GaAs/GaInNAs多量子阱谐振腔增强型长波长光探测器

报道了一种具有高速响应特性的GaAs基长波长谐振强增强型(RCE)光探测器,它采用分子束外延技术(MBE)在GaAs衬底上直接生长GaAs/AlAs布拉格反射镜(DBR)和GaInNAs/GaAs多量子阱吸收层而形成,解决了GaAs系材料只能对短波长光响应的问题,实现了GaAs基探测器对长波长光的响应。该器件在峰值响应波长1296.5nm处获得了17.4%的量子效率,响应谱线半宽为11nm,零偏置时的暗电流密度8.74×10-15A/μm2,具有良好的暗电流特性。通过RC常数测量计算得到器件的3dB带宽为4.82GHz。     

具有多波长处理功能的单片集成光探测器阵列

从理论上设计并研制了一种用于可重构光分插复用技术中的具有多波长处理功能的单片集成光探测器阵列,器件在GaAs基衬底上集成了GaAs/AlGaAs材料的法布里一珀罗谐振腔和InP-In0.53 Ga0.47 As-InP材料的PIN光探测器.为了能够实现对多路波长的探测,首先利用湿法腐蚀,改变不同区域谐振腔的厚度,然后通过二次外延完成谐振腔的生长,最后利用低温缓冲层技术在GaAs材料上异质外延高质量的InP基的PIN结构.器件的工作波长位于1500 nm左右,可实现对4路波长,间隔为10 nm的光信号探测,光谱响应线宽低于0.8 nm,峰值量子效率达到12%以上,响应速率达到8.2 GHz.实验测试结果与理论分析进行了对比,并得到了很好的解释.     

谐振腔增强型光探测器的高速响应性能研究

高速长波长光探测器是高速光纤通信系统和网络的关键器件，它要求光探测器具有宽的频率响应带宽和高量子效率。常用的PIN光探测器由于量子效率和高速性能均受到吸收层厚度的牵制，使得二者相互制约，成为一对矛盾。谐振腔增强型(RCE)光探测器为这一矛盾的解决提供了有效的方案。基于谐振腔增强型光探测器的实际设计和制作模型，分析了器件吸收层中的光场分布，并将其运用于载流子的连续方程，从理论上详细地分析了器件的高速响应特性，给出了计算结果。针对研制的高速长波长谐振腔增强型光探测器，进行了理论分析和实际器件测试的结果比较，得到了比较一致的结果。     

新型长波长InP基谐振腔增强型光探测器

介绍了一种新型长波长InP基谐振腔增强型(RCE)光探测器。通过V(FeCl3):V(H2O)溶液对InGaAs牺牲层的选择性湿法腐蚀,制备出具有InP/空气隙的高反射率分布布拉格反射镜(DBR),并将该选择性湿法腐蚀技术成功地应用到长波长InP基谐振腔增强型光探测器的制备中去,从而彻底解决了InP/InGaAsP高反射率分布布拉格反射镜难以外延生长的问题。所制备出的谐振腔增强型光探测器,其台面面积为50μm×50μm,底部反射镜为1.5对的InP/空气隙分布布拉格反射镜,顶部反射镜靠InGaAsP与空气的界面反射来实现。测试结果表明,该谐振腔增强型光探测器在波长1.510μm处获得了约59％的峰值量子效率,在3V反偏压下暗电流为2nA,3dB响应带宽达到8GHz。     

单片集成GaAs基长波长谐振腔光探测器的研究

介绍了一种GaAs基的长波长谐振腔增强型(RCE)光探测器.通过两步生长法,在GaAs村底上异质外延生长了InP-InGaAs-InP的p-i-n光吸收结构和GaAs/AlAs的分布布拉格反射镜(DBR).所制备的器件在1 549.4 nm处获得了67.3%的量子效率和17 nm的光谱响应线宽,在1 497.7 nm处获得了53.5%的量子效率和9.6 nm的光谱响应线宽,而InGaAs吸收层厚度仅为200 nm.采用单片集成法,工艺简单、易于产业化,随着缓冲层技术的发展,此种RCE光探测器的性能还将获得进一步提升.     

高速长波长谐振腔增强型光探测器的瞬态性能研究

基于谐振腔增强型(RCE)光探测器的实际设计和制作模型,提出了综合器件的隔离层及器件的串联电阻、结电容等参数的高速长波长RCE光探测器的瞬态响应特性的表达式,包括器件的冲击响应、阶跃响应和脉冲响应.从理论上详细地研究了高速长波长RCE光探测器的瞬态响应特性,最后给出了不同器件结构参数的计算结果.     

一种新型谐振腔增强型光电探测器的性能分析

通过理论探讨和实验仿真,分析了一种新型谐振腔增强型光电探测器RCEP(Resonant Cavity Enhanced Photodetector)的结构及性能,该RCEP的基本结构是将吸收层插入到谐振腔当中,并指出这种新型器件较传统器件可获得较高的量子效率和响应速度,而其具有的波长选择特性,使这种新型器件可在光波分复用WDM(Wavelength Division Multiplexing)系统中获得广泛应用.     

新型三腔谐振腔增强型光探测器的理论分析和数值模拟

提出了一种新的谐振腔增强型 (RCE)光探测器结构 ,它将器件结构中的谐振腔分为三个子腔。分析表明 ,采用这种新结构的光探测器在保留了 RCE光探测器优点的同时 ,还实现了器件量子效率及其光谱响应线宽之间制约关系的解耦 ,因而可以同时获得窄的光谱响应线宽 (<1 nm) ,高的量子效率 (>90 % )和高的响应速度。该器件可望在密集波分复用 (DWDM)光通信系统中得到广泛应用     

基于平行排列3×3耦合器的光器件

本文对基于平行排列3×3耦合器的光纤器件进行了研究。平行排列3×3耦合器不仅可以实现双端口光开关、全光缓存器、光纤谐振腔等器件,而且可以用作可调耦合比的耦合器。由于平行排列3×3耦合器的弱耦合特性和平行排列结构,使得基于平行排列3×3耦合器的光器件具有许多独特的特点。更重要的是,由于这种耦合器的平行排列结构,使得它很容易做成平板波导结构,形成各种集成光器件。     

用于单片集成光接收机前端的GaAs基InP/InGaAs HBT

实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks