Ni诱导非晶SiGe薄膜结晶

采用Ni诱导结晶的方法在氧化硅衬底上制备多晶SiGe薄膜.通过X射线衍射(XRD)、俄歇电子深度分布谱(AES)等测试方法对获得的多晶SiGe薄膜特性进行了表征,并对退火气氛中氧的存在对非晶SiGe结晶的影响进行了研究.研究表明Ni的参与可以显著降低非晶SiGe薄膜的结晶时间以及结晶温度;退火气氛中氧的存在对非晶SiGe结晶有明显阻碍作用;采用先在高纯N2(99.99%)气氛下快速热退火(RTA)预处理,再在普通退火炉中长时间退火的方法可以明显改善非晶SiGe薄膜的结晶情况.     

非晶硅和非晶硅锗薄膜的金属诱导结晶

分析了金属Ni、Al诱导非晶Si及非晶SiGe薄膜结晶的条件、特点和机理.简要介绍了金属诱导结晶相对于其它一些结晶工艺的优势及其在薄膜晶体管中的应用.概述了影响诱导结晶速率和薄膜微结构的诸多因素,如热处理条件和外加电场等.对电场增强金属诱导横向结晶的相关问题进行了探讨,指出适当强度的电场可显著加快横向诱导结晶的速率,但更强电场则会降低该速率,基于电迁移效应对该现象进行了解释.     

GSMBE外延生长SGOI材料的退火行为

在SIMOX SOI超薄硅衬底上外延生长了高质量SiGe合金薄膜来制备SGOI(SiGe on insulator)样品,并研究了其在1050℃氧化气氛中的高温退火行为.用Raman,DCXRD,RBS和光学显微镜等分析手段对SGOI样品在退火前后的性能进行了表征.分析结果表明:SGOI样品表面的穿透位错密度约为5×105cm-2;高温退火处理可以促进SGOI样品中异质外延生长SiGe合金薄膜的弛豫化和超薄Si夹层向SiGe合金薄膜的转化,进一步提高SiGe薄膜的晶体质量,并且有助于获得高Ge组分的SGOI材料.     

磁控溅射法制备LiTaO3薄膜及其结晶性能研究

用射频磁控溅射法在Pt/Ti/SiO₂/Si(100)基片上沉积了LiTaO₃薄膜,并在氧气气氛中不同温度下进行退火。采用SEM、XRD、XPS等表征方法分析了薄膜的结晶性能、各元素化学价态和元素原子百分比。结果表明,经700℃退火处理1h得到的薄膜结晶性能最好,在(104)晶向上具有强烈的择优取向性。薄膜退火温度的升高导致薄膜中Li空位缺陷和O空位缺陷减少。研究表明,薄膜中O/Li的原子比对结晶性能有着非常明显的影响,原子值越接近晶体化学计量比,结晶性能越好。     

退火气氛对铝诱导a-Si薄膜结晶过程的影响

以玻璃为衬底,室温条件下采用直流磁控溅射技术制备了Glass/Al/a-Si样品.在H2,N2和空气3种不同气氛中进行了退火处理.分别采用XRD,Raman光谱和SEM研究了退火气氛对a-Si薄膜销诱导晶化(AIC)过程的影响.XRD实验结果表明:a-Si薄膜在H2气氛中400℃下经过90min的退火处理就能得到结晶较好的poly-si薄膜.Raman光谱实验结果表明:在500℃下退火处理,相同时间内H2气氛中a-Si结晶程度最好,空气气氛中结晶程度最差.这是因为高温H2退火过程中,高活性H原子能将弱的Si-Si键破坏,并与之反应形成强Si-Si键,使得薄膜结构更加稳定有序,同时能加速薄膜中氧的外扩散,促使薄膜晶化.     

退火处理对ZnO薄膜结晶性能的影响

研究了退火处理对ZnO薄膜结晶性能的影响.ZnO薄膜由直流反应磁控溅射技术制得,并在O2气氛中不同温度(200～1000℃)下退火,利用X射线衍射(XRD)、原子力显微镜(AFM)和X射线光电子能谱(XPS)对其结晶性能进行了研究,提出了一个较为完善的ZnO薄膜退火模型.研究表明:热处理可使c轴生长的薄膜取向性增强;随退火温度的升高,薄膜沿c轴的张应力减小,压应力增加;同时晶粒度增大,表面粗糙度也随之增加.在640℃的应力松弛温度(SRT)下,ZnO薄膜具有很好的c轴取向,沿c轴的应力处于松弛状态,晶粒度不大,表面粗糙度较小,此时ZnO薄膜的结晶性能最优.     

退火气氛对铝诱导a-Si薄膜结晶过程的影响

以玻璃为衬底,室温条件下采用直流磁控溅射技术制备了Glass/Al/a-Si样品.在H2,N2和空气3种不同气氛中进行了退火处理.分别采用XRD,Raman光谱和SEM研究了退火气氛对a-Si薄膜销诱导晶化(AIC)过程的影响.XRD实验结果表明:a-Si薄膜在H2气氛中400℃下经过90min的退火处理就能得到结晶较好的poly-si薄膜.Raman光谱实验结果表明:在500℃下退火处理,相同时间内H2气氛中a-Si结晶程度最好,空气气氛中结晶程度最差.这是因为高温H2退火过程中,高活性H原子能将弱的Si-Si键破坏,并与之反应形成强Si-Si键,使得薄膜结构更加稳定有序,同时能加速薄膜中氧的外扩散,促使薄膜晶化.     

退火处理对ZnO薄膜结晶性能的影响

研究了退火处理对Zn O薄膜结晶性能的影响.Zn O薄膜由直流反应磁控溅射技术制得,并在O2 气氛中不同温度(2 0 0～10 0 0℃)下退火,利用X射线衍射(XRD)、原子力显微镜(AFM)和X射线光电子能谱(XPS)对其结晶性能进行了研究,提出了一个较为完善的Zn O薄膜退火模型.研究表明:热处理可使c轴生长的薄膜取向性增强;随退火温度的升高,薄膜沿c轴的张应力减小,压应力增加;同时晶粒度增大,表面粗糙度也随之增加.在6 4 0℃的应力松弛温度(SRT)下,Zn O薄膜具有很好的c轴取向,沿c轴的应力处于松弛状态,晶粒度不大,表面粗糙度较小,此时Zn O薄膜的结晶性能最优.     

柠檬酸溶胶-凝胶法制备非晶YBCO薄膜

采用柠檬酸溶胶-凝胶法(Pechini工艺)制备了钇钡铜氧(YBCO)溶胶,在SiO2/Si(110)衬底上生长了非晶YBCO薄膜.通过差热-热重分析得到了非晶YBCO薄膜的热处理务件.讨论了pH值对薄膜元素配比和表面形貌的影响,研究了薄膜结晶状态与退火温度之间的关系,获得了较为理想的薄膜制备工艺参数.     

Si纳米线表面Ni薄膜生长工艺

研究了Si纳米线表面Ni薄膜生长工艺。采用热蒸发法以SiO为起始原料制备自组生长的Si纳米线,再以5%(体积分数)HF剔除Si纳米线表面硅氧化合物,采用氩离子磁控溅射的方法在Si纳米线表面溅射一定厚度的无定形Ni颗粒,此后对镀Ni的Si纳米线进行完整晶体结构的退火处理。应用高分辨透射电镜(HRTEM)等结构表征工具分析了Si纳米线表面Ni薄膜的形成过程,HRTEM结果表明,在350℃左右退火得到的Si纳米线表面能形成连续的、结构完整的Ni薄膜;退火温度低于300℃时,表面溅射的Ni结晶效果较差;退火温度在800℃时,表面Ni薄膜发生团聚,形成了分立的纳米颗粒。     

金属诱导非晶硅薄膜低温晶化

介绍了一种非晶硅 (a- Si)薄膜低温晶化的新工艺 :金属诱导非晶硅薄膜低温晶化。研究了各种 a- Si/金属双层膜退火后的晶化情况。利用 X射线衍射分析了结晶硅膜的结构 ,通过光学显微镜观察了 Al诱导 a- Si薄膜晶化后的表面形貌 ,并初步探讨了金属诱导非晶硅薄膜低温晶化的机理     

PECVD制备纳米晶多晶硅薄膜

以Si(100)为衬底,采用磁控溅射和射频等离子体增强化学气相沉积系统制备了Si(100)/Al膜/非晶Si膜结构的样品。对该样品进行Al诱导真空退火以制备多晶硅薄膜,采用X射线衍射仪(XRD)和AFM分析薄膜微结构及表面形貌。实验结果表明,在经过500℃、550℃Al诱导退火后,形成了择优取向为〈111〉晶向的多晶硅薄膜。AFM给出了550℃退火后薄膜表面形貌,为100～200nm大小的圆丘状硅晶粒,密集排列在薄膜表面;并对Al诱导真空退火晶化的机理进行了分析。     

Structure and electrical properties of polycrystalline SiGe films grown by molecular beam deposition

The structural and electrical properties of polycrystalline Si_0.5Ge_0.5 films 150 nm thick grown by molecular beam deposition at temperatures of 200–550°C on silicon substrates coated with amorphous layers of silicon oxynitride were studied. It is shown that the films consist of a mixture of amorphous and polycrystalline phases. The amorphous phase fraction decreases from ～50% in films deposited at 200°C to zero in films grown at 550°C. Subsequent 1-h annealing at a temperature of 550°C results in complete solid-phase crystallization of all films. The electron transport of charge carriers in polycrystalline films occurs by the thermally activated mechanism associated with the energy barrier of ～0.2 eV at grain boundaries. Barrier lowering upon additional annealing of SiGe films correlates with an increase in the average grain size.     

Cw laser crystallization of glow discharge a-Si:H on glass substrates

Glow discharge hydrogenated amorphous Si films were crystallized using a cw Ar laser. The properties of the crystallized films were studied by optical and electron microscopy, electrical measurements and elastic recoil detection (ERD) analysis. In addition, a preferential plasma etching technique was used to determine the degree of crystallization. Large (>3 μm) high quality crystallites were induced above a threshold laser power of 100 W/cm by an explosive crystallization process. This was accompanied by the formation of bubbles and ejection of material from the crystallization centers. The sheet resistivity decreased by five to six orders of magnitude. Some 50–90% of the hydrogen remained in the films after laser annealing. A simple model shows that solid state diffusion accounts for the final hydrogen distribution in the laser annealed films. The use of this material for the fabrication of devices on glass substrates is discussed.     

Explosive crystallization of rf-sputtered amorphous CdTe films

Explosive crystallization of about 2-μm thick amorphous CdTe films prepared by rf-sputtering in an Ar-N₂ ambient has been observed. The transformation can be initiated with or without external thermal or mechanical impulses depending on the oxygen content of the films. The crystallization is accompanied by a light flash. X-ray diffraction, Auger analysis, and resistivity measurements were made on these films to arrive at a qualitative model to explain the observations.     

High Curie Temperature Ferromagnetism and High Hole Mobility in Tensile Strained Mn‐Doped SiGe Thin Films

Diluted magnetic semiconductors based on group‐IV materials are desirable for spintronic devices compatible with current silicon technology. In this work, amorphous Mn‐doped SiGe thin films are first fabricated on Ge substrates by radio frequency magnetron sputtering and then crystallized by rapid thermal annealing (RTA). After the RTA, the samples become ferromagnetic semiconductors, in which the Curie temperature increases with increasing Mn doping concentration and reaches 280 K with 5% Mn concentration. The data suggest that the ferromagnetism comes from the hole‐mediated process and is enhanced by the tensile strain in the SiGe crystals. Meanwhile, the Hall effect measurement up to 33 T to eliminate the influence of anomalous Hall effect reveals that the hole mobility of the annealed samples is greatly enhanced and the maximal value is ≈1000 cm² V^?1 s^?1, owing to the tensile strain‐induced band structure modulation. The Mn‐doped SiGe thin films with high Curie temperature ferromagnetism and high hole mobility may provide a promising platform for semiconductor spintronics.     

Ge-rich SiGe thin film deposition by co-sputtering in in-situ and ex-situ solid phase crystallization for photovoltaic applications

This study investigates the properties of high Ge content silicon-germanium thin films in the non-hydrogenated state (Ge-rich SiGe) deposited on glass by RF magnetron co-sputtering in both in-situ and ex-situ solid phase crystallization (SPC) at various temperatures, such as RT to 550 °C. The structural and optical characteristics of SiGe films have been explored systematically by optimizing growth temperature. Atomic composition of films was determined by EDX, which showed up to 77 at% of Ge. Structural properties were characterized by XRD, which revealed all samples to be in amorphous nature. The results from Raman and UV–VIS–IR transmittance measurements showed that the properties of amorphous Si_0.23Ge_0.77 films improved at 450 °C in both in-situ and ex-situ SPC processes. In addition, EDX exposed an advantage of in-situ process over ex-situ due to the incorporation of oxygen during ex-situ thermal annealing. Possible deposition at low substrate temperature as found here suggests that these Si_0.23Ge_0.77 films have a substantial potential to be used in thin film Si-based solar cells.     

金属诱导非晶硅横向晶化形成的多晶硅的生长研究

详细研究了金属诱导非晶硅横向晶化时间、温度对晶化生长的影响。结果显示 ,晶化生长速度受温度影响较大 ,其最大生长速度在 6 2 5℃附近。在较高的温度下 ,非晶自发成核和晶化 ,从而限制了金属诱导晶体生长速度。镍诱导源的长度和厚度也对晶体生长有影响 ,文中对其影响机理进行了讨论     

Effects of oxygen in Ni films on Ni-induced lateral crystallization of amorphous silicon films at various temperatures

Effects of oxygen in Ni films on the Ni-induced lateral crystallization (NILC) of amorphous silicon (a-Si) films at various temperatures have been investigated. It was found that oxygen in Ni films retarded the nucleation of polycrystalline silicon (poly-Si) from a-Si, but had little effect on the growth rate of poly-Si. This is because that needed an incubation period to be reduced to Ni metal for the subsequent mediated crystallization of a-Si.     

Structural and electrical analysis of poly-Ge films fabricated by e-beam evaporation for optoelectronic applications

We have investigated the relationship between structural and electrical properties of Ge thin films deposited on single crystal silicon (100) substrates by electron beam evaporation at room temperature. Post-thermal annealing was applied to obtain poly-crystalline Ge thin films. The structural effects of the annealing temperature and annealing time on the crystallization of Ge films were analyzed using Raman and X-ray diffraction measurements. Raman and X-ray diffraction spectra revealed a structural evolution from amorphous to crystalline phase with increasing annealing temperature and annealing time. It was found that high quality poly-crystalline Ge films were obtained with crystallization ratio of 90% at an annealing temperarure of 500 °C following the crystallization threshold of 450 °C. Effects of structural ordering on the electrical properties were investigated through current-voltage characteristics of fabricated heterostructure devices (Ge/p-Si). Smooth cathode-anode interchange in the diode behavior has been clearly observed following the structural ordering as a function of annealing temperature in a systematic way. These outcomes could be exploited for engineering of low-cost Ge based novel electronic and opto-electronic devices.