Electrodeposition of Tin Alloys from Alkaline Stannate Baths

The paper reports on a small development programme designed to concentrate on devising a relatively simple technique for the deposition of copper only in drilled holes of a conventionally produced printed wiring board. It is essential to start with a laminate containing catalysed resin base, producing the printed wiring pattern in the normal manner and plating up holes using autocatalytic electroless copper. Thickness measurements and microsections of electroless copper deposits have been obtained and appear to be encouraging.