多路V/I输出的高性能CMOS带隙基准源

在传统CMOS带隙基准源的基础上,采用温度补偿和差分负反馈的方法,提出了一种多路V/I输出的高性能CMOS带隙基准源结构.基于0.5 μm CMOS工艺,进行了设计实现.HSPICE仿真结果表明,该带隙基准源具有较低的温度系数(7.9×10-6/℃,0～100 ℃),电源电压从1.9 V变化到5.5 V,输出仅变化1.8 mV,基准源输出为1.233 V,分压电路产生多路输出,基准电流4 μA,温度系数均小于12×10-6 /℃(-25 ℃～125 ℃).     

高精度带隙基准电压源的实现

提出了一种高精度带隙基准电压源电路,通过补偿其输出电压所经过的三极管的基极电流获得精确的镜像电流源.设计得到了在-20～+80℃温度范围内温度系数为3×10-6/℃和-85dB的电源电压抑制比的带隙基准电压源电路.该电路采用台积电(TSMC) 0.35μm、3.3V/5V、5V电源电压、2层多晶硅 4层金属(2P4M)、CMOS工艺生产制造,芯片中基准电压源电路面积大小为0.654mm×0.340mm,功耗为5.2mW.     

一种高精度CMOS带隙基准电压源设计

介绍了带隙基准电压源的基本原理,设计了一种高精度带隙基准电压源电路.该电路采用中芯国际半导体制造公司0.18 μm CMOS工艺.Hspice仿真表明,基准输出电压在温度为-10～120 ℃时,温度系数为6.3×10-6/℃,在电源电压为3.0～3.6 V内,电源抑制比为69 dB.该电压基准在相变存储器芯片电路中,用于运放偏置和读出/写驱动电路中所需的高精度电流源电路.     

一种低温漂BiCMOS带隙基准电压源的设计

文章介绍了一种低温漂的BiCMOS带隙基准电压源.基于特许半导体(Chartered)0.35 μm BiCMOS工艺,采用Brokaw带隙基准电压源结构,通过一级温度补偿技术,设计得到了一种在-40℃到 85℃的温度变化范围内温度系数为15.2×10-6/℃,输出电压为2.5 V±0.002 V的带隙基准电压源电路.±20%的电源电压变化情况下,输出电压变化为2.2 mV,电源电压抑制比为60 dB.5 V电源电压下功耗为1.19 mW.具有良好的电源抑制能力.     

一种高精度宽电源范围集成电压基准源设计

在SOC及智能功率集成电路中,对基准电压源的电源电压范围及输出驱动电流都提出了更高的要求.基于csmc 40VBCD工艺设计并实现了一种输出精度高、驱动能力强、电源电压范围宽的5V集成基准电压源电路.设计中通过HV_PMOS实现电源电压和基准核心电路工作电压的隔离,拓宽了电源电压范围,采用双重电流负反馈保证了基准电压的高精度输出.通过Cadence软件平台下的Spectre仿真器对电路的各项电参数进行仿真验证,得到电源电压范围9～30V,在-20～125℃范围内温度系数5.688×10-6/℃,启动时间6.369μs,负载电流0～40mA,输出为5V的集成电压基准源电路.     

一种高精度低温漂带隙基准源设计

基于TSMC40nmCMOS工艺设计了一种高精度带隙基准电路。采用Spectre工具仿真,结果表明,带隙基准输出电压在温度为-40—125℃的范围内具有10×10^-6／℃的温度系数,在电源电压在1．5-5．5V变化时,基准输出电压随电源电压变化仅为0．42mV,变化率为0．23mv／V,采用共源共栅电流镜后,带隙基准在低频下的电源电压抑制比为-72dB。     

基于低压高精度运放的带隙基准电压源设计

基于传统带隙基准源的电路结构,采用电平移位的折叠共源共栅输入级和甲乙类互补推挽共源输出级改进了其运算放大器的性能,并结合一阶温度补偿、电流负反馈技术设计了一款低温度系数、高电源电压抑制比(PSRR)的低压基准电压源。利用华润上华公司的CSMC 0.35μm标准CMOS工艺对电路进行了Hspice仿真,该带隙基准源电路的电源工作范围为1.5～2.3 V,输出基准电压为(600±0.2)mV;工作温度为10～130℃,输出电压仅变化8μV,温度系数为1.86×10-6/℃,低频时PSRR为-72 dB。实际流片进行测试,结果表明达到了预期结果。     

一种电流求和型CMOS基准电流源

基于温度补偿的方法设计了一种高性能的CMOS基准电流源电路,该电路采用0.35mm N阱CMOS工艺实现.通过Cadence Spectre工具仿真,结果表明,在-40～85℃的温度范围内,该电路输出电流的温度系数小于40×10-6/℃.在3.3V电源电压下功耗约为1mW,属于低温漂、低功耗的基准电流源.     

一种高温度性能的带隙基准源

基于OKI 0.5μm BiCMOS工艺,设计了一种低温漂的带隙基准电压源。对传统基准源的电压模式输出级进行了改进,使之形成同时包含电压模式和电流模式的混合模式输出级,提高了温度补偿的灵活性。同时设计了一种基于分段线性补偿技术的高精度曲率校正电路,精确地对基准电压的高阶温度分量进行修调。 HSPICE仿真结果表明,在5 V的电源电压下,基准输出电压为1.2156 V,在-40℃~125℃温度范围内,基准电压的温度系数为0.43×10-6/℃,低频时电路电源抑制比低于-83 dB。电源电压在3.8 V~10 V范围内变化时,基准源的线性调整率为9.2μV/V。     

高电源抑制比带隙基准电压源的设计

提出一种采用0.25 μm CMOS工艺的低功耗、高电源抑制比、低温度系数的带隙基准电压源(BGR)设计.设计中,采用了共源共栅电流镜结构,运放的输出作为驱动的同时也作为自身电流源的驱动,并且实现了与绝对温度成正比(PTAT)温度补偿.使用Hspice对其进行仿真,在中芯国际标准0.25 μm CMOS工艺下,当温度变化范围在-25～125℃和电源电压变化范围为4.5～5.5 V时,输出基准电压具有9.3×10-6 V/℃的温度特性,Vref摆动小于0.12 mV,在低频时具有85 dB以上的电源电压抑制比(PSRR),整个电路消耗电源电流仅为20μA.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.