聚晶金刚石微细球头铣刀刃磨工艺参数优化

针对直径为0.5 mm的聚晶金刚石(PCD)微细球头铣刀刃磨质量控制问题,基于六轴数控刀具磨床几何运动原理,建立PCD微细球头铣刀的砂轮刃磨运动数学模型,开展PCD刀具精密刃磨正交试验,研究刃磨工艺参数对主轴负载率、刀具前刀面表面粗糙度、刀具刃口钝圆半径的影响规律。结果表明:磨削速度对主轴负载率以及刀具前刀面表面粗糙度的影响最为显著,提高磨削速度有利于获得较好的刀面质量;磨削深度对刃口钝圆半径的影响最为显著,减小磨削深度有利于获得锋利的刃口形状。通过合理选择刃磨工艺,PCD微细铣刀直径误差小于4.0 μm,刀具钝圆半径为4.5 μm,刀具角度误差小于1°,无明显刃磨损伤缺陷。      

微圆弧金刚石刀具修磨技术研究

微圆弧金刚石刀具是超精密加工中的重要应用工具,基于机械研磨法开展微圆弧金刚石刀具修磨技术研究。通过分析微圆弧金刚石刀具制备技术现状和制备难点,设计一种微圆弧金刚石刀具的修磨技术路线。通过修磨实验解决难磨、易磨方向定位,刀尖容易崩刃及精修刀尖圆弧等技术难点,制备刀尖半径R 8.2μm的微圆弧金刚石刀具。利用原子力显微镜和高倍光学显微镜进行观测,结果表明:前刀面粗糙度R_a=1.50nm,刀尖轮廓波纹度优于0.1μm,与进口高精度刀具指标相当。将其应用在微结构的超精密切削中,取得良好效果。      

微米、纳米及微/纳米复合金刚石涂层的切削性能研究

利用化学气相沉积(chemical vapor deposition,CVD)法在硬质合金上制备纳米、微米以及微/纳米复合金刚石涂层,并进行了切削对比试验。通过测试已加工材料的表面粗糙度和金刚石涂层刀具前、后刀面磨损,对比分析了不同金刚石涂层的切削性能,同时总结了CVD金刚石涂层刀具的失效形式及机理。结果表明:纳米金刚石涂层刀具切削加工后的表面粗糙度值最小,Ra=0.942μm;微米金刚石涂层刀具切削加工表面粗糙度值最大,Ra=1.631μm;纳米涂层刀具的后刀面磨损最大,约为微米涂层的2倍,复合涂层的5倍;微/纳米复合金刚石涂层刀具膜/基结合力高,前、后刀面的金刚石涂层没有出现脱落,且刀具的磨损量较少;金刚石涂层刀具的主要失效形式是涂层的过早脱落,其失效主要是由金刚石涂层的残余应力大、涂层化学纯度低、内部产生微裂纹多,以及切削时表面粗糙度高、切削力大和刀具积屑瘤普遍等原因引起的。     

机械研磨单晶金刚石刀具前刀面精度

为提高金刚石刀具的精度,理论分析机械研磨法加工金刚石前刀面的模型,并实验研究研磨盘表面质量和研磨晶向对金刚石刀具前刀面粗糙度的影响。结果表明:研磨盘经过充分平整后,刀具前刀面的粗糙度R_a由1.308 nm下降到0.920 nm。在(110)晶面精细研磨时,<100>晶向研磨后的表面粗糙度为0.540 nm,<110>晶向研磨后的表面粗糙度为0.430 nm,实现了对金刚石刀具的精密研磨。      

自制聚氨酯磨棒磨削合金灰口铸铁的表面粗糙度实验研究

为研究聚氨酯磨棒对合金灰口铸铁表面磨削质量的影响机制,自制了聚氨酯磨棒,并在磨棒中分别添加粒径为1、6和9μm的金刚石磨粒对合金灰口铸铁进行磨削加工,利用光学显微镜和白光干涉仪对磨削加工后的合金灰口铸铁表面形貌及平均表面粗糙度R_a进行分析比较。结果表明:使用粒径9μm的金刚石磨粒磨削工件表面,其磨削痕迹较深,表面粗糙度较差;相比之下,使用粒径6μm的金刚石磨粒磨削工件,可得到最佳的表面粗糙度,其R_a值可达0.01μm;而使用粒径1μm的金刚石磨粒,其磨削能力最差,材料被推挤到磨料的两侧,造成实际的表面粗糙度不够理想。     

磁力钝化参数对刀具非对称刃口的影响规律

基于磁力研磨原理,提出双磁盘磁力刀具钝化方法,并通过正交试验探究磁盘间距、磁盘转速、刀具转速和钝化时间对刀具刃口前、后刀面钝化量的影响规律,针对钝化对刀具表面质量的影响展开研究。结果表明：采用双磁盘磁力钝化方法制备的硬质合金立铣刀表面的磨削痕迹得到了有效去除,表面粗糙度沿磨削方向由0.235 μm降低至0.814 μm,垂直于磨削方向由0.313 μm降低至0.215 μm。     

钛合金铣削刀具的磨损对工件表面沿主轴方向粗糙度的影响

采用硬质合金立铣刀对Ti6Al4V进行高速铣削正交试验,将新刀具所加工的工件表面粗糙度和后刀面磨损至0.05 mm左右时的刀具所加工出来的工件表面粗糙度值进行对比分析,研究磨损后的刀具对工件表面粗糙度的影响。利用粗糙度仪对工件表面粗糙度进行测量,使用超景深显微镜对加工后的工件表面形貌以及刀具磨损情况进行观察,并利用测力仪测量铣削加工过程中刀具产生的铣削力。结果表明:当刀具后刀面磨损至0.05 mm时,其切削参数对工件表面的粗糙度影响大小与刀具崭新时的不一样,这是由于刀具的磨损导致在加工时刀具发生了振颤,从而影响到了工件沿机床主轴方向的粗糙度使其粗糙度增大。     

全国机械加工学会第四届年会磨加工方面宣读论文简介

金刚石滚轮修整若干问题的研究(被评为优秀论文) 过去对金刚石滚轮修整的研究仅限于被修砂轮的有效粗糙度,磨削力和被磨工件表面粗     

微粉金刚石钎焊砂轮磨削氧化铝陶瓷的磨削力和表面粗糙度特征

在不同磨削深度、砂轮转速和进给速度组合下,研究微粉金刚石钎焊砂轮磨削氧化铝陶瓷过程的磨削力及工件的表面粗糙度的变化规律,并筛选出低磨削力和低工件表面粗糙度的加工工艺参数。试验结果表明:在微粉金刚石钎焊砂轮的磨削过程中,氧化铝陶瓷主要通过脆性断裂的方式去除;随着磨削深度、进给速度的增加,砂轮在进给方向和切深方向的力以及工件表面粗糙度都上升;随着砂轮转速的增加,进给方向和切深方向的力以及工件表面粗糙度都下降。试验获得的低磨削力和低工件表面粗糙度精密加工工艺参数分别为:磨削深度为1.0 μm,进给速度为12 mm/min,砂轮转速为24 000 r/min和磨削深度为1.0 μm,进给速度为1 mm/min,砂轮转速为20 000 r/min。低磨削力磨削时,微粉金刚石钎焊砂轮受到的X方向和Z方向的磨削力分别为0.15 N和0.72 N;精密加工后的氧化铝陶瓷的表面粗糙度值可达0.438 μm。      

单晶硅超精密切削的刀具磨损试验研究

针对单晶硅超精密切削过程中金刚石刀具磨损问题,对单晶硅进行超精密车削试验。通过观察金刚石刀具磨损演变过程,分析刀具的磨损过程对表面加工质量的影响,得到刀具磨损机理。结果表明,在超精密切削单晶硅过程中,随着切削距离的增加,刀具磨损面积逐渐增加,加工过程中产生的碳化硅及类似金刚石碳颗粒与刀具后刀面发生划擦造成磨粒磨损;同时,由于交变载荷作用导致的应力疲劳现象,进而伴有解理断裂产生。当切削路程小于4km时,加工表面的粗糙度Ra值在200nm以内,切削路程大于8km时,表面粗糙度Ra值在350nm~400nm之间。     

Characterization of N-doped polycrystalline diamond films deposited on microgrinding tools

Chemical vapor deposited diamond films have many industrial applications but are assuming increasing importance in the area of microengineering, most notably in the development of diamond coated microgrinding tools. For these applications the control of structure and morphology is of critical importance. The crystallite size, orientation, surface roughness, and the degree of sp ³ character have a profound effect on the tribological properties of the films deposited. In this article, we present experimental results on the effects of nitrogen doping on the surface morphology, crystallite size, and wear of microgrinding tools. The sp ³ character optimizes at 200 ppm nitrogen, and above this value the surface becomes much smoother and crystal sizes decrease considerably. Fracture-induced wear of the diamond grain is the most important mechanism of material removal from a microgrinding tool during the grinding process. Fracture occurs as a consequence of tensile stresses induced into diamond grains by grinding forces to which they are subjected. The relationship between the wear of diamond coated grinding tools, component grinding forces, and induced stresses in the model diamond grains is described in detail. A significant correlation was found between the maximum value of tensile stress induced in the diamond grain and the appropriate wheel-wear parameter (grinding ratio). It was concluded that the magnitude of tensile stresses induced in the diamond grain by grinding forces at the rake face is the best indicator of tool wear during the grinding process.     

研磨刀架结构对金刚石刀具刃口质量的影响

金刚石刀具刃口锋利度和刀面表面粗糙度对所加工零件的质量有着重要影响。较好的研磨刀架结构将有助于降低因刀架而产生的振动扰动,获得高质量的刀具刃口。通过改进刀架结构,使刀具刃口锋利度从300 nm提高到了50 nm,表面粗糙度从15 nm提高到了0.5 nm,刀具刃口质量得到了明显改善。     

3D laser investigation on micron-scale grain protrusion topography of truncated diamond grinding wheel for precision grinding performance

A grain tip (GT) truncation is proposed to truncate grain protrusion tips of #270 diamond grinding wheel in plunge grinding of hard and brittle material. In this study, a 3D laser microscopy was employed to measure the wheel working surface and parameterize its 3D grain protrusion topography. The objective is to investigate how micron-scale grain protrusion parameters influence grinding performance such as grinding force and surface roughness. First, the GT truncation was performed after dressing of diamond grinding wheel in grinding experiment of quartz glass; then its 3D grain protrusion topography was constructed by smoothing 3D measured noise, matching measured point cloud, transferring protrusion frame and extracting 3D diamond grains; finally, the grain protrusion parameters such as grain protrusion number, grain protrusion height, grain protrusion volume, grain rake angle, grain clearance angle, etc. were investigated in connection with ground surface and grinding force. It is shown that GT truncation averagely decreases grain protrusion number, grain protrusion height, grain protrusion volume, grain rake angle and grain clearance angle by about 44%, 74%, 75%, 24% and 70% on whole wheel surface, respectively. However, it greatly increases active grain number by about 32 times and active grain volume by about 181 times in actual grinding with the depth of cut in 1 μm, thus leading to a decrease (about 80%) in surface roughness and an increase (about 40 times) in grinding force. It is also found that truncated diamond grain tips are mostly shaped with nanometer-scale tip wedges along grain cutting direction, leading to about 75% very large negative grain rake angles and about 75% large grain clearance angles, thus contributing to ductile-mode grinding. It is confirmed that the active grain number and active grain volume for the actual depth of cut may be regarded as main grain protrusion parameters to evaluate and predict the precision grinding performance of a coarser diamond grinding wheel.     

The ultimate sharpness of single-crystal diamond cutting tools—Part I: Theoretical analyses and predictions

In this paper, the brittle–ductile transition lapping mechanism is presented for mechanical lapping of single-crystal diamond cutting tools. The calculated critical depths of cut for controlling brittle–ductile transition in different orientations and on different planes are used to direct tool lapping and deduce the dynamic micro-mechanical strengths (such as tensile, shearing and compressive strengths) of diamond cutting tools, while in the tool fabrication. The investigation illustrates that the dynamic micro-mechanical strengths have great anisotropy, and the strengths in the ‘soft’ direction are all less than those in the ‘hard’ direction on any crystal plane. The lapping of designed cutting tools, oriented (1 1 0)–(1 0 0) and (1 0 0)–(1 0 0) as tool rake and flank faces respectively, is carried out in ductile mode based on the optimal lapping parameters as selected. Both atomic force microscope (AFM) and scanning electron microscope (SEM) measurements results show that the lapping quality of diamond cutting tools is much improved with the proposed lapping approach. The surface roughness on the tool rake face is 0.8 nm (Ra) and lapped cutting edge radius is 35–50 nm as achieved when (1 1 0)–(1 0 0) orientations are selected as rake and flank faces; and the rake face surface roughness is 0.7 nm (Ra) and lapped cutting edge radius is 30–40 nm as the rake and flank faces oriented with (1 0 0)–(1 0 0) combination. Theoretical analyses of the dynamic impact effects on the cutting edge radius are undertaken to predict their ultimate cutting edge radii. Theoretical calculations indicate that the extreme cutting edge radius can be sharpened down to 1–6 nm of the (1 1 0)–(1 0 0) oriented tools, and 2–5 nm for the (1 0 0)–(1 0 0) oriented cutting tools.     

Study on the grinding of advanced ceramics with slotted diamond wheels

Slotted diamond wheel grinding is a new machining technology. In this paper, an experimental study on the cutting force and the grinding temperature for ceramic face grinding using slotted diamond wheels is presented. Moreover, the empirical relationships related with the material removal rate, the surface roughness, the depth of cut, the wheel speed and the grain size are discussed. With these relationships, a temperature field for face grinding has been built. The work contributes to the fundamental theories for optimal design of slotted diamond wheels.     

–50 ℃冷风条件下抛光硬质合金刀片加工TC4钛合金的表面粗糙度分析

目的提高硬质合金刀片加工TC4钛合金的表面质量。方法利用化学机械抛光技术对传统磨削的硬质合金刀片分别进行粗抛、半精抛和精抛处理,运用正交试验法,在常温干切和–50℃冷风条件下,分别采用传统磨削的硬质合金刀片(磨削刀片)与化学机械抛光的硬质合金刀片(抛光刀片)进行切削TC4钛合金正交试验,利用方差分析法分析切削参数对已加工表面粗糙度Ra的影响。运用多元线性回归方法建立磨削刀片、抛光刀片在常温干切和–50℃冷风条件下切削TC4钛合金已加工表面粗糙度Ra的经验预测模型。结果硬质合金刀片前刀面通过粗抛、半精抛和精抛后,刀片前刀面的表面粗糙度Ra为19 nm。当切削参数相同时,磨削刀片在–50℃冷风条件下切削TC4钛合金的已加工表面粗糙度,比常温干切条件下平均降低了35.9%;抛光刀片在–50℃冷风条件下切削TC4钛合金的已加工表面粗糙度,比常温干切条件下平均降低了43.5%。在常温干切条件下,抛光刀片比磨削刀片切削TC4钛合金的已加工表面粗糙度平均降低了19.2%;在–50℃冷风条件下,抛光刀片比磨削刀片切削TC4钛合金的已加工表面粗糙度平均降低了28.7%。抛光刀片在–50℃冷风条件下切削TC4钛合金的已加工表面粗糙度Ra,比磨削刀片在常温干切条件下切削TC4钛合金的已加工表面粗糙度Ra平均降低了54.4%。结论采用对硬质合金刀片表面进行化学机械抛光技术和以–50℃冷风为切削介质的组合工艺,可有效降低TC4钛合金已加工表面粗糙度。