禁带变窄效应对突变AlGaAs/GaAs HBT电流影响的研究

重掺杂使导带、价带带边同时发生了收缩,从而产生禁带变窄效应(BGN)。对于基区重掺杂Npn突变AlGaAs/GaAsHBT,BGN引起导带和价带突变界面势垒形状及高度都发生了改变,这对基区、集电区电流产生重要的影响。文中基于Jain-Roulston禁带收缩模型及热场发射-扩散载流子输运机制,对这一现象进行了深入的研究。通过与其它计算程序常用的几种BGN模型比较得出为了更好描述电流传输,利用Jain-Roulston的BGN模型,考虑禁带变窄量在导带、价带有不同的分配,从而对电流有不同的影响是必要的。     

基区重掺杂对突变AlGaAs/GaAs HBT电学性能的影响

基区重掺杂不仅使基区能带发生变窄效应(BGN),且使突变结界面势垒形状及高度均发生了扰动,这两种因素都对电流输运特性产生重要的影响.基于热场发射-扩散模型,分析了基区重掺杂突变AlGaAs/GaAs HBT中的电流传输特性.结果表明:为了精确描述电流传输,必须考虑突变结界面势垒形状及高度扰动所引起的电流变化.     

重掺杂能带结构的变化对突变HBT电流影响

基于禁带变窄量在导带和价带之间的分布比例与掺杂浓度相关的Jain-Roulston模型,研究了重掺杂能带结构的变化对突变异质结HBT电流影响.研究表明:禁带变窄量在导、价带间分布模型选用的不同,计算结果之间有明显的差别,基于Jain-Roulston分布模型的结果同实验测量符合很好.因此对于突变HBT性能分析,必须精确考虑重掺杂禁带变窄量在能带上的具体分布.     

重掺杂能带结构的变化对突变HBT电流影响

基于禁带变窄量在导带和价带之间的分布比例与掺杂浓度相关的Jain-Roulston模型,研究了重掺杂能带结构的变化对突变异质结HBT电流影响.研究表明:禁带变窄量在导、价带间分布模型选用的不同,计算结果之间有明显的差别,基于Jain-Roulston分布模型的结果同实验测量符合很好.因此对于突变HBT性能分析,必须精确考虑重掺杂禁带变窄量在能带上的具体分布.     

具有超高掺杂基区的GaAs赝HBT分析

超高掺杂GaAs具有明显的禁带变窄(BGN)效应,因此采用超高掺杂基区的GaAs同质晶体管也可获得HBT的效果.故称之为赝HBT(p—HBT)。本文根据实验结果讨论了超高掺杂情况下GaAs的BGN效应及其对有效本征载流子浓度的影响,并对np~+n型结构GaAs p—HBT的发射极注入效率和共发射极电流增益进行了理论分析。结果表明,当基区掺杂浓度高于1×10~(20)/cm~3时可以获得较好的器件特性。     

重掺杂突变InP/InGaAs HBT界面势垒扰动对电流传输的影响

基区重掺杂使HBT突变结界面势垒形状及高度发生了扰动,这种扰动对电流输运特性有重要的影响.本文基于热场发射-扩散模型,分析了基区重掺杂突变InP/InGaAs HBT中的电流传输特性,并同实验测试数据进行了比较.结果表明:为了精确地描述电流传输特性,基区重掺杂情况下,必须考虑突变结界面势垒形状及高度扰动所引起的电流变化.     

具有AlGaAs缓变结构的InGaP/GaAs HBT性能改进分析

对改进型结构具有零导带势垒尖峰的缓变InGaP/AlGaAs/GaAs HBT器件的直流和高频特性进行了理论探讨,并同传统突变结构的InGaP/GaAs HBT的相应性能作了比较。结果表明:在低于30 nm的一定范围内的缓变层厚度下,与突变的InGaP/GaAs HBT相比,改进型结构的InGaP/AlGaAs/GaAs HBT具有更低的offset和开启电压、更强的电流驱动能力、更好的伏-安输出特性和高频特性。     

突变 HBT准费密能级分裂与复合电流

要精确描述HBT的复合电流,必须考虑异质结界面处的准费密能级分裂。而重掺杂改变了分裂量的大小．从而使复合电流发生与之相对应的变化。本文利用更准确的考虑了重掺杂效应影响的准费密能级分裂模型,计算了各种复合电流。通过比较得出准费密能级分裂对复合电流的重要性。     

si/Si_(1-x)Ge_x/Si异质结双极晶体管中基区杂质外扩散与未掺杂Si_(1-x)Ge_x结隔离层的影响

研究了Si/Si_(1-x)Ge_x/Si n-p-n异质结双极晶体管(HBT)的结界面处基区杂质外扩散与标定的未掺杂Si_(1-x)Ge_x隔离层的影响。发现,来自重掺杂基区或非突变界面处少量硼的外扩散会在导带中形成寄生势垒,它严重地影响了HBT中集电极电流的提高。未掺杂界面隔离层能消除这些寄生势垒从而极大地提高了集电极电流。     

基区重掺杂的高电流增益AlGaAs/GaAs异质结双极晶体管

研究了AlGaAs/GaAs异质结双极晶体管(HBT)的电流增益和AlGaAs/GaAs异质结二极管(HD)的发光强度随偏压的变化。HBT的发射板-基极结的理想因子接近于1,这与HD中发光强度随偏压的变化关系相一致。重掺杂基区HBT电流增益的降低被认为是基区中非辐射复合电流所引起。在基区掺杂为2×10~(10)cm~(-3)的HBT中得到80的高电流增益。     

基区重掺杂禁带变窄效应在突变HBT器件模拟中的准确考虑

Heavy doping of the base in HBTs brings about a bandgap narrowing （BGN） effect, which modifies the intrinsic carrier density and disturbs the band offset, and thus leads to the change of the currents. Based on a thermionic-field-diffusion model that is used to the analyze the performance of an abrupt HBT with a heavydoped base, the conclusion is made that, although the BGN effect makes the currents obviously change due to the modification of the intrinsic carrier density, the band offsets disturbed by the BGN effect should also be taken into account in the analysis of the electrical characteristics of abrupt HBTs. In addition, the BGN effect changes the bias voltage for the onset of Kirk effects.     

Considerations of dopant-dependent bandgap narrowing for accurate device simulation in abrupt HBTs

Heavy doping of the base in HBTs brings about a bandgap narrowing(BGN)effect,which modifies the intrinsic carrier density and disturbs the band offset,and thus leads to the change of the currents.Based on a thermionic-field-diffusion model that is used to the analyze the performance of all abrupt HBT with a heavydoped base,the conclusion is made that,although the BGN effect makes the currents obviously change due to the modification of the intrinsic carrier density,the band offsets disturbed by the BGN effect should also be taken into account in the analysis of the electrical characteristics of abrupt HBTs.In addition,the BGN effect changes the bias voltage for the onset of Kirk effects.     

The importance of bandgap narrowing distribution between theconduction and valence bands in abrupt HBTs

Abrupt heterojunction bipolar transistors (HBTs) show interfaces where discontinuities in the energy levels appear. Currents through these interfaces are controlled by tunneling and thermionic emission. The values of these currents depend on the form and height of the energy barriers, which are disturbed by the heavy doping effects on semiconductor energy band structure. In this work, the real bandgap narrowing is distributed between the conduction and valence bands according to Jain-Roulston model, and its effect on the base and collector currents of Si/SiGe and InP/InGaAs HBTs is analyzed. This analysis is carried out through a numerical model which combines the drift-diffusion transport in the bulk of transistor with the thermionic emission and tunneling at the base-emitter interface, and an empirically determined surface recombination current     

The impact of bandgap offset distribution between conduction and valence bands in Si-based graded bandgap HBT''s

This work examines the impact of bandgap offset distribution between conduction and valence bands in Si-based graded bandgap HBT's using dc and ac simulation. For a fixed total bandgap offset, a conduction band pushed up by the total offset, together with a valence band pushed up by 2× the total offset gives the best ac performance, and allows the highest operational current for high frequency applications in an n–p–n HBT. A retrograded mole fraction profile, when properly optimized, can produce nearly identical ac performance for different bandgap offset distributions. These suggest that contrary to popular belief, applying careful optimization can yield excellent transistor performance for any arbitrary band alignment for both n–p–n and p–n–p graded bandgap HBT's.     

Heterojunction tunnelling model for pnp and npn polysilicon emitter bipolar transistors

A new tunnelling model is described which treats the interfacial layer in a polysilicon emitter transistor as a wide bandgap semiconductor. Potential barriers are formed in the valence and conduction bands, the sizes of which vary with the dopant type and concentration in the interfacial layer.<>     

应变致能带分裂对Si_（1－x）Ge_x应变层中重掺杂禁带窄变的影响

针对应变Ｓｉ１－ｘＧｅｘ的应变致能带分裂及重掺杂对裂值的影响，提出了多子双带结构的等价有效简并度模型和有关算法。模型中考虑了非抛物线能带结构。应用该模型，计算了赝形生长在（１００）Ｓｉ衬底上的Ｓｉ１－ｘＧｅｘ应变层的重掺杂禁带窄变，发现当掺杂超过一定浓度（对于ｐ型和ｎ型合金，该浓度分别约为１．９×１０１９ｃｍ－３和３．５×１０１９ｃｍ－３）后，它在某一Ｇｅ组分下得到极大值，而当掺杂低于这个浓度时，它则随Ｇｅ组分的增加单调下降。文中还将计算结果与其它未细致考虑应变致能带分裂因素的理论工作进行了比较。     

Voltage- and temperature-dependent gate capacitance and current model: application to ZrO/sub 2/ n-channel MOS capacitor

Based on the energy-dispersion relation in each region of the gate-dielectric-silicon system, a tunneling model is developed to understand the gate current as a function of voltage and temperature. The gate capacitance is self-consistently calculated from Schrodinger and Poisson equations subject to the Fermi-Dirac statistics, using the same band structure in the silicon as used for tunneling injection. Franz two-band dispersion is assumed in the dielectric bandgap. Using a Wentzel-Kramer-Brillouin (WKB)-based approach, direct and Fowler-Nordheim (FN) tunneling and thermionic emission are considered simultaneously. The model is implemented for both the silicon conduction and valence bands and both gate- and substrate-injected currents. ZrO/sub 2/ NMOSFETs were studied through temperature-dependent C/sub g/-V/sub g/ and I/sub g/-V, simulations. The extracted band gaps and band offsets of the ZrO/sub 2/- and interfacial-Zr-silicate-layer are found to be comparable with the reported values. The gate currents in ZrO/sub 2/-NMOSCAPs are found to be primarily contributed from the silicon conduction band and tunneling appears to be the most probable primary mechanism through the dielectric. Oscillations of gate currents and kinks of gate capacitance were observed near the flat-band in the experiments. These phenomena might be caused by the interface states.