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对载重于午线轮胎285/75R24.5和轻载子午线轮胎185/80R14C进行了硫化测温试验。测温结果表明,载重子午线轮胎带束层区域易欠硫,胎面区域易过硫;轻载子午线轮胎胎圈区域易欠硫,胎体和胎面区域易过硫。硫化后冷却时的后硫化效应对总硫化程度影响很大,尤以轻载子午线轮胎为甚。可以通过合理调整硫化时间和温度改善轮胎整体硫化程度。 相似文献
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选取18.00-25 40PR TL510规格轮胎进行不同硫化工艺测温试验,分析研究合适的内冷却硫化工艺条件。与传统过热水硫化工艺相比,内冷却硫化工艺是在内温过热水循环一段时间后切换为冷却水循环,同时提前关闭外温蒸汽,降低胎体帘线出罐时温度,减少轮胎从出罐到进行后充气期间的帘线收缩,并降低轮胎过硫度和硫化能耗,改善轮胎硫化均匀性,提高轮胎质量。 相似文献
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工程机械轮胎硫化测温仪 总被引:2,自引:1,他引:2
介绍工程机械轮胎硫化测温仪的技术指标和功能特点。实心轮胎和工程机械轮胎硫化测温所用的测温仪必须能超长时间连续工作。工程机械轮胎硫化测温仪具有如下特性:20点测温,测温周期10s,测温和硫化计算同时进行,可连续工作22h,并自动处理异常温度,各种数据和图表测温结束后即可输出。该测温仪也适用于其它车辆斜交轮胎、子午线轮胎和其它橡胶制品的硫化测温。 相似文献
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改性双马来酰亚胺树脂的固化工艺研究 总被引:5,自引:0,他引:5
本文用DSC法研究改性双马来酰亚胺树脂的固化动力学参数和固化工艺,固化度和红外光谱确定了后处理工艺。研究所得的固化工艺条件中140℃/h、190℃/2h,240℃/4h能达到完全固化。 相似文献
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Brendan P. McGettrick Jagdish K. Vij
Ciaran B. McArdle
《International Journal of Adhesion and Adhesives》1994,14(4):211-236Dielectric spectroscopy (DS) is shown to be a most useful tool for the study of the surface initiated redox cure in model anaerobic acrylic adhesives. These models are deliberately designed to exhibit different levels of cure heterogeneity. The cure is initiated by the surfaces of two substrates on either side of a bondline. The heterogeneous cure situation is referred to as low cure through volume (CTV). Poor CTV is an undesirable feature that leads to mechanical weakness in an adhesive bond. Thus, experimental techniques based on DS are developed to investigate the cure characteristics and in particular the CTV phenomenon in the model anaerobic adhesives. 相似文献
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PCB油墨是指印制电路板(Printed Circuit Board,简称为PCB)所采用的油墨,光引发剂是PCB油墨的重要组分之一,目前常用引发剂最敏感的吸收波长在365nm左右,与高压汞灯(PCB油墨常用的固化光源)发出的最强波长一致;LED光源发出的光波长是395nm,基于光引发剂的吸收光谱与光源的发射光谱相匹配的原则,随着UVLED曝光机的出现,要求对传统PCB油墨中光引发剂的最大吸收波长做出相应的改变,光引发剂的改变将会给PCB油墨带来革命性的影响。 相似文献
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本文的目的是得到一种快速、可重复的方法来反映并量化两种不同橡胶产品在固化温度下结构的形成,从控制应力屈服测试和蠕变测试结果我们发现流变学方法可以用来很好的表征橡胶的固化。 相似文献
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A series of complexes incorporating the epoxy–imidazole adduct of phenyl glycidyl ether with 2‐ethyl‐4‐methylimidazole (PGE‐EMI), has been prepared with the acetato and chloro transition metal salts of Mn, Co, Ni, Cu, Zn, and Ag. These complexes have been characterized using spectroscopic methods (IR, UV‐Vis, 1H‐ and 13C‐NMR, where appropriate) and their thermal stabilities have been determined using elevated temperature NMR techniques. These high‐temperature NMR results indicated that the chloro complexes studied (of Mn2+, Co2+, Ni2+, Cu2+, and Zn2+) exist in equilibrium (i.e., they dissociate reversibly in a solution of dimethylsulphoxide, DMSO, at elevated temperatures), while the corresponding acetato complexes dissociate irreversibly. For the silver complexes, thermogravimetric analysis (TGA) was used to monitor the dissociation, showing that the weight loss recorded was consistent with the dissociation of the metal salt to liberate the PGE–imidazole ligand. The thermal stabilities of the metal complexes were influenced by changing both the transition metal (e.g., from Mn to Zn) and varying the anion (e.g., from acetate to chloride). From 1H‐NMR analysis, a decrease of ca. 10°C was observed in the thermal dissociation of the acetato complexes when compared with the chloro complexes, showing that the series of PGE‐EMI complexes with acetate anions is less thermally stable than the corresponding chlorides. This finding suggests that these PGE‐EMI complexes may be modified to accommodate their use in a variety of different curing schedules when used to cure epoxy resins. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 201–217, 2000 相似文献
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Heejin Park 《应用聚合物科学杂志》2017,134(15)
Evaluation of degree of cure (DoC) of a glass reinforced epoxy composite prepreg used for manufacturing of printed circuit board (PCB) is an intensive issue because of its practical importance and cost reduction in industry. Typical techniques such as differential scanning calorimetry (DSC) and fourier transform infrared spectroscopy (FTIR) are destructive and require curing a material during a chosen time, quenching the sample to stop cure before performing analysis. Thus, it is necessary to remove the temperature influence on the determination of DoC. In this study, the feasibility of nondestructive dielectric sensing method as an in situ DoC measuring technique through cure monitoring of prepreg is presented, where a vacuum packing configuration has been established so as for the prepreg to evaluate accurately the DoC in a quenched state at an ambient temperature. The optimal curing condition to get the fully cured state of a prepreg material is determined by the dielectric cure monitoring based on the behavior of ion viscosity. The temperature effect compensated DoC of prepreg is correlated and compared with that evaluated by DSC and FTIR. The correlated DoC with ion viscosity has identified the curing behavior of prepreg by determining cure kinetic parameters. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44707. 相似文献