica. The proposed I/O interface circuits are fabricated using a 0.10-/spl mu/m, 2-metal layers DRAM process, and the active area is 330 /spl times/ 66 /spl mu/m/sup 2/. It exhibits 200 mV /spl times/ 690 ps eye windows on the given channel with a 1.8-V supply voltage.  相似文献   

13.
A bidirectional 80-km-reach 64-channel dense wavelength-division-multiplexing passive optical network with 50-GHz channel spacing based on wavelength-locked Fabry-Peacuterot laser diodes is demonstrated. By changing the position of the broadband light source (BLS) for the upstream channels to the remote node, both the need for a high-power BLS and the power penalties induced by backscattering are overcome. Packet-loss-free transmission is obtained, guaranteeing 125 Mb/s per channel (8-Gb/s capacity in a single direction) without the support of an optical amplifier  相似文献   

14.
132.2-Gb/s PDM-8QAM-OFDM Transmission at 4-b/s/Hz Spectral Efficiency   总被引:2,自引:0,他引:2  
In this letter, we investigate 132.2-Gb/s polarization- division-multiplexed orthogonal frequency-division-multiplexing (PDM-OFDM) transmission at 25-GHz channel spacing. We show that the nonlinear tolerance is dependent on the OFDM symbol length. By using 14.4-ns-long OFDM symbols, 7 $, times ,$132.2-Gb/s transmission of PDM-OFDM at 4-b/s/Hz spectral efficiency is reported over 1300-km standard single-mode fiber.   相似文献   

15.
An 87.7 mm2 1.6 GB/s 128 Mb chain FeRAM with 130 nm 4-metal CMOS process is demonstrated. In addition to small bitline capacitance inherent to chain FeRAM architecture, three new FeRAM scaling techniques - octal bitline architecture, small parasitic capacitance sensing scheme, and dual metal plateline scheme - reduce bitline capacitance from 100 fF to 60 fF. As a result, a cell signal of ±220 mV is achieved even with the small cell size of 0.252 ?m2. An 800 Mb/s/pin read/write bandwidth at 400 MHz clock is realized by installing SDRAM compatible DDR2 interface, and performance is verified by simulation. The internal power-line bounce noise due to 400 MHz clock operation is suppressed to less than 50 mV by an event-driven current driver, which supplies several hundreds of mA of current within 2 ns response. The precise timing and voltage controls are achieved by using the data stored in a compact FeRAM-fuse, which consists of extra FeRAM memory cells placed in edge of normal array instead of conventional laser fuse links. This configuration minimizes area penalty to 0.2% without cell signal degradation.  相似文献   

16.
We present a traveling-wave-electrode InP-based differential quadrature phase-shift keying modulator with a novel n-p-i-n waveguide structure. The structure features low electrical and optical propagation losses, which allow the modulator to operate at a high bit rate together with a low driving voltage and a low insertion loss. We successfully demonstrate 80-Gb/s modulation with a driving voltage of only 3 $hbox{V}_{rm pp}$ in a push–pull configuration. The chip size is just 7.5 mm$, times ,$ 1.3 mm.   相似文献   

17.
A full-duplex transceiver capable of 8-Gb/s data rates is implemented in 0.18-/spl mu/m CMOS. This equalized transceiver has been optimized for small area (329 /spl mu/m /spl times/ 395 /spl mu/m) and low power (158 mW) for point-to-point parallel links. Source-synchronous clocking and per-pin skew compensation eliminate coding bandwidth overhead and reduce latency, jitter, and complexity. This link is self-configuring through the use of automatic comparator offset trim and adaptive deskew. Comprehensive diagnostic capabilities have been integrated into the transceiver to provide link, interconnect, and circuit characterization without the use of external test equipment. With a resolution of 4 mV and 9 ps, these capabilities enable on-die eye diagram generation, equivalent time waveform capture, noise characterization, and jitter distribution measurements.  相似文献   

18.
8×2.5Gbit/s光时分复用信号产生系统   总被引:1,自引:0,他引:1  
介绍由2×2光纤耦合器进行级联实现的8×2.5Gbit/s光时分复用信号产生系统,信号源采用增益开关量子阱DFB激光器,脉冲周期为400ps。实验结果表明,采用这种方案实现的时分复用信号产生系统,插入脉冲的间隔均匀,脉冲的波动小且损耗低。  相似文献   

19.
An 8-Gb/s receiver is demonstrated in 0.35-/spl mu/m SiGe with two on-chip 60-fF ac-coupling capacitors. These capacitors are formed by on-chip metal layers and have a breakdown voltage of at least /spl plusmn/690 V, which is the dc input range of the receiver. The receiver especially resists strong ac common-mode edges with a slew rate up to 4V/ns for enhanced EMI rejection. The self-clocked quantized feedback technique used, features uncoded data that contains long sequences of consecutive identical digits or ac-unbalanced data. The differential input sensitivity is 0.5-1.1Vpp with a supply voltage between 2.5 and 3.5 V.  相似文献   

20.
A 4-Gb/s clock and data recovery (CDR) circuit is realized in a 0.25-/spl mu/m standard CMOS technology. The CDR circuit exploits 1/8-rate clock technique to facilitate the design of a voltage-controlled oscillator (VCO) and to eliminate the need of 1:4 demultiplexer, thereby achieving low power consumption. The VCO incorporates the ring oscillator configuration with active inductor loads, generating four half-quadrature clocks. The VCO control line comprises both a programmable 6-bit digital coarse control and a folded differential fine control through a charge-pump and a low pass filter. Duty-cycle correction of clock signals is obtained by exploiting a high common-mode rejection ratio differential amplifier at the ring oscillator output. A 1/8-rate linear phase detector accomplishes the phase error detection with no systematic phase offset and inherently performs the 1:4 demultiplexing. Test chips demonstrate the jitter of the recovered clock to be 5.2 ps rms and 47 ps pk-pk for 2/sup 31/-1 pseudorandom bit sequence (PRBS) input data. The phase noise is measured to be -112 dBc/Hz at 1-MHz offset. The measured bit error rate is less than 10/sup -6/ for 2/sup 31/-1 PRBS. The chip excluding output buffers dissipates 70 mW from a single 2.5-V supply.  相似文献   

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