Y_2O_3∶Eu薄膜的制备及其发光性能研究

用电子束蒸发方法在ITO基片上生长Y2O3∶Eu荧光薄膜,并在不同条件下退火处理。分别用X射线衍射(XRD)、X射线光电子能谱(KPS)、扫描电子显微镜(SEM)和光致发光(PL)谱表征Y2O3∶Eu荧光薄膜的结构、成分、形貌和发光性能。实验表明:随着温度升高,薄膜的结晶程度提高,弥补了薄膜晶体表面的表面缺陷,提高了薄膜的发光性能;600℃退火处理的光致发光中,617nm和596nm的谱线最强。     

Y2O3:Eu薄膜的制备及其发光性能研究

用电子束蒸发方法在ITO基片上生长Y2O3：Eu荧光薄膜．并在不同条件下退火处理。分别用X射线衍射(XRD)、X射线光电子能谱(KPS)、扫描电于显微镜(SEM)和光致发光(PL)谱表征Y2O3：Eu荧光薄膜的结构、成分、形貌和发光性能。实验表明：随着温度升高,薄膜的结晶程度提高,弥补了薄膜晶体表面的表面缺陷,提高了薄膜的发光性能：600 O退火处理的光致发光中,617nm和596nm的谱线最强。     

YSZ/Al_2O_3复合薄膜高温绝缘层的研究

采用电子束蒸发、射频磁控溅射、等离子喷涂等方法,在镍基高温合金基底上制备YSZ(质量分数12%Y2O3稳定的Zr O2)、Al2O3复合薄膜结构绝缘层,并研究了复合薄膜结构绝缘层在室温到800℃范围内的绝缘特性,以及高温对复合薄膜晶体结构和表面形貌的影响。结果表明:晶态YSZ/非晶态YSZ/Al2O3结构绝缘层在室温下的绝缘电阻大于1.2 GΩ,在800℃大气环境下有150 kΩ左右的绝缘电阻。在室温到800℃范围内,随温度升高其绝缘电阻呈近指数下降的变化规律。经过在800℃大气环境中热处理8 h,YSZ的立方相结构未发生改变,Al2O3表面十分致密,表明该复合结构绝缘层薄膜具有良好的高温绝缘性能和稳定性。     

双源电子束蒸发提高光学薄膜致密性的工艺研究

采用双源电子束蒸发的方法,在K9玻璃基片上蒸镀Si和SiO2得到的混合膜层,折射率不仅可调,而且比Si膜要高.用原子力显微镜(AFM)分别对单纯镀的Si膜与双源电子束蒸发镀的Si/SiO2混合膜层的表面形貌进行了观测,结果表明,前者表面疏松,有明显的孔洞结构;后者膜层表面细密.采用双源蒸发的成膜理论,对该方法提高膜层致密性的原因进行了探讨.     

BaTiO_3薄膜的磁控溅射生长及特性研究

用射频磁控溅射方法制备了 Ba Ti O3 (BT)薄膜。用扫描电镜 (SEM)观察了 Ba Ti O3 薄膜表面形貌、截面结构。电子探针分析表明样品具有良好的组份均匀性。介电特性研究表明材料同样具有较好的微结构     

氧化铁镍薄膜的制备与表征

首先提出射频反应磁控溅射中薄膜沉积速率同O2流量和溅射功率关系的理论计算模型;其次根据这一理论计算模型,在O2/Ar气氛中,利用射频反应磁控溅射制备氧化铁镍薄膜;最后分别采用台阶仪、X射线衍射(XRD)、X射线光电子能谱(XPS)、电子扫描镜(SEM)和电化学工作站对薄膜进行了表征,并分析了在制备过程中O2含量、工作压强和溅射功率对薄膜的沉积速率、结构、组分和表面形貌的影响.实验验证了所提出的理论计算模型以及Ni3 的存在;得到了膜厚与晶型以及工作压强与形貌的关系;电化学测试结果为:在电流密度为8 mA/cm2时的过电势为284 mV.     

Ga2O3:Mn电致发光薄膜的微结构及光谱特性研究

采用电子束蒸发法在硅衬底或BaTiO3陶瓷基片上沉积了Ga2O3：Mn电致发光膜,并进行了不同温度热处理,制备了电致发光器件。用X射线衍射(XRD)分析了Ga2O3：Mn薄膜晶体结构;用荧光分光光度计测试了电致发光器件的发射光谱。研究了Ga：O。：Mn薄膜的晶体结构与其光谱特性之间的关系。实验结果表明,Ga2O3：Mn薄膜结晶度随热处理温度的提高而提高,且晶体结构和结晶取向也随之改变;经500℃热处理的Ga2O3：Mn薄膜电致发光器件发绿光,其光谱主峰分布在495～535nm之间,且随驱动电压增高,谱峰出现蓝移现象。     

Ga_2O_3∶Mn电致发光薄膜的微结构及光谱特性研究

采用电子束蒸发法在硅衬底或 Ba Ti O3陶瓷基片上沉积了 Ga2 O3∶Mn电致发光膜 ,并进行了不同温度热处理 ,制备了电致发光器件。用 X射线衍射 ( XRD)分析了 Ga2 O3∶ Mn薄膜晶体结构 ;用荧光分光光度计测试了电致发光器件的发射光谱。研究了 Ga2 O3∶ Mn薄膜的晶体结构与其光谱特性之间的关系。实验结果表明 ,Ga2 O3∶ Mn薄膜结晶度随热处理温度的提高而提高 ,且晶体结构和结晶取向也随之改变 ;经 5 0 0℃热处理的 Ga2 O3∶ Mn薄膜电致发光器件发绿光 ,其光谱主峰分布在 495～ 5 3 5 nm之间 ,且随驱动电压增高 ,谱峰出现蓝移现象     

不同退火过程对紫外HfO2/SiO2,Y2O3/SiO2多层膜性能的影响

采用直升式和阶梯式加热法对电子束热蒸发镀制出的HfO2/SiO2,Y2O3/SiO2多层膜进行了400℃的退火处理,发现采用阶梯式加热法退火后多层膜在190～300 nm范围内的峰值反射率均得到提高,说明此种后处理方法可能会改善膜层在紫外波段的光学性能.再对HfO2,Y2O3的单层膜进行相应的退火处理,发现退火后HfO2膜层的物理厚度减小从而发生监移现象;直升式退火使Y2O3膜层的折射率变小引起蓝移.阶梯式退火使得Y2O3膜层的物理厚度减小引起蓝移.对退火前后样品的微结构进行X射线衍射(XRD)法测量发现,退火可以使材料进行品化,并且采用直升式加热法后材料的结晶度更大,从而膜内散射变大,会引起膜层反射率的轻微降低.     

ZnS:Li_2O 薄膜的电致发光特性

本文报道了新型较高亮度的ZnS:Li2O蓝色薄膜电致发光,烧结了新型的蓝色发光材料ZnS:Li2O,用电子束蒸发制备出SiO2夹层结构的ZnS,Li2O蓝色电致发光器件,通过吸收光谱,电致发光光谱,激光光电压与发光强度的关系等研究了ZnS:Li2O薄膜发光特性,认为ZnS:Li2O薄膜电致发光可能是由Zn填隙和氧替硫引起的。氧替位能抑制通过硫空位产生的无辐射跃迁使蓝色发光增强。     

Analysis of the stress and interfacial reactions in Pt/Ti/SiO2/Si for use with ferroelectric thin films

The microstructure of the Pt/Ti/SiO₂/Si structure has been investigated by scanning and transmission electron microscopy. Pt films of 100 nm thickness deposited by sputtering or evaporation onto unheated substrates gave complete coverage of the underlying Ti layer and showed a granular and faceted structure with grains ∼20 nm in diameter. They did not exhibit hillocks or surface TiO_x formation. X-ray diffraction was used to examine the film stress through use of the sin²ψ method with bulk values for the elastic constants (v=0.39, E=162 GPa). The as-deposited sputtered film had a compressive stress of ∼540 MPa, while the evaporated films had tensile stresses of ∼630 MPa. The films then received a 400°C rapid thermal anneal (RTA) for 90 s and a subsequent RTA of 650°C for 30s. Further investigation of the film stresses and microstructure were made after each annealing step. After the low temperature anneal, the film stress for the sputtered film became tensile. Plan-view sections examined by transmission electron microscopy (TEM) showed that the as-deposited sputtered films were dense but became porous after annealing. Initially, the evaporated films had a less dense microstructure, but were more stable with annealing. Little change in the stress for the evaporated film was observed after this initial low temperature annealing step. Additional annealing of the evaporated and sputtered samples caused complete consumption of the Ti layer including some TiO_x formation from the underlying SiO₂ layer and marked interaction with the Pt; however, little change in the stress was found. The surface of the Pt film revealed larger grains, but otherwise remained unaffected. The underlying phase changes were minimized once the Ti layer had reacted with the Pt. Due to the ratio of the layers, Pt:Ti of 2:1, the surface of the Pt was unaffected.     

Structural and electrical investigation of BLT films deposited at different times using electron beam evaporation technique

Thin films Bi4Ti3O12 (BLT) were deposited using electron beam evaporation on silicon substrate at several times, also on AlN/Si and SiO2/Si substrates. Thin films morphology and thickness were measured via scanning electron microscopy (SEM). The crystallography was studied using X-ray diffraction (XRD) technique for films which have a (0010) preferred orientation in all substrate types. The capacitance values were contingent on frequency value in C-V measurement. The ferroelectric characterization was investigated for BLT film deposited on isolator layer (SiO2 or AlN) for Al/Bi4Ti3O12/SiO2/Si devices. Memory effect value varied from 1 V to 3 V depending on the thin films isolator on substrate.     

不同衬底上纳米晶CdTe薄膜的低温制备及光性能研究

CdTe nanocrystalline thin films have been prepared on glass, Si and Al2O3 substrates by radio-frequency magnetron sputtering at liquid nitrogen temperature. The crystal structure and morphology of the films were charac-terized by X-ray diffraction （XRD） and field-emission scanning electron microscopy （FESEM）. The XRD examinations revealed that CdTe films on glass and Si had a better crystal quality and higher preferential orientation along the （111） plane than the Al2O3. FESEM observations revealed a continuous and dense morphology of CdTe films on glass and Si substrates. Optical properties of nanocrystalline CdTe films deposited on glass substrates for different deposited times were studied.     

Properties of CdTe nanocrystalline thin films grown on different substrates by low temperature sputtering

CdTe nanocrystalline thin films have been prepared on glass, Si and Al2O3 substrates by radio-frequency magnetron sputtering at liquid nitrogen temperature. The crystal structure and morphology of the films were characterized by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FESEM). The XRD examinations revealed that CdTe films on glass and Si had a better crystal quality and higher preferential orientation along the (111) plane than the Al2O3. FESEM observations revealed a continuous and dense morphology of CdTe films on glass and Si substrates. Optical properties of nanocrystalline CdTe films deposited on glass substrates for different deposited times were studied.     

电子束蒸发法制备六硼化镧薄膜及其特性研究

用电子束蒸发的方法在Ta衬底上制备了LaB6薄膜,用电子显微镜、X射线光电子能谱仪对样品的表面状况、化学组分进行了分析.采用真空热电子发射法测出了LaB6薄膜的逸出功.结果表明,电子束蒸发的方法能够得到化学成分偏差较小、表面状况较好的LaB6薄膜,其逸出功为2.59eV,具有良好的电子发射性能.     

氮化Si基ZnO/Ga_2O_3制备GaN薄膜

利用射频磁控溅射法在Si衬底上先溅射ZnO缓冲层,接着溅射Ga2O3薄膜,然后ZnO/Ga2O3膜在管式炉中常压下通氨气进行氮化,反应自组生成GaN薄膜。XRD测量结果表明,利用该方法制备的GaN薄膜是沿c轴方向择优生长的六角纤锌矿多晶结构的薄膜,利用SEM观测了其表面形貌,PL测量结果发现了位于351nm处的室温光致发光峰。     

Electroless deposition of Co(W) thin films

Thin films of cobalt that contain small amounts of tungsten [Co(W)] were deposited by the electroless process. Those films do not contain either phosphorus or boron which are included in most electroless cobalt films processes. The deposition bath for Co(W) thin films include Co ions, tungstate ions as a source for tungsten, di-methyl-amine-borane (DMAB) complex as a reducing agent, ammonium hydrate as a complexing agent, acetic acid for buffering and surfactants. Co(W) layers were deposited on two types of seed layers: (a) thin sputtered cobalt or copper films on 100 nm SiO₂/Si and (b) bare silicon wafers activated by an aqueous Pd/PdCl₂ solution. The deposited layer thickness range was 40–1000 nm with deposition rate at 90 °C and pH 9 of 7 nm/s for both Pd activated Si and sputtered Co seed, and 5 nm/s for the sputtered Cu seed. Lowering the temperature to 70 °C lowered the deposition rate to 0.7 nm/s for the Pd activated Si. The deposited layers were bright coloured, uniform, and with low defect density under visual inspection. The thin films composition was found to be Cobalt with 3–4 at.% tungsten for all types of seed layers. The Co(W) thin films specific resistivity was in the range of 60–90 μΩ cm. Finally we present the thin film morphology as it was characterized using atomic force microscopy and scanning electron microscopy.     

Al_2O_3过渡层厚度对AZO薄膜性能的影响研究

采用磁控溅射法,在预先沉积了Al2O3过渡层的玻璃衬底上制备了性能优良的AZO薄膜。借助XRD、AFM、四探针仪和分光光度计对AZO薄膜的结构、表面形貌以及电学和光学性质进行了表征,并研究了Al2O3过渡层厚度对AZO薄膜性能的影响。结果表明:Al2O3过渡层的添加对AZO薄膜的表面形貌有一定影响;AZO薄膜的结晶质量随着过渡层厚度的增加先上升后下降;AZO薄膜的电阻率因过渡层的添加而明显降低,特别是在AZO薄膜较薄时;在添加了1～3 nm厚的过渡层后,160 nm厚的AZO薄膜的电阻率下降了44%左右;AZO薄膜的可见光透射率和光学带隙基本不受过渡层影响。     

电子束蒸发制备PbI_2薄膜及其性能表征

采用电子束蒸发工艺在普通玻璃衬底上制备了PbI_2多晶薄膜,研究了不同衬底温度对薄膜结构、表面形貌及紫外-可见光谱的影响.XRD结构表征显示,不同衬底温度下沉积的PbI_2薄膜均属六方结构,低温下呈现(002)方向的c轴择优生长,但随着衬底温度的升高,择优生长弱化;SEM形貌分析结果表明,PbI_2薄膜的晶粒尺寸随着衬底温度的升高而增大,同时晶粒间应力造成的突起减少,薄膜表面致密度和平整度提高;UV光谱测试结果表明,不同衬底温度下制备PbI_2薄膜透过光谱的吸收限均在515nm附近,且呈现陡直的吸收边.计算发现,薄膜禁带宽度约为2.42 eV,随着衬底温度升高而略微增大,显示结晶质量提高.

Abstract：

Polycrystalline lead iodide (PbI_2) thin films were deposited on glass substrates by electron beam evaporation method.The influence of different substrate temperatures on the structure,surface morphology and optical transmittance of the films was studied.XRD analysis shows the PbI_2 films deposited at different temperatures possess hexagonal structure,with a preferred growth orientation of (002) at low temperature,but this preferred growth characteristic vanishes when the substrate temperature increases.SEM micrograph reveals the grain size of PbI_2 thin films increases with the rising substrate temperature,meanwhile,the surface bulges resulted from the strain between grains decrease,making the surface of the films more compact and uniform.UV transmittance shows the steep absorption edge is at 515 nm for all samples grown under different substrate temperatures and the corresponding band gap is about 2.42 eV.     

Cd掺杂BZCN薄膜的制备及其介电性能

用射频磁控溅射法,在Pt/Si基片上制备了立方烧绿石结构的Cd掺杂Bi1.5Zn0.7Cd0.3Nb1.5O7(BZCN)薄膜。研究了衬底温度对薄膜结构、表面形貌以及介电性能的影响。结果表明,沉积温度为600℃,退火温度为700℃制备的薄膜,在测试频率为100 kHz,测试电场强度为1.33×106 V/cm的条件下,介电可调率达到11.8%,tanδ小于0.004 2。