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1.
Between the growth temperatures of 490-520°C Si-doped GaAs0.5Sb0.5 changes from 1×1017 cm-3 n-type to 2×1017 cm-3 p-type. The scattering mechanisms of the n and p-type epilayers are investigated. The reproducibility and potential applications of the observed conduction type change are demonstrated by the fabrication of a pn diode  相似文献   

2.
Long-wavelength infrared photodiodes were fabricated using InAs 1-xSbx/InSb (x=0.82-0.85) strained-layer superlattices (SLSs). These structures can be grown using either molecular-beam epitaxy or metalorganic chemical vapor deposition. These photodiodes display broad spectral responses up to wavelengths greater than or approximately equal to 10 μm, and detectivities of 1×10 9 cm-Hz1/2/W at 10 μm  相似文献   

3.
Optimality property of the Gaussian window spectrogram   总被引:1,自引:0,他引:1  
It is shown that for any signal x(t) the minimum of ∫-∞-∞ [(t-tx)2+(f-f x)2] Sx(w)(t , f) dt df over all normalized time-windows w(t) is achieved by the Gaussian window w(t)=21/4 exp (-πt2). Here (tx, f x) is the center of gravity of the signal x(t ), Sx(w) (t, f) is the spectrogram of x(t) due to the window w( t), and the double integral is a measure of the spread of S x(w) (t, f) around (t x, fX) in the time-frequency plane  相似文献   

4.
The carrier-induced index change was measured using a novel injection-reflection technique in combination with differential carrier lifetime data. The observed relation between index change and injected carrier density at bandgap wavelength is nonlinear and is approximately given by δnact=-6.1×10-14 ( N)0.66 for a 1.5-μm laser and δn act=-1.3×10-14 (N)0.68 for a 1.3-μm laser. The carrier-induced index change for a 1.3-μm laser at 1.53-μm wavelength is smaller and is given by δn act=-9.2×10-16 (N)0.72   相似文献   

5.
A dispersion formula ϵ*eff(f)=ϵ* -{ϵ**eff(0)}/{1+( f/f50)m}, for the effective relative permittivity ϵ*eff(f) of an open microstrip line is derived for computer-aided design (CAD) use. The 50% dispersion point (the frequency f50 at which ϵ*eff(f50)={ϵ **eff(0)}/2}) is used a normalizing frequency in the proposed formula, and an expression for f50 is derived. To obtain the best fit of ϵ *eff(f) to the theoretical numerical model, the power m of the normalized frequency in the proposed formula is expressed as a function of width-to-height ratio w/ h for w/h⩾0.7 and as a function of w /h, f50, and f for w/h⩽0.7. The present formula has a high degree of accuracy, better than 0.6% in the range 0.1<w/h⩽10, 1<ϵ*⩽128, and any height-to-wavelength ratio h0  相似文献   

6.
Itoh  T. Tsujii  S. 《Electronics letters》1988,24(6):334-335
Presents an effective recursive algorithm for computing multiplicative inverses in GF(2m), where m=2k, employing normal bases. The proposed algorithm requires m-1 cyclic shifts and two multiplications in GF (2m) and in each subfield of GF(2m): GF(2m/2), GF(2m/4),. . ., GF (28) and GF(24)  相似文献   

7.
Electrical characteristics of Al/yttrium oxide (~260 Å)/silicon dioxide (~40 Å)/Si and Al/yttrium oxide (~260 Å)/Si structures are described. The Al/Y2O3/SiO2/Si (MYOS) and Al/Y2 O3/Si (MYS) capacitors show very well-behaved I-V characteristics with leakage current density <10-10 A/cm2 at 5 V. High-frequency C- V and quasistatic C-V characteristics show very little hysteresis for bias ramp rate ranging from 10 to 100 mV/s. The average interface charge density (Qf+Q it) is ~6×1011/cm2 and interface state density Dit is ~1011 cm-2-eV-1 near the middle of the bandgap of silicon. The accumulation capacitance of this dielectric does not show an appreciable frequency dependence for frequencies varying from 10 kHz to 10 MHz. These electrical characteristics and dielectric constant of ~17-20 for yttrium oxide on SiO2/Si make it a variable dielectric for DRAM storage capacitors and for decoupling capacitors for on-chip and off-chip applications  相似文献   

8.
A novel surface passivation tailored to a two-dimensional array of small-area, gate-controlled InSb photovoltaic diodes fabricated on etch-thinned bulk InSb wafers, with backside illumination, is presented. The surface passivation is based on a controlled surface treatment that reduces the native oxide and is followed by photon-assisted deposition of SiOx. Thinned bulk n-type InSb with (111) orientation forms two distinctive types of interface on the In and Sb faces, respectively. The In face forms an accumulated interface with reduced surface recombination velocity. The Sb face forms a slightly accumulated interface, with a relatively small concentration of fast and slow surface states. The current-voltage and differential resistance-voltage characteristics of implanted p+-n photodiodes exhibit nearly flat behavior up to 1-V reverse bias with reduced leakage currents. The Ro×A product of small-geometry diodes is 5×104 Ω-cm2 at 77 K  相似文献   

9.
p+-n junction diodes for sub-0.25-μm CMOS circuits were fabricated using focused ion beam (FIB) Ga implantation into n-Si (100) substrates with background doping of Nb=(5-10)×10 15 and Nb+=(1-10)×1017 cm-3. Implant energy was varied from 2 to 50 keV at doses ranging from 1×1013 to 1×1015 cm-2 with different scan speeds. Rapid thermal annealing (RTA) was performed at either 600 °C or 700°C for 30 s. Diodes fabricated on Nb+ with 10-keV Ga+ exhibited a leakage current (IR) 100× smaller than those fabricated with 50-keV Ga+. Tunneling was determined to be the major current transport mechanism for the diodes fabricated on Nb+ substrates. An optimal condition for IR on Nb+ substrates was obtained at 15 keV/1×1015 cm-2. Diodes annealed at 600°C were found to have an IR 1000× smaller than those annealed at 700°C. I-V characteristics of diodes fabricated on Nb substrates with low-energy Ga+ showed no implant energy dependence. I-V characteristics were also measured as a function of temperature from 25 to 200°C. For diodes implanted with 15-keV Ga +, the cross-over temperatures between Idiff and Ig-r occurred at 106°C for Nb + and at 91°C for Nb substrates  相似文献   

10.
Carrier-induced change in refractive index of InP, GaAs and InGaAsP   总被引:9,自引:0,他引:9  
The change in refractive index Δn produced by injection of free carriers in InP, GaAs, and InGaAsP is theoretically estimated. Bandfilling (Burstein-Moss effect), bandgap shrinkage, and free-carrier absorption (plasma effect) are included. Carrier concentrations of 1016/cm3 to 1019/cm 3 and photon energies of 0.8 to 2.0 eV are considered. Predictions for Δn are in reasonably good agreement with the limited experimental data available. Refractive index changes as large as 10-2 are predicted for carrier concentrations of 10 8/cm3 suggested that low-loss optical phase modulators and switches using carrier injection are feasible in these materials  相似文献   

11.
Two theorems on lattice expansions   总被引:1,自引:0,他引:1  
It is shown that there is a tradeoff between the smoothness and decay properties of the dual functions, occurring in the lattice expansion problem. More precisely, it is shown that if g and g¯ are dual, then (1) at least one of H1/2 g and H1/2 g¯ is n in L2(R), and (2) at least one of Hg and g ¯ is not in L2(R). Here, H is the operator -1/(4π2)d2/(dt2 )+t2. The first result is a generalization of a theorem first stated by R.C. Balian (1987). The second result is new and relies heavily on the fact that, when G∈W2,2(S) with S=[-1/2, 1/2]×[-1/2, 1/2] and G(0), than 1/GL 2(S)  相似文献   

12.
The Gaussian arbitrarily varying channel with input constraint Γ and state constraint Λ admits input sequences x=(x1,---,Xn) of real numbers with Σxi2nΓ and state sequences s=(S1,---,sn ) of real numbers with Σsi2nΛ; the output sequence x+s+V, where V=(V1,---,Vn) is a sequence of independent and identically distributed Gaussian random variables with mean 0 and variance σ2. It is proved that the capacity of this arbitrarily varying channel for deterministic codes and the average probability of error criterion equals 1/2 log (1+Γ/(Λ+σ2)) if Λ<Γ and is 0 otherwise  相似文献   

13.
Minority-carrier diffusion length L, lifetime τ, and diffusion coefficient D in n-type Si are measured at 296 K in the doping range from 1018 cm-3 to 7×1019 cm-3. The measurement is based on a lateral collection of carriers generated by a spatially uniform light. The distance between the illumination edge and the collection junction is defined by photolithography. This allows simultaneous and independent determination of all transport parameters in the same material. A self-consistency and accuracy check is provided by the relation L 2=Dτ. Details of experimental procedures are described. Empirical best-fit relations for the three parameters are given. The extraction of lifetime and diffusion coefficient was done in the frequency domain, which allows for straightforward elimination of parasitic effects in the nanosecond and subnanosecond range  相似文献   

14.
Statistics on the backscatter coefficient σ0 from the Ku-band Seasat-A Satellite Scatterometer (SASS) collected over the world's land surfaces are presented. This spaceborne scatterometer provided data on σ0 between latitude 80° S and 80° N at incidence angles up to 70°. The global statistics of vertical (V) and horizontal (H) polarization backscatter coefficients for 10° bands in latitude are presented for incidence angles between 20° and 70° and compared with the Skylab and ground spectrometer results. Global images of the time-averaged V polarization σ0 at a 45° incidence angle and its dependence on the incidence angle are presented and compared to a generalized map of the terrain type. Global images of the differences between the V an H polarization backscatter coefficients are presented and discussed. The most inhomogeneous region, which contains the deserts of North Africa and the Arabian Peninsula, is studied in greater detail and compared with the terrain type  相似文献   

15.
A highly reliable, accurate, and efficient method of calculating the probability of detection, PN(X,Y ), for N incoherently integrated samples, where X is the constant received signal-to-noise ratio of a single pulse and Y is the normalized threshold level, is presented. The useful range of parameters easily exceeds most needs. On a VAX/11 computer with double precision calculations, better than 13-place absolute accuracy is normally achieved. There is a gradual loss of accuracy with increasing parameter values. For example, for N=109, and with both NX and Y near 107, the accuracy can drop to ten places. The function PN(X,Y ) can be equated to the generalized Marcum Q-function, Qm(α,β). The corresponding limits on α and β are roughly 4500 for the 13-place accuracy and 60000 for ultimate (INTEGER×4) limit  相似文献   

16.
The ill-posedness of the extrapolation problem in the presence of noise is considered. A stable algorithm is constructed by solving a Fredholm equation based on a regularization method. The algorithm appears relatively robust, since the noise ηδ(t ) is taken as a function in L2[-T,T](T>0) such that the error energy ∫|ηδ(t)|2 dt⩽δ2, where integration is from - T to T, and the constructed extrapolation uniformly converges to the desired signal over (-∞, +∞) as δ→0. An estimate for the error energy of the constructed extrapolation over (-∞, +∞) and for the absolute error between the constructed extrapolation and the desired signal over (-∞, +∞) are presented  相似文献   

17.
Magneto-transport and cyclotron resonance measurements were made to determine directly the density, mobility, and the effective mass of the charge carriers in a high-performance 0.15-μm gate In0.52 Al0.48As/In0.53Ga0.47As high-electron-mobility transistor (HEMT) at low temperatures. At the gate voltage VG=0 V, the carrier density n g under the gate is 9×1011 cm-2, while outside of the gate region ng=2.1×1012 cm-2. The mobility under the gate at 4.2 K is as low as 400 cm2/V-s when VG<0.1 V and rapidly approaches 11000 cm2/V-s when VG>0.1 V. The existence of this high mobility threshold is crucial to the operation of the device and sets its high-performance region in VG>0.1 V  相似文献   

18.
The emitter saturation current density, J0 was measured on diffused boron emitters in silicon for the case in which the emitter surface is passivated by a thermal oxide and for the case in which Al/Si is deposited on the emitter surface. The oxide-passivated emitters have a surface recombination velocity, s, which is near its lowest technologically achievable value. In contrast, the emitters with Al/Si on the surface have surface recombination velocities which approach the maximum possible value of s. From the J 0 measurements, the apparent bandgap narrowing as a function of boron doping was found. Using this bandgap narrowing data, the surface recombination velocity at the Si/SiO2 interface was extracted for surface boron concentrations from 3×1017 to 3×1019 cm-3  相似文献   

19.
A detailed study of the growth of amorphous hydrogenated fluorinated silicon (a-Si:H, F) from a DC glow discharge in SiF4 and H2 is discussed. The electrical properties of the films can be varied over a very wide range. The bulk properties of the best films that were measured included an Urbach energy Eu =43 meV, a deep-level defect density Ns=1.5×1015 cm-3, and a hole drift mobility of 8×10-3 cm2 V-1 s-1, which reflects a characteristic valence band energy of 36 meV. It was found that Eu, N s, and the density of surface states Nss are related to each other. Under the deposition condition of the films with the best bulk properties, Nss reaches its highest value of 1×1014 cm-2. It is suggested that in growth from SiF4/H2, the density of dangling bonds at the growing surface is very sensitive to the deposition conditions  相似文献   

20.
The bipolar inversion-channel field-effect transistor (BICFET) relies on a field-effect mechanism to induce and modulate an inversion layer placed at the heterojunction interface. The device was fabricated using molecular beam epitaxy. A current gain of ~15 has been achieved at a current density J of ~8×103 A/cm2 at 300 K. At 77 K, the gain rises to 40 with J=2×104 A/cm2. This gain, which follows theoretical predictions, continuously increases with collector current and is limited only by the amount of heat generated in a large-area device. Because of its potential for ballistic transport in the collector, the InGaAs/InAlAs BICFET should be very attractive for high-speed applications  相似文献   

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