Thermal properties of TiO2 films grown by atomic layer deposition

We study the thermal properties of amorphous TiO₂ thin films of various thicknesses t, grown by atomic layer deposition. The thermo-optic coefficient dn/dT and the temperature coefficient dρ/dT of film density ρ are determined from ellipsometric data in wavelength range 380 < λ < 1800 nm with the Cauchy model and the Lorentz-Lorenz relation. It is found that dn/dT exhibits negative values for films with t < 150 nm and positive values for thicker films, while no significant changes in the two coefficients take place if t < 200 nm. A qualitative physical explanation based on porosity of the thin films is suggested. Films with t = 60 nm are illustrated in detail at λ = 640 nm: the room-temperature values of the coefficients are found to be dn/dT = − 3.1 × 10^− 5 °C^− 1 and dρ/dT = − 4.8 × 10^− 5g cm^− 3° C^− 1.     

Native oxide consumption during the atomic layer deposition of TiO2 films on GaAs (100) surfaces

The consumption of the surface native oxides is studied during the atomic layer deposition of TiO₂ films on GaAs (100) surfaces. Films are deposited at 200 °C from tetrakis dimethyl amido titanium and H₂O. Transmission electron microscopy data show that the starting surface consists of ~2.6 nm of native oxide and X-ray photoelectron spectroscopy indicates a gradual reduction in the thickness of the oxide layer as the thickness of the TiO₂ film increases. Approximately 0.1-0.2 nm of arsenic and gallium suboxide is detected at the interface after 250 process cycles. For depositions on etched GaAs surfaces no interfacial oxidation is observed.     

Effect of deposition temperature on the properties of CeO2 films grown by atomic layer deposition

Cerium oxide dielectric thin films have been grown on n-type silicon by atomic layer deposition using a monomeric homoleptic Ce^IV alkoxide precursor with water vapour. Herein we report the dielectric properties of CeO₂ films deposited from tetrakis(1-methoxy-2-methyl-2-propanolate)cerium. The resulting films exhibit permittivities in the range 25-42 at 1 MHz with a strong dependency on the deposition temperature. The microstructural origin of this behaviour has been investigated. The as-deposited films were found to be crystalline and they exhibited the cubic fluorite structure for deposition temperatures in the range 150 °C to 350 °C. Variations in the crystallite sizes are governed by the deposition temperature and have been estimated using a Debye-Scherrer analysis of the X-ray diffraction patterns. The changing crystallite size correlates with changes seen in the triply-degenerate F_2g first-order Raman line half-width at 465 cm^− 1. It is concluded that the frequency dependency of the film dielectric properties is strongly influenced by the crystallite size which in turn is governed by the growth temperature.     

Characteristics of atomic layer deposition grown HfO2 films after exposure to plasma treatments

Ultra thin HfO₂ films were grown by the atomic layer deposition (ALD) technique using tetrakismethylethylaminohafnium (Hf[N(CH)₃(C₂H₅)]₄) and ozone (O₃) as the precursors and subsequently exposed to various plasma conditions, i.e., CCP (capacitively coupled plasma) and MMT (modified magnetron typed plasma) in N₂ or N₂/O₂ ambient. The conventional CCP treatment was not effective in removing the carbon impurities, which were incorporated during the ALD process, from the HfO₂ films. However, according to the X-ray photoelectron spectroscopy measurements, the MMT treated films exhibited a significant reduction in their carbon contents and the efficient incorporation of nitrogen atoms. Although the incorporated nitrogen was easily released during the post-thermal annealing of the MMT treated samples, it was more effective than the CCP treatment in removing the film impurities. Consequently, the MMT treated samples exhibited excellent electrical properties as compared to the as-deposited HfO₂ films, including negligible hysteresis (flatband voltage shift), a low leakage current, and the reduced equivalent oxide thickness of the gate stack. In conclusion, MMT post treatment is more effective than conventional CCP treatment in improving the electrical properties of high-k films by reducing the carbon contamination and densifying the as-deposited defective films.     

Surface chemistry and film growth during TiN atomic layer deposition using TDMAT and NH3

Surface chemistry and film growth were examined during titanium nitride (TiN) atomic layer deposition (ALD) using sequential exposures of tetrakis-dimethylamino titanium (TDMAT) and NH₃. This ALD system is shown to be far from ideal and illustrates many potential problems that may affect ALD processing. These studies were performed using in situ Fourier transform infrared (FTIR) techniques and quartz crystal microbalance (QCM) measurements. Ex situ measurements also analyzed the properties of the TiN ALD films. The FTIR studies revealed that TDMAT reacts with NH_x* species on the TiN surface following NH₃ exposures to deposit new Ti(N(CH₃)₂)_x* species. Subsequent NH₃ exposure consumes the dimethylamino species and regenerates the NH_x* species. These observations are consistent with transamination exchange reactions during the TDMAT and NH₃ exposures. QCM studies determined that the TDMAT and NH₃ reactions are nearly self-limiting. However, slow continual growth occurs with long TDMAT exposures. In addition, the TiN ALD growth rate increases progressively with growth temperature. The resistivities of the TiN ALD films were ?10⁴ μΩ cm and the densities were ?3 g/cm³ corresponding to a porosity of ∼40%. The high porosity allows facile oxidation of the TiN films and lowers the film resistivities. These high film porosities will seriously impair the use of these TiN ALD films as diffusion barriers.     

Growth and characterization of epitaxial anatase TiO2(001) on SrTiO3-buffered Si(001) using atomic layer deposition

Epitaxial anatase titanium dioxide (TiO₂) films have been grown by atomic layer deposition (ALD) on Si(001) substrates using a strontium titanate (STO) buffer layer grown by molecular beam epitaxy (MBE) to serve as a surface template. The growth of TiO₂ was achieved using titanium isopropoxide and water as the co-reactants at a substrate temperature of 225-250 °C. To preserve the quality of the MBE-grown STO, the samples were transferred in-situ from the MBE chamber to the ALD chamber. After ALD growth, the samples were annealed in-situ at 600 °C in vacuum (10^− 7 Pa) for 1-2 h. Reflection high-energy electron diffraction was performed during the MBE growth of STO on Si(001), as well as after deposition of TiO₂ by ALD. The ALD films were shown to be highly ordered with the substrate. At least four unit cells of STO must be present to create a stable template on the Si(001) substrate for epitaxial anatase TiO₂ growth. X-ray diffraction revealed that the TiO₂ films were anatase with only the (004) reflection present at 2θ = 38.2°, indicating that the c-axis is slightly reduced from that of anatase powder (2θ = 37.9°). Anatase TiO₂ films up to 100 nm thick have been grown that remain highly ordered in the (001) direction on STO-buffered Si(001) substrates.     

Effects of atomic layer deposited HfO2 compact layer on the performance of dye-sensitized solar cells

The performance of dye-sensitized solar cells (DSSCs) is limited by the back-reaction of photogenerated electrons from the photoelectrode back into liquid electrolyte. An atomic layer deposited (ALD) hafnium oxide (HfO₂) ultra thin compact layer was grown on the surface of the transparent conducting oxide (TCO) and its effects on the DSSC performance were studied with dark and illuminated current-voltage and electrochemical impedance spectroscopy measurements. It was found that this compact layer was effectively blocking the back-reaction of electrons from TCO to the liquid electrolyte, resulting in the overall photoconversion efficiency being enhanced by 66% compared to a DSSC with a conventional sol-gel processed TiO₂ compact layer. Reasons for the improved photovoltaic performance were attributed to passivation of the TCO surface, better electronic quality of the compact layer material and the higher compactness, shown by atomic force microscopic images, obtained from gas-based deposition methods. Also, an increased short-circuit current density suggests that the interfacial resistance for the injection of electrons from the porous nanoparticle network to TCO was reduced. Further, the theory of electron recombination at the TCO/compact layer/electrolyte interface was developed and used to explain the improved DSSC performance with an ALD HfO₂ compact layer.     

Self-limiting growth of anatase TiO2: A comparison of two deposition techniques

Self-limiting deposition of titanium dioxide thin films was accomplished using pulsed plasma-enhanced chemical vapor deposition (PECVD) and plasma-enhanced atomic layer deposition (PEALD) at low temperatures (T < 200 °C) using TiCl₄ and O₂. TiCl₄ is shown to be inert with molecular oxygen at process conditions, making it a suitable precursor for these processes. The deposition kinetics were examined as a function of TiCl₄ exposure and substrate temperature. The quality of the anatase films produced by the two techniques was nominally identical. The key distinctions are found in precursor utilization and conformality. Pulsed PECVD requires 20 times less TiCl₄, while PEALD must be used to uniformly coat complex topographies.     

On the initial growth of atomic layer deposited TiO2 films on silicon and copper surfaces

Atomic layer deposition (ALD) of TiO₂ using tetrakis(diethylamino)titanium precursor and H₂O was studied on silicon and copper surfaces in order to examine differences in nucleation. Both surfaces were patterned on the same substrate to assure identical deposition conditions. Spectral ellipsometry, X-ray photoelectron spectroscopy and surface profilometry were used to probe nucleation phenomena, growth rates, and surface morphology on both surfaces. The TiO₂ deposition on copper was found to exhibit a significant induction period of about 20-25 ALD cycles with no observable TiO₂ during the first 10-15 cycles on the copper side; in contrast, no such inhibited growth was observed in the TiO₂ deposition on silicon. This result opens up potential for selective ALD of TiO₂ films on silicon-based substrates patterned with a metal without the use of a mask, a self-assembled monolayer or soft lithography which is impractical for some nanoscale semiconductor fabrication processes. After film nucleation, the TiO₂ growth rate on both surfaces was found to be 0.10 nm/cycle.     

Thin films of In2O3 by atomic layer deposition using In(acac)3

Thin films of indium oxide have been deposited using the atomic layer deposition (ALD) technique using In(acac)₃ (acac = acetylacetonate, pentane-2,4-dione) and either H₂O or O₃ as precursors. Successful growth using In(acac)₃ is contradictory to what has been reported previously in the literature [J.W. Elam, A.B.F. Martinson, M.J. Pellin, J.T. Hupp, Chem. Mater. 18 (2006) 3571.]. Investigation of the dependence of temperature on the deposition shows windows where the growth rates are relatively unaffected by temperature in the ranges 165–200 °C for In(acac)₃ and H₂O, 165–225 °C for In(acac)₃ and O₃. The growth rates obtained are of the order 20 pm/cycle for In(acac)₃ and H₂O, 12 pm/cycle for In(acac)₃.     

Hysteresis-free HfO2 film grown by atomic layer deposition at low temperature

Hysteresis-free hafnium oxide films were fabricated by atomic layer deposition at 90 °C without any post-deposition annealing, and their structures and properties were compared with films deposited at 150 °C and 250 °C. The refractivity, bandgap, dielectric constant and leakage current density all increase with deposition temperature, while the growth rate and breakdown field decrease. All films are amorphous with roughly the same composition. Although the thin films deposited at the above-mentioned temperatures all show negligible hysteresis, only the 90 °C-deposited films remain hysteresis-free when the film thickness increases. The 90 °C-deposited films remain hysteresis-free after annealing at 300 °C. The hysteresis in films deposited at high temperatures increases with deposition temperature. Evidences show such hysteresis originates in the HfO₂ film instead of the interface. Based on a careful structure analysis, middle-range order is suggested to influence the trap density in the films. HfO₂ films deposited at low temperature with negligible hysteresis and excellent electrical properties have great potential for the fabrication and integration of devices based on non-silicon channel materials and in applications as tunneling and blocking layers in memory devices.     

In situ studies of the atomic layer deposition of thin HfO2 dielectrics by ultra high vacuum atomic force microscope

We studied in situ the initial stages of atomic layer deposition (ALD) of HfO₂ by an ultra high vacuum atomic force microscope working in frequency-modulation mode. The ALD cycles, made by using tetrakis-di-methyl-amido-Hf and water as precursors, were performed on the Si(001)/SiO₂ substrate maintained at 230 °C. After each ALD cycle we studied the influence of the HfO₂ growth on the surface height histogram, the root mean square roughness, the surface fractal dimension and the autocorrelation function. This detailed analysis of the surface topography allowed us to confirm the completion of the first HfO₂ layer after four ALD cycles.     

Blue-shifted stimulated emission from ZnO films deposited on SiO2 by atomic layer deposition

ZnO films were prepared by atomic layer deposition upon a SiO₂ layer on a Si substrate and treated by rapid thermal annealing. The optically-pumped random lasing actions with low threshold values were observed in the ZnO films on SiO₂/Si substrates. With the decrease in ZnO film thickness or the increase in post-annealing duration, the stimulated emission shifted toward the shorter wavelength and the lasing threshold increased. The results can be attributed to the inter-diffusion between ZnO and SiO₂, which causes the modification of bandgap renormalization in ZnO.     

Properties of atomic layer deposited HfO2 thin films

The growth, composition and morphology of HfO₂ films that have been deposited by atomic layer deposition (ALD) are examined in this article. The films are deposited using two different ALD chemistries: i) tetrakis ethylmethyl amino hafnium and H₂O at 250° and ii) tetrakis dimethyl amino hafnium and H₂O at 275 °C. The growth rates are 1.2 Å/cycle and 1.0 Å/cycle respectively. The main impurities detected both by X-ray Photoelectron Spectroscopy and Fourier transform infrared spectroscopy (FTIR) are bonded carbon (~ 3 at.%) and both bulk and terminal OH species that are partially desorbed after high temperature inert anneals up to 900 °C. Atomic Force Microscopy reveals increasing surface roughness as a function of increasing film thickness. X-ray diffraction shows that the morphology of the as-deposited films is thickness dependent; films with thickness around 30 nm for both processes are amorphous while ~ 70 nm films show the existence of crystallites. These results are correlated with FTIR measurements in the far IR region where the HfO₂ peaks are found to provide an easy and reliable technique for the determination of the crystallinity of relatively thick HfO₂ films. The index of refraction for all films is very close to that for bulk crystalline HfO₂.     

Characterizations of NbAlO thin films grown by atomic layer deposition

Niobium-aluminate (NbAlO) thin films have been prepared on silicon (100) with different Nb₂O₅:Al₂O₃ growth cycle ratio by atomic layer deposition (ALD) technology. The structural, chemical and optical properties of NbAlO thin films are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry (SE). The results show that all the obtained NbAlO films are amorphous and fully oxidized. It is also found that the proportion of components in the NbAlO film can be well-controlled by varying the ALD growth cycles of the independent oxides. Furthermore, the refraction index of the prepared films is observed to increase with an increase of the concentration of Nb in the mixtures.     

Monocrystalline zinc oxide films grown by atomic layer deposition

In the present work we report on the monocrystalline growth of (00.1) ZnO films on GaN template by the Atomic Layer Deposition technique. The ZnO films were obtained at temperature of 300 °C using dietylzinc (DEZn) as a zinc precursor and deionized water as an oxygen precursor. High resolution X-ray diffraction analysis proves that ZnO layers are monocrystalline with rocking curve FWHM of the 00.2 peak equals to 0.07°. Low temperature photoluminescence shows a sharp and bright excitonic line with FWHM of 13 meV.     

Initial reaction mechanism of H-passivated Ge surface passivation by atomic layer deposition of Al2O3 and AlN

The authors investigated the surface passivation mechanisms of H-terminated Ge(100)(2 × 1) by atomic layer deposition of Al₂O₃, AlN through first-principles calculation method. The formation of initial Al₂O₃ and AlN passivation layer on Ge surface is investigated at atomic scale and the corresponding reaction pathways for both the reaction are also presented. The reaction barrier heights of H₂O and NH₃ half reaction are 0.53 eV/mol and 0.51 eV/mol higher than that of Al(CH₃)₃ half reaction, respectively which indicates that the overall passivation processes of the both reactions are limited by the second half reaction. Moreover, the chemisorption state and product state of the NH₃ half reaction are found to be in the same energy level, and it is possible that the second half reaction of AlN will be trapped in a chemisorption state.     

Surface poisoning in the nucleation and growth of palladium atomic layer deposition with Pd(hfac)2 and formalin

Palladium (Pd) atomic layer deposition (ALD) can be performed with Pd(hfac)₂ (hfac = hexafluoroacetyl-acetone) and formalin as the reactants. For Pd ALD on oxide surfaces, the nucleation of Pd ALD has been observed to require between 20 and 100 ALD cycles. To understand the long nucleation periods, this study explored the surface reactions occurring during Pd ALD nucleation and growth on hydroxylated Al₂O₃ substrates. In situ Fourier transform infrared (FTIR) spectroscopy on high surface area nanopowders was used to observe the surface species. The adsorption of Pd(hfac)₂ on hydroxylated Al₂O₃ substrates was found to yield both Pd(hfac)* and Al(hfac)* surface species. The identity of the Al(hfac)* species was confirmed by separate FTIR studies of hfacH adsorption on the hydroxylated Al₂O₃ substrates. Isothermal loss of the Al(hfac)* species revealed second-order kinetics at 448-523 K with an activation barrier of E_d = 39.4 kcal/mol. The lack of correlation between Al(hfac)* and AlOH* species during the loss of Al(hfac)* species suggested that the Al(hfac)* species may desorb as Al(hfac)₃. After Pd(hfac)₂ exposure and the subsequent formalin exposure on hydroxylated Al₂O₃ substrates, only hfac ligands from Pd(hfac)* species were removed from the surface. In addition, the formalin exposure added formate species. The Al(hfac)* species was identified as the cause of the long nucleation period because Al(hfac)* behaves as a site blocker. The surface poisoning by Al(hfac)* species was corroborated by adsorbing hfacH prior to the Pd(hfac)₂ exposures. The amount of Pd(hfac)* species after Pd(hfac)₂ exposures decreased progressively versus the previous hfacH exposure. Pd ALD occurred gradually during the subsequent Pd ALD cycles as the Al(hfac)* species were slowly removed from the Al₂O₃ surface. Ex situ transmission electron microscopy analysis revealed Pd nanoclusters that grew in size and dispersion with increasing number of Pd ALD cycles. These nanoclusters eventually coalesced to form a continuous Pd ALD film. Surface poisoning by the hfac ligands may help to explain the nucleation difficulties for metal ALD on oxide substrates using β-diketonate reactants.     

Chemical bonding structure of TiO2 thin films grown on n-type Si

Titanium dioxide thin films were obtained by RF magnetron sputtering system with different Ar and O atmospheres. Chemical bonding structures of the thin films were investigated using the Fourier transform infrared spectroscopy (FTIR) in the range of 400-7500 cm^− 1 for as-deposited and conventionally thermal annealed films at different temperature in air. These structural characterizations of the films were carried out by describing the low-frequency fluctuations of the FTIR spectra using the noninvasive (i.e. error controllable) procedure of the optimal linear smoothing. This approach is based on the criterion of the minimal relative error in selection of the proper smoothing window. It allows the receiving an optimal separation of a possible trend from the high-frequency fluctuations, defined as a random sequence of the relative fluctuations possessing zero trends. Thus, the noise can be read and extra information about the structures was then obtained by comparing with the experimental results. In the film annealed at 900 °C, the rutile phase was the dominant crystalline phase as revealed by infrared spectroscopy. At the annealing temperatures lower than 900 °C, both the anatase and the rutile phases were coexisting. In addition, symmetric and asymmetric Si-O-Si vibrations modes were observed at around 1000 cm^− 1 and 800 cm^− 1, respectively. These peaks suggest that a thin SiO₂ film was formed at the TiO₂/Si interface during the growth and the annealing of the TiO₂ films. It was also observed that the reactivity between TiO₂ film and Si substrate is increased with the increasing annealing temperature.     

Fluorescent tags to visualize defects in Al2O3 thin films grown using atomic layer deposition

Defects and cracks in thin film barriers that are coated on polymers allow the leakage of reactive species through the polymer substrate. Fluorescent tags have been developed to visualize defects and cracks in thin film barriers and to inspect rapidly the barrier quality with minimal sample preparation. For Al₂O₃ films with a thickness of 25 nm deposited on polyethylene naphthalate polymer substrates using atomic layer deposition techniques, the fluorescent tags have identified cracks ~ 20 nm in width after applied strain and have observed individual defects as small as ~ 200 nm in diameter.