Influence of the interfacial resin layer on delamination initiation in broken ply composite laminates

The present study has investigated the influence of a resin layer on the delamination initiation at the interface of broken and continuous plies in the case of GR/E (graphite/epoxy) laminates with broken central plies. A full three-dimensional (3D) finite element (FE) analysis was performed with each layer of the laminate modelled as homogeneous and orthotropic. The interface between the broken and the continuous plies was modelled with a thin resin-rich layer. Eight-noded isoparametric layered elements were used to model the laminate specimen. Also, 3D contact elements were used to prevent inter-penetration of the delaminated faces at the interface. Based on the results of the 3D FE analysis, strain energy release rates were calculated at the delamination front using Irwin's 'crack closure integral'. Using the concepts of linear elastic fracture mechanics (LEFM), the strain energy release rate was used as a parameter for assessing delamination initiation. The effects of various factors such as resin layer stiffness, resin layer thickness, and fibre orientation at the interface on the three components of the strain energy release rates, namely G_I, G_II and G_III, were studied for laminates with various crack sizes of the broken ply, and the influence of the resin layer in the delamination initiation was established. It was observed that delamination initiation is a mixed-mode phenomenon even in the case of uniaxial loading and the dominance of the mode of delamination is governed by the resin layer stiffness, thickness, and lamina orientation at the interface. The present work also concludes that an increase in the resin layer modulus leads to an increase in the probability of mode I delamination while the probability of mode II delamination decreases. A 0/90 interface exhibits a higher chance of delamination in modes I and II, while mode III delamination is maximum for 0/30 and 0/60 fibre orientation interfaces. It was also observed that the larger the crack width, the greater the probability of delamination initiation at the interface.     

Effect of residual stresses on fatigue crack growth behavior of aluminum substrate repaired with a bonded composite patch

Composite patches bonded to cracked metallic aircraft structures have been shown to be a highly cost-effective method for extending the service life of the structures. The fatigue crack growth behavior of pre-cracked 7075-T6 aluminum substrate with the 12.7-mm V-notch crack repaired with boron/epoxy composite patches was investigated. 1-ply, 2-ply, 3-ply and 4-ply composite patches were studied. The residual stresses due to mismatch of the coefficients of thermal expansion between the aluminum plate and boron/epoxy composite patch were calculated based on the classical equation. The effects of the residual stresses and patch layers on fatigue lifetime, fatigue crack growth rate, and fatigue failure mode of the repaired plates were examined experimentally. A modified analytical model, based on Rose's analytical solution and Paris power law, was developed for this research. This model considered the residual stress effect and successfully predicted the fatigue lifetime of the patched plates. Results showed that the composite patch had two competing impacts on the structure. The composite patch could cause residual tensile stress in the aluminum substrate, which could consequently increase the crack growth rate. Moreover, reinforcement with the composite patch could also retard the crack propagation in the aluminum plate. If a 4-ply composite patch was used, it resulted in high residual stresses and effectively would not extend the fatigue lifetime of cracked aluminum plates.     

Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures

In this work, a smart cure cycle with cooling, polymerization and reheating was devised to nearly completely eliminate thermal residual stresses in the bonding layer of the co-cure bonded hybrid structure. In situ dielectrometry cure monitoring, DSC experiments and rheometric measurements were performed to investigate the physical state and the cure kinetics of the neat epoxy resin in the carbon fiber/epoxy composite materials. From the experimental results, an optimal cooling point in the cure cycle was obtained. Also, process parameters such as cooling rate, polymerization temperature and polymerization time in the curing process were investigated. Then, the thermal residual stresses were estimated by measuring the curvatures of co-cure bonded steel/composite strips and their effects on the static lap-shear strengths of co-cure bonded steel/composite lap joints were measured. Also, the effects of thermal residual stresses on the tensile strength, the interlaminar shear strength and the interlaminar fracture toughness of the composite material itself were measured using tensile, short beam shear and double cantilever beam tests. From these results, it was found that the smart cure cycle with cooling, polymerization and reheating eliminated the thermal residual stresses completely and improved the interfacial strength of the co-cure bonded hybrid structures, as well as the tensile strength of the composite structures.     

Influence of curvature geometry of laminated FRP composite panels on delamination damage in adhesively bonded lap shear joints

Three dimensional non-linear finite element analyses of Lap Shear Joints (LSJs) made with curved laminated FRP composite panels having pre-existing delaminations between the first and second plies of the strap adherend have been carried out using contact and Multi-Point Constraint elements (MPC). Progressive growth of delamination has been simulated by sequential release of the MPC elements. Strain Energy Release Rate (SERR), being an indicative parameter has been computed using Virtual Crack Closure Technique (VCCT) for assessing the growth and propagation of the delamination damage fronts. The inter-laminar stresses and the SERRs at the two fronts of the pre-embedded delamination are found to be significantly influenced by the delamination size. The three individual modes of SERR on the two delamination fronts are found to be much different from each other, indicating dissimilar rates of propagation. The curvature geometry of adherends significantly influences the SERR values. It is seen that decrease of radius of curvature of adherend panels, keeping their widths unchanged, increases the SERR values. Flatter FRP composite adherends have superior resistance to delamination damage propagation as compared to LSJs made with curved composite laminated panels.     

Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method

In this study, a concentrated force is applied to both adherends bonded by an adhesive under pin–pin boundary conditions. First a mathematical model is derived with governing equations and boundary conditions. These complicated, and analytically problematic, coupled equations are solved numerically using symbolic manipulation and singular value decomposition (SVD). Also discussed are the effects of major factors, including the relative thickness of adherends, joint length and the action point of the concentrated force on the peel and shear stresses in the adhesive layer. This study identifies the conditions under which the upper adherend without breakage can be fully separated from the lower adherend. Particularly, it is found that the thickness of the lower adherend should be greater than ten times that of the adhesive layer but less than one-third that of the upper adherend, the adhesive layer should be relatively thin (h _a ≤ 0.01 mm), and the adhesive joint should be relatively short (thickness to length ratio γ ₁ ≥ 0.08).     

Analysis of the interaction using FTIR within the components of OREC composite GPE based on the synthesized copolymer matrix of P(MMA-MAh)

Poly(methyl methacrylate-maleic anhydride) (P(MMA-MAh)) has been synthesized from methyl methacrylate (MMA) and maleic anhydride (MAh) monomers. The molar ratio of monomers was found to be 1MAh:8MMA. The molecular weight of copolymer was determined in the order 10⁴ (g/mol).Rectorite modified with dodecyl benzyl dimethyl ammonium chloride (OREC) was used as a filler additive to modify gel polymer electrolytes (GPEs) which consisted of P(MMA-MAh) used as polymer matrix, propylene carbonate (PC) as a plasticizer and LiClO₄ as lithium ion producer. Characterization of interaction of CO in PC and copolymer with Li⁺ and OH group on OREC surface has been thoroughly examined using FTIR. The quantitative analysis of FTIR shows that the absorptivity coefficient a of copolymer/LiClO₄, PC/LiClO₄, PC/OREC and copolymer/OREC is 0.756, 0.113, 0.430 and 0.602, respectively, which means that the Li⁺ or OH bonded CO is more sensitive than free CO in FTIR spectra. The limit value of bonded CO equivalent fraction of copolymer/LiClO₄, PC/LiClO₄, PC/OREC and copolymer/OREC is 55, 94, 57 and 26%, respectively, which implies that all the interaction within the components is reversible and the intensity of interaction is ordered as PC/LiClO₄, PC/OREC, copolymer/OREC and copolymer/LiClO₄.     

Analysis of electrochemical parameters in time domain during the passive layer cracking occurring on the 304L stainless steel in chlorides solution under tensile stresses

Dynamic electrochemical impedance spectroscopy (DEIS) has been applied for detailed analysis of the passive–active transient region during the passive layer cracking process. The effect of applied potential and tensile stresses on the passive layer rupture of type 304L stainless steel (SS) immersed in 0.5 M NaCl solution at room temperature was examined. This paper presents instantaneous impedance spectra obtained for 304L stainless steel samples at the different potential values that refer to the transition from passive into active state while crack of the passive layer took place. Besides, differential dependencies of electrochemical parameters versus relative elongation have been presented to illustrate the system's dynamics changes.