一种平板式MEMSRF射频开关的设计

介绍了一种实用的平板电容式MEMSRF射频开关。研究了外加驱动电压与由此所引起的极板间距和极板受力变化之间的非线性关系,提出了一种有效的基于有限元的设计分析方法,在此基础上设计了相应的MEMS加工工艺流程,并给出了具体的MEMS工艺。     

A low voltage vertical comb RF MEMS switch

Design and simulations of a novel RF MEMS switch is reported as a solution to many RF wireless applications. A new comb structure for RF MEMS switch is proposed for low voltage and high frequency operations. Isolation degree and actuation voltage, both improved by the new structure. The mechanical and electromagnetic simulation results show better performance for this new switch compared to parallel plate switch. The simulation is done by the intellisuit and HFSS softwares. The Simulation results show that the actuation voltage is decreased by 13% and the linearity of the switch displacement with respect to the actuation voltage is improved by 22% compared to the parallel plate structure. The HFSS simulation results indicate an insertion loss better than 0.33 dB at 50 GHz and isolation greater than 13.4 dB at 50 GHz.     

发展中的RF MEMS开关技术

从驱动方式和机械结构的角度介绍了不同的RF MEMS开关类型,分析了各类MEMS开关的性能及优缺点,分析了MEMS开关在制作和发展中面临的牺牲层技术、封装技术、可靠性问题等关键技术和问题,介绍了MEMS开关的发展现状及其在组件级和系统级的应用,以及对MEMS开关技术的展望。     

Effect of residual stress on RF MEMS switch

Studies have been carried out on a RF MEMS shunt switch to analyze the effect of residual stress on its electromechanical characteristics. This paper presents the simulated results as well as theoretically calculated results of a shunt switch due to the presence of residual stress gradient in respect of resonant frequency, pull down voltage and switching characteristics. The effect of introduction of holes in the beam is also studied. The calculated results, corresponding to the switch (without holes) at zero residual stress, of resonant frequency, pull-down voltage and switch on and off time are 28.14 kHz, 28.2 V, 16.35 μsec and 8.6 μsec respectively. Modal analysis of the both the structures (with and without holes) are carried out for different values of residual stress gradients. Modal analysis predicted that higher values of tensile stress gradient are not favorable for switching action. The pull-down voltages and switch on and off times are simulated at different stress gradients. With the increase in compressive stress gradient, the pull-down voltage is found to increase, whereas, switch on and off times is decreased. Corresponding to −20 MPa/μm residual stress gradient, the resonant frequency, pull-down voltage and switch on and off times are found to be 74.5 kHz, 63.5 V, 7.5 μsec and 3.36 μsec respectively. Introduction holes in the structure modified these values to 63.77 kHz, 53.1 V, 8.7 μsec, 3.92 μsec respectively.     

A low-voltage lateral MEMS switch with high RF performance

MEMS switches are one of the most promising future micromachined products that have attracted numerous research efforts in recent years. The majority of MEMS switches reported to date employ electrostatic actuation, which requires large actuation voltages. Few are lateral relays and those often require nonstandard post process, and none of them is intended for high-frequency applications. We have developed an electrothermally actuated lateral-contact microrelay for RF applications. It is designed and fabricated on both low-resistivity and high-resistivity silicon substrate using surface micromachining techniques. The microrelay utilizing the parallel six-beam actuator requires an actuation voltage of 2.5-3.5 V. Time response is measured to be 300 /spl mu/s and maximum operating frequency is 2.1 kHz. The RF signal line has a current handling capability of approximately 50 mA. The microrelay's power consumption is in the range of 60-100 mW. The lateral contact mechanism of the microrelay provides a high RF performance. The microrelay has an off-state isolation of -20 dB at 40 GHz and an insertion loss of -0.1 dB up to 50 GHz. The simplicity of this 4-mask fabrication process enables the possibility of integrating the microrelay with other passive RF MEMS components.     

Design of MEMS switch for RF applications

Components like passive electronically scanned (sub) arrays, T/R modules, reconfigurable antennas etc., in RF applications are in need of MEMS switches for its re-configurability and polarization. This paper presents the analysis, design and simulation of a MEMS switch. The switch proposed in this paper is intended to work in the frequency range of 4–8 GHz. The proposed switch fulfills the switching characteristics concerning the five requirements loss, linearity, high switching speed, small size/power consumption, low pull down voltage following a relatively simple design, which ensures reliability, robustness and high fabrication yield. The switch implemented in this paper is based on the integration mode of operation and widely used in RF applications.     

RF MEMS悬臂梁开关的设计与仿真

利用有限元软件HFSS和ANSYS系统研究了串联MEMS开关的微波性能和力学性能与其结构参数之间的关系,并在此基础上优化出悬臂梁开关的几何结构参数,设计了RF MEMS开关,实验表明：在外施电压为10V左右时,悬臂梁的挠度可达3μm左右,5GHz时,回波损耗小于0．2dB,隔离度大于35dB。     

A lateral RF MEMS capacitive switch utilizing parylene as dielectric

A novel lateral RF MEMS capacitive switch was reported in this paper. This switch employed parylene as the dielectric material, taking advantages of its low temperature deposition and conformal coating. The low resistivity single crystalline silicon served as the material of the mechanical structures. The switch was fabricated by bulk micromachining processes with only two lithographic masks and a shadow mask. The dynamical response, parylene insulation performance, and RF performances of the fabricated switch were characterized, respectively. The switching time from the open state to the close state was 105 μs at a loaded voltage of 78 V, while 15.6 μs from the close state to the open state. The isolation was better than 15 dB from 20 to 40 GHz, and the maximal isolation was 23.5 dB at 25 GHz; while the insertion loss was below 1.4 dB at 25 GHz, when bonding wires connected the ground lines. These results verify that the parylene is a good candidate material to act as sidewall dielectric to realize the lateral capacitive switch.     

RF MEMS开关的静电斥力驱动研究

针对射频微机电系统(RF MEMS)开关工作时因介质充电而发生“粘连”失效的问题,提出了利用静电斥力驱动替代传统的静电引力驱动方式,使RF MEMS开关在工作时介质层不存在电势差,从根源上消除介质充电.通过COMSOL仿真软件,分析了静电斥力的产生机理,重点探究了静电斥力驱动结构中尺寸参数对可动极板位移的影响,并通过结构优化有效降低了驱动电压,为开关后续设计提供了参考.     

Multiport RF MEMS switch for satellite payload applications

Microsystem Technologies - Design, fabrication and characterization of a novel RF switch is proposed in this paper. The multiport RF MEMS switch provides a single input multiple output novel...     

Capacitance modelling of perforated RF MEMS shunt switch

Microsystem Technologies - This paper presents the capacitance modelling of RF MEMS shunt switch by using the parallel plate, fringing field, and parasitic capacitance. The model carried out...     

Low temperature epoxy bonding for RF MEMS capacitive switch

Packaging is one of the most critical tasks for MEMS devices. Unlike solid state devices, MEMS structures involves moving structures which needs to be protected from outer environment ensuring free movement of the structure. In the present paper, inverted silicon cavity is used for capping the MEMS devices. However, in case of RF MEMS, silicon cavity would add parasitics and affects its electrical performance. Enclosing the MEMS structure, its mechanical response will also alter. The electrical as well as mechanical characteristics of the RF MEMS switch are analyzed using finite element method simulations. The electrical response of the fabricated switch after packaging is compared with unpackaged device.

     

RF MEMS开关在牺牲层工艺上的改进

通过对传统的RF MEMS开关采取在信号线上电镀桥墩、改进桥梁的形状以及在桥背面设计接触点的新颖方法,使得RF MEMS开关的下拉电压减小、开关时间缩短和可靠性提高.在工艺上,特别采用了对聚酰亚胺牺牲层进行全刻蚀和半刻蚀的改进加工流程来实现桥背面的接触点.测试结果表明:开关的下拉电压为28V,最低开关时间为0.8μs,开关寿命达7×105次,0～10GHz的插入损耗在0～0.5dB,隔离度为35～45dB.     

欧姆接触式RF MEMS开关设计与仿真

利用表面微加工工艺设计了一种双悬臂梁支撑的欧姆接触式MEMS开关,开关的材料为Au。通过对开关驱动电压的理论分析得出,悬臂梁的刚度越低,下拉电压就会越小;又因为刚度与悬臂梁厚度的三次方呈比例,所以,降低刚度最有效的办法就是减少梁的厚度。通过对开关的性能仿真发现:开关的闭合电压为44V;触点的接触力为22.45μN;谐振频率为25.5kHz。开关闭合时,触点接触后并非立即稳定,而是要弹跳数次后才趋于稳定,此现象增加了开关从闭合到稳定的时间。驱动电压为50,60 V时开关的弹跳时间分别为174.94,66.84μs,由此可见,通过适当增加电压可有效降低开关时间和由闭合到稳定的时间。     

Design and performance analysis of hybrid SPDT RF MEMS switch

Microsystem Technologies - This paper presents the design and simulation of Hybrid type RF MEMS switch for satellite communication application. The Hybrid switch beam is having non-uniform meanders...     

Asymmetric RF MEMS resonant switch for high speed switching applications

Microsystem Technologies - Although micro-electro-mechanical switches are beneficial in small sizes, high levels of power handling, compatibility with CMOS process, wide bandwidth and zero power...     

低驱动电压k波段电容耦合式RFMEMS开关的设计

设计了一种低驱动电压的电容耦合式射频微机械(RF MEMS)开关.RF MEMS开关采用共面波导传输线,双电极驱动,悬空金属膜采用弹性折叠梁支撑.使用MEMS CAD软件CoventorWare、微波CAD软件HFSS,分别仿真了开关的力学性能和电磁性能,仿真结果表明:开关的驱动电压为2.5V,满足低驱动电压的设计目标;开关开态的插入损耗约为0.23 dB@20 GHz,关态的隔离度约为18.1 dB@20 GHz.最后给出了这种RF MEMS开关的微制造工艺.     

Design and of analysis of SPDT Ohmic RF MEMS switch

Microsystem Technologies - This paper reports on the simulation and analysis of Ohmic SPDT (single pole double throw) switch for telecommunication application. A comparative study is performed by...     

Effect of nanoscale heating on electrical transport in RF MEMS switch contacts

This paper explores contact heating in microelectromechanical systems (MEMS) switches with contact spot sizes less than 100 nm in diameter. Experiments are conducted to demonstrate that contact heating causes a drop in contact resistance. However, existing theory is shown to over-predict heating for MEMS switch contacts because it does not consider ballistic transport of electrons in the contact. Therefore, we extend the theory and develop a predictive model that shows excellent agreement with the experimental results. It is also observed that mechanical cycling causes an increase in contact resistance. We identify this effect as related to the build-up of an insulating film and demonstrate operational conditions to prevent an increase in contact resistance. The improved understanding of contact behavior gained through our modeling and experiments allows switch performance to be improved.     

悬臂梁接触式RF MEMS开关的关键工艺研究

采用厚度为2μm的Au制作成共平面波导（CPW）、聚酰亚胺作为牺牲层、PECVD法淀积Si3N4薄膜作为悬臂梁,制作成悬臂梁接触式RF MEMS开关。着重对开关的关键工艺-CPV的Au剥离工艺和悬臂梁制作工艺进行研究,讨论了工艺中存在的问题及其解决方法。通过实验获得较佳的工艺参数,并制作出驱动电压为12-20V的悬臂梁接触式RF MEMS开关。