Development of Binem® displays on flexible plastic substrates

Abstract— We have successfully fabricated Binem® displays on thin flexible plastic substrates. The fabrication is based on the standard Binem® process for glass, which has been adapted to plastic using new materials and technologies. The first application is targeted for an embedded display for smart‐card products.     

X-Ray masks for very deep X-Ray lithography

 The high aspect ratio, deep x-ray lithography and electrodeposition process [Becker et al. (1986)] can be expensive unless throughput is high enough. The use of a very high energy synchrotron has allowed the cost of exposure to be significantly reduced through simultaneous exposure of stacked photoresist [Guckel et al (1994)]. Synchrotron radiation at high photon energies has resulted the use of a large area x-ray mask. Both stacked exposures and a large area x-ray masks have significantly increased the throughput of the deep x-ray lithography and electrodeposition process. Received: 25 August 1997/Accepted: 3 September     

Performance of thin film silicon MEMS on flexible plastic substrates

The fabrication and characterization of thin film silicon MEMS microbridges on flexible polyethylene terephthalate substrates are described. Surface micromachining using an aluminum sacrificial layer and a maximum processing temperature of 110 °C was used for device fabrication. These microbridges are electrostatically actuated and their deflection at resonance and at low frequencies is measured optically. Quasi-DC deflection with a quadratic dependence of the actuation voltage is observed, and resonance frequencies up to 2 MHz and quality factors of around 500 are measured in vacuum. Bending measurements are performed by subjecting these devices to tensile and compressive strain. The low frequency response (bridge deflection as a function of the applied voltage) was measured in air before bending and after every bending step. Under tensile strain, 16.6% of the devices survive the maximum bending with a radius of curvature of 1 cm, equivalent to a tensile strain 1.25%. In contrast, for compressive strain, 50% of the devices survive the bending corresponding to a radius of curvature of −0.5 cm, equivalent to a compressive strain of −2.5%. Thin film silicon microresonators on flexible plastic substrates can withstand more compressive strain than tensile.     

Multi-scale,multi-depth lithography using optical fibers for microfluidic applications

This paper proposes and demonstrates a method for multi-scale, multi-depth three-dimensional (3D) lithography. In this method, 3D molds for replicating microchannels are fabricated by passing a non-focused laser beam through an optical fiber, whose tip is immersed in a droplet of photopolymer. Line width is adjustable from 1 to 980 µm using eight kinds of optical fibers with different core diameters. The height of line drawing can be controlled by adjusting the distance between the tip of the optical fiber and a substrate. The surface roughness (R_a, R_z) of a single line and plane was evaluated. The method was employed to fabricate a 3D mold of a microchannel containing tandem chambers, which was then successfully replicated in PDMS. Multi-scale, multi-depth 3D lithography can provide a simple, flexible tool for producing PDMS microfluidic devices.     

Fabrication and characteristics of ZnO thin films deposited by RF sputtering on plastic substrates for flexible display

ZnO thin films were successfully grown on flexible plastic substrates using radio-frequency mag-netron sputtering method at room temperature.The effects of the sputtering power on the quality of the ZnO films have been investigated.The results show that thin films were polycrystalline,with wurtzite structure and a strong preferred c-axis orientation (002).The root-mean-square (rms) surface roughness of the ZnO thin films is 22.1 nm.The ZnO thin films fabricated by sputtering with 70 W sputtering power have a high mobility of 34.33 cm 2 /V·s.The ZnO films are shown to be compatible with flexible display on plastic substrates.     

Roll‐to‐roll manufacturing of electronics on flexible substrates using self‐aligned imprint lithography (SAIL)

Abstract— The manufacture of large‐area arrays of thin‐film transistors on polymer substrates using roll‐to‐roll (R2R) processes exclusively is being developed. Self‐aligned imprint lithography (SAIL) enables the patterning and alignment of submicron‐sized features on meter‐scaled flexible substrates in the R2R environment. SAIL solves the problem of precision interlayer registry on a moving web by encoding all the geometry information required for the entire patterning steps into a monolithic three‐dimensional imprint with discrete thickness modulation. The pre‐aligned multiple‐step mask structure maintains its alignment regardless of subsequent substrate distortion. Challenges are encountered in relation to the novel nature of using flexible substrates and building toolsets for the R2R processing. In this paper, methods of the SAIL process, the resulting active‐matrix backplanes, the trajectory of SAIL process development, and the remaining issues for production are presented.     

Shape deviations in masks for optical structures produced by electron beam lithography

E-beam lithography is a well-known technology used in the structuring of resist for mask fabrication. In the LIGA process E-beam lithography is used to fabricate the first X-ray mask. Due to the high precision of X-ray lithography patterning errors and defects are transformed into the several hundred micrometers thick resist structures. The side walls of these high-aspect-ratio structures are often used as optical mirrors, for which very good surface properties are essential. Deviations in the shape of the side walls even far below the wavelength of the used light lead to spurious strayed or misguided light. For grating microspectrometers the requirements are particularly stringent. The width of the grating teeth does not only have to be precise, but also the grating teeth have to be positioned accurately along the entire grating width. Using LIGA microspectrometers as an example, deviations in masks and LIGA-structured side walls were studied and subsequent correlations made with the corresponding e-beam writing pattern.     

Flexible and bistable FLC and cholesteric displays on plastic substrates for mobile applications and smart cards

Abstract— New smart-card applications like purse cards, etc. require an integrated display which allows the card-holder to read information which is stored on the IC of the card. On the other hand, the integration of a display into a plastic card requires some very specific features like flexibility and pressure stability, low-voltage CMOS-addressing, memory capability, and, of course, a reflective mode since no backlight is available. In this paper, two bistable reflective LCD solutions using ferroelectric and cholesteric LCs are discussed and very promising prototype results are presented. Pressure and bending tests as well as contrast measurements are compared in order to show the potential of meeting the requirements for use in smart cards.     

Microfabrication of thick tungsten films for use as absorbers of deep X-ray lithography masks

 We fabricated thick (5 μm) tungsten (W) film patterns by sputtering and dry etching, and realized a new deep X-ray lithography mask. The X-ray mask with 5-μm-thick W absorbers could expose about 1-mm-thick resist structures. In the deposition process of W films, the column structure of about 0.2 μm grain size, from which pattern edge roughness originates, disappeared by adding nitrogen into the sputtering gas. W film etching was carried out by reducing gas pressure and cooling the substrate (−40 °C), and a side etch width of below 0.2 μm was obtained. From the results of the pattern edge roughness and the side etch width, a pattern fabrication accuracy below ±0.5 μm was achieved. Furthermore, film stress, which induces pattern distortion, was reduced to below 50 MPa by controlling the sputtering gas pressure. The obtained mask achieved a pattern distortion below ±0.3 μm. Received: 7 July 1999/Accepted: 29 May 2000     

Latest advances in substrates for flexible electronics

Abstract— Recent advances in both organic‐ and inorganic‐based electronics processed on flexible substrates offer substantial rewards in terms of being able to develop displays that are thinner, lighter, robust, and conformable, and can be rolled away when not required. In addition, plastic‐based substrates coupled with the recent developments in solution deposition and ink‐jet printing for laying down OLED materials and active‐matrix thin‐film‐transistor (TFT) arrays open up the possibility of cost‐effective processing in high volumes using roll to roll (R2R) processing. To replace glass, however, a plastic substrate needs to be able to offer some or all of the properties of glass, i.e., clarity, dimensional stability, thermal stability, barrier, solvent resistance, and low coefficient of thermal expansion (CTE) coupled with a smooth surface. In addition, a conductive layer may be required. No plastic film offers all these properties so any plastic‐based substrate will almost certainly be a multilayer composite structure. This paper will discuss the issues associated with selecting plastic materials, contrast the various options, and highlight how to gain optimum performance through process control. This will be illustrated with examples of film in use in flexible electronic applications.     

E-beam lithography of nano-interdigital transducers on insulating and semiconducting substrates

This work describes the micro-fabrication process developed to manufacture nano-interdigital transducers (nano-IDTs) to be used in surface acoustic wave applications. The combination of electron-beam (e-beam) lithography and lift-off process is shown to be effective in fabricating IDT finger patterns with a line width below 100 nm and good yield. It is also shown how a very thin organic anti-static layer can be used to avoid charge accumulation on the resist layer during e-beam lithography, which is easy to occur on insulating piezoelectric substrates and results in e-beam deflection. However, it is also shown how the use of this anti-static layer is not required with the insulating piezoelectric layer resting on a semiconducting substrate such as highly doped silicon. The effect of the e-beam dose on insulating and semiconducting layers is also discussed.     

Alignment layers for cholesteric displays on glass and plastic substrates

Abstract— The optical performance of surface-stabilized cholesteric liquid-crystal displays (SCT-LCDs) has been optimized by using obliquely sputtered SiO₂ as the alignment layer. A comparison with polyimides used up to now showed an improvement in the contrast ratio by a factor of 2 for glass displays. A second advantage of this material is the absence of high temperatures during the manufacturing process. Therefore, it is possible to use obliquely sputtered SiO₂ for the preparation of plastic display prototypes. We have realized a 6-in. VGA display with approximately 130 dpi. This is the largest cholesteric display with the highest resolution fabricated on plastic substrates to date.     

Large area mold fabrication for the nanoimprint lithography using electron beam lithography

The mold fabrication is a critical issue for the development of nanoimprint lithography as an effective low-cost and mass production process.This paper describes the fabrication process developed to fabricate the large area nanoimprint molds on the silicon wafers.The optimization of e-beam exposure dose and pattern design is presented.The overlayer process is developed to improve the field stitching accuracy of e-beam exposure,and around 10 nm field stitching accuracy is obtained.By means of the optimizatio...     

Method for fabrication of liquid‐crystal cells with narrow gap,fast switching,and flexible plastic substrates

Abstract— A phase‐separation method for the construction of devices with specific internal architecture of LC/polymer composite system is presented. The method results in adjacent uniform polymer and LC films parallel to the substrates. Scanning electron microscopy was employed to investigate the internal structures. The results show that the thicknesses of the LC and the polymer films in cells constructed with fixed‐size spacers directly depends on the LC/polymer in the initial mixture. This can be effectively used for precision cell‐gap control and to fine‐tune the LC optical path length. Cells with a submicrometer gap, prepared with this method and with 35 wt.% of LC in the mixture, exhibited a total response time approaching 1 msec. This method has also been used to fabricate devices with plastic substrates.     

RF MEMS membrane switches on GaAs substrates for X-band applications

Micromechanical switches have demonstrated great potential at microwave frequencies. For low-loss applications at microwave frequencies, it is important to use high-resistivity substrates. This paper presents the design and fabrication of the shunt-capacitive MEMS switch on GaAs substrates. Analytical mechanical and impedance models of the membrane switch are given, and the results are confirmed by using the ANSYS and HFSS software, respectively. A surface micromachining process, which is compatible with the conventional millimeter-wave integrated circuits (MMICs) fabrication technology, was adopted to fabricate the RF switch on GaAs substrates. Its S-parameter was taken using a HP8510C vector network analyzer and a Cascade Probe station. The measured insertion loss of the switch and its associated transmission line is less than 0.25 dB from 1 to 25.6 GHz, and the isolation may reach -42 dB at its self-resonate frequency of 24.5 GHz. The actuation voltage is about 17 V. The switch has demonstrated lifetimes as long as 5/spl times/10/sup 6/ cycles. The wideband high performance in isolation and insertion loss offers the monolithic integration capability with GaAs MMICs.     

Fabrication of planar and three-dimensional microcoils on flexible substrates

Inductors are basic components of magnetic sensors. Generally, with those sensors, a weak magnetic variation has to be detected. As the sensitivity increases with the inductance value, our objectives are to design inductors with a maximum of turns while keeping millimetric sizes for the sensor. In this work, we present two microcoil fabrication processes compatible with rigid and flexible substrates. The first one is used for the realization of planar microcoils with one step of copper micromoulding. For example, a 40-turn microcoil of 1 mm external diameter and 5 μm copper width and spacing wires has been obtained. The second process allows the fabrication of three-dimensional microcoils (microsolenoids). It is based on two steps of copper micromoulding. In this process, a grey-tone photolithography step is implemented. Microsolenoids with 10–13 wires have been realized.     

UV-NIL replication of microlens arrays on flexible fluoropolymer substrates

Microsystem Technologies - This paper describes application of UV-NIL technique for the fabrication of hexagonal OrmoComp microlens arrays on flexible fluoropolymer substrates having exceptional...     

Solution-processed ZnO energy harvester devices based on flexible substrates

Microsystem Technologies - The smart healthcare devices connected to the internet of things (IoT) for medical services can acquire and process physiological data of risk patients, real-time...     

Fabrication of planar and three-dimensional microcoils on flexible substrates

Inductors are basic components of magnetic sensors. Generally, with those sensors, a weak magnetic variation has to be detected. As the sensitivity increases with the inductance value, our objectives are to design inductors with a maximum of turns while keeping millimetric sizes for the sensor. In this work, we present two microcoil fabrication processes compatible with rigid and flexible substrates. The first one is used for the realization of planar microcoils with one step of copper micromoulding. For example, a 40-turn microcoil of 1 mm external diameter and 5 μm copper width and spacing wires has been obtained. The second process allows the fabrication of three-dimensional microcoils (microsolenoids). It is based on two steps of copper micromoulding. In this process, a grey-tone photolithography step is implemented. Microsolenoids with 10–13 wires have been realized.