Thermal imidization of poly(amic acid) on Si(100) surface modified by plasma polymerization of glycidyl methacrylate

The plasma polymerization of glycidyl methacrylate (GMA) on pristine and Ar plasma-pretreated Si(100) surfaces was carried out. The epoxide functional groups of the plasma-polymerized GMA (pp-GMA) could be preserved, to a large extent, through the control of the glow discharge parameters, such as the radio-frequency (RF) power, carrier gas flow rate, system pressure, and monomer temperature. The pp-GMA film was used as an adhesion promotion layer for the Si substrate. The polyimide (PI)/pp-GMA-Si laminates, formed by thermal imidization of the poly(amic acid) (PAA) precursor poly(pyromellitic dianhydride-co-4,4′-oxydianiline) (PMDA-ODA) on the pp-GMA-deposited Si surface (the pp-GMA-Si surface), exhibited a 180°-peel adhesion strength as high as 9.0 N/cm. This value was much higher than the negligible adhesion strength for the PI/Si laminates obtained from thermal imidization of the PAA precursor on both the pristine and the argon plasma-pretreated Si(100) surfaces. The high adhesion strength of the PI/pp-GMA-Si laminates was attributed to the synergistic effect of coupling the curing of epoxide functional groups in the pp-GMA layer with the imidization process of the PAA, and the fact that the plasma-deposited GMA chains were covalently tethered onto the Si(100) surface. The chemical composition and structure of the deposited films were characterized, respectively, by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy, while the surface morphology of the deposited films was characterized by atomic force microscopy (AFM).     

Adhesion enhancement of thermally evaporated aluminum to surface graft copolymerized poly(tetrafluoroethylene) film

Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film via UV-induced graft copolymerization with glycidyl methacrylate (GMA) and 1-vinylimidazole (VIDz) were carried out to improve the adhesion with evaporated aluminum metal. The surface compositions of the graft copolymerized PTFE films were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the evaporated aluminum to the surface graft copolymerized PTFE film was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment of the graft copolymerized PTFE surface prior to metallization, and the extent of thermal treatment after metallization. The optimum T-peel adhesion strengths of the Al/PTFE laminates were in excess of 10 and 5 N/cm, respectively, for the GMA and VIDz graft copolymerized PTFE films. These adhesion strengths are significantly higher than those obtained between the evaporated aluminum and the pristine or plasma-pretreated PTFE film. The mechanism of adhesion enhancement and the failure of the metal-polymer assembly were also investigated. It was observed that the failure occurred within the PTFE film. The strong adhesion between Al and PTFE arises from the charge-transfer interaction between the Al atom and the epoxide moiety of the grafted GMA polymer, as well as from the fact that the graft chains are covalently tethered on the PTFE film surface as a result of the grafting process.     

Modification of poly(tetrafluoroethylene) and copper foil surfaces by graft polymerization for adhesion improvement

Thermal graft polymerization-induced lamination of surface-modified copper foil to surface-modified poly(tetrafluoroethylene) (PTFE) film was achieved in the presence of an epoxy resin adhesive and glycidyl methacrylate (GMA) monomer, or in the presence of GMA and hexamethylenediamine (HEDA). The copper foil surfaces were pretreated with an organosilane coupling agent (SCA), such as (3-mercaptopropyl)trimethoxysiane, 3-(trimethoxysilyl)propyl methacrylate, or N¹-[3-(trimethoxysilyl)propyl]diethylene-triamine. The silanized copper foils were subjected to brief Ar plasma treatment and subsequently to UV-induced graft polymerization with GMA (the Cu-SCA-g-GMA surface). Surface modification of PTFE film included Ar plasma treatment alone, or Ar plasma pretreatment followed by UV-induced graft polymerization with GMA (the GMA-g-PTFE surface). The modified surfaces and interfaces were characterized by X-ray photoelectron spectroscopy (XPS) and water contact angle measurements. The Cu-SCA-g-GMA/epoxy resin-GMA/PTFE or Cu-SCA-g-GMA/GMA–HEDA/GMA-g-PTFE laminates exhibited T-peel adhesion strengths in excess of 9 N/cm and the joints delaminated by cohesive failure inside the bulk of the PTFE film. The strong adhesion in these Cu foil-PTFE laminates is attributable to the fact that the GMA chains are covalently tethered on both the PTFE and the silanized Cu surfaces, as well the fact that these grafted GMA chains are covalently incorporated into the highly crosslinked network structure of the adhesive at the interphase.     

Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper

The surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) films via UV-induced graft copolymerization with either 3-(trimethoxysilyl)propyl methacrylate (TM-SPMA) or glycidyl methacrylate (GMA) was carried out to enhance their adhesion to electrolessly deposited copper. The surface compositions of the PTFE films at various stages of surface modification and electroless plating were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the graft-copolymerized PTFE film to the electrolessly deposited copper was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment time after graft copolymerization, and the extent of thermal post-treatment after metallization. The maximum T-peel strength achieved between the electrolessly deposited copper and the GMA graft-copolymerized PTFE film was about 11 N/cm. This adhesion strength represented a more than 20-fold increase over what could be achieved when the PTFE film was treated by Ar plasma alone. The mechanisms of the adhesion strength enhancement and the failure mode in the metal-polymer laminates were also investigated. It was found that the failure was cohesive in nature within the PTFE film.     

Modification of poly(tetrafluoroethylene) and gold surfaces by thermal graft copolymerization for adhesion improvement

The adhesion between a poly(tetrafluoroethylene) (PTFE) film and a gold substrate was achieved by surface graft copolymerization of glycidyl methacrylate (GMA) on an argon plasma-pretreated PTFE film at elevated temperature with simultaneous lamination to a surface-modified gold substrate. The plasma pretreatment introduces peroxides which are thermally degraded into radicals to initiate the graft copolymerization of GMA on the PTFE surface. The gold surface, on the other hand, was first pretreated with 3-mercaptopropionic acid (MPA), 3-mercaptopropionic acid-2-ethylhexyl ester (MPAEE), or (3-mercaptopropyl)trimethoxysilane (MPTMS) to form self-assembled monolayers (SAMs) and then subjected to Ar plasma treatment. The simultaneous graft copolymerization and lamination of the PTFE film to the gold surface was carried out in the presence of GMA and an amine hardener at an elevated temperature under atmospheric conditions. The modified surfaces and interfaces were characterized by X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The gold/GMA/PTFE assembly exhibited a T-peel adhesion strength above 10 N/cm and the joint delaminated by cohesive failure inside the bulk of the PTFE film. The strong adhesion of the Au/PTFE laminate is the result of concurrent graft copolymerization on both the Ar plasma-pretreated PTFE surface and the SAM of the Au surface to form a covalent network. The network is further strengthened by the crosslinking reaction promoted by the presence of the hardener.     

Grafting of Epoxy Resin on Surface-modified Poly(tetrafluoroethylene) Films

An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests.     

Grafting of Epoxy Resin on Surface-modified Poly(tetrafluoroethylene) Films

An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests.     

Oxidative graft polymerization of aniline on Si(100) surface modified by plasma polymerization of glycidyl methacrylate

Modification of argon plasma-pretreated Si(100) surfaces via plasma polymerization of glycidyl methacrylate(GMA), followed by reactive coupling of the epoxide groups of the plasma deposited GMA chains with aniline, and finally by oxidative graft polymerization of aniline was carried out. An alternative approach involved the modification of the argon plasma-pretreated Si(100) surfaces via plasma polymerization of glycidyl methacrylate(GMA), followed by direct oxidative graft polymerization of aniline and thermal curing. The compositions and chemical states of the modified Si surfaces were characterized by X-ray photoelectron spectroscopy (XPS). The two methods of surface modification of the Si(100) surfaces produced similar results. The protonation-deprotonation behavior, the interconvertible intrinsic redox states, and the metal reduction behavior (the electroless plating of Pd from the Pd(II) ion solution) of the grafted polyaniline (PANI) chains on the Si(100) surface were grossly similar to those of the PANI homopolymer. The coupling of PANI to the covalently tethered GMA chains on the Si(100) surface was suggested by the cohesive failure inside the epoxy adhesive that was applied to the modified Si surface in an attempt to peel off the PANI layer from the GMA plasma-polymerized Si (GMA-pp-Si) substrate.     

Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate

Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film were carried out via near-UV light-induced graft copolymerization with glycidyl methacrylate (GMA). The structure and chemical composition of the copolymer surface and interface were studied by angle-resolved X-ray photoelectron spectroscopy (XPS). For PTFE substrate with a substantial amount of grafting, the grafted GMA polymer penetrates or becomes partially submerged beneath a thin surface layer of dense substrate chains to form a stratified surface microstructure. The concentration of the surface-grafted GMA polymer increases with the plasma pretreatment time, the near-UV light illumination time, and the monomer concentration. The GMA graft copolymerized PTFE surfaces adhere strongly to one another when brought into direct contact and cured (i) in the presence of a diamine alone or (ii) in the presence of an epoxy adhesive (epoxy resin plus diamine curing agent). In the presence of diamine alone, failure occurs in the interfacial region. For epoxy adhesive-promoted adhesion, the failure mode is cohesive, i.e. it takes place in the bulk of one of the delaminated PTFE films. The lap shear strengths in both cases increase with the amount of surface-grafted epoxide polymer. The development of the adhesion strength depends on the concentration of the surface graft, the microstructure of the graft copolymerized PTFE surface, the interfacial reactions, and the nature of the bonding agent.     

Thermal imidization of poly(amic acid) precursors on surface-modified poly(tetrafluoroethylene) films via graft copolymerization with glycidyl methacrylate

A novel method for preparing composites of polyimides (PI) laminated to poly(tetrafluoroethylene) (PTFE) films is reported. PI/PTFE composites were developed through thermal imidization of poly(amic acid) (PAA) precursors on surface-modified PTFE films. Surface modification of PTFE films was carried out via Ar plasma pretreatment of the films, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The surface composition and topography of the graft copolymerized PTFE films and the delaminated PI and PTFE surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. The adhesion strengths of the PI (imidized PAA) on the GMA graft copolymerized PTFE films were evaluated as a function of various thermal imidization schedules. The adhesion reliability of the PI/PTFE composites was tested by a series of hydrothermal cycles. The development of strong Tpeel adhesion strengths of about 8 N/cm with excellent reliability for the PI/PTFE composites was attributable to the synergistic effect of coupling the curing of the epoxide functional groups of the grafted GMA chains with the imidization process of the PAA and the fact that the GMA chains were covalently tethered onto the PTFE surface. The PI/PTFE composites delaminated via cohesive failure inside the PTFE substrates. The delaminated PI film with a covalently adhered 'rough' PTFE surface layer exhibited a water contact angle as high as 140°.     

Surface Modification of Poly(Tetrafluoroethylene) Films by Graft Copolymerization for Adhesion Improvement with Sputtered In-Sn Oxides

Surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) films was carried out via UV-induced graft Copolymerization with glycidyl methacrylate (GMA), acrylamide (AAm) and hydroxylethylacrylate (HEA) to improve the adhesion strength with sputtered indium-tin-oxide (ITO). The surface compositions of the graftcopolymerized PTFE films were studied by X-ray photoelectron spectroscopy (XPS). The graft yield increases with increasing monomer concentration and Ar plasma pre-treatment time of the PTFE films. The T-peel adhesion strength was affected by the type of monomer used for graft Copolymerization, the graft concentration, and the thermal post-treatment after ITO deposition. A double graft-copolymerization process, which involved initially the graft copolymeri/ation with AAm or HEA, followed by graft Copolymerization with GMA. was also employed to enhance the adhesion of sputtered ITO to PTFE. T-peel adhesion strengths in excess of 8 N cm were achieved in the ITO graft-modified PTFE laminates. The adhesion failure of the ITO/PTFE laminates in T-peel tests was found to occur inside the PTFE films. The electrical resistance of ITO on all graft-modified PTFE surfaces before and after thermal post-treatment remained conslant at about 30 Ω square, suggesting that the graft layer did not have any significant effect or. the electrical properties of the deposited ITO.     

Lamination of conductive polypyrrole films to poly(tetrafluoroethylene) films via interfacial graft copolymerization

A simple technique for the lamination of a conductive polymer film to an inert dielectric polymer film was demonstrated. The electrochemically synthesized and p‐toluenesulfonic acid‐doped polypyrrole (PPY) film was laminated simultaneously to the argon plasma‐pretreated PTFE film during the thermally induced graft copolymerization of the PTFE surface with a functional monomer. The graft copolymerization was carried out using glycidyl methacrylate (GMA) monomer containing 20% v/v hexamethyldiamine (HMDA) and in the absence of any polymerization initiator. Thermally induced graft copolymerization of the GMA monomer on the PPY surface was minimal. The lap shear and T‐peel adhesion strengths of the laminates were found to be dependent on the GMA graft concentration on the PTFE surface, which, in turn, was affected by the plasma pretreatment time of the film. To increase the GMA graft concentration for the enhancement of adhesion strength, the plasma‐pretreated PTFE surfaces were premodified via UV‐induced graft copolymerization with GMA prior to the simultaneous thermal graft copolymerization and lamination process. The modified surfaces and interfaces were characterized by X‐ray photoelectron spectroscopy (XPS). Through XPS measurements of the delaminated surfaces, it was found that the PPY/PTFE laminates failed predominantly by cohesive failure inside the PTFE substrate. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 716–727, 2001     

ELECTROLESS PLATING OF GLASS AND SILICON SUBSTRATES THROUGH SURFACE PRETREATMENTS INVOLVING PLASMA-POLYMERIZATION AND GRAFTING PROCESSES

Electroless plating of nickel (or copper) was carried out on glass (or silicon) substrates that were previously surface modified by using plasma-polymerization and grafting processes, and then activated by immersion in a simple acidic PdCl₂ solution. Three pretreatments based on the deposition of plasma-polymerized thin films (PACVD process) on O₂ plasma-cleaned substrates were investigated. They include film deposition of (1) amorphous hydrogenated carbon (a-C:H) grown from CH₄, whose surface is subsequently plasma-functionalized in NH₃ or N₂; (2) amorphous hydrogenated carbon nitride (a-CN_x:H) grown from CH₄/NH₃ or CH₄/N₂ mixtures; and (3) amorphous hydrogenated carbon nitride grown from volatile organic precursors (allylamine, acetonitrile).

In the three cases, X-ray photoelectron spectroscopy (XPS) results show that chemisorption of the catalyst occurs on the nitrogen-containing functionalities created by plasma polymerization and grafting and thus that the electroless deposition is possible. Differences were observed depending on the nature and thickness of the plasma-polymerized thin films, as well as on the nature and concentration of the nitrogen-containing functionalities present or grafted at the surface. Practical adhesion of Ni films was investigated using a Scotch® tape test. Ni films up to 3 or 4?μm in thickness were shown to pass this test successfully, i.e., without causing any metal detachment.     

Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine

Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly deposited copper. X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) results revealed that the pyridine groups in the plasma polymerized 4VP (pp‐4VP) layer could be preserved to a large extent under proper glow discharge conditions. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl₂) during the electroless plating of copper, but also as an adhesion promotion layer for the electrolessly deposited copper. The T‐peel adhesion strength of the electrolessly deposited copper with both the 4VP plasma‐polymerized FPI (pp‐4VP‐FPI) film and the 4VP graft‐copolymerized FPI (4VP‐g‐FPI) film was much higher than that of the electrolessly deposited copper with the pristine or the Ar plasma‐treated FPI films. The high adhesion strength between the electrolessly deposited copper and the surface‐modified FPI film was attributed to the fact that the plasma‐polymerized and the UV graft‐copolymerized 4VP chains were covalently tethered on the FPI surfaces, as well as the fact that these grafted 4VP polymer chains were spatially and reactively distributed into the copper matrix.

     

Photografting of N‐isopropylacrylamide and glycidyl methacrylate binary monomers on polyethylene film: Effect of mixed solvent consisting of water and organic solvent

Photografting (λ > 300 nm) of N‐isopropylacrylamide (NIPAAm) and glycidyl methacrylate (GMA) binary monomers (NIPAAm/GMA) on low‐density polyethylene film (thickness = 30 μm) was investigated at 60°C using mixed solvent consisting of water and an organic solvent such as acetone. Xanthone was used as a photoinitiator by coating it on the film surfaces. A maximum percentage of grafting was observed at a certain concentration of acetone in the mixed solvent, which was commonly observed for both ratios of NIPAAm/GMA, 8/2 and 7/3. Based on the photografting of NIPAAm/GMA on xanthone‐coated film, monomer reactivity ratios of NIPAAm (r₁) and GMA (r₂) were calculated using the Fineman–Ross method. The values were 0.31 ± 0.1 and 4.8 ± 0.2 for the water solvent system, while they were 0.96 ± 0.1 and 4.9 ± 0.1 for the mixed solvent system. NIPAAm/GMA‐grafted films with a homogeneous distribution of grafted chains were formed by photografting using water and mixed solvents. The NIPAAm/GMA‐grafted films exhibited temperature‐responsive characters, whereas the grafted films showed a reversible change in the degree of swelling between 0 and 50°C, respectively. Epoxy groups in the grafted poly(NIPAAm/GMA) chains could be aminated with ethylenediamine in N,N′‐dimethylformamide at 70°C for 3 h. Complexes of the aminated NIPAAm/GMA‐grafted chains with cupric ion exhibited catalytic activity for the decomposition of hydrogen peroxide at 20 to 50°C. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 2469–2475, 2005     

Surface modification of plasma‐pretreated high density polyethylene films by graft copolymerization for adhesion improvement with evaporated copper

Surface modification of Ar plasma‐pretreated high density polyethylene (HDPE) film via UV‐induced graft copolymerization with glycidyl methacrylate (GMA) and 2‐hydroxyethylacrylate (HEA) was carried out to improve the adhesion with evaporated copper. The surface compositions of the modified HDPE surfaces were characterized by X‐ray photoelectron spectroscopy (XPS). The adhesion strengths of evaporated copper with the graft‐copolymerized HDPE films were affected by the Ar plasma pretreatment time, the monomer concentration used for graft copolymerization, and the graft concentration. Post‐treatments, such as plasma post‐treatments after graft copolymerization and thermal treatment (curing) after metalization, further enhanced the adhesion strength of the Cu/HDPE laminates. The T‐type peel strengths of the laminates involving the graft‐modified and plasma posttreated HDPE films were greater than 15 N/cm. The enhanced adhesion strength resulted from the strong affinity of the graft chains for Cu and the fact that the graft chains were covalently tethered on the HDPE surface. XPS characterization of the delaminated surfaces of the Cu/HDPE laminates revealed that the failure mode of the laminates with T‐peel adhesion strengths greater than 5 N/cm was cohesive in nature.     

Influence of substrate material and ion bombardment on plasma-deposited fluorocarbon thin films

The influence of substrate material and ion bombardment on fluorocarbon thin films deposited using a C₂F₆ glow discharge in an rf, parallel plate reactor was investigated. Monitoring of the plasma process by optical emission spectroscopy indicated that the dominant species in the glow discharge was CF₂. Studies of bulk polytetrafluoroethylene (PTFE) and plasma-polymerized fluorocarbon thin-film samples in an XPS system demonstrated that the formation of non-CF₂ species can be induced by ion bombardment of CF₂ molecules. Characterization of the deposited fluorocarbon films by XPS found that the F/C ratio and CF_x distribution (0 < x < 3) in the films were dependent on processing conditions. Fluorocarbon films deposited simultaneously onto Al, glass, steel, and PTFE substrates using a C₂F₆ plasma and a graphite sputter target had measurably different F/C ratios, with the F/C ratio of the films deposited onto the Al substrates consistently lower than the F/C ratios of the films deposited onto the other substrates. When a C₂F₆ plasma was used without a graphite target, the F/C ratio in the film was constant, but the CF_x distribution was different for each of the substrate materials. Analysis of the plasma-polymerized films by TEM revealed that localized growth of fluorocarbon particles occurred during the initial stages of deposition, consistent with an activated growth mechanism. Differences in the F/C ratio for films deposited onto the various substrate materials were attributed to the interaction of the fluorocarbon plasma with the exposed surface of the substrate prior to complete coverage by the polymeric film. © 1994 John Wiley & Sons, Inc.     

Surface modification of ABS by photocatalytic treatment for electroless copper plating

Surface roughness of acrylonitrile–butadiene–styrene (ABS) resin prior to metallization is treated generally with sulphuric/chromic acid system. However, the presence of chrominum (VI) ion imposes serious environmental problems. In this work, TiO₂ photocatalytic treatment was used to enhance the adhesion strength between the ABS surface and the electroless copper film. Effects of the TiO₂ content, irradiation time and UV power upon the surface topography, surface characterization and the adhesion strength were investigated. The results indicated that the surface hydrophilicity of ABS resin and the adhesion strength between the electroless copper film and ABS surface increased with an increase in the UV power and a prolongation in irradiation time, and did not increase linearly with an increase of TiO₂ content. Though the surface topography of ABS changed little, the adhesion strength reached 1.25?kN/m, which was higher than that in the optimal H₂SO₄–MnO₂ colloid. The surface chemistry results indicated that –COOH and –OH groups formed with the photocatalytic treatment and the absorption strengths increased with the UV power. XPS analysis results further demonstrated that the contents of C=O and –COOH reached 6.4 and 4.9% with the photocatalytic treatment, which was much higher than that of the H₂SO₄–MnO₂ colloid (3.9 and 3.1%). The high contents of C=O and –COOH groups enhanced the surface hydrophilicity of the ABS resin and improved the adhesion strength between the electroless copper film and ABS resin. The results indicated that the photocatalytic treatment was an environment-friendly and effective method to replace the commercial wet chemical process for ABS surface modification.     

Surface modification of low‐density polyethylene (LDPE) film and improvement of adhesion between evaporated copper metal film and LDPE

To improve the interfacial adhesion between evaporated copper film and low‐density polyethylene (LDPE) film, the surface of LDPE films was modified by treating with chromic acid [K₂Cr₂O₇/H₂O/H₂SO₄ (4.4/7.1/88.5)]/oxygen plasma. Chromic‐acid‐etched LDPE was exposed to oxygen plasma to achieve a higher content of polar groups on the LDPE surface. We investigated the effect of the treatment time of chromic acid in the range of 1–60 min at 70°C and oxygen plasma in the range of 30–90 sec on the extent of polar groups created on the LDPE. We also investigated the surface topography of and water contact angle on the LDPE film surface, mechanical properties of the LDPE film, and adhesion strength of the evaporated copper metal film to the LDPE film surface. IR and electron spectroscopy for chemical analysis revealed the introduction of polar groups on the modified LDPE film surface, which exhibited an improved contact angle and copper/LDPE adhesion. The number of polar groups and the surface roughness increased with increasing treatment time of chromic acid/plasma. Water contact angle significantly decreased with increasing treatment time of chromic acid/plasma. Combination treatment of oxygen plasma with chromic acid drastically decreased the contact angle. When the treatment times of chromic acid and oxygen plasma were greater than 10 min and 30 sec, respectively, the contact angle was below 20°. With an increasing treatment time of chromic acid, the tensile strength of the LDPE film decreased, and the film color changed after about 10 min and then became blackened after 30 min. With the scratch test, the adhesion between copper and LDPE was found to increase with an increasing treatment time of chromic acid/oxygen plasma. From these results, we found that the optimum treatment times with chromic acid and oxygen plasma were near 30 min and 30 sec, respectively. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 1677–1690, 2001     

Effects of titania content and plasma treatment on the interfacial adhesion mechanism of nano titania-hybridized polyimide and copper system

Nano-titania (TiO₂) incorporated into polyimide (PI) matrix can significantly enhance the adhesion strength for PI/TiO₂ hybrid film and copper system. Surface modifications by various plasma treatments (Ar, Ar/N₂ and Ar/O₂) were also applied in this study to improve the adhesion strength. The Ar/N₂ plasma treatment is regarded as the more effective way in promoting the adhesion strength. The maximum adhesion value of 9.53 N/cm was obtained for the PI/TiO₂-1 wt% hybrid film with Ar/N₂ plasma treatment. It is enhanced about 10 times as large as pristine PI. Furthermore, by Ar/O₂ plasma treatment, a weak boundary of copper oxide was formed at the interlayer between PI/TiO₂ hybrid film and copper which decreases the adhesion strength. The effects of plasma treatment and content of nanosized TiO₂ on the adhesion strength between PI/TiO₂ hybrid film and copper system were studied. Atomic force microscope and contact angle analyses were used to measure the changes in surface morphology and surface energy as a result of plasma treatment. Besides, the interfacial states of peeled-off polymer side and copper side were investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Based on the result of XPS spectra, the peeled-off failure mode between PI/TiO₂ hybrid film and copper was proposed in this study.