共查询到20条相似文献,搜索用时 140 毫秒
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研究了硅衬底上电子束蒸发铝膜,在H2SO4水溶液中阳极氧化形成硅衬底多孔氧化铝复合结构的过程.硅衬底电子束蒸发铝膜的阳极氧化过程主要由多孔氧化铝的生长、氧化铝生长向氧化硅生长的过渡和氧化硅生长三个阶段构成.硅衬底多孔氧化铝复合结构的透射电子显微镜观察表明,在硅衬底上形成了垂直于硅表面的氧化铝纳米孔,而孔底可形成SiO2层.有序结构多孔氧化铝的形成不依赖于铝膜的结晶状态,而是由阳极氧化过程的自组织作用所决定的.实验表明将多孔氧化铝制备工艺移植到硅基衬底上直接形成硅基衬底多孔氧化铝复合结构是可行的,它也为硅基纳米材料的制备提供了一种新的自组织模板. 相似文献
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硅基底电子束蒸发铝膜阳极氧化特性 总被引:3,自引:0,他引:3
研究了硅衬底上电子束蒸发铝膜 ,在 H2 SO4 水溶液中阳极氧化形成硅衬底多孔氧化铝复合结构的过程 .硅衬底电子束蒸发铝膜的阳极氧化过程主要由多孔氧化铝的生长、氧化铝生长向氧化硅生长的过渡和氧化硅生长三个阶段构成 .硅衬底多孔氧化铝复合结构的透射电子显微镜观察表明 ,在硅衬底上形成了垂直于硅表面的氧化铝纳米孔 ,而孔底可形成 Si O2 层 .有序结构多孔氧化铝的形成不依赖于铝膜的结晶状态 ,而是由阳极氧化过程的自组织作用所决定的 .实验表明将多孔氧化铝制备工艺移植到硅基衬底上直接形成硅基衬底多孔氧化铝复合结构是可行的 相似文献
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Improved performance of Si-based spiral inductors 总被引:1,自引:0,他引:1
Tung-Sheng Chen Deng J.D.-S. Chih-Yuan Lee Chin-Hsing Kao 《Microwave and Wireless Components Letters, IEEE》2004,14(10):466-468
Conventional spiral inductors on silicon wafer have suffered low quality (Q) factor due to substrate loss. In this work, a technique that combines optimized shielding poly and proton implantation treatment is utilized to improve inductor Q-value. The optimized poly-silicon and proton-bombarded substrate have added 37% and 54% increment to the Q-value of inductors, respectively. If two techniques are combined, a phenomenal Q-value increment as high as 122% of 4-nH spiral inductors can be realized. The combination of the two means has created a multiplication of their individual contribution rather than addition. The technique used in this work shall become a critical measure to put inductors on silicon substrate with satisfactory performance for Si-based radio frequency integrated circuit applications. 相似文献
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Spiral inductors and metal-to-metal capacitors for microwave applications, which are integrated on a silicon substrate by using standard 0.8 μm BiCMOS technology, are described. Optimization of the inductors has been achieved by tailoring the vertical and lateral dimensions and by shunting several interconnect metal layers together. Lumped element models of inductors and capacitors provide detailed understanding of the important geometry and technological parameters on the device characteristics. The high quality factors of nearly 10 for the inductors are among the best results in silicon, particularly when using standard silicon technology 相似文献
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Guo L.H. Zhang Q.X. Lo G.Q. Balasubramanian N. Kwong D.-L. 《Electron Device Letters, IEEE》2005,26(9):619-621
Wafer-transfer technology (WTT) has been applied to transfer RF inductors from a silicon wafer to an opaque plastic substrate (FR-4). By completely eliminating silicon substrate, the high performance of integrated inductors (Q-factor > 30 for inductance /spl sim/3 nH with resonant frequency /spl sim/23 GHz) has been achieved. Based on the analysis of a modified /spl pi/-network model, our results suggest that the performance limitation is switched from being a synthetic mechanism of substrate and metal-ohmic losses on low resistivity Si-substrate to merely a metal-ohmic loss on FR-4. Thus, the inductor patterns, which are optimized currently for RFICs on silicon wafer, can be further optimized to take full advantage of the WTT on new substrate from the newly obtained design freedom. 相似文献
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José R. Sendra Javier del Pino Antonio Hernández Benito González Javier García Andrés García-Alonso Antonio Nunez 《Analog Integrated Circuits and Signal Processing》2003,35(2-3):121-132
In this work we propose a modification to the conventional lumped equivalent circuit model for integrated inductors. Also the widely used parametric model is modified. The proposed models expand the frequency range where the integrated inductor behavior is accurately predicted. They are useful in developing automatic tools to assist the designers in selecting and automatically laying-out integrated inductors [1]. This work is based on measurements from integrated inductors fabricated in a standard silicon process. 相似文献
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《Solid-state electronics》2006,50(7-8):1283-1290
We present a comprehensive approach of designing on-chip inductors using a CMOS-compatible technology on a porous silicon substrate. On-chip inductors realized on standard CMOS technology on bulk silicon suffer from mediocre Q-factor values partly because of the loss created by the Si substrate at higher frequencies, in addition to the metal losses. We examine the alternative of using porous Si as a thick layer isolating the Si substrate from the metallization in an otherwise standard CMOS technology. We present theoretical designs produced with full-wave Method-of-Moments simulations, verified by measurements in standard 0.18 μm CMOS technology using Al metallization. When porous Si is introduced in that technology, the same inductor metallization produced Q-factor enhancements of the order of 50%, compared to the same inductor on bulk crystalline silicon. We also produce optimized single-ended inductor designs using Cu on porous Si, in a 0.13 μm-compatible CMOS technology. The resulting Q-factors are enhanced by a factor of 2 and reach values of 30 or more in the 2–3 GHz frequency range. Even higher quality factors can be obtained in this technology when differential designs are used. 相似文献
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J. del Pino J. R. Sendra A. Hernández S. L. Khemchandani J. Aguilera B. González J. García A. Nunez 《Analog Integrated Circuits and Signal Processing》2002,33(2):171-178
In this paper we are reporting our research in the development of automatic tools to assist the designers in selecting and automatically laying-out integrated inductors. This task is accomplished by analyzing carefully the lumped equivalent circuit model for these passive components, and using different approaches and modifications depending on the required accuracy and application. As a result modified circuit models for integrated inductors based on the conventional lumped element model are proposed. Model development is based on measurements taken from more than 100 integrated spiral inductors designed and fabricated in a standard silicon process. We show the ability of the proposed models to accurately predict the integrated inductor behavior extending the frequency range where they can be applied as compared with the conventional model. 相似文献
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To meet requirements in mobile communication and microwave integrated circuits, miniaturization of the inductive components that many of these systems require is of key importance. At present, active circuitry is used which simulates inductor performance and which has high Q-factor and inductance; however, such circuitry has higher power consumption and higher potential for noise injection than passive inductive components. An alternate approach is to fabricate integrated inductors, in which lithographic techniques are used to pattern an inductor directly on a substrate or a chip. However, integrated inductors can suffer from low Q-factor and high parasitic effects due to substrate proximity. To expand the range of applicability of integrated microinductors at high frequency, their electrical characteristics, especially quality factor, should be improved. In this work, integrated spiral microinductors suspended (approximately 60 μm) above the substrate using surface micromachining techniques to reduce the undesirable effect of substrate proximity on the inductor performance are investigated. The fabricated inductors have inductances ranging from 15-40 nH and Q-factors ranging from 40-50 at frequencies of 0.9-2.5 GHz. Microfilters based on these inductors are also investigated by combining these inductors with integrated polymer filled composite capacitors 相似文献