一种8位1 GS/s折叠内插A/D转换器

基于TSMC 0.18 μm CMOS工艺,采用两级级联的折叠内插结构,设计了一种8位1 GS/s折叠内插A/D转换器。在预放大器阵列输出端引入失调平均网络,优化了预放大器阵列的输入对管尺寸,以补偿边界预放大器的增益衰减。在折叠电路中引入幅度补偿电路,以增加较小的电路功耗为代价改善了电路的带宽限制,提高了增益及输出线性范围。分析了内插平均电阻网路中的高倍内插误差,通过优化内插电阻值,实现了内插输出失调的减小,保证了系统良好的精度特性。仿真结果表明,在采样率为1 GS/s、输入正弦波频率为465.82 MHz的条件下,该8位折叠内插A/D转换器的有效位数能够达到7.31位,功耗为290 mW。     

高速ADC中折叠电路的改进

针对8bit 125Ms/s折叠插值A/D转换器芯片设计,文中提出了一种新的折叠波产生算法,在低压设计中节省了电压设计余度.折叠电路的尾电流源采用低压宽摆幅的共源共栅结构,使差分对的尾电流源更匹配,改善了整个A/D转换器的非线性;折叠电路输出端采用跨阻放大器输出,提高了折叠电路输出端的带宽;采用共模反馈电路,使折叠输出的共模点更稳定,减小了折叠波的过零点失真.整个电路采用2.5V低电压设计,UMC 0.25μm的工艺模型参数,用Hspice对A/D电路进行模拟验证.结果表明,此电路取得了预期结果.     

一种用于高速14位A/D转换器的采样/保持电路

介绍了一种采用0.35 μm CMOS工艺的开关电容结构采样/保持电路.电路采用差分单位增益结构,通过时序控制,降低了沟道注入电荷的影响;采用折叠共源共栅增益增强结构放大器,获得了要求的增益和带宽.经过电路模拟仿真,采样/保持电路在80 MSPS、输入信号(Vpp)为2 V、电源电压3 V时,最大谐波失真为-90 dB.该电路应用于一款80 MSPS 14位流水线结构A/D转换器.测试结果显示:A/D转换器的DNL为0.8/-0.9 LSB,INL为3.1/-3.7 LSB,SNR为70.2 dB,SFDR为89.3 dB.     

一种40 MSPS 10位流水折叠分级式A/D转换器

探讨和研究基于流水线(Pipelined)技术的折叠分级式A/D转换器(ADC),理论分析了它的原理和一般结构,给出了一个具体结构的ADC框图和具体的折叠电路,并得出了实际制作的ADC的测试图。该折叠分级式ADC的输入频率可达到1 MHz,2级折叠电路产生的高2位加上子ADC产生的8位,使A/D转换器可达到10位的分辨率,采样率最大为40 MSPS。     

用于10位100 MS/s流水线A/D转换器的采样保持电路

设计了一个用于10位100 MHz采样频率的流水线A/D转换器的采样保持电路。选取了电容翻转结构;设计了全差分套筒式增益自举放大器,可以在不到5 ns内稳定在最终值的0.01%内;改进了栅压自举开关,减少了与输入信号相关的非线性失真,提高了线性度。采用TSMC 0.25μm CMOS工艺,2.5 V电源电压,对电路进行了仿真和性能验证,并给出仿真结果。所设计的采样保持电路满足100 MHz采样频率10位A/D转换器的性能要求。     

一种3+8位112MSPS折叠分级式A/D转换器

探讨和研究了折叠分级式A/D转换器.反向恢复时间短和结电容小的二极管可以明显改善绝对值电路的高频特性,由此,设计实现了一个分辨率为3+8位,采样速率达112 MSPS的折叠分级式A/D转换器.给出了电路结构框图和多个具体的子模块电路图;并给出了具体的实验波形和动态性能测试数据.     

基于0.13 μm SiGe BiCMOS工艺的12位1.6 GS/s折叠插值A/D转换器

提出了一种基于0.13 μm SiGe BiCMOS工艺的高速、高精度折叠插值A/D转换器。采用基于SEF开关的新型采样/保持电路,固定保持阶段电压,实现了高速、高精度、高线性度的信号采样。采用带有射极跟随器的折叠放大器,构成平均折叠和环形插值的四级级联结构,减少了比较器数目,降低了建立时间和整体功耗。采用新型两级比较器,将模拟与数字信号进行隔离,优化了回踢噪声。使用小尺寸晶体管,减小了再生时间。在3.3/5 V电源和0.13 μm SiGe BiCMOS工艺下,该折叠插值A/D转换器实现了1.6 GS/s的采样率,SFDR为71.3 dB,SNDR为63.6 dB,ENOB为10.27 bit。     

一种16位600 MS/s电流舵D/A转换器的设计

基于0.18 μm CMOS工艺,设计了一种16位600 MS/s电流舵D/A转换器。该D/A转换器为1.8 V/3.3 V双电源供电,采用并行输入、差分电流输出的四分段(5+4+3+4)电流舵结构。采用灵敏放大器型锁存器可以精确锁存数据,避免出现误码;由恒定负载产生电路和互补交叉点调整电路组成的同步与开关驱动电路,降低了负载效应引起的谐波失真,同时减小了输出毛刺;低失真电流开关消除了差分开关对共源节点处寄生电容对D/A转换器动态性能的影响。Spectre仿真验证结果表明,当采样频率为625 MHz,输入信号频率为240 MHz时,该D/A转换器的SFDR为78.5 dBc。     

高速高精度A／D转换器结构浅析

全并行(闪烁型)A/D转换器和逐次逼近型A/D转换器不能同时达到很高的转换速度和分辨率。本文介绍了几种能同时实现高速高分辨率A/D转换的电路,并对二步式A/D转换器、分区式A/D转换器以及流水线型A/D转换器的基本原理、结构和误差作了一些分析。     

7位80MS/s电流模式折叠分级式模数转换器

提出了一种基于电流模式的折叠分级式A/D转换器(ADC),分析了电路原理和结构,阐述了如何提高ADC的性能。测试表明,电路已达到相关性能指标。转换速率为80MS/s,在3.0MHz输入信号下的信噪失真比(SINAD)为44.4dB,有效位数(ENOB)为7.1位。给出了已实现ADC电路的结构、测试波形和动态性能测试结果。     

CMOS折叠—插值A／D转换器中的气泡效应研究

ＣＭＯＳ折叠－插值Ａ／Ｄ转换器是一种新颖的高速低功耗转换器，但随着输入电压和采样频率的增加，其动态性变差，误码率上升，产生所谓的“气泡”现象。文章分析了“气泡”的产生机理，给出了减小“气泡”效应的方法及实现途径。     

A 70-MS/s 110-mW 8-b CMOS folding and interpolating A/D converter

A CMOS analog to digital converter based on the folding and interpolating technique is presented. This technique is successfully applied in bipolar A/D converters and now also becomes available in CMOS technology. The analog bandwidth of the A/D converter is increased by using a transresistance amplifier at the outputs of the folding amplifiers and, due to careful circuit design, the comparators need no offset compensation. The result is a small area (0.7 mm² in 0.8 μm CMOS), high speed (70 MS/s), and low-power (110 mW at 5 V supply, including reference ladder) A/D converter. A 3.3 V supply version of the circuit runs at 45 MS/s and dissipates 45 mW     

An ultra high-speed 8-bit timing interleave folding＆interpolating analog-to-digital converter with digital foreground calibration technology

A 2-Gsample/s 8-b analog-to-digital converter in 0.35μm BiCMOS process technology is presented. The ADC uses the unique folding and interpolating algorithm and dual-channel timing interleave multiplexing technology to achieve a sampling rate of 2 GSPS.Digital calibration technology is used for the offset and gain corrections of the S/H circuit,the offset correction of preamplifier,and the gain and clock phase corrections between channels.As a result of testing,the ADC achieves 7.32 ENOB at an analog input of 484 MHz and 7.1 ENOB at Nyquist input after the chip is self-corrected.     

An 8-b 300MS/s folding and interpolating ADC for embedded applications

A 1.4-V 8-bit 300-MS/s folding and interpolating analog-to-digital converter (ADC) is proposed. Fabricated in the 0.13-μm CMOS process and occupying only 0.6-mm2 active area, the ADC is especially suitable for embedded applications. The system is optimized for a low-power purpose. Pipelining sampling switches help to cut down the extra power needed for complete settling. An averaging resistor array is placed between two folding stages for power-saving considerations. The converter achieves 43.4-dB signal-to-noise and distortion ratio and 53.3-dB spurious-free dynamic range at 1-MHz input and 42.1-dB and 49.5-dB for Nyquist input. Measured results show a power dissipation of 34 mW and a figure of merit of 1.14 pJ/convstep at 250-MHz sampling rate at 1.4-V supply.     

8 bit 400 MS/s CMOS折叠插值结构ADC的设计

折叠插值结构是高速ADC设计中的常用结构。提出了一种新的在折叠插值结构ADC中只对THA进行时间交织的技术,可以在基本不增加芯片功耗和面积的情况下,使ADC的系统速度提高近1倍。位同步技术可以保证粗分和细分通路之间的同步,在位同步的基础上设计了新的编码方式。基于上述技术设计了8 bit 400 MS/s CMOS折叠插值结构ADC,核心电路电流为110mA,面积仅1mm×0.8mm,Nyquist采样频率下SNDR为47.2dB,SFDR为57.1dB。     

A wide input bandwidth 7-bit 300-MSample/s folding and current-mode interpolating ADC

A 7-bit Nyquist folding and interpolating analog-to-digital converter (ADC) that converts at 300 MSamples/s is presented. Using current-mode signal processing techniques for analog preprocessing and a front-end sample-and-hold, the proposed 7-bit folding and interpolating ADC yields a wide input bandwidth up to 60 MHz with six effective number of bits. The ADC consumes 200 mW from a 3.3-V power supply. The chip occupies 1.2 mm/sup 2/ active area, fabricated in 0.35-/spl mu/m CMOS.     

CMOS folding A/D converters with current-mode interpolation

A CMOS folding and interpolating A/D conversion architecture fully compatible with standard digital CMOS technology is described. Fully-differential, continuous-time, current-mode, open-loop analog circuitry is used to achieve high speed. Results from 125 Ms/s 8-b and 150 Ms/s 6-b prototypes implemented in a digital 1 μm n-well CMOS process are presented. The 8-b (6-b) converter occupies 4 mm² (2 mm²) and dissipates 225 mW (55 mW) from a single 5 V power supply     

一种8位高速折叠内插A/D转换器的设计

介绍了基于0.35μm BiCMOS工艺的8位高速A/D转换器,采用独特的折叠和内插结构,在大大降低成本、功耗的同时,既能保证超高转换速率,又能达到较高的静态和动态指标。在采样率1GS/s和模拟输入差分250mV(Vp-p)、484MHz条件下进行测试,SFDR高达56dB,SNR高达45.5dB;在3.3V电源电压下,功耗为800mW。     

An 8-bit 1 GS/s folding and interpolating ADC with a base-4 architecture

A base-4 architecture for folding and interpolating ADC is proposed. It employs cascaded folding and interpolating topology with both the folding factors and interpolating factors of 4. Duo to that the base-4 folding and interpolating has an intrinsic relationship with the quantization process which is base-2, the architecture requires only 2 × N + 6 comparators for an N-bit ADC. What’s more, the coarse flash ADC can be eliminated because all the most significant bits can be conveniently extracted from the intermediate signals as the “byproduct” of the folding amplifiers. In addition, the base-4 architecture can be extended to higher resolution easily because of the modularized and unified configuration. This architecture is implemented with a 1 GS/s 8-bit ADC in 0.35 μm SiGe BiCMOS process. Measurement results reveal the chip exhibits DNL of 0.30/?0.26 LSB and INL of 0.80/?0.80 LSB. The ENOB is 6.9 LSB at 10.1 MHz input. The SNDR is above 42 dB over the first and the second Nyquist zone. The SFDR is above 45 dB over the first Nyquist zone and the second Nyquist zone. The ERBW is over 1.2 GHz.