Voltage dependence of the differential capacitance of a p +-n junction

The dependences of the differential capacitance and current of a p ⁺-n junction with a uniformly doped n region on the voltage in the junction region are calculated. The p ⁺-n junction capacitance controls the charge change in the junction region taking into account a change in the electric field of the quasi-neutral n region and a change in its bipolar drift mobility with increasing excess charge-carrier concentration. It is shown that the change in the sign of the p ⁺-n junction capacitance with increasing injection level is caused by a decrease in the bipolar drift mobility as the electron-hole pair concentration in the n region increases. It is shown that the p ⁺-n junction capacitance decreases with increasing reverse voltage and tends to a constant positive value.     

“Ideal” static breakdown in high-voltage (1 kV) 4<Emphasis Type="Italic">H</Emphasis>-SiC<Emphasis Type="Italic">p-n</Emphasis> junction diodes with guard ring termination

Nearly “ideal” static high-voltage breakdown (1060 V) in 4H-SiC p⁺-n-n⁺ diodes with guard ring termination is observed. At the doping level of 1.9 × 10¹⁶ cm^?3 in the n-type base, the diode breakdown field is 2.7 × 10⁶ V/cm. At the reverse bias as high as 1000 V, the leakage-current density does not exceed 5 × 10^?5 A/cm². The diodes withstand without degradation an avalanche-current density of 1 A/cm², which corresponds to the dissipated power of 1 kW/cm².     

Numerical analysis on abnormal thyristor forward voltage increase due to heavy doping in gated p-base layer

An abnormal forward voltage increase was observed for a p-base gated double diffused n⁺pn^?p⁺ high power thyristor with high impurity concentration at the n⁺-p emitter-base junction. Accurate numerical analysis shows that heavy doping effects are the most responsible mechanism for the abnormality and that depletion layer formation at the center junction accompanies it.It will be shown that appropriate control of the impurity concentration at the emitter-base junction is necessary to avoid this abnormality by realizing the common base transistor current gain of greater than 0.73 for n⁺n^?-portion.     

Effect of low-temperature annealing on characteristics of SiC detectors with radiation-induced defects

p ⁺-n-n ⁺ detector structures based on CVD films with an uncompensated donor concentration of 2 × 10¹⁴ cm^?3 have been studied. The p ⁺-region was created by implantation of Al ions. The detectors were preliminarily irradiated with 8-MeV protons at a fluence of 3 × 10¹⁴ cm^?2 and then annealed at 600°C for 1 h. In measurements performed in the temperature range 20–150°C, the forward-and reverse-bias modes were compared. It is shown that the annealing leads to a higher collection efficiency of carriers generated by nuclear radiation and to a decrease in the amount of charge accumulated by traps in the course of testing. Despite the positive effect of the annealing, a considerable amount of radiation defects remain, which is manifested, in particular, in the kinetics of the forward current.     

A calculation of the capacitance-voltage characteristics of p+-InP/n-InP/n-InGaAsP photodiodes

An analytic solution for the capacitance-voltage characteristics of p⁺?InP/n?InP/n?InGaAsP diodes has been obtained. The solution, which closely approximates that obtained using numerical methods, indicates that the dip followed by a peak generally observed in the effective carrier concentration profile as derived from experimental capacitance measurements is likely due to the properties of the n-n heterojunction rather than actual variations in the doping concentration. The availability of the analytic solution greatly facilitates the study of the effects of various parameters on these characteristics. The influence of grading and the collection of holes in the notch formed by the valence band discontinuity is also briefly considered.     

Drift of the breakdown voltage in p-n junctions in silicon (walk-out)

A quantitative model for the time behaviour of the walk-out phenomenon in planar p-n junctions is given. The injection of hot carriers into SiO₂ and subsequent trapping of part of them is assumed to be the origin of the walk-out. The model is found to be in reasonable agreement with the experimental results on both p⁺?n and n⁺?p junctions. The parameters in the model are discussed in relation with the experiments.     

Effect of irradiation with fast neutrons on electrical characteristics of devices based on CVD 4<Emphasis Type="Italic">H</Emphasis>-SiC epitaxial layers

The effect of irradiation with 1-MeV neutrons on electrical properties of Al-based Schottky barriers and p⁺-n-n⁺ diodes doped by ion-implantation with Al was studied; the devices were formed on the basis of high-resistivity, pure 4H-SiC epitaxial layers possessing n-type conductivity and grown by vapor-transport epitaxy. The use of such structures made it possible to study the radiation defects in the epitaxial layer at temperatures as high as 700 K. Rectifying properties of the diode structures were no longer observed after irradiation of the samples with neutrons with a dose of 6×10¹⁴ cm^?2; this effect is caused by high (up to 50 GΩ) resistance of the layer damaged by neutron radiation. However, the diode characteristics of irradiated p⁺-n-n⁺ structures were partially recovered after an annealing at 650 K.     

Influence of the electron-hole equilibrium shift on transition-metal diffusion in GaAs

Diffusion of impurities of transition metals Fe, Cu, and Cr in heavily doped p ⁺-, n ⁺-, and intrinsic (at diffusion temperature) GaAs is studied. A technique in which impurity diffuses into GaAs-based structures with heavily doped layers (p ⁺-n or n ⁺-n) was used. It is shown that the impurity diffusivity values in p ⁺-GaAs and n ⁺-GaAs are significantly higher and lower, respectively, than for i-GaAs. The results obtained are discussed taking into account the effect of the electron-hole equilibrium shift in semiconductors on the diffusion of impurities migrating according to the dissociative mechanism. The interstitial-component concentration for Fe, Cu, and Cr impurities in GaAs was determined at the diffusion temperature.     

The open-circuit voltage of back-surface-field (BSF) p-n junction solar cells in concentrated sunlight

Simple analytical expressions for the open-circuit voltage of the n⁺?p?p⁺ and p⁺?n?n⁺ BSF solar cells, which are valid for both the low- and high-levels of optical illumination, are derived. Based on the principle of superposition the open-circuit voltage of both the n⁺?p?p⁺ and p⁺?n?n⁺ solar cells are expressed in terms of the short-circuit current and the known saturated dark current. Effects of the high-low junction doping, the energy-gap shrinkage, and the dimensions of the BSF solar cells on the open-circuit voltage are included. The numerical results of the derived expressions are found to be in good agreement with the exact numerical analysis of Fossum et al. The optimal design considerations based on the known characteristics of the open-circuit voltage are also discussed.     

Special features of the sublimational molecular-beam epitaxy of Si and its potentialities for growing Si:Er/Si structures

The concentration of charge carriers and their Hall mobility in Si:Er/Si layers grown by sublimational molecular-beam epitaxy were investigated as functions of temperature in the range of 300–77 K. No electric activity of Er-containing luminescent centers was observed. The feasibility of precise control over impurity profiles in growing the p ⁺-n-n ⁺ electroluminescent structures is demonstrated.     

Subnanosecond 4<Emphasis Type="Italic">H</Emphasis>-SiC diode current breakers

Mesa epitaxial 4H-SiC-based p ⁺-p-n ₀-n ⁺ diodes have been fabricated and their reverse recovery characteristics have been measured in modes typical of fast semiconductor current breakers, drift step recovery diodes, and SOS diodes. It has been found that, after the short (～10 ns) pulsed injection of nonequilibrium carriers by a forward current with a density of 200–400 A cm^?2 and the subsequent application of a reverse voltage pulse (with a rise time of 2 ns), diodes can break a reverse current with a density of 5–40 kA cm^?2 in a time of about (or less than) 0.3 ns. A possible mechanism for ultrafast current breaking is discussed.     

Giant burst of impact ionization in a <Emphasis Type="Italic">p-n</Emphasis> junction of the 6<Emphasis Type="Italic">H</Emphasis>-SiC polytype

A study of the electron component of impact ionization in the p ⁺-n ^?-n ⁺ junction in the 6HSiC polytype made it possible to detect a giant burst of impact ionization and origination of an extra early avalanche breakdown. The electric field of this breakdown is lower by ～20% than the electric field of the breakdown arising as a result of a steady development of the impact ionization. It is of interest that this phenomenon occurs abruptly, without any apparent causes, in particular, without an increase in the dark current characteristic of a prebreakdown state of the p-n junction. Conditions for origination of an unusual breakdown and its properties made it possible to assume that there are nonlinear processes that give rise to a streamer. In the p-n junction plane, the anomalous breakdown is seen as a narrow glowing track with a width of ≈10 μm. This effect takes place in the conditions of the Wannier-Stark ladder of states. The latter can stimulate a local accumulation of charge and formation of a streamer structure.     

Polycrystalline silicon solar cells on metallurgical silicon substrates

The use of a polycrystalline silicon p-n junction structure deposited on low-cost substrates is a promising approach for the fabrication of low-cost solar cells. Metallurgical-grade silicon, with a purity of about 98% and a cost of about $1/kg, was cast into plates in a boron nitride container and used as substrates for the deposition of solar cell structures. The substrates were polycrystalline with millimeter size crystallites. Solar cells of the configurations n>⁺-silicon/p-silicon/metallurgical silicon and n⁺-silicon/p⁺-silicon/metallurgical silicon were prepared by the thermal decomposition of silane and the thermal reduction of trichlorosilane containing appropriate dopants. The AMO efficiencies of n⁺-silicon/p-silicon/metallurgical silicon solar cells were up to 2.8% (with no anti-reflection coatings) and were limited by the grain boundaries in the p-layer. The grain boundary effects were reduced by increasing the dopant concentration in the p-layer, and AMO efficiencies of about 3.5% were obtained from n⁺-silicon/p⁺-silicon/metallurgi silicon solar cells.     

On the forward current-voltage characteristics of p+-n-n+ (n+-p-p+) epitaxial diodes

The forward-biased current-voltage characteristics of p⁺-n-n⁺ and n⁺-p-p⁺ epitaxial diodes are derived theoretically. Effects of the energy-gap shrinkage, the high-low junction built-in voltage, the high-level injection, and the minority-carrier life time on the forward-biased current-voltage characteristics are included. Good agreements between the theoretically derived results and the experimental data of Dutton et al. are obtained. The developed theory predicts that the leakage of the high-low junction is dominated by the recombination of minority carriers in the highly doped substrate, not by the recombination of minority carriers in the high-low space charge region, which is opposite to the previous prediction of Dutton et al.     

Profiling the boron distribution in asymmetric n +-p silicon photodiodes and a new concept for creating selectively sensitive photocells for megapixel color-image receivers

The spectral photosensitivity of n ⁺-p silicon photodiodes with a p ⁺ layer implanted in the substrate is studied experimentally. It is demonstrated that such p ⁺ doping effectively shifts the long-wavelength edge of the photosensitivity in the optical spectral range and the shift depends on the depth of the p ⁺ layer. A new concept for creating selectively sensitive photocells for megapixel color-image receivers is proposed. The receivers are based on n ⁺-p photodiode structures containing a few layers that are implanted at different depths and form desired color-separating potential barriers and lateral diffusion channels for collection of the minority carriers generated by photons of different colors.     

Effect of double reflection on the forward current-voltage characteristics of a silicon p+-s-n+ epitaxial diode

The behaviour of both majority and minority carriers in a p⁺-s-n⁺ epitaxial diode (where s may be p or n) has been investigated in this paper. Forward current-voltage characteristics of the diodes are obtained by exact numerical analysis, taking into account the effects of energy-gap narrowing, Auger recombination and carrier-carrier scattering. As with previous authors, it is found that the forward current increases with increasing middle layer thickness. The present analysis shows that such increase occurs only upto a specific applied bias, after which the forward current decreases with increasing middle layer thickness. This behaviour is attributed to double reflection, i.e. the reflection of both majority and minority carriers by the p-n junction and high-low junction respectively. Beyond the specific bias so determined, junction reflection loses its effectiveness. Distribution of carrier concentration and junction voltages for several device configurations are given to illustrate these features. The majority carrier reflection by the p-n junction is found to have a dominating effect in all cases.     

Solution of the problem of charge-carrier injection into an insulating layer under self-consistent boundary conditions at contacts

The problem of charge carrier injection into a finite-length insulating layer is analytically solved in the drift-diffusion approximation, taking into account self-consistent boundary conditions. The main assumption is the neglect of intrinsic doping of the i-type layer. The solution allows calculation of the potential, electric field, and current-voltage characteristics of various structures, i.e., metal-i-n ⁺ (or p ⁺)-semiconductor, metal-i-layer-metal, and n ⁺(p ⁺)-i-n ⁺(p ⁺) structures. The solution allows generalization for structures having heterobarriers at semiconductor layer interfaces. The proposed approach considers contact phenomena and volume effects associated with the space-charge-limited current in the i-type layer. The solution is valid in both extreme cases and intermediate conditions.     

Impact ionization wave breakdown of drift step recovery diodes

High frequency IMPATT oscillations followed under certain conditions by reversible impact ionization wave breakdown of the p ⁺-n-n ⁺ diode structure have been experimentally observed for the first time in a drift step recovery diode operating in the avalanche breakdown mode after a fast voltage restoration of the p-n junction.     

Effect of neutron irradiation on the structure of silicon p-n junctions of voltage limiters

Changes in capacitance-voltage characteristics of p-n junctions with a linear or close-to-linear uncompensated charge distribution under neutron irradiation are analyzed. It is confirmed that an intrinsic conductivity region is formed near the p-n junction due to such exposure. Empirical formulas are derived which describe the dependence of the sizes of this region and the effective concentration gradient of uncompensated charge on the neutron fluence in a wide range of initial (before neutron irradiation) concentration gradients (from 3 × 10¹⁸ to 2 × 10²⁰ cm^?4) and initial silicon resistivities (from 0.3 to 2 Ω cm).