Si(100)和(111)面和在其上Ni分子束外延的反射高能电子衍射研究

以反射高能电子衍射的方法研究了用Ar+离子轰击和高温处理技术获得的洁净的Si(100)和(111)面,以及在室温下这些表面上分子束外延生长镍硅化物。实验获得了Si(111)77以及它的负区衍射图,Si(100)21,Si(111)1919Ni和Si(100)42Ni的表面结构。实验同时表明,在低外延生长速率下(0.150.5/min)生成的镍硅化物的晶格结构与硅基底的一样。     

Si衬底上无坑洞3C-SiC的外延生长研究

在冷壁式不锈钢超高真空系统上 ,利用低压化学气相淀积 (LPCVD)方法在直径为 5 0 mm的单晶 Si(1 0 0 )和 Si(1 1 1 )晶向衬底上生长出了高取向无坑洞的晶态立方相碳化硅 (3 C-Si C)外延材料 ,利用反射高能电子衍射 (RHEED)和扫描电镜 (SEM)技术详细研究了 Si衬底的碳化过程、碳化层的表面形貌及缺陷结构 ,获得了界面平整光滑、没有空洞形成的 3 C-Si C外延材料 ,并采用 X-射线衍射 (XRD)、双晶 X-射线衍射 (DXRD)和霍尔(Hall)测试等技术研究了外延材料的结构和电学特性     

Direct growth of CdTe on (100), (211), and (111) Si by metalorganic chemical vapor deposition

CdTe epilayers were grown directly on (100), (211), and (111) silicon substrates by metalorganic chemical vapor deposition (MOCVD). The crystallinity and the growth orientation of the CdTe film were dependent on the surface treatment of the Si substrate. The surface treatment consisted of exposure of the Si surface to diethyltelluride (DETe) at temperatures over 600°C prior to CdTe growth. Direct growth of CdTe on (100) Si produced polycrystalline films whereas (lll)B single crystals grew when Si was exposed to DETe prior to CdTe growth. On (211) Si, single crystal films with (133)A orientation was obtained when grown directly; but produced films with (211)A orientation when the Si surface was exposed to DETe. On the other hand, only (lll)A CdTe films were possible on (111) Si, both with and without Te source exposure, although twinning was increased after exposure. The results indicate that the exposure to a Te-source changes the initial growth stage significantly, except for the growth on (111) Si. We propose a model in which a Te atom replaces a Si atom that is bound to two Si atoms.     

Poly- and single-crystalline h-GaN grown on SiCN/Si(100) and SiCN/Si(111) substrates by MOCVD

This paper reports the growth of polycrystalline GaN on Si(100) and single-crystalline h-GaN on Si(111) substrates with a single-crystalline SiCN burffer layer by metalorganic chemical vapor deposition (MOCVD). From high-resolution x-ray diffraction (HRXRD) and scanning election microscopy (SEM) analyses, GaN on SiCN/Si(100) is polycrystalline and GaN on SiCN/Si(111) is single-crystalline. From photoluminescence analysis, the energy gaps of h-GaN/SiCN/Si(100) and c-GaN/SiCN/Si(100) are ∼3.4 and ∼3.2 eV at 300 K but shift to 3.5 and 3.3 eV at 15 K, respectively. A model to explain the growth mechanism is also proposed.     

Fabrication of Co2Fe(Al,Si) and Co2Fe(Al,Si)/MgO on Ge(111) Substrate and Its Magnetic Properties

We investigated the interfacial effects on magnetic properties in Co₂Fe(Al,Si)/Ge (CFAS/Ge) and CFAS/MgO/Ge systems to demonstrate the effects of the interface structure on magnetic properties. CFAS and CFAS/MgO were deposited on the i-Ge(111) substrate. In-situ reflection high energy electron diffraction (RHEED) patterns showed epitaxially grown CFAS and MgO on Ge(111). According to the X-ray diffraction (XRD) ϕ-scan of CFAS(220), we determined that the crystallographic orientation relationships were CFAS(111)<–110>// Ge(111)<–110> and CFAS(111)<–110>//MgO(111)<–110>Ge(111)<–110>. The magnetic properties were measured by the vibrating sample magnetometer (VSM) and the saturation magnetization M_s value of CFAS with 2-nm thick MgO reached the value of L2₁ ordered one. A uniaxial magnetic anisotropy behavior was observed both in CFAS/Ge and CFAS/MgO/Ge structures after annealing. We confirmed the behavior did not only originate from the CFAS/Ge interface but also CFAS/MgO and the ordering structure.     

无坑洞n-3C-SiC/p-Si(100)的LPCVD外延生长及其异质结构特性

在MBE/CVD高真空系统上,利用低压化学气相淀积(LPCVD)方法在直径为50mm的单晶Si(100)衬底上生长出了高取向无坑洞的晶态立方相碳化硅(3C-SiC)外延材料,利用反射高能电子衍射(RHEED)和扫描电镜(SEM)技术详细研究了Si衬底的碳化过程和碳化层的表面形貌,获得了制备无坑洞3C-SiC/Si的优化碳化条件,采用霍尔(Hall)测试等技术研究了外延材料的电学特性,研究了n-3C-SiC/p-Si异质结的I-V、C-V特性及I-V特性对温度的依赖关系.室温下n-3C-SiC/p-Si异质结二极管的最大反向击穿电压达到220V,该n-3C-SiC/p-Si异质结构可用于制备宽带隙发射极SiC/Si HBTs器件.     

Surface reconstructions and reflection high-energy electron diffraction intensity oscillations during homoepitaxial growth on nonmisoriented GaAs(111)B by MBE

The growth by molecular beam epitaxy of high quality GaAs epilayers on nonmisoriented GaAs(111)B substrates is reported. Growth control of the GaAs epilayers is achieved via in situ, real time measurement of the specular beam intensity of reflection high-energy electron diffraction (RHEED). Static surface phase maps of GaAs(111)B have been generated for a variety of incident As flux and substrate temperature conditions. The dependence of GaAs(111)B to be the optimum starting surface for the latter growth of mirror-smooth epilayers. Regimes of growth conditions are optimized in terms of the static surface phase diagram and the temporal RHEED intensity oscillations.     

镍硅化物生成的TEM原位研究

蒸涂法获得的Si-Ni界面在室温到800℃下热处理,并用透射式电子显微镜对它进行原位研究。在化学清洗的洁净的Si(100)及(111)面上生成了Ni2Si,NiSi和NiSi2系列。实验表明,在真空度为110-6mmHg,温度为650℃时,化学清洗的Si表面上生成了SiC;各种镍硅化物的出现不是在某一确定温度;在Si(111)面上外延生长镍硅化物比在(100)面上容易。     

Electrical characterization of interface states in Ni/n-Si(111) Schottky diodes from (C-V) characteristics

Experiments have been performed on Ni/n-Si(111) Schottky diodes fabricated by the vacuum vapor deposition of Ni at 10⁻⁵ Torr pressure on an n-type «111å oriented silicon wafer. Measured current-voltage and capacitance-voltage characteristics in range frequency range 10 kHz-1 MHz have been analysed. Interface states parameters have been extracted from (C-V) characteristics using a metal-thin interfacial layer-semiconduct (MIS) structure model. The interface states density has been found to be in the range of 10¹¹ cm⁻² eV⁻¹ with a peak in the band gap of Si at about 0·51 eV below the conduction band edge.     

Intermetallic reactions in vacuum-deposited nickel and gold films on (111) silicon single crystals

Pure nickel and gold thin films were vacuum-deposited on (111) silicon single crystals. When Ni/Au/Si or Au/Ni/Si samples were heated to about 550° insitu, hexagonal or deformed hexagonal shaped crystallites were formed on the silicon substrates. The composition of these crystallites was determined by using x-ray diffraction, scanning elec-tron microscopy and scanning Auger microprobe methods. The crystallites were identified as NiSi₂. The crystal-lites on the (111) silicon plane parallel to the surface appeared as regular hexagons while the inclined crystal-lites resembled trapezia. The results of Auger spectra and in-depth composition profiles for Ni, Au, and Si showed that the NiSi₂ crystallites are islands in a matrix of Au-Si eutectic. Work supported by the Materials Research Division of the National Science Foundation     

CeO_2高K栅介质薄膜的制备工艺及其电学性质

研究了 Ce O2 作为高 K (高介电常数 )栅介质薄膜的制备工艺 ,深入分析了衬底温度、淀积速率、氧分压等工艺条件和利用 N离子轰击氮化 Si衬底表面工艺对 Ce O2 薄膜的生长及其与 Si界面结构特征的影响 ,利用脉冲激光淀积方法在 Si(10 0 )衬底生长了具有 (10 0 )和 (111)取向的 Ce O2 外延薄膜 ;研究了 N离子轰击氮化 Si衬底表面处理工艺对 Pt/ Ce O2 / Si结构电学性质的影响 .研究结果显示 ,利用 N离子轰击氮化 Si表面 /界面工艺不仅影响 Ce O2 薄膜的生长结构 ,还可以改善 Ce O2 与 Si界面的电学性质     

Epitaxial growth and electrical conductance of metal(CoSi2)/insulator(CaF2) nanometer-thick layered structures on Si (111)

Epitaxial growth of a metal (CoSi₂) /insulator (CaF2) nanometer-thick layered structure on Si(111) was demonstrated and the resistivity of CoSi₂ epilayer in this structure was investigated. An epitaxial CoSi₂ layer on CaF₂ was obtained by the two-step growth technique,i.e. solid phase epitaxy with the epitaxial Si layer grown in the first step and Co deposited in the second step. This technique was shown to be effective to avoid the Co agglomeration on CaF₂ layer observed in the co-evaporation of Si and Co. An epitaxial CaF₂ layer was formed on CoSi₂/CaF₂ at low substrate temperature (450°C) with partially ionized and accelerated CaF₂ beam, to avoid Co agglomeration in the CoSi₂/CaF₂ underlayer as well. Obtained results showed a single-crystalline nature in reflection high-energy electron diffraction (RHEED) and transmission electron microscopy (TEM) observations. The resistivity of a few nm-thick CoSi₂ epilayers embedded by CaF₂ has been investigated. We studied thickness and annealing temperature dependence of resistivity and showed that a minimum resistivity of 30 μΩ cm was obtained in a 2 nm-thick CoSi₂ sample annealed at 860°C.     

InP/InGaAs double-heterojunction bipolar transistors grown on (100)Si by metalorganic chemical vapor deposition

The authors report the successful fabrication of InP/InGaAs double-heterojunction bipolar transistors (DHBTs) grown by metalorganic chemical vapor deposition (MOCVD) on Si substrates. The Si substrates used were p-type (boron doped) FZ grown wafers with a resistivity of 5000 Ω×cm, oriented 2° off the (100) plane toward the [110] direction. Epitaxial layers for DHBTs were grown on the Si substrate with a thin GaAs buffer layer. A two-step growth process was applied for the InP layers on GaAs-on-Si wafers. The transistors exhibit high current gains over 200, which is comparable to those in transistors grown on InP substrates. The dislocations are found to increase the recombination current very little in the neutral base region, but increase in generation-recombination current at the emitter-base interface     

Ni(Pt)Si硅化物温度稳定性的研究

对比研究了夹层结构N i/P t/N i分别与掺杂p型多晶硅和n型单晶硅进行快速热退火形成的硅化物薄膜的电学特性。实验结果表明,在600~800°C范围内,掺P t的N iS i薄膜电阻率低且均匀,比具有低电阻率的镍硅化物的温度范围扩大了100~150°C。依据吉布斯自由能理论,对在N i(P t)S i薄膜中掺有2%和4%的P t样品进行了分析。结果表明,掺少量的P t可以推迟N iS i向N iS i2的转化温度,提高了镍硅化物的热稳定性。最后,制作了I-V特性良好的N i(P t)S i/S i肖特基势垒二极管,更进一步证明了掺少量的P t改善了N iS i肖特基二极管的稳定性。     

Metalorganic Chemical Vapor Deposition of CdTe(133) Epilayers on Si(211) Substrates

Single-crystalline CdTe(133) films have been grown by metalorganic chemical vapor deposition on Si(211) substrates. We studied the effect of various growth parameters on the surface morphology and structural quality of CdTe films. Proper oxide removal from the Si substrate is considered to be the principal factor that influences both the morphology and epitaxial quality of the CdTe films. In order to obtain single-crystalline CdTe(133) films, a two-stage growth method was used, i.e., a low-temperature buffer layer step and a high- temperature growth step. Even when the low-temperature buffer layer shows polycrystalline structure, the overgrown layer shows single-crystalline structure. During the subsequent high-temperature growth, two-dimensional crystallites grow faster than other, randomly distributed crystallites in the buffer layer. This is because the capturing of adatoms by steps occurs more easily due to increased adatom mobility. From the viewpoint of crystallographic orientation, it is assumed that the surface structure of Si(211) consists of (111) terrace and (100) step planes with an interplanar angle of 54.8°. This surface structure may provide many preferable nucleation sites for adatoms compared with nominally flat Si(100) or (111) surfaces. The surface morphology of the resulting films shows macroscopic rectangular-shaped terrace—step structures that are considered to be a (111) terrace with two {112} step planes directed toward 〈110〉.     

Microstructural Characterization of HgCdSe Grown by Molecular Beam Epitaxy on ZnTe/Si(112) and GaSb(112) Substrates

Transmission electron microscopy and small-probe microanalysis have been used to investigate the microstructure of HgCdSe thin films grown by molecular beam epitaxy on ZnTe/Si(112) and GaSb(112) substrates. The quality of the HgCdSe material was dependent on the growth temperature and materials flux, independent of the substrate. Samples grown at 100°C were generally of high quality, while those grown at 140°C had {111}-type stacking defects and increased dislocation densities. Improved preparation of the GaSb buffer layer should be developed for future HgCdSe growth on GaSb(112) substrates.     

脉冲激光沉积制备NiO(111)外延薄膜及其结构研究

采用脉冲激光沉积法(PLD)在具有六方纤锌矿结构的蓝宝石衬底上制备了NiO外延薄膜,研究了沉积温度、氧分压对薄膜结构和形貌的影响。在650℃、20Pa氧分压的条件下制得了高结晶质量的单晶NiO薄膜。高能电子衍射分析发现,该NiO薄膜沿Al2O3[11–20]方向入射的衍射图像为清晰的斑点,说明NiO薄膜的生长模式为岛状模式,薄膜与衬底的外延匹配关系为:(111)[11–2]NiO//(0001)[11–20]Al2O3。     

ZnO纳米棒与Si(111)和Si(100)衬底的外延关系(英文)

运用热蒸发技术在Si(111)和Si(100)基片上制备了ZnO纳米棒。SEM表征显示,ZnO纳米棒的直径约100nm,长度均匀,大约3μm;XRD表征发现ZnO纳米棒沿[0001]晶向择优生长。通过实验结果与理论分析得出:对于Si(111)基片上的样品,大部分ZnO纳米棒沿6个对称方向生长,而且与基片之间的夹角为54.7°,ZnO与Si(111)的外延关系为[0001]ZnO‖[114]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[141]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[411]Si,或[0001]ZnO‖[4]Si。对于Si(100)基片上的样品,大部分ZnO纳米棒沿4个对称方向生长,与基片之间的夹角为70.5°,其外延关系为[0001]ZnO‖[114]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[14]Si,或[0001]ZnO‖[14]Si。通过比较分析得出Si基片可以控制ZnO纳米棒的生长方向。     

Structure of CdTe(111)B grown by MBE on misoriented Si(001)

Single domain CdTe(111)B has been grown on Si(001) substrates tilted 1^o 2^o, and 4^o toward [110]. All the layers started with a double-domain structure, then a transition from a double- to a single-domain was observed by reflection high energy electron diffraction. A microscopic picture of this transition is presented. We also measured the tilt between CdTe(111)B and Si(001). The result does not follow the tilt predicted by the currently existing model. A new model of the microscopic mechanism of CdTe(111)B growth is presented. New evidence indicates that optimizing the tilt of the substrate surface is very crucial in improving the CdTe(111)B crystal quality.     

Incorporation behaviour of carbon and silicon on (100) and (111) surfaces during growth of GaAs/GaAs and Ga0.47In0.53As/InP by molecular beam epitaxy

Silicon and carbontetrabromide were used as dopant sources in the growth of GaAs/GaAs and Ga_0.47In_0.53As/InP structures. We studied the incorporation behaviour of these group IV atoms on (100) and {111} surfaces as a function of growth temperature. The free carver concentrations determined by Hall measurements for Si-doped GaAs and Ga_0.47In_0.53As layers are independent of growth temperature on all surface orientations studied. Silicon acts fundamentally as a donor except, as expected, for doped layers on (111)A GaAs substrates, where it acts as an acceptor. Carbon incorporation in GaAs and Ga_0.47In_0.53As always results in a p-type conduction independent of the surface orientations (100)/{111} or the growth temperatures we used. In contrast to the results on GaAs, carbon shows a strong temperature-dependent activation in Ga_0.47In_0.53As grown on (100) and (111)B surfaces. Carbon-doped Ga_0.47In_0.53As on (111)A and carbon-doped GaAs layers on (100)/{111} GaAs surfaces exhibit only a very weak dependence of the carrier concentration on the growth temperature. A significant amphoteric behaviour of carbon was not observed in any of the materials investigated.