H2O2/H2SO4法溶解不锈钢铜包套的新方法

介绍了一种用Ｈ２Ｏ２／Ｈ２ＳＯ４溶解不锈钢铜包套的新方法，对温度、稳定剂以及各种原料的浓度等影响因素进行了讨论。传统方法大多以硝酸为主要成颁溶解过程中放出有毒的ＮＯＸ，严重污染环境。本方法无此弊端，对保护环境具有重要意义。     

自配化学需氧量消解液的初步探讨

目前,有些环境监测分析室用美国ＨＡＣＨ公司的ＣＯＤ测定仪分析化学需氧量,这方法与煮沸回流２小时的重铬酸钾法相比,它不仅试剂用量小,节水省电,而且分析操作非常方便,深受监测分析人员的欢迎。但进口消解液价格较贵,给监测经费紧张的基层实验室使用带来了一定的困难,为此,笔者就能否用自配消解液代进口消解液分析化学需氧量进行了试验,获得了令人满意的结果。１试验部分１．１主要仪器 ＨＡＣＨ公司的ＣＯＤ消解反应器,ＤＲ／２０１０比色计。１．２试剂 １．２．１重铬酸钾标准溶液（１／６Ｋ_２Ｃｒ_２Ｏ_７=０．６９００ｍ…     

双效吸收式变热器热力性能分析

以Ｈ２Ｏ／ＬｉＢｒ和ＴＦＥ／ＮＭＰ为工质对分析了双效吸收式变热器的热力性能。结果表明双效吸收式变换器可达到两级吸收式变热器同样高的温度提升,但运行范围比两级吸收式变换器窄。以ＴＦＥ／ＮＭＰ为工质对的双效吸收式变热器比以Ｈ２Ｏ／ＬｉＢｒ为工质对的双效吸收式变热器得到的温升高,但系统性能降低。     

热分析法对醋酸锰脱水过程的探讨

本文用差热（ＤＴＡ）法、热重（ＴＧ）法研究了醋酸锰Ｍｎ（ＣＨ３ＣＯＯ）２．４Ｈ２Ｏ脱水的过程,探讨了不同粒度Ｍｎ（ＣＨ３ＣＯＯ）２．４Ｈ２Ｏ脱水的步骤及脱水的温度变化及原因。     

防止零件在箱式电炉中脱碳的简易方法

箱式电阻加热炉中被广泛采用 ,由于这种炉子在使用过程中密封不好易产生零件的表面脱碳而影响其质量。采用木碳粉做保护剂在箱式电阻炉进行淬火加热 ,防止零件表面脱碳 ,收到了良好的效果。１产生脱碳的原因分析在箱式电阻炉中加热时产生表面脱碳的原因为 :Ｏ２、ＣＯ２、Ｈ２Ｏ是一种氧化脱碳气体 ,能与钢中的碳起化学反应 ,使零件表面形成一层松脆的氧化皮。使零件表面的碳“燃烧” ,其化学反应如下 :２Ｃ Ｏ２ ２ＣＯＣ ＣＯ２ ２ＣＯＣ Ｈ２Ｏ ＣＯ Ｈ２ Ｃ Ｈ２ ＣＨ４参加化学反应的碳 ,可以是奥氏体中的碳 ,也可以是渗碳体中的…     

用工业原料制备Al2O3陶瓷内衬复钢管的研究

用ＳＨＳ铝热－离心法制备了氧化铝陶瓷内衬复合钢管,研究了用工业褐铁矿Ｆｅ２Ｏ３粉工业铝粉制备陶瓷内衬复钢管的有关工艺,并分析了复合钢管的组织和性能,结果表明,内衬陶瓷由Ｆｅ２Ｏ３、铁铝尖晶石和莫来石等相组成,内衬陶瓷硬度可达１３２７ＨＶ、Ｋ１Ｃ为３．８６ＭＰａ．ｍ＾１／２。     

Tecator凯氏定氮仪系统定氮催化剂组成比例对结果影响及改进

利用瑞典ｔｅｃａｔｏｒ凯氏定集仪系统以ＣｕＳＯ４．５Ｈ２Ｏ－Ｋ２ＳＯ４－Ｈ２ＳＯ４消解法测定样品中氮含量时，实验表明，催化剂中不加Ｋ２ＳＯ４，只加入少量ＣｕＳＯ４．５Ｈ２Ｏ按原定步骤测定时，所得结果与原传统方法中以Ｋ２ＳＯ４．ＣｕＳＯ４．５Ｈ２Ｏ按一定比例混合测得结果无明显差异。分别对土壤，饲料，谷物等样品进行了实验，得到了同样的效果，对其产生的原因本文亦进行了探讨。     

缺口型式和腐蚀介质对X52输送管冲击转变的影响

研究了Ｖ型缺口,预制裂纹试样及在含０．５％ＣＨ３ＣＯＯＨ的Ｈ２Ｓ饱和溶液中浸泡后２组Ｘ５２输送管母材和焊缝的系列温度冲击转变特性。结果表明,由于两组输送管母亲才成分和母材与焊缝组织的不同,导致母材和／或焊缝韧性有较大差异;母亲才在上述三种状态７的韧性变化不大,但焊缝预制裂纹试样大幅度降低焊缝韧性,提高韧脆转变温度。     

离子色谱法电导检测同时测定海水中硝酸盐、磷酸盐、硫酸盐等多种阴离子

本文报道利用离子色谱法结合抑制电导检测器的方法,采用Ｄｉｏｎｅｘ ＩｏｎｐｉｃＡＳ９ＨＣ（２ｍｍ）,以０．２５ｍＬ／ｍｉｎ流速的９ｍｍｏｌ／ Ｎａ２ＣＯ３作为淋洗液,在高氯化钠的含量条件下,同时成功地分离和检测痕量的硝酸盐、磷酸盐和非痕量的溴盐、硫酸盐,各离子在抑制电导检测下有很好的线性,检测下限分别为：ＮＯ＾－３０．３１４μｇ／ｍＬ,ＰＯ＾３－４０．２３９μｇ／ｍＬ,Ｂｒ＾－０．１１１μｇ／ｍＬ及ＳＯ＾２－４０．１８１μｇ／ｍＬ。对不同地区的海水进行测定,其回收率为７８％和１１７％。     

化学腐蚀法制造硅微透镜列阵的实验研究

采用ＫＯＨ：Ｈ２Ｏ的湿法化学腐蚀Ｓｉ｛１００｝晶片获得了球面轮廓曲线十分好的微透镜，透镜直径可从几个微米到几个毫米，焦距和孔径之比ｆ／Ｄ可以从２．５到１０以上。文章给出了微透镜及列阵的实验测试结果和若干显微照片，对其设计与制造建立了半经验理论模型。最后，对球面的形成原理及异常焦斑形状作了讨论。     

Experimental study on spray etching process in micro fabrication of lead frame

The objective of this study is to obtain detailed information for the micro fabrication of lead frames by applying spray technology to wet etching process. Wet etching experiments were performed with different etching parameters such as injection pressure, distance from nozzle tip to etched substrate, nozzle pitch and etchant temperature. The characteristics of single and twin spray were measured to investigate the correlation between the spray characteristics and the etching characteristics. Drop size and velocity were measured by Phase-Doppler Anemometer (PDA). Four liquids of different viscosity were used to reveal the effects of viscosity on the spray characteristics. The results indicated that the shorter the distance from nozzle tip and the nozzle pitch, the larger etching factor became. The average etching factor had good positive correlation with average axial velocity and impact force. It was found that the etching characteristics depended strongly on the spray characteristics.     

硅台面结构凸角腐蚀原因探析

本文探讨了硅台面结构凸角腐蚀的原因。指出非理想的直角掩膜结构导致了凸角腐蚀，凸角处侧壁由横向腐蚀速率最快的晶面所构成。     

蚀刻深度传感器耦合问题的研究

对离子束蚀刻深度传感器敏感元件与传感器元件间的耦合问题进行了探讨。表明敏感元件 对蚀刻深度的测量结果有较大的影响。给出了振动误差的抑制措施。     

Highly efficient smoothing of Inconel 718 via electrochemical-based isotropic etching polishing

For the highly efficient and versatile polishing of metals, isotropic etching polishing (IEP), which is based on the merging of isotropic etching holes, has been developed. In this study, the feasibility and mechanism of isotropic etching polishing of nickel-based superalloy Inconel 718 (IN718) and the polishing characteristics have been studied. The potentiodynamic experiments revealed similar trends of the cathodic, passive, second passivation, and transpassive regions in all the electrolytes, while the corrosion susceptibility of IN718 successively decreased with the increasing H₂SO₄ concentration in the electrolyte. The etching anisotropy of the IN718 precipitated with different phases can be experimentally transmuted to isotropic etching by modulating the electrolyte concentration and keeping electrolyte temperature equal or above the room temperature. Because of the positive correlation of the etching current with isotropic holes density and diameter, etching at higher currents is promoted for the rapid and proficient polishing. The surface evolution mechanism during IEP has been confirmed. The surface roughness initially increased due to the formation of etching holes, then decreased abruptly owing to the rapid merging of etching holes and finally achieved a smooth surface. The wet grounded surface of IN718 with a roughness of Sa 62.7 nm has been transformed into a mirror-like smooth surface with a roughness of Sa 0.86 nm within 300 s of IEP at optimized conditions and a high MRR of 2.73 mm³/min has been achieved.     

Study on the sensitive element of ion beam etching depth

In this paper, a sensitive element of ion beam etching depth is studied and a formula is obtained. Experimental results show that the relative error of etching depth is smaller than 0.98%. This has a practical significance to ion beam micro-fabrication.     

Improving the etching performance of high-aspect-ratio contacts by wafer temperature control: Uniform temperature design and etching rate enhancement

A novel wafer temperature control system using direct expansion cycles is developed to improve etching performance. This system enables rapid temperature control of a wafer with low power consumption. In a previous report, we confirmed that the etching rate and mask selectivity of high-aspect-ratio contact etching could be increased by around 6% and 14%, respectively, by controlling the temperature of the wafer during the etching process. In this study, an advanced wafer temperature control system that realizes not only rapid response but also uniform wafer cooling is developed, and a new etching process that controls O₂ gas flow rate as well as wafer temperature during etching is evaluated to decrease the etching rate depression of high-aspect-ratio contact etching. As a result, a rate of wafer temperature change of 1 °C/s and uniformity of ±0.7% with a coefficient of performance exceeding 3 is achieved over a wafer with a diameter of 300 mm during the etching process. Furthermore, etching rate depression in C₄F₆/Ar/O₂ plasma is decreased from 14.4% to 7.8% for a sample with a diameter of 100 nm and aspect ratio of 30.     

沸水对POM树脂的侵蚀作用机理及改善其耐沸水性的方法

考察了沸水对POM的侵蚀作用,如表明龟裂、添加剂析出、变色及断裂伸长率下降等等,提出了改善其耐沸水性的方法。     

反应离子束蚀刻中温度效应的研究

介绍了一种新型的干法刻蚀方法──冷源反应离子束刻蚀法用来到蚀各种激光学器件，并着重研究了刻蚀过程中的温度效应，提出了解决温度效应的有效方法。     

硅各向异性腐蚀模拟的3-D连续CA模型研究

针对硅的各向异性腐蚀，直接采用硅的晶格结构作为CA（元胞自动机）的晶格结构，建立了硅各向异性腐蚀的3D连续CA模型。模型通过引入更多腐蚀过程中出现的晶面，使得腐蚀过程中表层元胞边界条件的确定只与表层元胞有关，提高了模拟的精度。通过对模似结果的理论分析及将模拟的三维输出结果与已有实验结果进行对比，验证了模型的模拟效果。     

准分子激光刻蚀技术在微机械中的应用研究

准分子激光刻蚀技术在微机械领域有着十分广泛的应用前景,用该技术制作的聚合物微结构深宽比大、精度高,并且工艺简单。我们分析了准分子激光刻蚀原理,探索了这种技术的工艺方法和技术条件,特别对掩膜的结构和制作工艺进行了较为深入的研究。本文采用简易的实验装置,用自行研制的三种结构掩膜进行了准分子激光刻蚀实验,得到了50μm 深的聚合物材料微机械构件。