Fabrication of micro sloping structures of SU-8 by substrate penetration lithography

In this paper, three-dimensional (3D) micro sloping structures were fabricated by ordinary mask pattern and diffraction phenomenon. Especially, we fabricated the structures with SU-8 negative photoresist and substrate penetration lithography. In this method, exposure is performed arranging in order of a mask, a substrate and the SU-8 resist. There is a gap that is equal to the thickness of the substrate between resist and mask. In narrow slit of mask, resist is less exposed than usual because of Fraunhofer diffraction. The amount of exposure depends on slit width so that the height of SU-8 resist can be controlled. A 173 μm height of structure was obtained in the case of 27 μm width slit and 24.2 μm height of structure was obtained in the case of 7.4 μm width slit. By using this method, high aspect ratio 3D SU-8 structures with smooth sloping were fabricated in the length of 100–300 μm and in the height of 50–200 μm with rectangular triangle mask pattern. In the same way, there is influence of Fresnel diffraction on edge of aperture so that micro taper structures were fabricated. A lot of taper structures were fabricated by the method to make the surface repellency. The contact angle was achieved more than 160° in this study.     

Active-head slider with piezoelectric actuator using shear-mode deformation

The active-head slider technology for hard disk drive is one of the most promising means to decrease flying height. This paper describes a piezoelectric flying height control slider which has a faster dynamic response compared with conventional active-head sliders. This slider can be also adapted to the conventional slider-fabrication process. PZT layer located near the magnetic head has shear mode deformation by applying electric voltage between the upper and lower electrodes when the flying height of magnetic head needs to be decreased or increased. We fabricated a prototype with single crystal Si substrate for feasibility study. Our evaluation of the prototype revealed that the piezoelectric constant of the shear mode deformation was 0.88 nm/V, and the dynamic response was 50 kHz. The shape of the air bearing surface was optimized by simulations using a robust design method. We found that the stroke was 8 nm for an applied voltage of 11 V if the flying height was 11 nm with no deformation in PZT.     

Fabrication of cantilever with self-sharpening nano-silicon-tip for AFM applications

A simple, high yield method for the fabrication of cantilever with nano-silicon-tip by wet etching for atomic force microscopy (AFM) applications is described in this paper. The nano-silicon-tips with well controlled dimensions are fabricated by self-sharpening anisotropic wet etching technologies using a special pentagon etch mask design. The spring constant of the cantilever according to demand can be easily realized by changing the design of the etch mask and tuning the etching time in the fabrication process. A fabrication yield as high as 90 % has been realized for the AFM probes on 2 inch wafers. The height of tips on the cantilever is 10–15 μm, and the apex of each nano-silicon-tip typically has a radius of curvature of 5–10 nm. The cantilever’s spring constant can be well controlled within the range of 0.8–120 N m^?1. The fabricated AFM probes are capable of generating high quality AFM image comparable with the commercial probes available in our lab.     

Fabrication of Fresnel zone plates with high aspect ratio by soft X-ray lithography

High focusing efficiency Fresnel zone plates for hard X-ray imaging is fabricated by electron beam lithography, soft X-ray lithography, and gold electroplating techniques. Using the electron beam lithography, Fresnel zone plates which has an outermost zone width of 100 nm and thickness of 250 nm has been fabricated. Fresnel zone plates with outermost zone width of 150 nm and thickness of 660 nm has been fabricated by using soft X-ray lithography.     

Fabrication of ceramic microcomponents and microreactor for the steam reforming of ethanol

Ceramics have several advantages over other materials in MEMS, such as heat resistance, hardness, corrosion resistivity even in harsh environments, chemical inertness for biological applications and catalytic activity of surfaces and so on. For these advantages ceramic microstructures will be very potentially useful in microsystem, especially in microreactor. A novel method for the high aspect ratio micro ceramic structures fabrication based on deep X-ray lithography and lost-mold technique is developed. By using this method, ceramic microreactors have been successfully fabricated. The ceramic microreactor consists of 14 identical microchannels in parallel, each with typical dimensions of approximately 300 μm in width, 400 μm in height and 20 mm in length. The Ni film catalyst with thickness of 300 nm is uniformly coated through sputtering process. The steam reforming of Ethanol into hydrogen on the ceramics microreactor was studied at temperatures between 500 and 700°C. The microreactors have been characterized by studying of C₂H₆O conversion, H₂ selectivity, and product stream composition.     

Polymeric microneedle fabrication using a microinjection molding technique

Polymeric microneedles fabricated by microinjection molding techniques have been demonstrated using Topas^®COC as the molding plastic material. Open-channel microneedles with cross-sectional area of 100 μm × 100 μm were designed and fabricated on top of a shank of 4.7 mm in length, 0.6 mm in width, and 0.5 mm in depth. The tip of the microneedle has a round shape with a radius of 125 μm as limited by the drill used in fabricating the mold insert. The injection molding parameters including clamping force, shot size, injection velocity, packing pressure, and temperature were characterized in order to achieve best reproducibility. Experimentally, a fabricated microneedle was successfully injected into a chicken leg and a beef liver freshly bought from a local supermarket and about 0.04 μL of liquid was drawn from these tissues immediately. This new technology allows mass production of microneedles at a low cost for potential biomedical applications.     

Fabrication of X-ray imaging zone plates by e-beam and X-ray lithography

X-ray imaging and microscopy techniques have been developed in worldwide due to their capabilities of large penetration power and high spatial resolution. Fresnel zone plates is considered to be one of the most convenient optic devices for X-ray imaging and microscopy system. The zone plates with aspect ratio of 7 and 13 have been fabricated by e-beam lithography combined with X-ray lithography in this paper. Firstly, the X-ray lithography mask of zone plates with outermost zone width of 100 nm was fabricated by e-beam lithography and gold electroplating techniques. Secondly, the zone plates with gold profile thickness of 700 and 1,300 nm were replicated by X-ray lithography and gold electroplating techniques. X-ray imaging and microscopy techniques were introduced to characterize the high-aspect-ratio zone plates’ inner structures. At the X-ray energy of 7.5 keV, the first-order focusing efficiency of zone plates with gold profile thickness of 700 nm is about 8.63%.     

Resist evaluation for proton beam writing,Ni mold fabrication and nano-replication

Proton beam writing (PBW) is a new direct-write technique which has shown great potential to fabricate structures down to 20 nm level in resist material. Protons can be accelerated up to a high energy (3.5 MeV) at Centre for Ion Beam Applications. Because the mass of a proton is much larger than the mass of an electron (m_p:m_e = 1,800:1), the energy of the secondary electrons is very small compared with secondary electrons generated by electron beam lithography. Therefore, a proton will travel along a straight path into resist and secondary electrons will only expose the resist within several nanometers around the path of the proton. PBW is capable of fabricating structures with very straight, vertical and smooth sidewalls without proximity effect. This is very important when combining PBW with Ni electroplating and nanoimprinting as well as injection molding. High quality Ni molds with smooth and vertical side walls are critical in nanoimprint lithography and injection molding. In our experiments, several new resists including AR-P 3250, a mixture of AR-P 3250 and AR 300-12, and ma-N 2401 are tested with PBW for the production of high aspect ratio Ni molds and thermoplastic replication with these molds. High aspect ratio structures (up to 7) are fabricated at a width of 500 nm in Ni molds. The structures are transferred to plastic via nanoimprinting and injection molding.     

High throughput projection UV lithography of high-aspect-ratio thick SU-8 microstructures

This paper presents a method and an ultra-violet (UV) lithography system to fabricate high-aspect-ratio microstructures (HARMS) with good sidewall quality and nice dimension control to meet the requirement for industrial high throughput and high yield production of micro devices. The advantages, equipment, working principle of UV projection scanning exposure, and scanning exposure strategies are introduced first. Following the numerical simulation for the UV projection scanning exposure of thick SU-8 photoresist, experiment results are demonstrated for different exposure strategies. With Continually Changing Focus Projection Scanning (CCFPS), SU-8 microstructures with 860 μm high and 15 μm feature size are demonstrated. For microstructure with 866 μm height, 20 μm width, from the top layer to the bottom layer, the dimension can be controlled in the range of +0.7 to ?1.7 μm; also, the vertical sidewall angle can be controlled inside 90 ± 0.16°. It approves that the CCFPS exposure for HARMS can achieve much straighter and more vertical sidewall compared with UV contact print or UV projection exposure with focusing image on the resist surface or an optimized depth.     

Fabrication of AFM probe with CuO nanowire formed by stress-induced method

A novel method has been proposed to fabricate an atomic force microscope (AFM) probe using CuO nanowire and a stress-induced method that can form the nanowire easily. By heating a commercial AFM probe with a film coating of Ta and Cu, a Cu hillock with CuO nanowires on its surface could be formed at the end of the probe. The thickness of the coating films, the heating temperature, and the heating time were investigated to obtain CuO nanowires with a high aspect ratio for use as an AFM probe tip. It was found that a suitable probe tip can be fabricated using the a Cu film thickness of 700 nm, a heating temperature of 380 °C and a heating time of 6 h. Probe tips (~5 μm high) and nanowires of ~25 nm diameter were obtained successfully. In the range evaluated, the measurement resolution of the CuO nanowire probe was slightly worse than that of a commercial AFM probe. However, both probes had almost the same dimensional measurement precision.     

Dual layer photoresist complimentary lithography applied on sapphire substrate for producing submicron patterns

In this study, the combined technologies of dual-layer photoresist complimentary lithography (DPCL), inductively coupled plasma-reactive ion etching and laser direct-write lithography are applied to produce the submicron patterns on sapphire substrates. The inorganic photoresist has almost no resistance for chlorine containing plasma and aqueous acid etching solution. However, the organic photoresist has high resistance for chlorine containing plasma and aqueous acid etching solution. Moreover, the inorganic photoresist is less etched by oxygen plasma etching process. The organic and inorganic photoresist deposit sequentially into a composite photoresist on a substrate. The DPCL takes advantages of the complementary chemical properties of organic and inorganic photoresist. We fabricated two structures with platform and non-platform structure. The non-platform structure featured structural openings, the top and bottom diameters and the depth are approximately 780, 500 and 233 nm, respectively. The platform structure featured structural openings, the top and bottom diameters and the depth are approximately 487, 288 and 203 nm, respectively. The precision submicron or nanoscale patterns of large etched area and patterns with high aspect ratio can be quickly produced by this technique. This technology features a low cost but high yield production technology. It has the potential applications in fabrication of micro-/nanostructures and devices for the optoelectronic industry, semiconductor industry and energy industry.     

Single-mode—multimode—single-mode and lossy mode resonance-based devices: a comparative study for sensing applications

In this work, a thin-film consisting of 15 bilayers (estimated thickness: 210 nm) of titanium (IV) oxide and poly(sodium 4-styrenesulfonate) is simultaneously deposited onto two optical fiber structures: a single-mode—multimode—single-mode (SMS) device and a lossy mode resonance (LMR)-based device. The performance of both structures, as refractometers and relative humidity sensors, is studied and compared. In both cases, the sensitivity of the LMR-based device (955 nm/RIU and 3.54 nm/RH %, respectively) highly improves the one of the SMS (142 nm/RIU and 0.3 nm/RH %). These facts can be taken into account when developing sensors based on either SMS or LMR technologies.     

Micromachining of electroformed nickel mold using thick photoresist microstructure for imprint technology

In order to fabricate polymer-based microstructures with feature sizes on the order of micrometers, we have been developing a microimprint technology with a fine nickel (Ni) mold instead of a conventional photolithography technique. The Ni mold was successfully fabricated by electroforming using a positive thick photoresist microstructure patterned on a silicon substrate as a replication master. The photoresist microstructure with excellent edge quality can be obtained under irradiation with single wavelength (g line) selected from a high-pressure mercury lamp. In addition, its sidewall angle in the range of 65° to 84° can be controlled precisely by varying the distance between a photomask and a photoresist surface. On the structured photoresist master, Ni was electroplated up to a thickness of about 110 μm, and then removed from the master. In this process, two-step electroplating at different current densities was carried out in order to prevent deformation of the photoresist master due to stress generated in a Ni electrodeposit. With the Ni mold, fine patterns with a width of 10 or 30 μm and a depth of 24 μm were almost completely transferred to polymetric materials (PMMA). The geometrical dimensions of the fabricated PMMA microstructures were found to be only about 10% reduction against the Ni mold.     

Direct imprinting of organic–inorganic hybrid materials into high aspect ratio sub-100 nm structures

The challenging fabrication of sub-100-nm structures with high aspect ratio by UV-nanoimprint lithography (NIL) is addressed in this work. Thermal shrinkage is induced by cooling the structures below room temperature to avoid the issues commonly arising during the release of the polymeric nanostructures from the master. The UV-NIL has been performed to obtain OrmoComp^® nanostructures using OrmoStamp^® working stamps copied from Si masters. Nanoridges and nanopillars with 45 nm width and 380 nm thickness have been fabricated with a corresponding aspect ratio of 8.5. This is, to the best of our knowledge, the highest aspect ratio achieved using organic–inorganic hybrid materials at the sub-100-nm scale.     

Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique

Vertical Si nanowires with ultra-high-aspect-ratio were fabricated using a combined process of deep reactive ion etching and sacrificial oxidation. The combined process starts with etching the Si substrates by the Bosch process to form micrometer-scale structures. The etched micrometer-scale structures are shrunk to nanometer-scale by sacrificial oxidation. The fabricated Si nanowires that were aligned vertically to the substrate had a diameter of less than 200 nm and a length greater than 10 μm. One of the fabricated Si nanowires had a diameter of 110 nm and a length of 11 μm. The resulting aspect-ratio reached 100, which is a value that is significantly high for vertical Si nanowires fabricated by using a top-down approach.     

Orthogonal and fine lithographic structures attained from the next generation proton beam writing facility

A second generation proton beam writing (PBW) system has been built at the Centre for Ion Beam Applications at the National University of Singapore for fabrication of high aspect ratio 3D nano lithographic structures. System improvements and a few lithographic structures obtained with this facility are presented in this paper. Through accurate alignment of the magnetic quadrupole lenses and the electrostatic scanning system, orthogonal beam scanning has been achieved. The earlier constrain of limited beam scan area has been overcome by adopting a combination of beam and stage scanning as well as stitching. With these improvements smallest ever Ni structure of 65 nm in width has been fabricated using nickel electroplating on a proton beam written PMMA sample in the second generation PBW facility. Using this improved PBW facility, we have also demonstrated the fabrication of fine lithographic patterns with 19 nm line width and 60 nm spacing in 100 nm thick negative high resolution hydrogen silsesquioxane resist. Future possible system improvements leading to finer resolution will be discussed briefly.     

Vertical mirrors fabricated by deep reactive ion etching forfiber-optic switching applications

We report on vertical mirrors fabricated by deep reactive ion etching of silicon. The mirror height is 75 μm, covering the fiber core of a single-mode fiber when the latter is placed into a groove of equal depth and etched simultaneously with the mirror. To obtain a uniform etch depth, etching is stopped on a buried oxide layer. Using the buried oxide as a sacrificial layer allows to fabricate mirrors with suspension and actuation structures as well as fiber-alignment grooves in one and the same processing step. A minimal mirror thickness of 2.3 μm was achieved, resulting in an aspect ratio higher than 30. The verticality was better than 89.3°. In the upper part of the mirror a surface roughness below 40 nm rms was obtained. At a wavelength of 1300 nm the reflectivity of the aluminum-coated mirrors was measured to be higher than 76%. Using a reactive ion etched mirror we have fabricated an optical fiber switch with electrostatic actuation. The coupling loss in the bar state of two packaged prototypes was between 0.6 and 1.7 dB and between 1.4 and 3.4 dB in the cross state. The switching time is below 0.2 ms     

Micromachined pyramidal shaped biodegradable microneedle and its skin penetration capability

A biodegradable pyramidal shaped microneedle array made of hyaluronic acid-based material was fabricated by anisotropic wet etching and a molding process. First, pyramidal shaped needles were fabricated on a Si wafer by anisotropic wet etching as an original master and then a mixture of two biodegradable materials, hyaluronic acid and a collagen, were replicated with the same shape as the original Si needle by a molding process. The height and pitch of the needle were 0.21 and 0.62 mm, respectively. The tip radius in the replicated biodegradable needle became 0.005 mm. The penetration capability of the needle arrays was evaluated by applying the load to skin multiple times. Results showed that both the Si and biodegradable needle arrays could successfully penetrate silicone rubber sheets with the applied load of 100 g. The developed biodegradable needle arrays also successfully penetrated mouse skin with the load of 50 g.     

Fabrication of SU-8 photoresist micro–nanofluidic chips by thermal imprinting and thermal bonding

Micro–nanofluidic chips have been widely applied in biological and medical fields. In this paper, a simple and low-cost fabrication method for micro–nano fluidic chips is proposed. The nano-channels are fabricated by thermal nano-imprinting on an SU-8 photoresist layer followed by thermal bonding with a second SU-8 photoresist layer. The micro-channels are produced on the second layer by UV exposure and then thermal bonded by a third layer of SU-8 photoresist. The final micro–nano fluidic chip consists of micro-channels (width of 200.0 ± 0.1 μm and, depth of 8.0 ± 0.1 μm) connected by nano-channels (width of 533 ± 6 nm and, depth of 372 ± 6 nm), which has great potential in molecular filtering and detection.

     

Laser polishing and 2PP structuring of inside microfluidic channels in fused silica

This study presents the development of post-processing steps for microfluidics fabricated with selective laser etching (SLE) in fused silica. In a first step, the SLE surface—even inner walls of microfluidic channels—can be smoothed by laser polishing. In addition, two-photon polymerization (2PP) can be used to manufacture polymer microstructures and microcomponents inside the microfluidic channels. The reduction in the surface roughness by laser polishing is a remelting process. While heating the glass surface above softening temperature, laser radiation relocates material thanks to the surface tension. With laser polishing, the RMS roughness of SLE surfaces can be reduced from 12 µm down to 3 nm for spatial wavelength λ < 400 µm. Thanks to the laser polishing, fluidic processes as well as particles in microchannels can be observed with microscopy. A manufactured microfluidic demonstrates that SLE and laser polishing can be combined successfully. By developing two-photon polymerization (2PP) processing in microchannels we aim to enable new applications with sophisticated 3D structures inside the microchannel. With 2PP, lenses with a diameter of 50 µm are processed with a form accuracy rms of 70 nm. In addition, this study demonstrates that 3D structures can be fabricated inside the microchannels manufactured with SLE. Thanks to the combination of SLE, laser polishing and 2PP, research is pioneering new applications for microfluidics made of fused silica.