Bi2O3薄膜的制备及其电阻开关特性的研究

电阻式存储器由于具有众多的优点有望成为最有前景的下一代高速非挥发性存储器的选择之一.实验利用射频磁控溅射法在重掺硅上沉积了Bi2O3薄膜,并对该薄膜的结晶状态和Au/Bi2O3/n+Si/Al结构的电阻开关特性进行了研究.XRD分析结果表明,射频磁控溅射法沉积所得的Bi2O3薄膜结晶性能好,(201)取向明显.I-V曲线测试结果表明,Au/Bi2O3/n+Si/Al结构具有单极性电阻开关特性.通过对不同厚度Bi2O3薄膜的Au/Bi2O3/n+Si/Al结构I-V特性比较发现,随着薄膜厚度的增加,电阻开关的Forming、Set和Reset阈值电压均随之增加.对于Bi2O3薄膜厚度为31.2 nm的Au/Bi2O3/n+Si/Al结构,其Forming、Set和Reset阈值电压均低于4 V,符合存储器低电压工作的要求.     

PZT/ZnO薄膜制备及其结构特性研究

利用固相反应制备的ZnO-Li_(2.2%)陶瓷靶和RF射频磁控溅射技术在Si(100)基片上制备了高度c轴择优取向的ZnO薄膜,XRD和电性能分析表明掺杂Li离子改善了ZnO靶材的结构和性能,同时研究了不同RF溅射温度对ZnO薄膜结构与取向的影响;然后采用sol-gel前驱单体薄膜制备方法,以ZnO为过渡层淀积PZT薄膜,探讨高度c轴(002)择优取向ZnO薄膜对PZT薄膜结构与性能的影响,实验发现在PZT/ZnO异质结构中,致密、均匀和高度c轴择优取向的ZnO可作为晶核,促进PZT钙钛矿结构转化、晶粒(110)择优取向生长,相应降低PZT薄膜的退火温度.     

VO_2薄膜及电学开关特性

用溶胶-凝胶法在非晶玻璃上制备VO2薄膜,经过熔融、涂膜、烘干和热处理等工艺最后得到电阻相变2～3个量级的VO2薄膜.对烘干温度、熔融温度、膜厚和热处理温度对薄膜电阻开关特性的影响进行了研究.通过AFM,XRD和XPS对薄膜的结构和特性进行分析.     

ZnO薄膜气相法制备

ZnO薄膜具有压电、光电、压敏、气敏、发光等多种特性,应用十分广泛。介绍了ZnO薄膜气相法制备原理中的各类主要方法,包括脉冲激光沉积、磁控溅射、分子束外延、金属有机化合物化学气相沉积、单源化学气相沉积和等离子体增强化学气相沉积等技术;分析了这些方法的优缺点;展望了ZnO薄膜今后的研究方向。     

纳米TiO2薄膜微阵列电极的制备与紫外光电阻特性表征

采用溶胶凝胶法在叉指型微阵列电极表面制备了TiO2纳米薄膜，并对薄膜形貌、厚度以及溶胶粒子尺寸进行了表征，研究了温度、紫外光照对纳米TiO2薄膜微阵列电极的电阻的影响。结果表明，溶胶粒子平均粒径在9nm，单次提拉制备的TiO2纳米薄膜膜厚为120nm，两次提拉薄膜厚度200nm，纳米TiO2薄膜微阵列电极电阻呈现半导体特性，大气环境中，紫外光照下纳米薄膜微电极的低温电阻较无光照时明显减小，表现出紫外光敏感特性。随着温度的升高，紫外光照下的电阻与无光照时电阻差值逐步减小，表明温度对纳米薄膜电阻有更大的影响。     

连续非均相沉淀法生长ZnO薄膜及其光致发光性能研究

将连续离子层吸附与反应法(SILAR)和液相非均相沉淀技术相结合,提出ZnO薄膜的连续非均相沉淀液相制备技术。以[Zn(NH_3)_4]~(2 )络离子为前驱体,以玻璃和Si(100)为衬底,从90℃水溶液中沉积得到ZnO薄膜。XRD分析表明,所得薄膜为六方纤锌矿型多晶结构,沿(002)晶面择优取向。AFM测试表明,薄膜表面致密、均匀,ZnO粒子尺度约为200nm～300nm。在340nm室温紫外光激发下,薄膜产生强的近紫外光发射(～390nm)和若干较弱的深能级发射(～450nm～500nm)。初步探讨了连续非均相沉淀法生长ZnO薄膜的机理。     

一种具有线性电阻温度特性的非晶薄膜

射频溅射 CoMnNiO-AuGeNi 非晶薄膜223K～343K 温区具有线性电阻温度系数.电阻率ρ=ρ_0[1-m(T-T_0)],温度系数可达6000ppm。这种材料的 B 值与温度的关系为,B=Tln[1-m(T-T_0)];激活能△E=KTln[1-m(T-T_0)]。本文报导这种材料的实验结果,并对电阻温度特性的线性化机理进行解释。     

ZnO陶瓷靶制备及其薄膜 RF溅射工艺研究

利用固相反应制备了直径为70mm,厚度为10-15mm高质量掺杂Li2CO2的ZnO陶瓷靶材,实验了不同摩尔浓度的Li+掺杂对靶材性能的影响,确定了最佳Li+掺杂量为2．2mol％,同时通过在不同温度烧结实验、不同成型压力实验确定了ZnO靶材制备的最佳工艺,并采用所制备的ZnO-Li2.2％陶瓷靶和RF(射频磁控)技术在Si(100)、玻璃(载玻片)、及Pt(111)／Ti／SiO2／Si(100)基片上制备出高度c轴(002)择优取向的ZnO薄膜,其绝缘电阻率ρ为4．12×108Ω·cm,达到了声表面波器件(SAW)的使用要求．     

氧化锌透明导电薄膜的制备及其特性

氧化锌薄膜的透明导电特性与化学计量偏离和溅射条件有关。以２％氧化铝掺杂的氧化锌陶瓷作靶,采用ＦＲ磁控溅射技术制备的透明导电薄膜,其电阻率４．５＊１０＾－３Ωｃｍ,载流子浓度２．８＊１０＾２０ｃｍ＾－３,霍尔迁移率１５．８ｃｍ＾２／Ｖ．ｓ平均透射率大于８０％。     

室温下射频磁控溅射制备ZnO:Al透明导电薄膜及其性能研究

采用射频磁控溅射技术,在室温下,以ZnO:Al2O3(2%Al2O3(质量比))为靶材,在石英玻璃基底上,采用不同工艺条件制备了ZnO:Al(AZO)薄膜。使用扫描电子显微镜观察了薄膜的表面形貌,X射线衍射分析了薄膜的结构,四探针测量仪得到薄膜的表面电阻,轮廓仪测量了薄膜厚度,并计算了电阻率,最后采用分光光度计测量了薄膜的透过率;研究了溅射功率、溅射气压与薄膜厚度对薄膜电阻率及透过率的影响。结果表明:所制备的AZO薄膜具有(002)择优取向,并且发现薄膜厚度对薄膜的光电性能有明显影响,溅射气压和溅射功率对薄膜电学性能有较大影响,但是对薄膜透过率影响不大。当功率为1kW、溅射气压0.052Pa、AZO薄膜厚度为250nm时,其电阻率为8.38×10-4Ω·cm,波长在550nm处透过率为89%,接近基底的本底透过率92%。当薄膜厚度为1125 nm时薄膜的电阻率降至最低(6.16×10-4Ω·cm)。     

Electrochemical Tantalum Oxide for Resistive Switching Memories

Redox‐based resistive switching memories (ReRAMs) are strongest candidates for the next‐generation nonvolatile memories fulfilling the criteria for fast, energy efficient, and scalable green IT. These types of devices can also be used for selector elements, alternative logic circuits and computing, and memristive and neuromorphic operations. ReRAMs are composed of metal/solid electrolyte/metal junctions in which the solid electrolyte is typically a metal oxide or multilayer oxides structures. Here, this study offers an effective and cheap electrochemical approach to fabricate Ta/Ta₂O₅‐based devices by anodizing. This method allows to grow high‐quality and dense oxide thin films onto a metallic substrates with precise control over morphology and thickness. Electrochemical‐oxide‐based devices demonstrate superior properties, i.e., endurance of at least 10⁶ pulse cycles and/or 10³I–V sweeps maintaining a good memory window with a low dispersion in R_OFF and R_ON values, nanosecond fast switching, and data retention of at least 10⁴ s. Multilevel programing capability is presented with both I–V sweeps and pulse measurements. Thus, it is shown that anodizing has a great prospective as a method for preparation of dense oxide films for resistive switching memories.     

Full Electric Control of Exchange Bias at Room Temperature by Resistive Switching

Electric control of exchange bias (EB) is of vital importance in energy‐efficient spintronics. Although many attempts have been made during the past decade, each has its own limitations for operation and thus falls short of full direct and reversible electrical control of EB at room temperature. Here, a novel approach is proposed by virtue of unipolar resistive switching to accomplish this task in a Si/SiO₂/Pt/Co/NiO/Pt device. By applying certain voltages, the device displays obvious EB in the high‐resistance‐state while negligible EB in the low‐resistance state. Conductive filaments forming in the NiO layer and rupturing near the Co–NiO interface are considered to play dominant roles in determining the combined resistive switching and EB phenomena. This work paves a new way for designing multifunctional and nonvolatile magnetoelectric random access memory devices.     

退火温度对TiO2基电阻开关器件性能的影响

采用直流磁控溅射法在n+-Si上制备了TiO2薄膜,采用电子束蒸发镀膜仪在TiO2薄膜上沉积Au电极,获得了Au/TiO2/n+-Si结构的器件.研究了退火温度对薄膜结晶性能及器件电阻开关特性的影响.Au/TiO2/n+-Si结构的器件具有单极性电阻开关特性,置位(set)电压,复位(reset)电压、reset电流及功率的大小随退火温度的不同而不同,并基于灯丝理论对器件的电阻开关效应的工作机理进行了探讨.研究结果表明,500℃退火的器件具有良好的非易失性.器件高低阻态的阻值比大于103,其信息保持特性可达10年之久.在读写次数为100次时,器件仍具有电阻开关效应.     

PLD法制备TiO2薄膜及电阻转变特性研究

采用脉冲激光沉积法（PLD）,以Pt(111)/Ti/SiO₂/Si为衬底,制备了具有电阻转变特性的TiO₂薄膜.X射线衍射（XRD）分析未发现明显的TiO₂结晶峰,薄膜呈纳米晶或非晶态.扫描电子显微镜（SEM）及原子力显微镜（AFM）分析表明,TiO₂薄膜表面平整、光滑致密.电学测试结果表明,TiO₂薄膜具有明显的单极性电阻转变特性,高低阻态比值达到10⁴.高阻态下薄膜的导电过程可用空间电荷限制电流模型解释,过程中存在软击穿现象.在此基础上,对薄膜中丝导电通道的产生及熔断过程进行了初步分析.     

氧化锌薄膜的阴极恒电流沉积和表征

以铜片为阴极,采用恒电流法从硝酸锌溶液中电沉积出氧化锌薄膜.分别讨论了溶液浓度和温度对薄膜结构和组成的影响,结果表明,在低浓度和低温时将有金属锌析出.通过电化学交流阻抗对薄膜的结构进行了表征,分析表明氧化锌薄膜具有一种外层粗糙、内层致密的双层结构.     

氧化锌薄膜研究的新进展

ZnO薄膜是一种具有优良的压电、光电、气敏、压敏等性质的材料.ZnO薄膜的制备方法多样,薄膜的性质取决于不同的掺杂组分,并与制备工艺紧密相关.简述了ZnO薄膜的制备方法与基本性质与应用,分析了ZnO薄膜研究、应用与开发现状,展望了产业化发展前景.     

Collective Control of Potential-Constrained Oxygen Vacancies in Oxide Heterostructures for Gradual Resistive Switching

Filamentary resistive switching in oxides is one of the key strategies for developing next-generation non-volatile memory devices. However, despite numerous advantages, their practical applications in neuromorphic computing are still limited due to non-uniform and indeterministic switching behavior. Given the inherent stochasticity of point defect migration, the pursuit of reliable switching likely demands an innovative approach. Herein, a collective control of oxygen vacancies is introduced in LaAlO₃/SrTiO₃ (LAO/STO) heterostructures to achieve reliable and gradual resistive switching. By exploiting an electrostatic potential constraint in ultrathin LAO/STO heterostructures, the formation of conducting filaments is suppressed, but instead precisely control the concentration of oxygen vacancies. Since the conductance of the LAO/STO device is governed by the ensemble concentration of oxygen vacancies, not their individual probabilistic migrations, the resistive switching is more uniform and deterministic compared to conventional filamentary devices. It provides direct evidence for the collective control of oxygen vacancies by spectral noise analysis and modeling by Monte-Carlo simulation. As a proof of concept, the significantly-improved analog switching performance of the filament-free LAO/STO devices is demonstrated, revealing potential for neuromorphic applications. The results establish an approach to store information by point defect concentration, akin to biological ionic channels, for enhancing switching characteristics of oxide materials.